CN105289935A - Glue dispensing curing mechanism - Google Patents
Glue dispensing curing mechanism Download PDFInfo
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- CN105289935A CN105289935A CN201410355399.5A CN201410355399A CN105289935A CN 105289935 A CN105289935 A CN 105289935A CN 201410355399 A CN201410355399 A CN 201410355399A CN 105289935 A CN105289935 A CN 105289935A
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Abstract
The invention relates to a glue dispensing curing mechanism. The glue dispensing curing mechanism comprises a base, an X-axis mechanism, an XY connecting plate, a Y-axis mechanism, a YZ connecting plate, a Z-axis mechanism, a ZR connecting plate, an R-axis mechanism, a photographing detection curing mechanism, a glue dispensing mechanism and a glue receiving mechanism. The X-axis mechanism, the Y-axis mechanism and the Z-axis mechanism can transfer the R-axis mechanism to a standard working position. The movement distance in the X-axis direction, the movement distance in the Y-axis direction and the movement distance in the Z-axis direction of the R-axis mechanism are determined by an X-axis photoelectric sensor, a Y-axis photoelectric sensor and a Z-axis photoelectric sensor respectively. When glue dispensing is conducted by a glue dispensing pin in the standard working position, a charge coupled device (CCD) conducts photographing and aligning, whether glue dispensing is qualified or not is detected by lasers, and after glue dispensing is qualified, a glue dispensing position is baked through an ultraviolet (UV) lamp till glue is dried; when glue dispensing is not conducted, the glue dispensing pin is located in the position of a glue receiving bucket, and the situation that the glue is dripped on the mechanism, so that mechanism operation is influenced is avoided.
Description
technical field:
The present invention relates to a kind of some adhesive curing mechanism.
Background technology
A glue is carried out and in solidification process to product, need product to be placed on product carrier, and the product needed after placing has the job position of a standard to carry out the some adhesive curing of product, location is just needed this time to carry out a glue, make a plastic pin at standard operation position point glue, and by contraposition of taking pictures, detect last to a mechanism that glue position is toasted.
Summary of the invention
The object of this invention is to provide one point adhesive curing mechanism, for giving product point glue and solidifying, some plastic pin is at standard operation location point glue, and CCD is used for taking pictures contraposition, and whether radium-shine detection is qualified, and after some glue, UV lamp faces toward the baking of some glue position, by drying adhesive; When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents glue from dropping in mechanism, affects institution staff.
Technology solution of the present invention is as follows:
A kind of some adhesive curing mechanism, it comprises base, X-axis mechanism, XY connecting plate, Y-axis mechanism, YZ connecting plate, Z-axis mechanism, ZR connecting plate, R axis mechanism, takes pictures and detect curing mechanism, glue applying mechanism and connect gluing mechanism, described X-axis mechanism is arranged on base, and Y-axis mechanism is arranged in X-axis mechanism by XY connecting plate; Described Z-axis mechanism is arranged in Y-axis mechanism by YZ connecting plate; Described R axis mechanism comprises R axle lift cylinder and lift cylinder fixed head, and described R axle lift cylinder is connected on ZR connecting plate; Described lift cylinder fixed head is arranged on R axle lift cylinder.
Described taking pictures is detected curing mechanism and is comprised CCD installing rack, CCD, light source fixing frame, light source, UV lamp, radium-shine fixed head and radium-shine, described CCD installing rack is arranged on the left side of ZR connecting plate, described CCD is arranged on CCD installing rack, described light source fixing frame is arranged on CCD installing rack, and light source is arranged on light source fixing frame; Described UV lamp is arranged on lift cylinder fixed head; The described radium-shine right side being arranged on lift cylinder fixed head by radium-shine fixed head.
Described glue applying mechanism comprises glue bucket fixed head, some plastic pin, glue dispensing valve door and glue bucket, and described glue bucket fixed head is arranged on the right side of ZR connecting plate, and glue bucket is arranged on glue bucket fixed head medial surface; Described some plastic pin is arranged on the front side of ZR connecting plate, and some plastic pin is connected with glue bucket, and by glue dispensing valve gate control glue inlet point plastic pin.
Described connect gluing mechanism comprise connect glue bucket support, connect glue bucket mount pad, connect glue bucket, fiber amplifier, fiber amplifier holder, sensor and sensor holder, the described glue bucket support that connects is fixedly mounted on base, connect glue bucket mount pad to be arranged on and to connect glue bucket stent ends, connect glue bucket and be arranged on and connect on glue bucket mount pad; Described connecing on glue bucket support is provided with fiber amplifier by fiber amplifier holder, described in connect on glue bucket mount pad, by sensor holder, sensor be installed.
R axis mechanism can be transported to standard operation position by described X-axis mechanism, Y-axis mechanism, Z-axis mechanism, and its move distance in X-direction, Y direction and Z-direction is determined by X-axis photoelectric sensor, Y-axis photoelectric sensor and Z axis photoelectric sensor respectively; When a plastic pin is after standard operation location point glue, CCD takes pictures contraposition, and whether radium-shine test point glue qualified, after spot gluing lattice, UV lamp again to a glue position baking, by drying adhesive; When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents glue from dropping in mechanism, affects institution staff.
As preferably, described X-axis mechanism comprises X-axis motor, X-axis shaft coupling, the linear module of X-axis, the linear module slide block of X-axis, X-axis slide rail, X-axis slide block, X-axis photoelectric sensor and X-axis sensing chip, the linear module of described X-axis, X-axis slide rail and X-axis photoelectric sensor are arranged on base respectively, and the linear module of X-axis and X-axis slide rail are parallel to each other; Described X-axis slide rail coordinates X-axis slide block is installed, the linear module of X-axis coordinates the linear module slide block of X-axis is installed; Described X-axis motor is linked together by X-axis shaft coupling and the linear module of X-axis; The linear module slide block of described X-axis and X-axis slide block are connected to XY connecting plate, and X-axis sensing chip is arranged on the bottom of XY connecting plate.
As preferably, described Y-axis mechanism comprises y-axis motor, Y-axis shaft coupling, the linear module of Y-axis, Y-axis photoelectric sensor and Y-axis sensing chip, and the linear module of described Y-axis and Y-axis photoelectric sensor are arranged on XY connecting plate respectively; Described y-axis motor is linked together by Y-axis shaft coupling and the linear module of Y-axis; The linear module of described Y-axis is connected to YZ connecting plate, and Y-axis sensing chip is arranged on the side of YZ connecting plate.
As preferably, described Z-axis mechanism comprises Z axis motor, Z axis shaft coupling, z axis module, Z axis module connecting plate, Z axis photoelectric sensor and Z axis sensing chip, described Z axis motor is linked together by Z axis shaft coupling and z axis module, z axis module back is connected to Z axis module connecting plate, and Z axis module connecting plate and YZ connecting plate link together; Described z axis module is positively connected with ZR connecting plate, and the back of described ZR connecting plate is connected to Z axis photoelectric sensor, and Z axis mounting bar is arranged on the side of Z axis module connecting plate.
As preferably, described X-axis photoelectric sensor, Y-axis photoelectric sensor and and Z axis photoelectric sensor have three respectively, be respectively used to the move distance determining X-direction, Y direction and Z-direction.
Beneficial effect of the present invention is:
R axis mechanism can be transported to standard operation position by X-axis mechanism, Y-axis mechanism, Z-axis mechanism by the present invention, whole mechanism is used for product point glue and solidifies, point plastic pin is at standard operation location point glue, CCD is used for contraposition of taking pictures, whether radium-shine detection is qualified, after spot gluing lattice, UV lamp toasts, by drying adhesive facing to some glue position.When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents glue from dropping in mechanism, affects institution staff.Point glue position of the present invention is accurate, and can realize fully automatic working, operating efficiency is high, improves the quality of product, reduces the labour intensity of workman.
Accompanying drawing explanation
Figure l is structural representation of the present invention;
Fig. 2 is R axis mechanism of the present invention, takes pictures and detect the structural representation of curing mechanism and glue applying mechanism;
Fig. 3 is the structural representation connecing gluing mechanism of the present invention.
In figure l ~ 3: I-X axis mechanism; II-Y axis mechanism; III-Z axis mechanism; IV-R axis mechanism; V-takes pictures detection curing mechanism; VI 1 glue applying mechanism; VII 1 connect gluing mechanism; 1-base; 2-XY connecting plate; 3-YZ connecting plate; 4-ZR connecting plate; 5-X spindle motor; 6-X axle shaft coupling; 7-X axis linear module; 8-X axis linear module slide block; 9-X axle slide rail; 10-X axle slide block; 11-X axis photoelectric sensor; 12-X axle sensing chip; 13-Y spindle motor; 14-Y axle shaft coupling; 15-Y axis linear module; 16-Y axis photoelectric sensor; 17-Y axle sensing chip; 18-2 spindle motor; 19-2 axle shaft coupling; 20-2 axis linear module; 21-2 axle module connecting plate; 22-2 axis photoelectric sensor; 23-2 axle sensing chip; 24-R axle lift cylinder; 25-lift cylinder fixed head; 26-CCD installing rack; 27-CCD; 28-light source fixing frame; 29-light source; 30-UV lamp; The radium-shine fixed head of 31-; 32-is radium-shine; 33-glue bucket fixed head; 34-point plastic pin; 35-glue dispensing valve door; 36-glue bucket; 37-connects glue bucket support; 38-connects glue bucket mount pad; 39-connects glue bucket; 40-fiber amplifier; 41-fiber amplifier holder; 42-sensor; 43-sensor holder.
Detailed description of the invention
Embodiment, see accompanying drawing l ~ 3, a kind of some adhesive curing mechanism, it comprises base l, X-axis mechanism I, XY connecting plate 2, Y-axis mechanism II, YZ connecting plate 3, Z-axis mechanism III, ZR connecting plate 4, R axis mechanism IV, takes pictures and detect curing mechanism V, glue applying mechanism VI and connect gluing mechanism VII, described X-axis mechanism is arranged on base, and Y-axis mechanism is arranged in X-axis mechanism by XY connecting plate; Described Z-axis mechanism is arranged in Y-axis mechanism by YZ connecting plate.
Described X-axis mechanism I comprises X-axis motor 5, X-axis shaft coupling 6, the linear module of X-axis 7, the linear module slide block 8 of X-axis, X-axis slide rail 9, X-axis slide block 10, X-axis photoelectric sensor II and X-axis sensing chip 12, the linear module of described X-axis, X-axis slide rail and X-axis photoelectric sensor are arranged on base respectively, X-axis photoelectric sensor has three, and the linear module of X-axis and X-axis slide rail are parallel to each other; Described X-axis slide rail coordinates X-axis slide block is installed, the linear module of X-axis coordinates the linear module slide block of X-axis is installed; Described X-axis motor is linked together by X-axis shaft coupling and the linear module of X-axis; The linear module slide block of described X-axis and X-axis slide block are connected to XY connecting plate, and X-axis sensing chip is arranged on the bottom of XY connecting plate.
Described Y-axis mechanism II comprises y-axis motor 13, Y-axis shaft coupling 14, the linear module 15 of Y-axis, Y-axis photoelectric sensor 16 and Y-axis sensing chip 17, and the linear module of described Y-axis and Y-axis photoelectric sensor are arranged on XY connecting plate respectively, and Y-axis photoelectric sensor has three; Described y-axis motor is linked together by Y-axis shaft coupling and the linear module of Y-axis; The linear module of described Y-axis is connected to YZ connecting plate, and Y-axis sensing chip is arranged on the side of YZ connecting plate.
Described Z-axis mechanism III comprises Z axis motor 18, Z axis shaft coupling 19, z axis module 20, Z axis module connecting plate 21, Z axis photoelectric sensor 22 and Z axis sensing chip 23, described Z axis motor is linked together by Z axis shaft coupling and z axis module, z axis module back is connected to Z axis module connecting plate, and Z axis module connecting plate and YZ connecting plate link together; Described z axis module is positively connected with ZR connecting plate, and the back of described ZR connecting plate is connected to three Z axis photoelectric sensors, and Z axis mounting bar is arranged on the side of Z axis module connecting plate.
Described R axis mechanism IV comprises R axle lift cylinder 24 and lift cylinder fixed head 25, and described R axle lift cylinder is connected on ZR connecting plate; Described lift cylinder fixed head is arranged on R axle lift cylinder.
The described detection curing mechanism V that takes pictures comprises CCD installing rack 26, CCD27, light source fixing frame 28, light source 29, UV lamp 30, radium-shine fixed head 31 and radium-shine 32, described CCD installing rack is arranged on the left side of ZR connecting plate, described CCD is arranged on CCD installing rack, described light source fixing frame is arranged on CCD installing rack, and light source is arranged on light source fixing frame; Described UV lamp is arranged on lift cylinder fixed head; The described radium-shine right side being arranged on lift cylinder fixed head by radium-shine fixed head.
Described glue applying mechanism VI comprises glue bucket fixed head 33, some plastic pin 34, glue dispensing valve door 35 and glue bucket 36, and described glue bucket fixed head is arranged on the right side of ZR connecting plate, and glue bucket is arranged on glue bucket fixed head medial surface; Described some plastic pin is arranged on the front side of ZR connecting plate, and some plastic pin is connected with glue bucket, and by glue dispensing valve gate control glue inlet point plastic pin.
Described connect gluing mechanism VII comprise connect glue bucket support 37, connect glue bucket mount pad 38, connect glue bucket 39, fiber amplifier 40, fiber amplifier holder 41, sensor 42 and sensor holder 43, the described glue bucket support that connects is fixedly mounted on base, connect glue bucket mount pad to be arranged on and to connect glue bucket stent ends, connect glue bucket and be arranged on and connect on glue bucket mount pad; Described connecing on glue bucket support is provided with fiber amplifier by fiber amplifier holder, described in connect on glue bucket mount pad, by sensor holder, sensor be installed.
The course of work of the present invention: R axis mechanism can be transported to standard operation position by described X-axis mechanism, Y-axis mechanism, Z-axis mechanism, and its move distance in X-direction, Y direction and Z-direction is determined by X-axis photoelectric sensor, Y-axis photoelectric sensor and Z axis photoelectric sensor respectively; When a plastic pin is after standard operation location point glue, CCD takes pictures contraposition, and whether radium-shine test point glue qualified, after spot gluing lattice, UV lamp again to a glue position baking, by drying adhesive; When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents glue from dropping in mechanism, affects institution staff.
Above-described embodiment is the specific descriptions of carrying out the present invention; just the present invention is further described; can not be interpreted as limiting the scope of the present invention, those skilled in the art makes some nonessential improvement according to the content of foregoing invention and adjustment all falls within protection scope of the present invention.
Claims (5)
1. a Zhong Dian adhesive curing mechanism, it is characterized in that: it comprises base, X-axis mechanism, XY connecting plate, Y-axis mechanism, YZ connecting plate, Z-axis mechanism, ZR connecting plate, R axis mechanism, takes pictures and detect curing mechanism, glue applying mechanism and connect gluing mechanism, described X-axis mechanism is arranged on base, and Y-axis mechanism is arranged in X-axis mechanism by XY connecting plate; Described Z-axis mechanism is arranged in Y-axis mechanism by YZ connecting plate; Described R axis mechanism comprises R axle lift cylinder and lift cylinder fixed head, and described R axle lift cylinder is connected on ZR connecting plate; Described lift cylinder fixed head is arranged on R axle lift cylinder: described in take pictures and detect curing mechanism and comprise CCD installing rack, CCD, light source fixing frame, light source, UV lamp, radium-shine fixed head and radium-shine, described CCD installing rack is arranged on the left side of ZR connecting plate, described CCD is arranged on CCD installing rack, described light source fixing frame is arranged on CCD installing rack, and light source is arranged on light source fixing frame; Described UV lamp is arranged on lift cylinder fixed head; The described radium-shine right side being arranged on lift cylinder fixed head by radium-shine fixed head; Described glue applying mechanism comprises glue bucket fixed head, some plastic pin, glue dispensing valve door and glue bucket, and described glue bucket fixed head is arranged on the right side of ZR connecting plate, and glue bucket is arranged on glue bucket fixed head medial surface; Described some plastic pin is arranged on the front side of ZR connecting plate, and some plastic pin is connected with glue bucket, and by glue dispensing valve gate control glue inlet point plastic pin; Described connect gluing mechanism comprise connect glue bucket support, connect glue bucket mount pad, connect glue bucket, fiber amplifier, fiber amplifier holder, sensor and sensor holder, the described glue bucket support that connects is fixedly mounted on base, connect glue bucket mount pad to be arranged on and to connect glue bucket stent ends, connect glue bucket and be arranged on and connect on glue bucket mount pad; Described connecing on glue bucket support is provided with fiber amplifier by fiber amplifier holder, described in connect on glue bucket mount pad, by sensor holder, sensor be installed; R axis mechanism can be transported to standard operation position by described X-axis mechanism, Y-axis mechanism, Z-axis mechanism, and its move distance in X-direction, Y direction and Z-direction is determined by X-axis photoelectric sensor, Y-axis photoelectric sensor and Z axis photoelectric sensor respectively; When a plastic pin is after standard operation location point glue, CCD takes pictures contraposition, and whether radium-shine test point glue qualified, after spot gluing lattice, UV lamp again to a glue position baking, by drying adhesive; When not putting glue, some plastic pin is positioned at and meets glue bucket place, prevents glue from dropping in mechanism, affects institution staff.
2. the one point adhesive curing mechanism according to claim l, it is characterized in that: described X-axis mechanism comprises X-axis motor, X-axis shaft coupling, the linear module of X-axis, the linear module slide block of X-axis, X-axis slide rail, X-axis slide block, X-axis photoelectric sensor and X-axis sensing chip, the linear module of described X-axis, X-axis slide rail and X-axis photoelectric sensor are arranged on base respectively, and the linear module of X-axis and X-axis slide rail are parallel to each other; Described X-axis slide rail coordinates X-axis slide block is installed, the linear module of X-axis coordinates the linear module slide block of X-axis is installed; Described X-axis motor is linked together by X-axis shaft coupling and the linear module of X-axis; The linear module slide block of described X-axis and X-axis slide block are connected to XY connecting plate, and X-axis sensing chip is arranged on the bottom of XY connecting plate.
3. the one point adhesive curing mechanism according to claim l, it is characterized in that: described Y-axis mechanism comprises y-axis motor, Y-axis shaft coupling, the linear module of Y-axis, Y-axis photoelectric sensor and Y-axis sensing chip, and the linear module of described Y-axis and Y-axis photoelectric sensor are arranged on XY connecting plate respectively; Described y-axis motor is linked together by Y-axis shaft coupling and the linear module of Y-axis; The linear module of described Y-axis is connected to YZ connecting plate, and Y-axis sensing chip is arranged on the side of YZ connecting plate.
4. the one point adhesive curing mechanism according to claim l, it is characterized in that: described Z-axis mechanism comprises Z axis motor, Z axis shaft coupling, z axis module, Z axis module connecting plate, Z axis photoelectric sensor and Z axis sensing chip, described Z axis motor is linked together by Z axis shaft coupling and z axis module, z axis module back is connected to Z axis module connecting plate, and Z axis module connecting plate and YZ connecting plate link together; Described z axis module is positively connected with ZR connecting plate, and the back of described ZR connecting plate is connected to Z axis photoelectric sensor, and Z axis mounting bar is arranged on the side of Z axis module connecting plate.
5. the one point adhesive curing mechanism according to claim l, is characterized in that: described X-axis photoelectric sensor, Y-axis photoelectric sensor and and Z axis photoelectric sensor have three respectively, be respectively used to the move distance determining X-direction, Y direction and Z-direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410355399.5A CN105289935A (en) | 2014-07-25 | 2014-07-25 | Glue dispensing curing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410355399.5A CN105289935A (en) | 2014-07-25 | 2014-07-25 | Glue dispensing curing mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN105289935A true CN105289935A (en) | 2016-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410355399.5A Pending CN105289935A (en) | 2014-07-25 | 2014-07-25 | Glue dispensing curing mechanism |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105944913A (en) * | 2016-06-24 | 2016-09-21 | 苏州山河宇通光电科技有限公司 | Automatic glue injection machine |
| CN107583820A (en) * | 2017-09-26 | 2018-01-16 | 深圳双十科技有限公司 | A kind of point gum machine |
| CN107961951A (en) * | 2017-12-30 | 2018-04-27 | 昆山希盟自动化科技有限公司 | Semi-automatic boss double-station dispenser |
| CN112275571A (en) * | 2020-09-23 | 2021-01-29 | 深圳市轴心自控技术有限公司 | Dispensing real-time glue line detection equipment and method |
| CN112964703A (en) * | 2021-02-03 | 2021-06-15 | 深圳市腾盛精密装备股份有限公司 | Position detection method of colorless transparent volatile liquid |
-
2014
- 2014-07-25 CN CN201410355399.5A patent/CN105289935A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105944913A (en) * | 2016-06-24 | 2016-09-21 | 苏州山河宇通光电科技有限公司 | Automatic glue injection machine |
| CN105944913B (en) * | 2016-06-24 | 2018-08-14 | 苏州山河宇通光电科技有限公司 | Automatic glue injection machine |
| CN107583820A (en) * | 2017-09-26 | 2018-01-16 | 深圳双十科技有限公司 | A kind of point gum machine |
| CN107961951A (en) * | 2017-12-30 | 2018-04-27 | 昆山希盟自动化科技有限公司 | Semi-automatic boss double-station dispenser |
| CN112275571A (en) * | 2020-09-23 | 2021-01-29 | 深圳市轴心自控技术有限公司 | Dispensing real-time glue line detection equipment and method |
| CN112964703A (en) * | 2021-02-03 | 2021-06-15 | 深圳市腾盛精密装备股份有限公司 | Position detection method of colorless transparent volatile liquid |
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Application publication date: 20160203 |
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