CN208478335U - A kind of T0-263 lead frame structure - Google Patents
A kind of T0-263 lead frame structure Download PDFInfo
- Publication number
- CN208478335U CN208478335U CN201821100723.9U CN201821100723U CN208478335U CN 208478335 U CN208478335 U CN 208478335U CN 201821100723 U CN201821100723 U CN 201821100723U CN 208478335 U CN208478335 U CN 208478335U
- Authority
- CN
- China
- Prior art keywords
- cooling fin
- lead frame
- muscle
- frame structure
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a kind of T0-263 lead frame structure, the lead frame includes cooling fin and external pin, setting is used for the slide glass area of bearing integrated chip on the cooling fin, the external pin includes interim pins and several side pins, the interim pins are connect with cooling fin, interim pins are connect with side pin by middle muscle and side muscle, stepped aperture is opened up on the muscle of side, cooling fin upper end connects muscle connection by convex, the T0-263 lead frame structure, influence of the punching stress to chip when reducing molding, improve finished product rate and punching efficiency, less copper strips can be used in the structure simultaneously, reduce the cost of frame, and the bond strength of lead frame and plastic-sealed body is high, it is not in lamination.
Description
Technical field
The utility model relates to semiconductor devices and integrated antenna package field more particularly to a kind of T0-263 lead frames
Frame structure.
Background technique
The impurity in air influences performance to the corrosion of chip circuit in order to prevent, needs to be packaged chip；Separately
On the one hand, the chip after encapsulation is also more convenient for installing and be transported.
For lead frame as one of component extremely crucial in semiconductor components and devices and integrated antenna package, it plays support
The important function of chip, scatter and disappear work calories and connection external circuit；In the prior art, TO-263 interim pins place of bending is
One circular arc, routing unstable quality and abnormal alarm is more, production efficiency is low；In addition, two end faces of frame or so are there are burr,
The range deviation of end face to location hole is big, so when carrying can be in front and back in process of production in order to avoid the collision of front and back frame
One safe distance is set between frame, this causes handling efficiency very low；Air, moisture etc. are readily along Copper substrate and plastic-sealed body
Faying face permeated, product rear assembly flow back or product occur when be easy to produce " puffed rice " phenomenon, so as to cause production
Product failure；Both sides are all made of the connection of side muscle to frame up and down, and since side muscle is thicker at cooling fin, punching power compares when subsequent forming
Greatly, it is easy to cause deformation of products and punching stress transfer, to generate damage to chip.
Utility model content
The applicant is directed to disadvantage mentioned above, has carried out Improvement, provides a kind of T0-263 lead frame structure.
Technical solution used by the utility model is as follows:
A kind of T0-263 lead frame structure, the lead frame include cooling fin and external pin, on the cooling fin
Slide glass area for bearing integrated chip is set, and the external pin includes interim pins and several side pins, described
Interim pins are connect with cooling fin, and interim pins are connect with side pin by middle muscle and side muscle, open up stepped aperture on the muscle of side, are dissipated
Backing upper end connects muscle connection by convex.
As a further improvement of the above technical scheme:
Routing area with gold thread, copper wire, aluminum wire bonding is set on the cooling fin.
Three side of the cooling fin back side is provided with step, and cooling fin two sides open up shrinkage pool, and it is anti-that cooling fin front opens up up-side down triangle
Sink.
The interim pins setting is used for the cross platform of routing, and rectangle of the side pin setting for routing is flat
Platform.
The beneficial effects of the utility model are as follows:
1, muscle connection is connected using convex at cooling fin, influence of the punching stress to chip when reducing molding improves product
Yield rate and punching efficiency, while less copper strips can be used in the structure, reduces the cost of frame；
2, the setting of three side boss of the cooling fin back side and the positive capillary groove of falling △ can increase plastic-sealed body and Copper substrate
Bond strength, while preventing steam etc. and penetrating into；
3, interim pins are provided with cross platform, and side pin is provided with rectangular platform, and cross platform and rectangle are flat
Routing stability can be improved in platform, to improve finished product rate；
4, accurately stepped aperture is opened up on the muscle of side, avoids the collision of front and back frame in production process, while realized and continuously removing
Fortune, increases production efficiency.
Detailed description of the invention
Fig. 1 is the front view of the T0-263 lead frame structure of the utility model.
Fig. 2 is the side view of the T0-263 lead frame structure of the utility model.
In figure: 1, cooling fin；11, slide glass area；12, routing area；13, step；14, shrinkage pool；15, triangle capillary groove；2,
Interim pins；21, cross platform；3, side pin；31, rectangular platform；4, middle muscle；5, side muscle；51, stepped aperture；6, convex
Even muscle.
Specific embodiment
With reference to the accompanying drawing, illustrate the specific embodiment of the present embodiment
As shown in Figure 1 and Figure 2, the T0-263 lead frame structure of the present embodiment, lead frame include cooling fin 1 and external
Pin, on cooling fin 1 setting for bearing integrated chip slide glass area 11 and with gold thread, copper wire, aluminum wire bonding routing
Area 12, external pin include interim pins 2 and several side pins 3, and interim pins 2 are connect with cooling fin 1, interim pins 2 with
Side pin 3 is connected by middle muscle 4 and side muscle 5, and stepped aperture 51 is opened up on side muscle 5, and 1 upper end of cooling fin connects muscle 6 by convex and connects
It connects.
1 back side of cooling fin, three side is provided with step 13, and 1 two sides of cooling fin open up shrinkage pool 14, and 1 front of cooling fin opens up down
Triangle capillary groove 15 can increase the bond strength of plastic-sealed body and Copper substrate, while can effectively prevent the infiltration of steam.
The setting of interim pins 2 is used for the cross platform 21 of routing, and the setting of side pin 3 is used for the rectangular platform of routing
31, routing stability can be improved in cross platform 21 and rectangular platform 31.
The T0-263 lead frame structure connects muscle 6 by middle muscle 4, side muscle 5 and convex, avoids lead frame from deforming, and convex
Type connects muscle 6, and product can be made to be easier to punching in final punch forming, avoids damage of the punching process excessive stresses to chip
And deformation of products, while the setting of the structure, the use of Copper substrate can be reduced, reduces frame punching cost, in addition lead frame
The truncation of frame both ends is using mold positioning punching truncation, the generation of burr when reducing truncation, while stepped aperture 51 is opened up on side muscle 5
Range deviation is very small, solves frame " sky is removed " waiting problem during subsequent production, improves production efficiency.
Above description is the explanation to the utility model, is not the restriction to utility model, defined by the utility model
Range is referring to claim, and without prejudice to the basic structure of the utility model, the utility model can make any shape
The modification of formula.
Claims (4)
1. a kind of T0-263 lead frame structure, it is characterised in that: the lead frame includes cooling fin (1) and external pin,
Setting is used for the slide glass area (11) of bearing integrated chip on the cooling fin (1), and the external pin includes interim pins
(2) it is connect with several side pins (3), the interim pins (2) with cooling fin (1), interim pins (2) and side pin (3)
It is connected, is opened up stepped aperture (51) on side muscle (5), cooling fin (1) upper end connects muscle (6) by convex by middle muscle (4) and side muscle (5)
Connection.
2. T0-263 lead frame structure according to claim 1, it is characterised in that: on the cooling fin (1) setting with
The routing area (12) of gold thread, copper wire, aluminum wire bonding.
3. T0-263 lead frame structure according to claim 1, it is characterised in that: the setting of three side of cooling fin (1) back side
Have step (13), cooling fin (1) two sides open up shrinkage pool (14), and cooling fin (1) front opens up up-side down triangle capillary groove (15).
4. T0-263 lead frame structure according to claim 1, it is characterised in that: interim pins (2) setting is used
In the cross platform (21) of routing, side pin (3) setting is used for the rectangular platform (31) of routing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821100723.9U CN208478335U (en) | 2018-07-12 | 2018-07-12 | A kind of T0-263 lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821100723.9U CN208478335U (en) | 2018-07-12 | 2018-07-12 | A kind of T0-263 lead frame structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208478335U true CN208478335U (en) | 2019-02-05 |
Family
ID=65210198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821100723.9U Expired - Fee Related CN208478335U (en) | 2018-07-12 | 2018-07-12 | A kind of T0-263 lead frame structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208478335U (en) |
-
2018
- 2018-07-12 CN CN201821100723.9U patent/CN208478335U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190205 Termination date: 20190712 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |