CN203443718U - Apparatus for measuring electrostatic force of electrostatic chuck - Google Patents
Apparatus for measuring electrostatic force of electrostatic chuck Download PDFInfo
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- CN203443718U CN203443718U CN201320360935.1U CN201320360935U CN203443718U CN 203443718 U CN203443718 U CN 203443718U CN 201320360935 U CN201320360935 U CN 201320360935U CN 203443718 U CN203443718 U CN 203443718U
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- electrostatic
- vacuum cavity
- force
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- 238000005259 measurement Methods 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims description 6
- 239000011553 magnetic fluid Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 46
- 238000009434 installation Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 8
- 238000003795 desorption Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009659 non-destructive testing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
This utility model discloses an apparatus for measuring electrostatic force of an electrostatic chuck, comprising a vacuum chamber body, an electrostatic chuck, a force measurement sensor, a power device and a distance measurement sensor. Particularly, the electrostatic chuck is positioned within the vacuum chamber; the force measurement sensor can be movably arranged within the vacuum chamber in a direction of getting close to or getting away from the electrostatic chuck and the force measurement sensor is applicable to connecting to a wafer; the power device is arranged on the vacuum chamber and is connected to the force measurement sensor; and the distance measurement sensor is positioned within the vacuum. More complete and precise data can be obtained through the apparatus for measuring electrostatic force of the electrostatic chuck. In the process of manufacturing integrated circuits by using the electrostatic chuck, the electrostatic force can be effectively regulated such that the manufacture efficiency and quality are improved.
Description
Technical field
The utility model relates to integrated circuit manufacturing equipment design field, particularly a kind of device of electrostatic force of measurement of electrostatic chuck.
Background technology
Electrostatic chuck (electrostatic chuck, be called for short ESC or E-chuck) be a universal component in the IC manufacturing process such as etching, photoetching, PVD, CVD, Implantation, its Core Feature is to produce electrostatic force by inner electrostatic attraction electrode, wafer is evenly adsorbed on to its upper surface, to carry out IC technological process.Flatness and Temperature Distribution that the electrostatic force size that electrostatic chuck produces and distribution situation affect wafer, thereby IC shop characteristic is affected greatly, thus the detection of electrostatic force size and distribution situation the optimization of technological process with control in be an indispensable part.Need to design a set of function detection equipment for electrostatic chuck, for measuring the size of wafer suffered electrostatic force under adsorbed state, to improve shop characteristic, guarantee higher wafer manufacture quality.
Gap width between wafer and electrostatic chuck upper surface is micron dimension, is an important parameter that determines electrostatic force size, in theory square inversely proportional relation of electrostatic force size and gap width.Obtain the electrostatic force size of wafer when normal sorption state, must propose in order to differentiate the rational basis of wafer adsorption and desorption two states.The essence of desorption is that the suffered electrostatic force of wafer is less than some values, is not enough to wafer to be adsorbed on electrostatic chuck reliably, but also there is no at present clear and definite regulation or unified common recognition for the judgment basis of this threshold value.
Domestic and international existing measurement mechanism, all to wafer, to apply external force in some way to make its desorption, by direct observation or sensor, survey, at a time gap width reaches preset value, think wafer success desorption, now institute's externally applied forces is the size of wafer suffered electrostatic force in technological process.But electrostatic force with the increase in gap gradually, reduce smoothly, and be not mutatedly reduced to zero or certain little value, it is equivocal, very coarse therefore adopting this criterion, cannot guarantee that measurement result is the size of wafer suffered electrostatic force under adsorbed state.
For this reason, the measurement mechanism the utility model proposes, its object does not also lie in the electrostatic force size of measuring a certain moment, but obtain the relation that electrostatic force size changes with gap length, thereby find the electrostatic force optimal value in technological process, can launch more deep research to the mechanism of electrostatic chuck accordingly.
Utility model content
The utility model one of is intended to solve the problems of the technologies described above at least to a certain extent or at least provides a kind of useful business to select.For this reason, an object of the present utility model is to propose a kind of device of electrostatic force of simple in structure, the easy to detect and measurement of electrostatic chuck that precision is high.
Device according to the electrostatic force of measurement of electrostatic chuck of the present utility model, comprising: vacuum cavity, electrostatic chuck, force cell, propulsion system and distance measuring sensor.Particularly, described electrostatic chuck is located in described vacuum cavity; Described force cell is being located in described vacuum cavity movably near described electrostatic chuck with on away from the direction of described electrostatic chuck, and described force cell is suitable for connecting wafer; Described propulsion system are located on described vacuum cavity, and described propulsion system are connected with described force cell; Described distance measuring sensor is located in described vacuum cavity.
According to the device of the electrostatic force of measurement of electrostatic chuck of the present utility model, there is force cell and distance measuring sensor, can detect the electrostatic force of electrostatic chuck to wafer by force cell, and detect spacing between wafer and electrostatic chuck or the variation of spacing by distance measuring sensor, thereby draw the relation between electrostatic force and distance, can obtain more complete accurate data.Adopting electrostatic chuck to produce in the process of integrated circuit, can effectively regulate electrostatic force, thereby enhance productivity and quality.
In addition, according to the device of the electrostatic force of the above-mentioned measurement of electrostatic chuck of the utility model, can also there is following additional technical characterictic:
Described electrostatic chuck is located at the bottom in described vacuum cavity, and described propulsion system are located at the top of described vacuum cavity.Thus, sensor probe is arranged in wafer top, realizes Non-Destructive Testing, obtains the result of more realistic technological process.Electrostatic chuck is installed from cavity bottom; to hold with pipeline or the cable of the servicing unit such as protection electrostatic chuck bottom and helium generator, radio-frequency power supply, static power supply, be connected; and be easy to guarantee the installation site precision of electrostatic chuck, be convenient to change and dismounting.
The diapire of described vacuum cavity is provided with mounting hole, and described electrostatic chuck is provided with the mounting flange that coordinates to seal described mounting hole with described mounting hole.Thus, be convenient to install electrostatic chuck, improved the efficiency of assembling of device.
Described mounting flange and described vacuum cavity are bolted.Thus, improve further installation effectiveness, and be convenient to installation and removal, be convenient to replacing or the maintenance of electrostatic chuck.
Described propulsion system comprise linear electric motors, and the roof of described vacuum cavity is provided with support, and described linear electric motors are located on described support, and the output shaft of described linear electric motors stretches into described vacuum cavity and is connected with described force cell.Thus, adopt linear electric motors directly to drive wafer, error and the inhomogeneous situation of wafer desorption of having avoided intermediate transmission mechanism to cause, simultaneously compact conformation, requisite space is little, the gap of wafer and electrostatic chuck upper surface is converted into the vertical displacement of wafer in motion process and measures.
Between the output shaft of described linear electric motors and described vacuum cavity, be provided with magnetic fluid sealing ring.Thus, be convenient to the sealing of vacuum cavity.
Described force cell is provided with the sucker that is suitable for connecting wafer.Thus, be convenient to install wafer, make wafer stable, improved the stability of measurement mechanism.
Described vacuum cavity is provided with view window.Thus, can observe at any time measuring process, guarantee that measurement result correctness and wafer are not damaged.
The front end of described vacuum cavity opens wide and is sealed by described view window.Thus, be convenient to further observe.
Additional aspect of the present utility model and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage accompanying drawing below combination obviously and is easily understood becoming the description of embodiment, wherein:
Fig. 1 is the schematic diagram of device of electrostatic force of the measurement of electrostatic chuck of an embodiment of the present utility model;
Fig. 2 is the front view of device of electrostatic force of the measurement of electrostatic chuck of an embodiment of the present utility model;
Fig. 3 is the schematic diagram of vacuum cavity of device of electrostatic force of the measurement of electrostatic chuck of an embodiment of the present utility model.
Embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of indications such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " be only for describing object, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the present utility model, the implication of " a plurality of " is two or more, unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the terms such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be to be also electrically connected to; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term in the utility model.
In the utility model, unless otherwise clearly defined and limited, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but contact by the other feature between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic under Second Characteristic and tiltedly, or only represent that First Characteristic level height is less than Second Characteristic.
The device of electrostatic force of the measurement of electrostatic chuck of the utility model embodiment is described with reference to the accompanying drawings.
As shown in Figure 1 to Figure 3, the device according to the electrostatic force of the measurement of electrostatic chuck of the utility model embodiment, comprising: vacuum cavity 1, electrostatic chuck 2, force cell 4, propulsion system and distance measuring sensor (not shown).
Particularly, electrostatic chuck 2 is located in vacuum cavity 1.Force cell 4 is located at movably in vacuum cavity 1 near electrostatic chuck 2 and the direction (as shown in Figure 2 in a downward direction) away from electrostatic chuck 2, and force cell 4 is suitable for connecting wafer.Described propulsion system are located on vacuum cavity 1, and described propulsion system are connected with force cell 4.Described distance measuring sensor is located in vacuum cavity 1.Wherein, the electrostatic force of the electrostatic chuck 2 that force cell 4 is subject to for detection of wafer to be measured, distance measuring sensor is for detection of the variation in gap between wafer and electrostatic chuck 2, and propulsion system are for changing the spacing between wafer to be measured and electrostatic chuck 2.
According to the device of the electrostatic force of the measurement of electrostatic chuck of the utility model embodiment, there is force cell 4 and distance measuring sensor, can detect by force cell 4 electrostatic force of 2 pairs of wafers of electrostatic chuck, and detect spacing between wafer and electrostatic chuck 2 or the variation of spacing by distance measuring sensor, thereby draw the relation between electrostatic force and distance, can obtain more complete accurate data.Adopting electrostatic chuck 2 to produce in the process of integrated circuit, can effectively regulate electrostatic force, thereby enhance productivity and quality.
As depicted in figs. 1 and 2, according to an embodiment of the present utility model, electrostatic chuck 2 is located at bottom in vacuum cavity 1 (as shown in Figure 2 downward direction), and described propulsion system are located at the top (direction making progress as shown in Figure 2) of vacuum cavity 1.Thus, sensor probe is arranged in wafer top, realizes Non-Destructive Testing, obtains the result of more realistic technological process.Electrostatic chuck is installed from cavity bottom; to hold with pipeline or the cable of the servicing unit such as protection electrostatic chuck bottom and helium generator, radio-frequency power supply, static power supply, be connected; and be easy to guarantee the installation site precision of electrostatic chuck, be convenient to change and dismounting.
Advantageously, the diapire of vacuum cavity 1 (i.e. the wall of downward direction as shown in Figure 3) is provided with mounting hole 9, and electrostatic chuck 2 is provided with the mounting flange 12 that coordinates to seal mounting hole 9 with mounting hole 9.Thus, be convenient to install electrostatic chuck 2, improved the efficiency of assembling of device.
Further, described mounting flange and vacuum cavity 1 are bolted.Thus, improve further installation effectiveness, and be convenient to installation and removal, be convenient to replacing or the maintenance of electrostatic chuck 2.
Advantageously, as shown in Figure 2, described propulsion system comprise linear electric motors, and the roof of vacuum cavity 1 is provided with support 7, and described linear electric motors are located on support 7, and the output shaft 3 of described linear electric motors stretches into vacuum cavity 1 and is connected with force cell 4.Thus, adopt linear electric motors directly to drive wafer, error and the inhomogeneous situation of wafer desorption of having avoided intermediate transmission mechanism to cause, simultaneously compact conformation, requisite space is little, the gap of wafer and electrostatic chuck upper surface is converted into the vertical displacement of wafer in motion process and measures.
Further, between the output shaft 3 of described linear electric motors and vacuum cavity 1, be provided with magnetic fluid sealing ring.Thus, be convenient to the sealing of vacuum cavity 1.
Advantageously, force cell 4 is provided with the sucker 6 that is suitable for connecting wafer.Thus, be convenient to install wafer, make wafer stable, improved the stability of measurement mechanism.
According to an embodiment of the present utility model, vacuum cavity 1 is provided with view window.Thus, can observe at any time measuring process, guarantee that measurement result correctness and wafer are not damaged.
Further, the front end of vacuum cavity 1 (one end forward) as shown in Figure 3 opens wide and is sealed by described view window.Thus, be convenient to further observe.
In addition, the most of elements in the utility model all adopt standard component, guaranteed performance, cost-saving.
The device of electrostatic force of the measurement of electrostatic chuck of a specific embodiment of the present utility model is described downwards with reference to the accompanying drawings.
The device of the electrostatic force for measurement of electrostatic chuck as shown in Figure 1, comprises that vacuum cavity 1, electrostatic chuck 2, propulsion system, force cell 4, distance measuring sensor and corresponding vacuum obtain device.
The device of the electrostatic force for measurement of electrostatic chuck as shown in Figure 2, comprises that linear electric motors and output shaft 3 thereof, force cell 4, rod end spherical joint 5 form with sucker 6.1 is chamber, and 2 is electrostatic chuck.Linear electric motors are fixed on support 7, support 7 is fixed on chamber 1 top, the output shaft 3 of linear electric motors stretches in chamber 1 through the apical pore 13 of vacuum cavity 1, and is connected with sucker 6 by force cell 4, rod end spherical joint 5, uses insulating gel that wafer is evenly pasted on to sucker 6 bottoms.Force cell 4 adopts the pulling force sensor with screw connection structure, is installed between the output shaft 3 and rod end spherical joint 5 of linear electric motors.
The device of the electrostatic force for measurement of electrostatic chuck as shown in Figure 3, has the structure such as installed surface 8, mounting hole 9, electric feedthroughs mounting hole 10, apical pore 11, vacuum pipe mounting hole, distance measuring sensor installed surface of view window.View window is threaded connection and is fixed on installed surface 8, detachable.Electrostatic chuck 2 is placed on mounting flange, and the servicing units such as the pipeline of its bottom or the cable center pit by mounting flange and outside helium generator, radio-frequency power supply, static power supply are connected.Mounting flange is fixed with bolts with bottom outlet 9 is installed, and is convenient to change tested electrostatic chuck.Electricity feedthroughs is all bolted and is fixed on mounting hole corresponding on chamber 10 with vacuum pipe.Distance measuring sensor installed surface is positioned at the electrostatic chuck top of chamber 1 inside, to detect the vertical displacement of wafer, can not cause interference to the motion of wafer.
Distance measuring sensor is all connected with external control system by electric feedthroughs with the cable of force cell 4, to guarantee the vacuum tightness of chamber interior.The output shaft 3 of linear electric motors and the static seal between reciprocating dynamic seal, view window and chamber between chamber apical pore 11 all adopt seal with O ring mode.Static seal between static seal between chamber bottom surface and quick detach flange, chamber sidewall and vacuum pipe flange all adopts gasket seal mode.
Measurement environment of the present utility model is without plasma vacuum chamber, has considered the influence factors of physical field to electrostatic force such as electrostatic field, thermal field, rf electric field.Measurement mechanism comprises propulsion system, measures sensor-based system, vacuum cavity 1 and vacuum seal structure etc.
Propulsion system are installed on vacuum cavity 1 top, propulsion system comprise linear electric motors, the output shaft 3 of linear electric motors stretches in vacuum cavity 1 through the roof of vacuum cavity 1, the lower end of the output shaft 3 of linear electric motors is connected with sucker 6 by rod end spherical joint 5, wafer stands in sucker 6 bottoms by insulating gel, thereby the linear electric motors of tubulose drive output shaft 3 upwards slowly to lift wafer, rod end spherical joint 5 can adjusting or the site error of compensate for wafer and output shaft 3.
Vacuum obtains the side that device is positioned at vacuum cavity 1, adopts dry mechanical pump and molecular pump two-stage vacuum pump, by pipeline and vacuum cavity 1 internal communication sealing.
Distance measuring sensor is arranged in vacuum cavity 1, indirectly obtains not gap width in the same time by measuring crystal shift.Force cell 4 is arranged in gearing, is installed between the output shaft 3 and rod end spherical joint 5 of linear electric motors, and the sample frequency of force cell 4 is consistent with the sample frequency of distance measuring sensor, to measure corresponding electrostatic force size constantly.Sensor cable is all by being installed on the electric feedthroughs of vacuum cavity 1 and the controller of chamber outside carries out signal transmission.
In addition, can other testing tools be installed in conjunction with the research of the aspects such as electrostatic chuck temperature control technology, to realize the measurement of the indexs such as Temperature Distribution, flatness, grasp in time and adjust duty and the performance of electrostatic chuck, improve the yields that silicon chip is produced.
In the description of this instructions, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.
Although illustrated and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment in the situation that not departing from principle of the present utility model and aim in scope of the present utility model, modification, replacement and modification.
Claims (9)
1. a device for the electrostatic force of measurement of electrostatic chuck, is characterized in that, comprising:
Vacuum cavity;
Electrostatic chuck, described electrostatic chuck is located in described vacuum cavity;
Force cell, described force cell is being located in described vacuum cavity movably near described electrostatic chuck with on away from the direction of described electrostatic chuck, and described force cell is suitable for connecting wafer;
Propulsion system, described propulsion system are located on described vacuum cavity, and described propulsion system are connected with described force cell; With
Distance measuring sensor, described distance measuring sensor is located in described vacuum cavity.
2. the device of the electrostatic force of measurement of electrostatic chuck according to claim 1, is characterized in that, described electrostatic chuck is located at the bottom in described vacuum cavity, and described propulsion system are located at the top of described vacuum cavity.
3. the device of the electrostatic force of measurement of electrostatic chuck according to claim 2, is characterized in that, the diapire of described vacuum cavity is provided with mounting hole, and described electrostatic chuck is provided with the mounting flange that coordinates to seal described mounting hole with described mounting hole.
4. the device of the electrostatic force of measurement of electrostatic chuck according to claim 3, is characterized in that, described mounting flange and described vacuum cavity are bolted.
5. the device of the electrostatic force of measurement of electrostatic chuck according to claim 2, it is characterized in that, described propulsion system comprise linear electric motors, the roof of described vacuum cavity is provided with support, described linear electric motors are located on described support, and the output shaft of described linear electric motors stretches into described vacuum cavity and is connected with described force cell.
6. the device of the electrostatic force of measurement of electrostatic chuck according to claim 5, is characterized in that, between the output shaft of described linear electric motors and described vacuum cavity, is provided with magnetic fluid sealing ring.
7. the device of the electrostatic force of measurement of electrostatic chuck according to claim 1, is characterized in that, described force cell is provided with the sucker that is suitable for connecting wafer.
8. the device of the electrostatic force of measurement of electrostatic chuck according to claim 1, is characterized in that, described vacuum cavity is provided with view window.
9. the device of the electrostatic force of measurement of electrostatic chuck according to claim 8, is characterized in that, the front end of described vacuum cavity opens wide and sealed by described view window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320360935.1U CN203443718U (en) | 2013-06-21 | 2013-06-21 | Apparatus for measuring electrostatic force of electrostatic chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320360935.1U CN203443718U (en) | 2013-06-21 | 2013-06-21 | Apparatus for measuring electrostatic force of electrostatic chuck |
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| Publication Number | Publication Date |
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| CN203443718U true CN203443718U (en) | 2014-02-19 |
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| CN201320360935.1U Expired - Lifetime CN203443718U (en) | 2013-06-21 | 2013-06-21 | Apparatus for measuring electrostatic force of electrostatic chuck |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376176A (en) * | 2013-06-21 | 2013-10-30 | 清华大学 | Device for measuring electrostatic force of electrostatic chuck |
| CN105241599A (en) * | 2015-11-05 | 2016-01-13 | 清华大学 | Detection system and detection method for electrostatic force of electrostatic chuck |
-
2013
- 2013-06-21 CN CN201320360935.1U patent/CN203443718U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376176A (en) * | 2013-06-21 | 2013-10-30 | 清华大学 | Device for measuring electrostatic force of electrostatic chuck |
| CN103376176B (en) * | 2013-06-21 | 2015-10-28 | 清华大学 | The device of the electrostatic force of measurement of electrostatic chuck |
| CN105241599A (en) * | 2015-11-05 | 2016-01-13 | 清华大学 | Detection system and detection method for electrostatic force of electrostatic chuck |
| CN105241599B (en) * | 2015-11-05 | 2017-09-22 | 清华大学 | The detecting system and detection method of electrostatic chuck electrostatic force |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140219 Effective date of abandoning: 20151028 |
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| C25 | Abandonment of patent right or utility model to avoid double patenting |