CN203553132U - Thin carrier tape-type integrated circuit package - Google Patents
Thin carrier tape-type integrated circuit package Download PDFInfo
- Publication number
- CN203553132U CN203553132U CN201320741226.8U CN201320741226U CN203553132U CN 203553132 U CN203553132 U CN 203553132U CN 201320741226 U CN201320741226 U CN 201320741226U CN 203553132 U CN203553132 U CN 203553132U
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- integrated circuit
- lead frame
- chip
- edges
- support body
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- Expired - Fee Related
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Abstract
The utility model relates to thin carrier tape-type integrated circuit package, which comprises a lead frame body and an integrated circuit chip. Four pins are arranged inside a square groove; four edges of the back surface of the lead frame body are provided with lead strips; the four pins are connected with the four lead strips respectively; the output end of the integrated circuit chip is electrically connected with the pins; each of the four edges of the square groove is provided with at least one positioning hole; buckles with transverse openings are in clamping connection on circumferential edges of the integrated circuit chip; connection edges extend from the bottom of the outer edges of the buckles; the integrated circuit chip passes through the connection holes via bolts to be locked in the positioning holes; and the end surface of each bolt is level with the upper surface of the integrated circuit chip and the upper surface of the lead frame body. According to the thin carrier tape-type integrated circuit package, the package effects are good, a thin package technology is provided, and the fact that the integrated circuit can not be used due to problems such as pseudo soldering does not happen during the use process.
Description
Technical field
The utility model relates to the field of integrated circuit, especially a kind of slim tape carrier integrated antenna package.
Background technology
With regard to the encapsulation technology of electronic industry, develop gradually to pursue assembling structure and can meet compact requirement, the overall volume that indirectly makes electronic product is effectively reduced and also can be reduced manufacturing cost, make product in having more on the market commercial competitiveness.The pin of the circuit lead frame using at present has seven at least, eight, have at most two, 30, its processing and manufacturing difficulty is far longer than common lead frame of triode product, therefore the good conducting that how to guarantee each pin and integrated circuit (IC) chip is the important leverage that improves integrated circuit (IC) products unfailing performance, the integrated circuit of many pins, need to be plugged in corresponding connecting hole corresponding each pin, during due to connection, can produce the phenomenons such as rosin joint, thereby cause cannot using of chip, in addition, integrated circuit after encapsulation exists thickness too thick, encapsulation for some special dimensions cannot realize.
Summary of the invention
The technical problems to be solved in the utility model is: in order to overcome the problem of above-mentioned middle existence, provide a kind of slim tape carrier integrated antenna package, its project organization is reasonable and packaging effect good, possesses slimming encapsulation simultaneously.
The utility model solves the technical scheme that its technical problem adopts: a kind of slim tape carrier integrated antenna package, comprise lead frame support body and integrated circuit (IC) chip, on the center of described lead frame support body, offer square groove, in square groove, be placed with four pins, on the four edges of the rear surface of lead frame support body, be equipped with lead-in wire bar, four pins are connected with four lead-in wire bars respectively, the output of integrated circuit (IC) chip is electrically connected mutually with pin, four edges of square groove all offer at least one location hole, on the edge of described integrated circuit (IC) chip, be connected with the buckle of transverse opening, on the bottom of buckle outer ledge, be extended with fillet, on fillet, offer the connecting hole corresponding with location hole, described integrated circuit (IC) chip is passed connecting hole by screw and is locked on location hole, the end face of screw and the upper surface of integrated circuit (IC) chip, the upper surface of lead frame support body flushes.
In order to make integrated circuit (IC) chip more firmly be locked on lead frame, four edges of described square groove all offer three location holes.
In order to meet environmental requirement, on the surface of described lead frame support body, scribble corronil coating.
In order to realize slimming, the thickness of described lead frame support body is 0.5mm.
The beneficial effects of the utility model are: the slim tape carrier integrated antenna package of described one, adopt the integrated antenna package of this kind of design, and possess packaging effect good, and possesses slim encapsulation technology, in use, can be because of problems such as rosin joints, cause cannot using of integrated circuit.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the overall structure schematic diagram of a kind of slim tape carrier integrated antenna package described in the utility model;
Fig. 2 is the structural representation of buckle in Fig. 1.
Accompanying drawing acceptance of the bid note is described below: 1, lead frame support body, 2, integrated circuit (IC) chip, 3, pin, 4, lead-in wire bar, 5, buckle, 6, fillet, 7, connecting hole, 8, screw.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, and basic structure of the present utility model is only described in a schematic way, and therefore it only shows the formation relevant with the utility model.
The slim tape carrier integrated antenna package of one as depicted in figs. 1 and 2, comprise lead frame support body 1 and integrated circuit (IC) chip 2, the thickness of lead frame support body 1 is 0.5mm, on the surface of lead frame support body 1, scribble corronil coating, on the center of lead frame support body 1, offer square groove, in square groove, be placed with four pins 3, on the four edges of the rear surface of lead frame support body 1, be equipped with lead-in wire bar 4, four pins 3 are connected with four lead-in wire bars 4 respectively, the output of integrated circuit (IC) chip 2 is electrically connected mutually with pin 3, four edges of square groove all offer three location holes, on the edge of integrated circuit (IC) chip 2, be connected with the buckle 5 of transverse opening, on the bottom of buckle 5 outer ledges, be extended with fillet 6, on fillet 6, offer the connecting hole corresponding with location hole 7, integrated circuit (IC) chip 2 is locked on location hole through connecting hole 7 by screw 8, the upper surface of the end face of screw 8 and integrated circuit (IC) chip 2, the upper surface of lead frame support body 1 flushes.
The slim tape carrier integrated antenna package of one of the present utility model, integrated circuit (IC) chip 2 is encapsulated on lead frame support body 1, utilize buckle 5 to lock, improved degree of blocking, avoided the situation that occurs that integrated circuit (IC) chip 2 is loosening, the integrated circuit of this design, possesses slim feature, goes for needing the field of ultra-thin chip.
Take above-mentioned foundation desirable embodiment of the present utility model as enlightenment, by above-mentioned description, relevant staff can, not departing from the scope of this utility model technological thought, carry out various change and modification completely.The technical scope of this utility model is not limited to the content on specification, must determine its technical scope according to claim scope.
Claims (4)
1. a slim tape carrier integrated antenna package, it is characterized in that: comprise lead frame support body (1) and integrated circuit (IC) chip (2), on the center of described lead frame support body (1), offer square groove, in square groove, be placed with four pins (3), on the four edges of the rear surface of lead frame support body (1), be equipped with lead-in wire bar (4), four pins (3) are connected with four lead-in wire bars (4) respectively, the output of integrated circuit (IC) chip (2) is electrically connected mutually with pin (3), four edges of square groove all offer at least one location hole, on the edge of described integrated circuit (IC) chip (2), be connected with the buckle (5) of transverse opening, on the bottom of buckle (5) outer ledge, be extended with fillet (6), on fillet (6), offer the connecting hole corresponding with location hole (7), described integrated circuit (IC) chip (2) is locked on location hole through connecting hole (7) by screw (8), the upper surface of the end face of screw (8) and integrated circuit (IC) chip (2), the upper surface of lead frame support body (1) flushes.
2. the slim tape carrier integrated antenna package of one according to claim 1, is characterized in that: four edges of described square groove all offer three location holes.
3. the slim tape carrier integrated antenna package of one according to claim 1, is characterized in that: on the surface of described lead frame support body (1), scribble corronil coating.
4. the slim tape carrier integrated antenna package of one according to claim 1, is characterized in that: the thickness of described lead frame support body (1) is 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320741226.8U CN203553132U (en) | 2013-11-20 | 2013-11-20 | Thin carrier tape-type integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320741226.8U CN203553132U (en) | 2013-11-20 | 2013-11-20 | Thin carrier tape-type integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553132U true CN203553132U (en) | 2014-04-16 |
Family
ID=50471212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320741226.8U Expired - Fee Related CN203553132U (en) | 2013-11-20 | 2013-11-20 | Thin carrier tape-type integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553132U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098641A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of integrated circuit package structure of high efficiency and heat radiation |
| CN110797269A (en) * | 2019-11-07 | 2020-02-14 | 温州胜泰智能科技有限公司 | Integrated chip packaging method |
-
2013
- 2013-11-20 CN CN201320741226.8U patent/CN203553132U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098641A (en) * | 2016-06-20 | 2016-11-09 | 东莞市联洲知识产权运营管理有限公司 | A kind of integrated circuit package structure of high efficiency and heat radiation |
| CN106098641B (en) * | 2016-06-20 | 2018-09-21 | 甬矽电子(宁波)股份有限公司 | A kind of integrated circuit package structure of heat dissipation |
| CN110797269A (en) * | 2019-11-07 | 2020-02-14 | 温州胜泰智能科技有限公司 | Integrated chip packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20171120 |