CN103426379A - High pixel density LED display panel and manufacturing method thereof - Google Patents
High pixel density LED display panel and manufacturing method thereof Download PDFInfo
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- CN103426379A CN103426379A CN2013104009496A CN201310400949A CN103426379A CN 103426379 A CN103426379 A CN 103426379A CN 2013104009496 A CN2013104009496 A CN 2013104009496A CN 201310400949 A CN201310400949 A CN 201310400949A CN 103426379 A CN103426379 A CN 103426379A
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- pixel density
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- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 230000005496 eutectics Effects 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 241000218202 Coptis Species 0.000 description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
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- 229910052737 gold Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
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- 239000011159 matrix material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
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- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 238000004134 energy conservation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a high pixel density LED display panel which comprises a circuit board. A plurality of flip chip LED chips adhere to the circuit board according to pixel arrangement, the positive electrodes of the flip chip LED chips are electrically connected with the positive electrode of a power supply of the circuit board, the negative electrodes of the flip chip LED chips are electrically connected with the negative electrode of the power supply of the circuit board, a transparent mask is arranged on the circuit board in a covering mode, and the transparent mask and the circuit board are combined to form a sealed display panel. The invention further discloses a manufacturing method of the LED display panel. According to the high pixel density LED display panel and the manufacturing method of the high pixel density LED display panel, pixel density is high, requirements for high pixel density of a display screen can be met, stability is high, and the service life is long.
Description
Technical field
The present invention relates to the LED technical field, specifically, relate to a kind of high pixel density LED display screen panel and preparation method thereof.
Background technology
The LED lamp belongs to cold light source, have thermal value low, use the advantages such as energy-conservation, that brightness is large and the life-span is long, so the LED lamp obtained application more and more widely, such as being used in display screen industry etc.LED display is the novel information display technique that the fast development of the later stage eighties is got up, and utilizes the lattice module that light emitting diode forms to form basic display unit.In recent years along with the rapid raising of LED manufacturing technology, the LED display technology relies on reliability high, long service life, adaptive capacity to environment is strong, cost performance is than high, shoot up in the short more than ten years as the mainstream technology of flat pannel display, be widely used in fields such as commercial advertisement, information issue, stadium institute and stage performances.
But current LED display is the not high problem of ubiquity picture element density because single led lamp pearl area occupied is large, therefore its picture element density does not reach household electrical appliance, as the requirement of the display screen matrix density of computer, TV etc., so LED display can't be for the household electrical appliance industry.Although OLED (Organic Light Emitting Diode) display screen occurred is at present compared with LED display, it has self luminous characteristic, picture element density is high, its picture element density can reach the requirement for picture element density of household electrical appliance, but the stability of OLED display screen is bad, serviceable life is short, also is not widely used.
In addition, existing LED lamp pearl needs to use the ultrasonic soldering gold thread in encapsulation process, in the process of welding gold thread, gold goal is easily melted at the two ends of gold thread, if be used in outdoor display screen, display screen is subject in the situation of the expansions such as the sun is exposed to the sun out of doors, and gold goal easily comes off and causes rosin joint, make its contact bad, cause display screen dead point rate high.
Summary of the invention
First technical matters to be solved by this invention is: provide a kind of picture element density high, can meet the high pixel density LED display screen panel that display screen that picture element density is had relatively high expectations requires.
Second technical matters to be solved by this invention is: the method for making that a kind of picture element density is high, can meet the high pixel density LED display screen panel that display screen that picture element density is had relatively high expectations requires is provided.
For solving above-mentioned first technical matters, technical scheme of the present invention is:
A kind of high pixel density LED display screen panel, comprise circuit board, be pasted with some brilliant LED chips that cover according to Pixel arrangement on described circuit board, the described positive electrode that covers brilliant LED chip is electrically connected to the positive source of described circuit board, the described negative electrode that covers brilliant LED chip is electrically connected to the power cathode of described circuit board, be covered with transparent face mask on described circuit board, described transparent face mask is combined with described circuit board and is formed the display screen panel sealed.
Preferably, form the vacuum cavity of sealing in described display screen panel between described transparent face mask and described circuit board.
Preferably, somely describedly cover brilliant LED chip and comprise that redness is covered brilliant LED chip, green covers brilliant LED chip and blueness is covered brilliant LED chip.
Preferably, the brilliant LED chip surface of covering on described circuit board is covered with cancellated film, and described film is between described circuit board and described transparent face mask.
Preferably, described film is plastic sheeting.
For solving above-mentioned second technical matters, technical scheme of the present invention is:
A kind of method for making of high pixel density LED display screen panel, is characterized in that, comprises the following steps:
A. prepare to meet the circuit board of picture element density requirement;
B. will cover brilliant LED chip is fixed on described circuit board according to the Pixel arrangement bonding;
C. use eutectic solder to cover the positive electrode of brilliant LED chip and the positive source eutectic of described circuit board is welded to connect by described, the described negative electrode that covers brilliant LED chip is electrically connected to the power cathode of described circuit board;
D. on described circuit board, transparent face mask is set, forms the cavity of sealing between described circuit board and described transparent face mask.
Preferably, further comprising the steps of after steps d:
E. the cavity of the sealing between described circuit board and described transparent face mask is evacuated, to protect the exposed brilliant LED chip that covers.
Preferably, further comprising the steps of before steps d:
E1. the brilliant LED chip surface of covering on circuit board covers cancellated film, and makes described film between described circuit board and described transparent face mask.
After having adopted technique scheme, the invention has the beneficial effects as follows:
1. high pixel density LED display screen panel of the present invention, need not buy again the LED(light emitting diode) finished product of LED of manufacturer, cover brilliant LED chip but directly mount on circuit board, then use eutectic solder to cover the positive electrode of brilliant LED chip and the positive source eutectic of described circuit board directly is welded to connect by described, by described, cover the negative electrode of brilliant LED chip and the power cathode eutectic of described circuit board is welded to connect.Like this, need not re-use chip set and gold thread in finished product of LED, save the shared large quantity space of chip set and gold thread, take up room little, thereby it is tightr to make to cover the Pixel arrangement of brilliant LED chip on circuit board, greatly improve its picture element density, thereby can produce the LED display of high pixel density.Solved existing LED display because picture element density is low, do not reached household electrical appliance, as the problem of the requirement of the display screen matrix density of computer, TV etc.Therefore, high pixel density LED display screen panel of the present invention, its picture element density is high, again than OLED display screen good stability and long service life, is more suitable for being applied to the display screen of household electrical appliance etc.In addition, high pixel density LED display screen panel of the present invention, need not re-use the ultrasonic soldering gold goal, solved display screen out of doors and be subject to the sun and be exposed to the sun etc. in situation about expanding, and gold goal easily comes off and causes the problem of rosin joint, has reduced display screen dead point rate.
2. high pixel density LED display screen panel of the present invention, the cavity of the sealing between described circuit board and described transparent face mask is evacuated, to protect the exposed brilliant LED chip that covers.Thereby make the solder joint on circuit board be not easy corrosion, circuit board is played a very good protection, extended the serviceable life of high pixel density LED display screen panel of the present invention.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the structural representation of high pixel density LED display screen panel of the present invention;
Fig. 2 is the principle schematic of covering brilliant LED chip in Fig. 1;
Fig. 3 is the structural representation that covers brilliant LED chip in Fig. 1;
In figure: 1, circuit board; 2, cover brilliant LED chip; 21, substrate; 22, projection; 23, wafer; 3, film; 4, transparent face mask.
Embodiment
Fig. 1 is the structural representation of high pixel density LED display screen panel of the present invention; Fig. 2 is the principle schematic of covering brilliant LED chip in Fig. 1; Fig. 3 is the structural representation that covers brilliant LED chip in Fig. 1.
With reference to Fig. 1, Fig. 2 and Fig. 3, high pixel density LED display screen panel of the present invention, comprise circuit board 1, be pasted with some brilliant LED chips 2 that cover according to Pixel arrangement on circuit board 1, the positive electrode that covers brilliant LED chip 2 is electrically connected to the positive source of circuit board 1, the negative electrode that covers brilliant LED chip 2 is electrically connected to the power cathode of circuit board 1, is covered with transparent face mask 4 on circuit board 1, transparent face mask 4 and the display screen panel of circuit board 1 in conjunction with the formation sealing.
In the present embodiment, form the vacuum cavity of sealing in display screen panel between transparent face mask 4 and circuit board 1.Somely cover brilliant LED chip 2 and comprise that redness is covered brilliant LED chip, green covers brilliant LED chip and blueness is covered brilliant LED chip.Brilliant LED chip 2 surfaces of covering on circuit board 1 are covered with cancellated film 3, and film 3 is between circuit board 1 and transparent face mask 4.Film 3 adopts the plastic sheeting of printing opacity to make, and for blocking circuit board 1 and changing the lighting angle that covers brilliant LED chip 2, avoids invalid mixed light.
Wherein, covering brilliant LED chip 2 is chips made from Flip Chip, Flip Chip is by the front of wafer conversely, the periphery that reaches circuit between wafer and substrate is used projection to connect, that is to say, formed a space by wafer, substrate, projection, and circuit structure is just in this inside, space.The chip encapsulated like this has the advantages such as volume is little, performance is high, line is short.
The method for making of high pixel density LED display screen panel of the present invention comprises the following steps:
A. prepare to meet the circuit board 1 of picture element density requirement;
B. will cover brilliant LED chip 2 is fixed on circuit board 1 according to the Pixel arrangement bonding;
C. use eutectic solder will cover the positive electrode of brilliant LED chip 2 and the positive source eutectic of circuit board 1 is welded to connect, the negative electrode that will cover brilliant LED chip 2 is electrically connected to the power cathode of circuit board 1;
D., transparent face mask 4 is set on circuit board 1, forms the cavity of sealing between circuit board 1 and transparent face mask 4;
E. the brilliant LED chip surface of covering on circuit board covers cancellated film, and makes described film between described circuit board and described transparent face mask;
F. the cavity of the sealing between circuit board 1 and transparent face mask 4 is evacuated, to protect the exposed brilliant LED chip that covers.
Certainly, in manufacturing process, also comprise some known process steps, for example circuit board check, driving power welding etc.At this, do not repeat one by one.
High pixel density LED display screen panel of the present invention, need not buy again the LED(light emitting diode) finished product of LED of manufacturer, cover brilliant LED chip 2 but directly mount on circuit board, then use eutectic solder will cover the positive electrode of brilliant LED chip 2 and the positive source eutectic of circuit board 1 is welded to connect, will cover the negative electrode of brilliant LED chip 2 and the power cathode eutectic of circuit board 1 and be welded to connect.Like this, need not re-use chip set and gold thread in finished product of LED, save the shared large quantity space of chip set and gold thread, take up room little, thereby it is tightr to make to cover the Pixel arrangement of brilliant LED chip 2 on circuit board 1, greatly improved its picture element density, the pixel of the display screen that can make than common LED chip avoids improving several times to tens times.Thereby can produce the LED display of high pixel density.Solved existing LED display because picture element density is low, do not reached household electrical appliance, as the problem of the requirement of the display screen matrix density of computer, TV etc.Therefore, high pixel density LED display screen panel of the present invention, its picture element density is high, again than OLED display screen good stability and long service life, is more suitable for being applied to the display screen of household electrical appliance etc.In addition, high pixel density LED display screen panel of the present invention, need not re-use the ultrasonic soldering gold goal, solved display screen out of doors and be subject to the sun and be exposed to the sun etc. in situation about expanding, and gold goal easily comes off and causes the problem of rosin joint, has reduced display screen dead point rate.
High pixel density LED display screen panel of the present invention, the cavity of the sealing between circuit board 1 and transparent face mask 4 is evacuated, to protect the exposed brilliant LED chip that covers.Thereby make the solder joint on circuit board 1 be not easy corrosion, circuit board 1 is played a very good protection, extended the serviceable life of high pixel density LED display screen panel of the present invention.
The above is giving an example of best mode for carrying out the invention, and the part of wherein not addressing in detail is those of ordinary skills' common practise.Protection scope of the present invention is as the criterion with the content of claim, and any equivalent transformation carried out based on technology enlightenment of the present invention, also within protection scope of the present invention.
Claims (8)
1. a high pixel density LED display screen panel, it is characterized in that: comprise circuit board, be pasted with some brilliant LED chips that cover according to Pixel arrangement on described circuit board, the described positive electrode that covers brilliant LED chip is electrically connected to the positive source of described circuit board, the described negative electrode that covers brilliant LED chip is electrically connected to the power cathode of described circuit board, be covered with transparent face mask on described circuit board, described transparent face mask is combined with described circuit board and is formed the display screen panel sealed.
2. high pixel density LED display screen panel as claimed in claim 1, is characterized in that: the vacuum cavity that forms sealing in described display screen panel between described transparent face mask and described circuit board.
3. high pixel density LED display screen panel as claimed in claim 1 is characterized in that: somely describedly cover brilliant LED chip and comprise that redness is covered brilliant LED chip, green covers brilliant LED chip and blueness is covered brilliant LED chip.
4. high pixel density LED display screen panel as described as the claims 1 to 3 any one, it is characterized in that: the brilliant LED chip surface of covering on described circuit board is covered with cancellated film, and described film is between described circuit board and described transparent face mask.
5. high pixel density LED display screen panel as claimed in claim 4, it is characterized in that: described film is plastic sheeting.
6. the method for making of high pixel density LED display screen panel as claimed in claim 1, is characterized in that, comprises the following steps:
A. prepare to meet the circuit board of picture element density requirement;
B. will cover brilliant LED chip is fixed on described circuit board according to the Pixel arrangement bonding;
C. use eutectic solder to cover the positive electrode of brilliant LED chip and the positive source eutectic of described circuit board is welded to connect by described, the described negative electrode that covers brilliant LED chip is electrically connected to the power cathode of described circuit board;
D. on described circuit board, transparent face mask is set, forms the cavity of sealing between described circuit board and described transparent face mask.
7. the method for making of high pixel density LED display screen panel as claimed in claim 6, is characterized in that, further comprising the steps of after steps d:
E. the cavity of the sealing between described circuit board and described transparent face mask is evacuated, to protect the exposed brilliant LED chip that covers.
8. the method for making of high pixel density LED display screen panel as claimed in claim 7, is characterized in that, further comprising the steps of before steps d:
E1. the brilliant LED chip surface of covering on described circuit board covers cancellated film, and makes described film between described circuit board and described transparent face mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310400949.6A CN103426379B (en) | 2013-09-05 | 2013-09-05 | A kind of high pixel density LED display panel and preparation method thereof |
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| CN201310400949.6A CN103426379B (en) | 2013-09-05 | 2013-09-05 | A kind of high pixel density LED display panel and preparation method thereof |
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| CN103426379A true CN103426379A (en) | 2013-12-04 |
| CN103426379B CN103426379B (en) | 2016-04-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016070844A1 (en) * | 2014-11-07 | 2016-05-12 | Lighthouse Technologies Limited | Indoor smd led equipped for outdoor usage |
| US10229630B2 (en) | 2014-05-14 | 2019-03-12 | The Hong Kong University Of Science And Technology | Passive-matrix light-emitting diodes on silicon micro-display |
| WO2020252657A1 (en) * | 2019-06-18 | 2020-12-24 | 深圳金立翔视效科技有限公司 | Display device, and display system |
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| KR100746598B1 (en) * | 2004-12-10 | 2007-08-10 | 주식회사 대한전광 | Led display board and manufacturing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10229630B2 (en) | 2014-05-14 | 2019-03-12 | The Hong Kong University Of Science And Technology | Passive-matrix light-emitting diodes on silicon micro-display |
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| WO2020252657A1 (en) * | 2019-06-18 | 2020-12-24 | 深圳金立翔视效科技有限公司 | Display device, and display system |
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| CN103426379B (en) | 2016-04-06 |
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