CN203540828U - Glue dispensing and curing mechanism - Google Patents

Glue dispensing and curing mechanism Download PDF

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Publication number
CN203540828U
CN203540828U CN201320746288.8U CN201320746288U CN203540828U CN 203540828 U CN203540828 U CN 203540828U CN 201320746288 U CN201320746288 U CN 201320746288U CN 203540828 U CN203540828 U CN 203540828U
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China
Prior art keywords
axis
connecting plate
glue
glue bucket
module
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Expired - Fee Related
Application number
CN201320746288.8U
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Chinese (zh)
Inventor
吕绍林
汪炉生
朱晓锋
叶友乐
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Bozhong Suzhou Precision Industry Technology Co Ltd
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Bozhong Suzhou Precision Industry Technology Co Ltd
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Priority to CN201320746288.8U priority Critical patent/CN203540828U/en
Application granted granted Critical
Publication of CN203540828U publication Critical patent/CN203540828U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a glue dispensing and curing mechanism which comprises a base, an X-axis mechanism, an XY connecting plate, a Y-axis mechanism, a YZ connecting plate, a Z-axis mechanism, a ZR connecting plate, an R-axis mechanism, a curing detection photographing mechanism, a glue dispensing mechanism and a glue receiving mechanism. The X-axis mechanism, the Y-axis mechanism, and the Z-axis mechanism can convey the R-axis mechanism to a standard operation position. The movement distances of the R-axis mechanism in the X-axis direction, the Y-axis direction and the Z-axis direction are determined by an X-axis photoelectric sensor, a Y-axis photoelectric sensor and a Z-axis photoelectric sensor respectively. After a glue dispensing needle has dispensed glue in the standard operation position, a CCD photographs for alignment, laser detection is performed to judge whether glue dispensing is up to standard or not, if glue dispensing is judged to be up to standard, a UV lamp performs baking on the position of glue dispensing and the glue is dried. When glue dispensing is not performed, the glue dispensing needle is located at the position of a glue receiving barrel, so that the glue does not drip onto the mechanism, and the work of the mechanism will not be influenced.

Description

A kind of adhesive curing mechanism of putting
Technical field:
The utility model relates to a kind of adhesive curing mechanism of putting.
Background technology:
To product, carry out in a glue solidification process, product need to be placed on product carrier, and place after product needed have the job position of a standard to carry out the some adhesive curing of product, carry out some glue with regard to needs location this time, make a plastic pin at standard operation position point glue, and by the contraposition of taking pictures, detect last to a mechanism that toast at glue position.
Utility model content:
The purpose of this utility model is to provide a kind of some adhesive curing mechanism, and for giving product point glue and solidifying, some plastic pin is at standard operation location point glue, the CCD contraposition that is used for taking pictures, and whether radium-shine detection is qualified, and after some glue, UV lamp is facing to the baking of some glue position, by drying adhesive; When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents that glue from dropping in mechanism, affects mechanism's work.
Technology solution of the present utility model is as follows:
A kind of adhesive curing mechanism of putting, it comprises base, X-axis mechanism, XY connecting plate, Y-axis mechanism, YZ connecting plate, Z-axis mechanism, ZR connecting plate, R axis mechanism, takes pictures and detect curing mechanism, glue applying mechanism and connect gluing mechanism, described X-axis mechanism is arranged on base, and Y-axis mechanism is arranged in X-axis mechanism by XY connecting plate; Described Z-axis mechanism is arranged in Y-axis mechanism by YZ connecting plate; Described R axis mechanism comprises R axle lift cylinder and lift cylinder fixed head, and described R axle lift cylinder is connected on ZR connecting plate; Described lift cylinder fixed head is arranged on R axle lift cylinder.
The described detection curing mechanism of taking pictures comprises CCD installing rack, CCD, light source fixing frame, light source, UV lamp, radium-shine fixed head and radium-shine, described CCD installing rack is arranged on the left side of ZR connecting plate, described CCD is arranged on CCD installing rack, described light source fixing frame is arranged on CCD installing rack, and light source is arranged on light source fixing frame; Described UV lamp is arranged on lift cylinder fixed head; The described radium-shine right side that is arranged on lift cylinder fixed head by radium-shine fixed head.
Described glue applying mechanism comprises glue bucket fixed head, some plastic pin, glue dispensing valve door and glue bucket, and described glue bucket fixed head is arranged on the right side of ZR connecting plate, and glue bucket is arranged on glue bucket fixed head medial surface; Described some plastic pin is arranged on the front side of ZR connecting plate, and some plastic pin be connected with glue bucket, and pass through glue dispensing valve gate control glue inlet point plastic pin.
Described connect gluing mechanism comprise connect glue bucket support, connect glue bucket mount pad, connect glue bucket, fiber amplifier, fiber amplifier holder, sensor and sensor holder, the described glue bucket support that connects is fixedly mounted on base, connect glue bucket mount pad and be arranged on and connect glue bucket support end, connect glue bucket and be arranged on and connect on glue bucket mount pad; Described connecing on glue bucket support is provided with fiber amplifier by fiber amplifier holder, described in connect on glue bucket mount pad, by sensor holder, sensor be installed.
As preferably, described X-axis mechanism comprises X-axis motor, X-axis shaft coupling, the linear module of X-axis, the linear module slide block of X-axis, X-axis slide rail, X-axis slide block, X-axis photoelectric sensor and X-axis sensing chip, the linear module of described X-axis, X-axis slide rail and X-axis photoelectric sensor are arranged on base respectively, and the linear module of X-axis and X-axis slide rail are parallel to each other; On described X-axis slide rail, coordinate X-axis slide block is installed, on the linear module of X-axis, coordinate the linear module slide block of X-axis is installed; Described X-axis motor links together by X-axis shaft coupling and the linear module of X-axis; The linear module slide block of described X-axis is being connected XY connecting plate with on X-axis slide block, and X-axis sensing chip is arranged on the bottom of XY connecting plate.
As preferably, described Y-axis mechanism comprises y-axis motor, Y-axis shaft coupling, the linear module of Y-axis, Y-axis photoelectric sensor and Y-axis sensing chip, and the linear module of described Y-axis and Y-axis photoelectric sensor are arranged on respectively on XY connecting plate; Described y-axis motor links together by Y-axis shaft coupling and the linear module of Y-axis; On the linear module of described Y-axis, connecting YZ connecting plate, and Y-axis sensing chip is arranged on the side of YZ connecting plate.
As preferably, described Z-axis mechanism comprises Z axis motor, Z axis shaft coupling, z axis module, Z axis module connecting plate, Z axis photoelectric sensor and Z axis sensing chip, described Z axis motor links together by Z axis shaft coupling and z axis module, z axis module back is connecting Z axis module connecting plate, and Z axis module connecting plate and YZ connecting plate link together; Described z axis module is positively connected with ZR connecting plate, and the back of described ZR connecting plate is connecting Z axis photoelectric sensor, and Z axis sensing chip is arranged on the side of Z axis module connecting plate.
As preferably, described X-axis photoelectric sensor, Y-axis photoelectric sensor and and Z axis photoelectric sensor have respectively three, be respectively used to determine the move distance of X-direction, Y direction and Z-direction.
The beneficial effects of the utility model are:
The utility model can be transported to R axis mechanism standard operation position by X-axis mechanism, Y-axis mechanism, Z-axis mechanism, whole mechanism is for also solidifying to product point glue, point plastic pin is at standard operation location point glue, CCD is used for the contraposition of taking pictures, whether radium-shine detection is qualified, after spot gluing lattice, UV lamp is facing to some glue position baking, by drying adhesive.When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents that glue from dropping in mechanism, affects mechanism's work.The utility model point glue position is accurate, can realize fully automatic working, and operating efficiency is high, has improved the quality of product, has reduced workman's labour intensity.
Accompanying drawing explanation:
Below in conjunction with accompanying drawing, the utility model is described further:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the top view of Fig. 1;
Fig. 4 is the left view of Fig. 1;
Fig. 5 is the structural representation of Z-axis mechanism of the present utility model;
Fig. 6 is R axis mechanism of the present utility model, takes pictures and detect the structural representation of curing mechanism and glue applying mechanism;
Fig. 7 is the left view of Fig. 6;
Fig. 8 is the gluing mechanism structural representation that connects of the present utility model;
In Fig. 1~8: I-X-axis mechanism; II-Y-axis mechanism; III-Z-axis mechanism; IV-R axis mechanism; V-detection the curing mechanism of taking pictures; VI-glue applying mechanism; VII-connect gluing mechanism; 1-base; 2-XY connecting plate; 3-YZ connecting plate; 4-ZR connecting plate; 5-X-axis motor; 6-X-axis shaft coupling; The linear module of 7-X-axis; The linear module slide block of 8-X-axis; 9-X-axis slide rail; 10-X-axis slide block; 11-X-axis photoelectric sensor; 12-X-axis sensing chip; 13-y-axis motor; 14-Y-axis shaft coupling; The linear module of 15-Y-axis; 16-Y-axis photoelectric sensor; 17-Y-axis sensing chip; 18-Z axis motor; 19-Z axis shaft coupling; 20-z axis module; 21-Z axis module connecting plate; 22-Z axis photoelectric sensor; 23-Z axis sensing chip; 24-R axle lift cylinder; 25-lift cylinder fixed head; 26-CCD installing rack; 27-CCD; 28-light source fixing frame; 29-light source; 30-UV lamp; 31-radium-shine fixed head; 32-radium-shine; 33-glue bucket fixed head; A 34-plastic pin; 35-glue dispensing valve door; 36-glue bucket; 37-connect glue bucket support; 38-connect glue bucket mount pad; 39-connect glue bucket; 40-fiber amplifier; 41-fiber amplifier holder; 42-sensor; 43-sensor holder.
The specific embodiment:
Embodiment, see accompanying drawing 1~8, a kind of adhesive curing mechanism of putting, it comprises base 1, X-axis mechanism I, XY connecting plate 2, Y-axis mechanism II, YZ connecting plate 3, Z-axis mechanism III, ZR connecting plate 4, R axis mechanism IV, takes pictures and detect curing mechanism V, glue applying mechanism VI and connect gluing mechanism VII, described X-axis mechanism is arranged on base, and Y-axis mechanism is arranged in X-axis mechanism by XY connecting plate; Described Z-axis mechanism is arranged in Y-axis mechanism by YZ connecting plate.
Described X-axis mechanism I comprises X-axis motor 5, X-axis shaft coupling 6, the linear module 7 of X-axis, the linear module slide block 8 of X-axis, X-axis slide rail 9, X-axis slide block 10, X-axis photoelectric sensor 11 and X-axis sensing chip 12, the linear module of described X-axis, X-axis slide rail and X-axis photoelectric sensor are arranged on respectively on base, X-axis photoelectric sensor has three, and the linear module of X-axis and X-axis slide rail are parallel to each other; On described X-axis slide rail, coordinate X-axis slide block is installed, on the linear module of X-axis, coordinate the linear module slide block of X-axis is installed; Described X-axis motor links together by X-axis shaft coupling and the linear module of X-axis; The linear module slide block of described X-axis is being connected XY connecting plate with on X-axis slide block, and X-axis sensing chip is arranged on the bottom of XY connecting plate.
Described Y-axis mechanism II comprises y-axis motor 13, Y-axis shaft coupling 14, the linear module 15 of Y-axis, Y-axis photoelectric sensor 16 and Y-axis sensing chip 17, and the linear module of described Y-axis and Y-axis photoelectric sensor are arranged on respectively on XY connecting plate, and Y-axis photoelectric sensor has three; Described y-axis motor links together by Y-axis shaft coupling and the linear module of Y-axis; On the linear module of described Y-axis, connecting YZ connecting plate, and Y-axis sensing chip is arranged on the side of YZ connecting plate.
Described Z-axis mechanism III comprises Z axis motor 18, Z axis shaft coupling 19, z axis module 20, Z axis module connecting plate 21, Z axis photoelectric sensor 22 and Z axis sensing chip 23, described Z axis motor links together by Z axis shaft coupling and z axis module, z axis module back is connecting Z axis module connecting plate, and Z axis module connecting plate and YZ connecting plate link together; Described z axis module is positively connected with ZR connecting plate, and the back of described ZR connecting plate is connecting three Z axis photoelectric sensors, and Z axis sensing chip is arranged on the side of Z axis module connecting plate.
Described R axis mechanism IV comprises R axle lift cylinder 24 and lift cylinder fixed head 25, and described R axle lift cylinder is connected on ZR connecting plate; Described lift cylinder fixed head is arranged on R axle lift cylinder.
The described detection curing mechanism V of taking pictures comprises CCD installing rack 26, CCD27, light source fixing frame 28, light source 29, UV lamp 30, radium-shine fixed head 31 and radium-shine 32, described CCD installing rack is arranged on the left side of ZR connecting plate, described CCD is arranged on CCD installing rack, described light source fixing frame is arranged on CCD installing rack, and light source is arranged on light source fixing frame; Described UV lamp is arranged on lift cylinder fixed head; The described radium-shine right side that is arranged on lift cylinder fixed head by radium-shine fixed head.
Described glue applying mechanism VI comprises glue bucket fixed head 33, some plastic pin 34, glue dispensing valve door 35 and glue bucket 36, and described glue bucket fixed head is arranged on the right side of ZR connecting plate, and glue bucket is arranged on glue bucket fixed head medial surface; Described some plastic pin is arranged on the front side of ZR connecting plate, and some plastic pin be connected with glue bucket, and pass through glue dispensing valve gate control glue inlet point plastic pin.
Described connect gluing mechanism VII comprise connect glue bucket support 37, connect glue bucket mount pad 38, connect glue bucket 39, fiber amplifier 40, fiber amplifier holder 41, sensor 42 and sensor holder 43, the described glue bucket support that connects is fixedly mounted on base, connect glue bucket mount pad and be arranged on and connect glue bucket support end, connect glue bucket and be arranged on and connect on glue bucket mount pad; Described connecing on glue bucket support is provided with fiber amplifier by fiber amplifier holder, described in connect on glue bucket mount pad, by sensor holder, sensor be installed.
The utility model course of work: described X-axis mechanism, Y-axis mechanism, Z-axis mechanism can be transported to R axis mechanism standard operation position, its move distance in X-direction, Y direction and Z-direction is determined by X-axis photoelectric sensor, Y-axis photoelectric sensor and Z axis photoelectric sensor respectively; When a plastic pin is after standard operation location point glue, the CCD contraposition of taking pictures, whether radium-shine test point glue is qualified, and after spot gluing lattice, UV lamp is again to a glue position baking, by drying adhesive; When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents that glue from dropping in mechanism, affects mechanism's work.
Above-described embodiment is the specific descriptions that the utility model is carried out; just the utility model is further described; can not be interpreted as the restriction to the utility model protection domain, those skilled in the art according to the content of above-mentioned utility model make some nonessential improvement and adjust all fall into protection domain of the present utility model within.

Claims (5)

1. a Zhong Dian adhesive curing mechanism, it is characterized in that: it comprises base, X-axis mechanism, XY connecting plate, Y-axis mechanism, YZ connecting plate, Z-axis mechanism, ZR connecting plate, R axis mechanism, takes pictures and detect curing mechanism, glue applying mechanism and connect gluing mechanism, described X-axis mechanism is arranged on base, and Y-axis mechanism is arranged in X-axis mechanism by XY connecting plate; Described Z-axis mechanism is arranged in Y-axis mechanism by YZ connecting plate; Described R axis mechanism comprises R axle lift cylinder and lift cylinder fixed head, and described R axle lift cylinder is connected on ZR connecting plate; Described lift cylinder fixed head is arranged on R axle lift cylinder;
The described detection curing mechanism of taking pictures comprises CCD installing rack, CCD, light source fixing frame, light source, UV lamp, radium-shine fixed head and radium-shine, described CCD installing rack is arranged on the left side of ZR connecting plate, described CCD is arranged on CCD installing rack, described light source fixing frame is arranged on CCD installing rack, and light source is arranged on light source fixing frame; Described UV lamp is arranged on lift cylinder fixed head; The described radium-shine right side that is arranged on lift cylinder fixed head by radium-shine fixed head;
Described glue applying mechanism comprises glue bucket fixed head, some plastic pin, glue dispensing valve door and glue bucket, and described glue bucket fixed head is arranged on the right side of ZR connecting plate, and glue bucket is arranged on glue bucket fixed head medial surface; Described some plastic pin is arranged on the front side of ZR connecting plate, and some plastic pin be connected with glue bucket, and pass through glue dispensing valve gate control glue inlet point plastic pin;
Described connect gluing mechanism comprise connect glue bucket support, connect glue bucket mount pad, connect glue bucket, fiber amplifier, fiber amplifier holder, sensor and sensor holder, the described glue bucket support that connects is fixedly mounted on base, connect glue bucket mount pad and be arranged on and connect glue bucket support end, connect glue bucket and be arranged on and connect on glue bucket mount pad; Described connecing on glue bucket support is provided with fiber amplifier by fiber amplifier holder, described in connect on glue bucket mount pad, by sensor holder, sensor be installed.
2. a kind of adhesive curing mechanism of putting according to claim 1, it is characterized in that: described X-axis mechanism comprises X-axis motor, X-axis shaft coupling, the linear module of X-axis, the linear module slide block of X-axis, X-axis slide rail, X-axis slide block, X-axis photoelectric sensor and X-axis sensing chip, the linear module of described X-axis, X-axis slide rail and X-axis photoelectric sensor are arranged on base respectively, and the linear module of X-axis and X-axis slide rail are parallel to each other; On described X-axis slide rail, coordinate X-axis slide block is installed, on the linear module of X-axis, coordinate the linear module slide block of X-axis is installed; Described X-axis motor links together by X-axis shaft coupling and the linear module of X-axis; The linear module slide block of described X-axis is being connected XY connecting plate with on X-axis slide block, and X-axis sensing chip is arranged on the bottom of XY connecting plate.
3. a kind of adhesive curing mechanism of putting according to claim 1, it is characterized in that: described Y-axis mechanism comprises y-axis motor, Y-axis shaft coupling, the linear module of Y-axis, Y-axis photoelectric sensor and Y-axis sensing chip, and the linear module of described Y-axis and Y-axis photoelectric sensor are arranged on respectively on XY connecting plate; Described y-axis motor links together by Y-axis shaft coupling and the linear module of Y-axis; On the linear module of described Y-axis, connecting YZ connecting plate, and Y-axis sensing chip is arranged on the side of YZ connecting plate.
4. a kind of adhesive curing mechanism of putting according to claim 1, it is characterized in that: described Z-axis mechanism comprises Z axis motor, Z axis shaft coupling, z axis module, Z axis module connecting plate, Z axis photoelectric sensor and Z axis sensing chip, described Z axis motor links together by Z axis shaft coupling and z axis module, z axis module back is connecting Z axis module connecting plate, and Z axis module connecting plate and YZ connecting plate link together; Described z axis module is positively connected with ZR connecting plate, and the back of described ZR connecting plate is connecting Z axis photoelectric sensor, and Z axis sensing chip is arranged on the side of Z axis module connecting plate.
5. a kind of point according to claim 1 adhesive curing mechanism, is characterized in that: described X-axis photoelectric sensor, Y-axis photoelectric sensor and and Z axis photoelectric sensor have respectively three, be respectively used to determine the move distance of X-direction, Y direction and Z-direction.
CN201320746288.8U 2013-11-22 2013-11-22 Glue dispensing and curing mechanism Expired - Fee Related CN203540828U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320746288.8U CN203540828U (en) 2013-11-22 2013-11-22 Glue dispensing and curing mechanism

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Application Number Priority Date Filing Date Title
CN201320746288.8U CN203540828U (en) 2013-11-22 2013-11-22 Glue dispensing and curing mechanism

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Publication Number Publication Date
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103586172A (en) * 2013-11-22 2014-02-19 苏州博众精工科技有限公司 Dispensing and curing mechanism
CN104438015A (en) * 2014-12-08 2015-03-25 南京熊猫电子股份有限公司 Frame glue coating and pro-curing device and method
CN104549892A (en) * 2015-02-03 2015-04-29 苏州博众精工科技有限公司 Dispensing curing mechanism for assembling small components of electronic product
CN106423732A (en) * 2016-10-18 2017-02-22 深圳市帝冠科讯科技有限公司 Double-station three-dimensional intelligent glue dispenser
CN107583820A (en) * 2017-09-26 2018-01-16 深圳双十科技有限公司 A kind of point gum machine
CN111822249A (en) * 2020-07-24 2020-10-27 苏州天准科技股份有限公司 Novel glue dispensing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103586172A (en) * 2013-11-22 2014-02-19 苏州博众精工科技有限公司 Dispensing and curing mechanism
CN104438015A (en) * 2014-12-08 2015-03-25 南京熊猫电子股份有限公司 Frame glue coating and pro-curing device and method
CN104438015B (en) * 2014-12-08 2016-05-25 南京熊猫电子股份有限公司 A kind of frame glue applies precuring device and method
CN104549892A (en) * 2015-02-03 2015-04-29 苏州博众精工科技有限公司 Dispensing curing mechanism for assembling small components of electronic product
CN106423732A (en) * 2016-10-18 2017-02-22 深圳市帝冠科讯科技有限公司 Double-station three-dimensional intelligent glue dispenser
CN107583820A (en) * 2017-09-26 2018-01-16 深圳双十科技有限公司 A kind of point gum machine
CN111822249A (en) * 2020-07-24 2020-10-27 苏州天准科技股份有限公司 Novel glue dispensing device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140416

Termination date: 20161122

CF01 Termination of patent right due to non-payment of annual fee