CN203444717U - LED display screen panel with high pixel density - Google Patents

LED display screen panel with high pixel density Download PDF

Info

Publication number
CN203444717U
CN203444717U CN201320551571.5U CN201320551571U CN203444717U CN 203444717 U CN203444717 U CN 203444717U CN 201320551571 U CN201320551571 U CN 201320551571U CN 203444717 U CN203444717 U CN 203444717U
Authority
CN
China
Prior art keywords
circuit board
display screen
screen panel
pixel density
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320551571.5U
Other languages
Chinese (zh)
Inventor
马友治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhang Jinzhi
Original Assignee
WEIFANG BORUI OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WEIFANG BORUI OPTOELECTRONIC TECHNOLOGY Co Ltd filed Critical WEIFANG BORUI OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201320551571.5U priority Critical patent/CN203444717U/en
Application granted granted Critical
Publication of CN203444717U publication Critical patent/CN203444717U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The utility model discloses an LED display screen panel with high pixel density. The LED display screen panel with the high pixel density comprises a circuit board, wherein a plurality of LED flip chips are mounted on the circuit board according to pixels, positive electrodes of the LED flip chips are electrically connected with the positive pole of a power source of the circuit board, negative electrodes of the LED flip chips are electrically connected with the negative pole of the power source of the circuit board, a transparent mask covers the circuit board, and the transparent mask and the circuit board are combined to form a closed display screen panel body. The LED display screen panel with the high pixel density is high in pixel density, the requirement of display screens for the high pixel density can be met, stability is high, and the service life is long.

Description

A kind of high pixel density LED display screen panel
Technical field
The utility model relates to LED technical field, specifically, relates to a kind of high pixel density LED display screen panel.
Background technology
LED lamp belongs to cold light source, have thermal value low, use the advantages such as energy-conservation, brightness is large and the life-span is long, so LED lamp obtained application more and more widely, such as being used in display screen industry etc.LED display is the novel information display technique that the fast development of the later stage eighties is got up, and utilizes the lattice module that light emitting diode forms to form basic display unit.In recent years along with the rapid raising of LED manufacturing technology, LED display technology relies on reliability high, long service life, adaptive capacity to environment is strong, cost performance is compared with high, in the short more than ten years, shoot up as the mainstream technology of flat pannel display, in fields such as commercial advertisement, information issue, stadium institute and stage performances, be widely used.
But current LED display is the not high problem of ubiquity picture element density because single led lamp pearl area occupied is large, therefore its picture element density does not reach household electrical appliance, as the requirement of the display screen matrix density of computer, TV etc., so LED display can't be for household electrical appliance industry.Although OLED (Organic Light Emitting Diode) display screen occurring is at present compared with LED display, it has self luminous characteristic, picture element density is high, its picture element density can reach the requirement for picture element density of household electrical appliance, but the stability of OLED display screen is bad, serviceable life is short, is not also widely used.
In addition, existing LED lamp pearl needs to use ultrasonic soldering gold thread in encapsulation process, in the process of welding gold thread, gold goal is easily melted at the two ends of gold thread, if be used in outdoor display screen, display screen is subject in the situation of the expansions such as the sun is exposed to the sun out of doors, and gold goal easily comes off and causes rosin joint, make its contact bad, cause display screen dead point rate high.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of picture element density high, can meet the high pixel density LED display screen panel that display screen that picture element density is had relatively high expectations requires.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of high pixel density LED display screen panel, comprise circuit board, on described circuit board, according to Pixel arrangement, be pasted with some brilliant LED chips that cover, describedly cover the positive electrode of brilliant LED chip and the positive source of described circuit board is electrically connected to, describedly cover the negative electrode of brilliant LED chip and the power cathode of described circuit board is electrically connected to, on described circuit board, be covered with transparent face mask, described transparent face mask is combined with described circuit board and is formed the display screen panel sealing.
Preferably, in described display screen panel, between described transparent face mask and described circuit board, form the vacuum cavity of sealing.
Preferably, described in some, cover brilliant LED chip and comprise that redness is covered brilliant LED chip, green covers brilliant LED chip and blueness is covered brilliant LED chip.
Preferably, the brilliant LED chip surface of covering on described circuit board is covered with cancellated film, and described film is between described circuit board and described transparent face mask.
Preferably, described film is plastic sheeting.
Adopted after technique scheme, the beneficial effects of the utility model are:
1. high pixel density LED display screen panel of the present utility model, need not buy again LED(light emitting diode) finished product of LED of manufacturer, but directly mount, cover brilliant LED chip on circuit board, then use eutectic solder to cover the positive electrode of brilliant LED chip and the positive source eutectic of described circuit board is directly welded to connect by described, by described, cover the negative electrode of brilliant LED chip and the power cathode eutectic of described circuit board is welded to connect.Like this, need not re-use chip set and gold thread in finished product of LED, save the shared large quantity space of chip set and gold thread, take up room little, thereby it is tightr to make to cover the Pixel arrangement of brilliant LED chip on circuit board, greatly improve its picture element density, thereby can produce the LED display of high pixel density.Solved existing LED display because picture element density is low, do not reached household electrical appliance, as the problem of the requirement of the display screen matrix density of computer, TV etc.Therefore, high pixel density LED display screen panel of the present utility model, its picture element density is high, again than OLED display screen good stability and long service life, is more suitable for being applied to the display screen of household electrical appliance etc.In addition, high pixel density LED display screen panel of the present utility model, need not re-use ultrasonic soldering gold goal, has solved display screen out of doors and has been subject in the situation of the expansions such as the sun is exposed to the sun, gold goal easily comes off and causes the problem of rosin joint, has reduced display screen dead point rate.
2. high pixel density LED display screen panel of the present utility model, the cavity of the sealing between described circuit board and described transparent face mask is evacuated, to protect the exposed brilliant LED chip that covers.Thereby make the solder joint on circuit board be not easy corrosion, circuit board is played a very good protection, extended the serviceable life of high pixel density LED display screen panel of the present utility model.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail:
Fig. 1 is the structural representation of high pixel density LED display screen panel of the present utility model;
Fig. 2 is the principle schematic of covering brilliant LED chip in Fig. 1;
Fig. 3 is the structural representation that covers brilliant LED chip in Fig. 1;
In figure: 1, circuit board; 2, cover brilliant LED chip; 21, substrate; 22, projection; 23, wafer; 3, film; 4, transparent face mask.
Embodiment
Fig. 1 is the structural representation of high pixel density LED display screen panel of the present utility model; Fig. 2 is the principle schematic of covering brilliant LED chip in Fig. 1; Fig. 3 is the structural representation that covers brilliant LED chip in Fig. 1.
With reference to Fig. 1, Fig. 2 and Fig. 3, high pixel density LED display screen panel of the present utility model, comprise circuit board 1, on circuit board 1, according to Pixel arrangement, be pasted with some brilliant LED chips 2 that cover, the positive electrode that covers brilliant LED chip 2 is electrically connected to the positive source of circuit board 1, the negative electrode that covers brilliant LED chip 2 is electrically connected to the power cathode of circuit board 1, is covered with transparent face mask 4 on circuit board 1, transparent face mask 4 and the display screen panel of circuit board 1 in conjunction with formation sealing.
In the present embodiment, in display screen panel, between transparent face mask 4 and circuit board 1, form the vacuum cavity of sealing.Somely cover brilliant LED chip 2 and comprise that redness is covered brilliant LED chip, green covers brilliant LED chip and blueness is covered brilliant LED chip.Brilliant LED chip 2 surfaces of covering on circuit board 1 are covered with cancellated film 3, and film 3 is between circuit board 1 and transparent face mask 4.Film 3 adopts the plastic sheeting of printing opacity to make, and for blocking circuit board 1 and changing the lighting angle that covers brilliant LED chip 2, avoids invalid mixed light.
Wherein, covering brilliant LED chip 2 is chips made from Flip Chip, Flip Chip is by the front of wafer conversely, between wafer and substrate and the periphery of circuit use projection to connect, that is to say, by wafer, substrate, projection, formed a space, and circuit structure is just in this inside, space.The chip encapsulating like this has the advantages such as volume is little, performance is high, line is short.
The method for making of high pixel density LED display screen panel of the present utility model, comprises the following steps:
A. prepare to meet the circuit board 1 of picture element density requirement;
B. will cover brilliant LED chip 2 is fixed on circuit board 1 according to Pixel arrangement bonding;
C. use eutectic solder to cover the positive electrode of brilliant LED chip 2 and the positive source eutectic of circuit board 1 is welded to connect, the negative electrode that covers brilliant LED chip 2 is electrically connected to the power cathode of circuit board 1;
D., transparent face mask 4 is set on circuit board 1, between circuit board 1 and transparent face mask 4, forms the cavity of sealing;
E. the brilliant LED chip surface of covering on circuit board covers cancellated film, and makes described film between described circuit board and described transparent face mask;
F. the cavity of the sealing between circuit board 1 and transparent face mask 4 is evacuated, to protect the exposed brilliant LED chip that covers.
Certainly, in manufacturing process, also comprise some known process steps, for example circuit board check, driving power welding etc.At this, do not repeat one by one.
High pixel density LED display screen panel of the present utility model, need not buy again LED(light emitting diode) finished product of LED of manufacturer, but directly mount, cover brilliant LED chip 2 on circuit board, then use eutectic solder to cover the positive electrode of brilliant LED chip 2 and the positive source eutectic of circuit board 1 is welded to connect, will cover the negative electrode of brilliant LED chip 2 and the power cathode eutectic of circuit board 1 is welded to connect.Like this, need not re-use chip set and gold thread in finished product of LED, save the shared large quantity space of chip set and gold thread, take up room little, thereby it is tightr to make to cover the Pixel arrangement of brilliant LED chip 2 on circuit board 1, greatly improved its picture element density, the pixel of the display screen that can make than common LED chip avoids improving several times to tens times.Thereby can produce the LED display of high pixel density.Solved existing LED display because picture element density is low, do not reached household electrical appliance, as the problem of the requirement of the display screen matrix density of computer, TV etc.Therefore, high pixel density LED display screen panel of the present utility model, its picture element density is high, again than OLED display screen good stability and long service life, is more suitable for being applied to the display screen of household electrical appliance etc.In addition, high pixel density LED display screen panel of the present utility model, need not re-use ultrasonic soldering gold goal, has solved display screen out of doors and has been subject in the situation of the expansions such as the sun is exposed to the sun, gold goal easily comes off and causes the problem of rosin joint, has reduced display screen dead point rate.
High pixel density LED display screen panel of the present utility model, the cavity of the sealing between circuit board 1 and transparent face mask 4 is evacuated, to protect the exposed brilliant LED chip that covers.Thereby make the solder joint on circuit board 1 be not easy corrosion, circuit board 1 is played a very good protection, extended the serviceable life of high pixel density LED display screen panel of the present utility model.
The above is giving an example of the utility model preferred forms, and the part of wherein not addressing is in detail those of ordinary skills' common practise.Protection domain of the present utility model is as the criterion with the content of claim, and any equivalent transformation carrying out based on technology enlightenment of the present utility model, also within protection domain of the present utility model.

Claims (5)

1. a high pixel density LED display screen panel, it is characterized in that: comprise circuit board, on described circuit board, according to Pixel arrangement, be pasted with some brilliant LED chips that cover, describedly cover the positive electrode of brilliant LED chip and the positive source of described circuit board is electrically connected to, describedly cover the negative electrode of brilliant LED chip and the power cathode of described circuit board is electrically connected to, on described circuit board, be covered with transparent face mask, described transparent face mask is combined with described circuit board and is formed the display screen panel sealing.
2. high pixel density LED display screen panel as claimed in claim 1, is characterized in that: the vacuum cavity that forms sealing in described display screen panel between described transparent face mask and described circuit board.
3. high pixel density LED display screen panel as claimed in claim 1, is characterized in that: described in some, cover brilliant LED chip and comprise that redness is covered brilliant LED chip, green covers brilliant LED chip and blueness is covered brilliant LED chip.
4. the high pixel density LED display screen panel as described in claims 1 to 3 any one, is characterized in that: the brilliant LED chip surface of covering on described circuit board is covered with cancellated film, and described film is between described circuit board and described transparent face mask.
5. high pixel density LED display screen panel as claimed in claim 4, is characterized in that: described film is plastic sheeting.
CN201320551571.5U 2013-09-05 2013-09-05 LED display screen panel with high pixel density Expired - Lifetime CN203444717U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320551571.5U CN203444717U (en) 2013-09-05 2013-09-05 LED display screen panel with high pixel density

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320551571.5U CN203444717U (en) 2013-09-05 2013-09-05 LED display screen panel with high pixel density

Publications (1)

Publication Number Publication Date
CN203444717U true CN203444717U (en) 2014-02-19

Family

ID=50095746

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320551571.5U Expired - Lifetime CN203444717U (en) 2013-09-05 2013-09-05 LED display screen panel with high pixel density

Country Status (1)

Country Link
CN (1) CN203444717U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103426379A (en) * 2013-09-05 2013-12-04 潍坊博瑞光电科技有限公司 High pixel density LED display panel and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103426379A (en) * 2013-09-05 2013-12-04 潍坊博瑞光电科技有限公司 High pixel density LED display panel and manufacturing method thereof

Similar Documents

Publication Publication Date Title
CN103715230B (en) A kind of transparent OLED device and its display device
CN102751308B (en) Organic light emitting diode (OLED) display panel and OLED spliced display screen with same
JP2011108651A (en) Organic photoelectric device
CN101696790A (en) High-power LED heat-dissipation packaging structure
CN109859644A (en) Display panel and display module
CN103426379B (en) A kind of high pixel density LED display panel and preparation method thereof
TW201436286A (en) Manufacturing method of light emitting diode array and manufacturing method of light emitting diode display device
CN207316663U (en) A kind of LED decorative lamp for assembling splicing
CN203444717U (en) LED display screen panel with high pixel density
CN107359267B (en) A kind of AMOLED waterproof encapsulation structure
CN206595290U (en) A kind of LED lamp bead of moistureproof dust protection
CN205943350U (en) Module base plate and display device
CN201462635U (en) Lighting device
CN201075269Y (en) High-density LED lattice screen
CN202195331U (en) Light-emitting diode (LED) light string structure
CN202585527U (en) Packaging structure of novel green light LED
CN105448902A (en) LED light-emitting device and manufacture method thereof
CN205211756U (en) AMOLED (Active matrix/Organic light emitting diode) display device
CN210429819U (en) MicroLED packaging structure
TWI282700B (en) Organic electroluminescence display
CN102544342B (en) Heat radiator and electrode integrated heat radiating device and manufacturing method thereof
CN203351666U (en) Led module
CN201732811U (en) LED packaging structure of solderless gold wire
CN202102655U (en) SMD type LED outdoor screen
CN207116435U (en) A kind of organic electroluminescence device and display device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: ZHANG JINZHI

Free format text: FORMER OWNER: WEIFANG BORAY OPTOELECTRONIC TECHNOLOGY CO., LTD.

Effective date: 20150106

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 261061 WEIFANG, SHANDONG PROVINCE TO: 266000 QINGDAO, SHANDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20150106

Address after: Licang District of Shandong city in Qingdao province 266000 ten MeiAn Road No. 26

Patentee after: Zhang Jinzhi

Address before: 261061, high-tech Development Zone, Shandong, Weifang Province, north of Jade East Street, central high road, West high tech building, Room 403

Patentee before: WEIFANG BORAY OPTOELECTRONIC TECHNOLOGY CO.,LTD.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140219