CN203523137U - Circuit board and electronic device - Google Patents
Circuit board and electronic device Download PDFInfo
- Publication number
- CN203523137U CN203523137U CN201320582237.6U CN201320582237U CN203523137U CN 203523137 U CN203523137 U CN 203523137U CN 201320582237 U CN201320582237 U CN 201320582237U CN 203523137 U CN203523137 U CN 203523137U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat pipe
- heat
- graphite flake
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a circuit board and an electronic device. The circuit board comprises a substrate, a heating chip and a heat radiation structure, wherein the heating chip is positioned on the substrate, the heat radiation structure comprises a graphite flake and a heat pipe, the main body portion of the heat radiation structure is in heat conduction connection with the graphite flake, and one end of the heat radiation structure extends out of the graphite flake and is in heat conduction connection with the heating chip. The electronic device comprises a housing, and the circuit board arranged in the housing. Heat generated by the heating chip is transferred to the graphite flake through the heat pipe, and then dispersed by the graphite flake. Since the heat conductivity of the heat pipe is much better than other heat radiation media, such as graphite flake or heat conduction mud, heat generated by the heating chip can be transferred in a short time, thereby lowering the temperature of the heating chip and ensuring normal working of the heating chip.
Description
Technical field
The utility model relates to a kind of circuit board and electronic equipment, particularly relates to a kind of circuit board cheaply and containing the electronic equipment of this structure.
Background technology
Circuit board comprises substrate and is arranged on the various chips on substrate, chip is provided with the integrated circuit consisting of primary elements such as resistance, electric capacity or inductance, when described integrated circuit work, there is electric current to pass through, while flowing through resistance due to electric current, can produce heat, therefore the chip that contains resistance can generate heat, while operating when euthermic chip long-term work or with other euthermic chips, easily cause circuit board local temperature too high simultaneously.
Too high in order to prevent circuit board local temperature, available circuit plate conventionally by euthermic chip scattering device on substrate, and by radiator structure being set further for euthermic chip dispels the heat.Circuit board for fabric swatch limited space, such as circuit board of mobile phone etc., its conventional radiator structure is graphite flake or heat conduction mud, the quantity of graphite flake or heat conduction mud is determined according to the number of euthermic chip, an euthermic chip arranges a graphite flake or heat conduction mud, described graphite flake or heat conduction mud are arranged on euthermic chip periphery, for example, on the encapsulated layer of euthermic chip, and are connected with described euthermic chip heat conduction.
Because euthermic chip needs dispersed placement, the layout of circuit board is had relatively high expectations; The radiating efficiency of the heat radiation such as graphite flake or heat conduction mud material is lower, cannot effectively reduce at short notice temperature.
As can be seen here, above-mentioned existing circuit board, in structure and use, obviously still has inconvenience and defect, and is urgently further improved.The design people is research and innovation in addition actively, to founding a kind of circuit board of new structure, makes it have more practicality.
Utility model content
Main purpose of the present utility model is, a kind of circuit board of new structure is provided, and technical problem to be solved is to make it have higher radiating efficiency, thereby is more suitable for practicality, and has the value in industry.
Another object of the present utility model is, a kind of electronic equipment is provided, and technical problem to be solved is to make it have the circuit board that radiating efficiency is high, thereby is more suitable for practicality.
The object of utility model and solve its technical problem and adopt following technical scheme to realize.A kind of circuit board according to the utility model proposes, comprises substrate, euthermic chip and radiator structure, and described euthermic chip is positioned on described substrate, it is characterized in that, described radiator structure, comprising: graphite flake; And heat pipe, its main part is connected with described graphite flake heat conduction, and its one end leans out described graphite flake, and is connected with described euthermic chip heat conduction.
The purpose of this utility model and solve its technical problem and also can be applied to the following technical measures to achieve further.
Preferably, aforesaid circuit board, wherein said heat pipe is bonding by the first heat conduction bond and described graphite flake.
Preferably, aforesaid circuit board, wherein said the first heat conduction bond is heat-conducting silica gel sheet.
Preferably, aforesaid circuit board, wherein said euthermic chip, comprises at least two; At least two described euthermic chips, concentrated setting is on described substrate.
Preferably, aforesaid circuit board, wherein said at least two euthermic chips are bonding by the second heat conduction bond and described heat pipe.
Preferably, aforesaid circuit board, wherein said the second heat conduction bond is heat-conducting silica gel sheet.
Preferably, aforesaid circuit board, the main part of wherein said heat pipe is positioned at the midline position of described graphite flake.
Preferably, aforesaid circuit board, the main part of wherein said heat pipe runs through described graphite flake.
Preferably, aforesaid circuit board, wherein said heat pipe is the copper heat pipe of external diameter 0.6mm
The object of utility model and solve its technical problem and also adopt following technical scheme to realize.According to a kind of electronic equipment the utility model proposes, it comprises: housing; And above-mentioned circuit board, be positioned at described housing.
The purpose of this utility model and solve its technical problem and also can be applied to the following technical measures to achieve further.
Preferably, aforesaid electronic equipment, wherein said housing, its inner side is provided with corrugated heat pipe; Described heat pipe, its main part is laid in described corrugated heat pipe, and protrudes described corrugated heat pipe.
Preferably, aforesaid electronic equipment, wherein said housing, makes by integral forming process; Described heat pipe, is connected with described corrugated heat pipe by described integral forming process.
By technique scheme, the utility model circuit board at least has following advantages:
The circuit board that the present embodiment provides, transfer of heat euthermic chip being produced by heat pipe is to graphite flake, described heat is shed via graphite flake, because the thermal conductivity of heat pipe exceeds other heat eliminating mediums such as graphite flake, heat conduction mud far away, thereby the transfer of heat that can at short notice euthermic chip be produced, reduce the temperature of euthermic chip, protection euthermic chip is normally worked; Because this structure has improved radiating efficiency, even if the relative concentrated setting of euthermic chip is also difficult for causing circuit board local temperature too high, reduced the fabric swatch requirement of circuit board.
The utility model electronic equipment at least has following advantages:
The electronic equipment that the present embodiment provides; by use, there is the circuit board that heat pipe and graphite flake combine; the heat rapidly euthermic chip being produced sheds; thereby the transfer of heat that can at short notice euthermic chip be produced; reduce the temperature of euthermic chip; protection euthermic chip is normally worked, thereby guarantees electronic equipment normal operation.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, below with preferred embodiment of the present utility model and coordinate accompanying drawing to be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the board structure of circuit schematic diagram that the utility model one preferred embodiment provides;
Fig. 2 is the board structure of circuit schematic diagram that another preferred embodiment of the utility model provides;
Fig. 3 is the board structure of circuit schematic diagram that the another preferred embodiment of the utility model provides;
Fig. 4 is the electronic equipment schematic partial cross-sectional view that the utility model one preferred embodiment provides;
Embodiment
For further setting forth the utility model, be to reach technological means and the effect that predetermined utility model object is taked, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of circuit board, structure, feature and effect thereof to according to the utility model proposes, be described in detail as follows.In following explanation, the not necessarily same embodiment that different " embodiment " or " embodiment " refer to.In addition, special characteristic, structure or the feature in one or more embodiment can be combined by any suitable form.
As shown in Figure 1, a kind of circuit board that an embodiment of the present utility model proposes, during described circuit board work, can produce heat and fabric swatch narrow space, take circuit board of mobile phone as example, it comprises substrate 1, euthermic chip 2 and radiator structure 3, euthermic chip 2 is positioned on substrate 1, radiator structure 3 comprises graphite flake 31 and heat pipe 32, graphite flake 31 can be fixed on the substrate 1 of circuit board, also can be fixed on circuit board other mobile phone components around, the main part of heat pipe 32 and graphite flake 31 are by direct contact fixing or be connected by mode heat conduction such as Heat Conduction Material are bonding, one end of heat pipe 32 leans out graphite flake 31, and by welding, the modes such as Heat Conduction Material is bonding are connected with euthermic chip 2 heat conduction.
The circuit board that the present embodiment provides is when work, electric current is by euthermic chip 2, cause euthermic chip 2 heatings, the heat that heat pipe 32 produces euthermic chip 2 fast reaches on the graphite flake 31 of the other end, and heat spreads (as shown by the arrows in Figure 1) on graphite flake 31.
The circuit board that the present embodiment provides, transfer of heat euthermic chip being produced by heat pipe is to graphite flake, described heat is shed via graphite flake, because the thermal conductivity of heat pipe exceeds other heat eliminating mediums such as graphite flake, heat conduction mud far away, thereby the transfer of heat that can at short notice euthermic chip be produced, reduce the temperature of euthermic chip, protection euthermic chip is normally worked; Because this structure has improved radiating efficiency, even if the relative concentrated setting of euthermic chip is also difficult for causing circuit board local temperature too high, reduced the fabric swatch requirement of circuit board.
Preferably, heat pipe 32 is bonding by the first heat conduction bond and graphite flake 31, and air is hot non-conductor, can hinder the transmission of heat, by adopting heat conduction bond bonding, can reduce the air of heat pipe 32 and graphite flake 31 heat-conduction part positions, improve radiating efficiency.
The first described heat conduction bond can be for having the phase-change material, heat conduction mud etc. of bonding force, preferred heat-conducting silica gel sheet, and heat-conducting silica gel sheet has good fillibility and cementability, can better discharge the air of heat-conduction part position, further improves radiating efficiency.
As shown in Figure 2, another embodiment of the present utility model provides a kind of circuit board, compare with above-described embodiment, described circuit board comprises two euthermic chips 2 and two heat pipes 32, two euthermic chip 2 concentrated settings are on substrate 1, a corresponding heat pipe 32 of euthermic chip 2, is connected with graphite flake 31 by heat pipe 32.
The radiator structure providing due to the present embodiment has higher radiating efficiency, when circuit board is provided with two or more euthermic chips, even by euthermic chip centralized layout, also can disperse fast the heat that euthermic chip produces, chip centralized layout can save the cloth board space of circuit board.
As shown in Figure 3, another embodiment of the present invention provides a kind of circuit board, compare with first embodiment, described circuit board comprises two euthermic chips 2, also comprise one second heat conduction bond 33, second heat conduction bond 33 two euthermic chips 2 of covering and two euthermic chips 2 are bonding, and heat pipe 32 is pressed on the second heat conduction bond 33 bonding with the second heat conduction bond 33.
By adopting the second heat conduction bond bonding, different euthermic chips can be connected with same heat pipe for thermal conductivity, connect technique simple and saved the consumption of heat pipe, saved heat radiation cost.
Preferably, the second described heat conduction bond is heat-conducting silica gel sheet, and heat-conducting silica gel sheet has good fillibility and cementability, can better discharge the air of heat-conduction part position, further improves radiating efficiency.
Preferably, referring to Fig. 2, heat pipe 32 is linear pattern, and its main part is positioned at the midline position of graphite flake 31, and runs through graphite flake 31.
By heat pipe 32 being arranged on to the midline of graphite flake 31, make the graphite flake 31 of heat pipe 32 both sides can receive uniformly the heat that heat pipe 32 transmits, be convenient to heat along direction of arrow diffusion in Fig. 2, improved radiating efficiency.Heat pipe 32 can be the arbitrary shapes such as shaped form, arc line shaped.
Preferably, as shown in Figure 2, heat pipe 32 runs through graphite flake 31.Euthermic chip 2 produces after heat, this heat, along the rapid going down of heat pipe, is diffused into along the direction of arrow along heat pipe 32 on graphite flake 31, by making heat pipe 32 run through graphite flake 31, can make heat evenly be diffused at short notice on graphite flake 31, further improve radiating efficiency.
Preferably, heat pipe 32 is the copper pipe of external diameter 0.6mm, and due to the fabric swatch limited space of circuit board of mobile phone, this heat pipe takes up space less, can save cloth board space.
An embodiment of the present utility model provides a kind of electronic equipment, it comprises housing and circuit board, circuit board is provided by above-described embodiment, described circuit board is positioned at described housing, the graphite flake of described circuit board is attached to described housing inner side, and the main part of heat pipe and graphite flake are by direct contact and fix or be connected by mode heat conduction such as Heat Conduction Material are bonding.
The electronic equipment that the present embodiment provides; by use, there is the circuit board that heat pipe and graphite flake combine; the heat rapidly euthermic chip being produced sheds; thereby the transfer of heat that can at short notice euthermic chip be produced; reduce the temperature of euthermic chip; protection euthermic chip is normally worked, thereby guarantees electronic equipment normal operation.
Referring to Fig. 4, another embodiment of the present utility model provides a kind of electronic equipment, it comprises housing 4 and circuit board, the inner side of housing 4 is provided with corrugated heat pipe 41, the circuit board that described circuit board selects above-described embodiment to provide, described circuit board is positioned at housing 4, the heat pipe 32 of described circuit board, its main part is laid in corrugated heat pipe 41, its one end leans out corrugated heat pipe 41, be connected with euthermic chip heat conduction, as shown in Figure 4, the external diameter of heat pipe 32 is greater than the degree of depth of corrugated heat pipe 41, its top part is protruded corrugated heat pipe 41, graphite flake 31 can be attached on housing 4 madial walls, thereby be connected with heat pipe 32 heat conduction, also can be attached on the interior miscellaneous part of housing 4, the part of protruding corrugated heat pipe 41 by heat pipe 32 is connected with heat pipe 32 heat conduction.
By the main part of heat pipe is arranged in the corrugated heat pipe on housing, further saved enclosure interior space, be conducive to circuit board fabric swatch and reduce electronic equipment thickness.
Preferably, housing 4 is one-body molded by Shooting Technique by plastic material, and heat pipe 32 is connected with corrugated heat pipe 41 by the Shooting Technique of housing 4.
By integral forming process, heat pipe is connected with housing, has improved globality and the switching performance of heat pipe and housing.
The above, it is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, although the utility model discloses as above with preferred embodiment, yet not in order to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solutions of the utility model, any simple modification of above embodiment being done according to technical spirit of the present utility model, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (12)
1. a circuit board, comprises substrate, euthermic chip and radiator structure, and described euthermic chip is positioned on described substrate, it is characterized in that, described radiator structure, comprising:
Graphite flake; And
Heat pipe, its main part is connected with described graphite flake heat conduction, and its one end leans out described graphite flake, and is connected with described euthermic chip heat conduction.
2. circuit board according to claim 1, is characterized in that, described heat pipe is bonding by the first heat conduction bond and described graphite flake.
3. circuit board according to claim 2, is characterized in that, the first described heat conduction bond is heat-conducting silica gel sheet.
4. according to the circuit board described in claim 1-3 any one, it is characterized in that:
Described euthermic chip, comprises at least two;
At least two described euthermic chips, concentrated setting is on described substrate.
5. circuit board according to claim 4, is characterized in that, at least two described euthermic chips are bonding by the second heat conduction bond and described heat pipe.
6. circuit board according to claim 5, is characterized in that, the second described heat conduction bond is heat-conducting silica gel sheet.
7. according to the circuit board described in claim 1-3 any one, it is characterized in that, the main part of described heat pipe is positioned at the midline position of described graphite flake.
8. according to the circuit board described in claim 1-3 any one, it is characterized in that, the main part of described heat pipe runs through described graphite flake.
9. the circuit board of stating according to claim 1-3 any one office, is characterized in that, described heat pipe is the copper heat pipe of external diameter 0.6mm.
10. an electronic equipment, is characterized in that, it comprises:
Housing; And
Circuit board described in claim 1-9 any one, is positioned at described housing.
11. electronic equipments according to claim 10, is characterized in that:
Described housing, its inner side is provided with corrugated heat pipe;
Described heat pipe, its main part is laid in described corrugated heat pipe, and protrudes described corrugated heat pipe.
12. electronic equipments according to claim 11, is characterized in that:
Described housing, makes by integral forming process;
Described heat pipe, is connected with described corrugated heat pipe by described integral forming process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320582237.6U CN203523137U (en) | 2013-09-18 | 2013-09-18 | Circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320582237.6U CN203523137U (en) | 2013-09-18 | 2013-09-18 | Circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203523137U true CN203523137U (en) | 2014-04-02 |
Family
ID=50382000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320582237.6U Expired - Lifetime CN203523137U (en) | 2013-09-18 | 2013-09-18 | Circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203523137U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482856A (en) * | 2017-07-25 | 2017-12-15 | 江阴双马机电科技有限公司 | Automobile air conditioner motor |
| WO2021147477A1 (en) * | 2020-01-21 | 2021-07-29 | 华为技术有限公司 | Terminal apparatus |
| CN113631015A (en) * | 2021-07-16 | 2021-11-09 | 江苏矽美科散热科技有限公司 | Light and thin heat dissipation device for electrical equipment |
| WO2024041017A1 (en) * | 2022-08-24 | 2024-02-29 | 北京嘉楠捷思信息技术有限公司 | Electronic device |
-
2013
- 2013-09-18 CN CN201320582237.6U patent/CN203523137U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107482856A (en) * | 2017-07-25 | 2017-12-15 | 江阴双马机电科技有限公司 | Automobile air conditioner motor |
| CN107482856B (en) * | 2017-07-25 | 2019-11-12 | 江阴双马机电科技有限公司 | Automobile air conditioner motor |
| WO2021147477A1 (en) * | 2020-01-21 | 2021-07-29 | 华为技术有限公司 | Terminal apparatus |
| CN113225971A (en) * | 2020-01-21 | 2021-08-06 | 华为技术有限公司 | Terminal equipment |
| CN113631015A (en) * | 2021-07-16 | 2021-11-09 | 江苏矽美科散热科技有限公司 | Light and thin heat dissipation device for electrical equipment |
| WO2024041017A1 (en) * | 2022-08-24 | 2024-02-29 | 北京嘉楠捷思信息技术有限公司 | Electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100499985C (en) | Thermally conductive member and cooling system using the same | |
| CN203896662U (en) | Mobile terminal composite type heat radiating structure and mobile phone | |
| CN203523137U (en) | Circuit board and electronic device | |
| CN203251556U (en) | Heat dissipation structure of electronic shielding cover | |
| CN105163485A (en) | Heat conducting substrate for heating device and heating device and manufacturing method thereof | |
| CN202931733U (en) | Portable electronic device | |
| CN207425975U (en) | A kind of power battery module with heat management device | |
| CN208014680U (en) | Cooling device and frequency converter | |
| CN209767915U (en) | PCB board with rapid heat dissipation | |
| CN201064074Y (en) | Heat pipe radiator | |
| CN207458925U (en) | A kind of IGBT radiator structures in PTC water heaters | |
| CN204157202U (en) | A kind of liquid-cooling heat radiation coldplate | |
| CN207459123U (en) | Battery management system and its radiator structure | |
| CN105552049A (en) | Integrated liquid cooling heat sink device of power module and bottom plate used by power module | |
| CN109152310A (en) | A kind of more circular arc microchannel heat sinks | |
| CN212013180U (en) | Thickened copper-plated large-current-resistant heat dissipation circuit board | |
| CN211606913U (en) | Easy radiating circuit board | |
| CN109103156A (en) | A kind of fractals microchannel heat sink | |
| CN211321839U (en) | Radiator with built-in power resistor | |
| CN203703900U (en) | Upright-type heat-dissipation structure with plastic heat-dissipation lamp body for LED lamp | |
| CN209497788U (en) | A multi-arc micro-channel cooling device | |
| KR200472110Y1 (en) | Boiler assembly for heating and cooling water mat | |
| CN207340394U (en) | A kind of water-filled radiator of labyrinth structure | |
| WO2017000747A1 (en) | Cooling plate, lithium-ion battery module, and automobile | |
| CN213919624U (en) | 3D printer bottom heat preservation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |