CN105241599B - The detecting system and detection method of electrostatic chuck electrostatic force - Google Patents
The detecting system and detection method of electrostatic chuck electrostatic force Download PDFInfo
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- CN105241599B CN105241599B CN201510743907.1A CN201510743907A CN105241599B CN 105241599 B CN105241599 B CN 105241599B CN 201510743907 A CN201510743907 A CN 201510743907A CN 105241599 B CN105241599 B CN 105241599B
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- 238000001514 detection method Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 22
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- 238000007664 blowing Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 83
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 230000009897 systematic effect Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
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- 230000033228 biological regulation Effects 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
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- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of detecting system of electrostatic chuck electrostatic force, including:One chip;One electrostatic chuck, the electrostatic chuck has the first surface and second surface being oppositely arranged, and first surface is used to place the chip, and second surface has an air inlet;One micro- power contact unit, micro- power contact unit is arranged at side of the chip away from the electrostatic chuck, for contacting the chip;The one gas back of the body blows control unit, and the gas back of the body blows control unit and connected with the air inlet of the electrostatic chuck, for providing gas to the electrostatic chuck;One automatically controls and collecting unit, gathers in real time and stores micro- power contact unit and the gas back of the body blows data in control unit, automatically controls the electrostatic chuck electrostatic force detection system.The invention further relates to a kind of method of application detecting system detection electrostatic chuck electrostatic force.
Description
Technical field
The present invention relates to a kind of detecting system of electrostatic chuck electrostatic force and using the system detectio electrostatic chuck electrostatic force
Method.
Background technology
Electrostatic chuck is general purpose module important during all kinds of IC manufacturings are equipped, and is widely used in the clamping of chip, removes
The occasions such as fortune, its main operational principle is by applying high voltage on electrostatic attraction electrode, equally distributed electrostatic force being produced, by crystalline substance
Piece is adsorbed in the ceramic dielectric layers on its surface.Electrostatic force is the topmost performance indications of electrostatic chuck, its size and uniform journey
Degree directly or indirectly influences other performance indications such as size and distribution, wafer flatness of chip temperature, is the master of design optimization
Want one of target.Because electrostatic force belongs to chip and the internal force in electrostatic chuck composition system, thus it is difficult direct measurement.
At present, when detecting chip using the system and method for existing detection electrostatic force and separated with electrostatic chuck, actually
Upper chip may be partially disengaged already, and the gap of chip and electrostatic chuck also changes already, causes the electrostatic force measured past
Toward the electrostatic force for being less than actual working state, larger systematic error is produced.
The content of the invention
In view of this, it is necessory to provide a kind of electrostatic chuck electrostatic force that can reduce systematic error detecting system and
Using the method for the system detectio electrostatic chuck electrostatic force.
A kind of detecting system of electrostatic chuck electrostatic force, including:One chip;One electrostatic chuck, the electrostatic chuck has phase
To the first surface and second surface of setting, first surface is used to place the chip, and second surface has an air inlet;One is micro-
Power contact unit, micro- power contact unit is arranged at side of the chip away from the electrostatic chuck, for contacting the crystalline substance
Piece;The one gas back of the body blows control unit, and the gas back of the body blows control unit and connected with the air inlet of the electrostatic chuck, for described
Electrostatic chuck provides gas;One automatically controls and collecting unit, gathers in real time and stores micro- power contact unit and the gas back of the body
The data in control unit are blown, the electrostatic chuck electrostatic force detection system is automatically controlled.
A kind of detection method of electrostatic chuck electrostatic force, comprises the following steps:
There is provided the detecting system of electrostatic chuck electrostatic force as claimed in claim 1 by S1;
S2, electrostatic chuck, positive placement location are adsorbed in by chip;
S3, controls micro- power contact unit to decline, and micro- power contact unit includes a Micro-force sensor, when micro- power probe is single
First contact force size between the chip controls micro- power probe when within the 5% of the Micro-force sensor full scale
Unit stops declining;
S4, starts the gas back of the body and blows control unit, and gas is passed through until chip disengaging is described quiet to the electrostatic chuck
Electric card disk, the number blown in control unit and micro- power contact unit is carried on the back while automatically controlling and gathering the gas with collecting unit
According to;
S5, analyzes above-mentioned data and finds the strong P of gas back of the body blow pressure that the chip departs from the electrostatic chuck moment1, by crystalline substance
The chip is obtained using above-mentioned same method after piece and electrostatic chuck upside down and departs from institute
State the strong P of gas back of the body blow pressure of electrostatic chuck moment2, by P1, P2Substitute into electrostatic force calculation formula
,
Wherein, P0For atmospheric pressure, S is the gross area of wafer surface, and G is the gross weight of chip.
Compared with prior art, the detecting system of electrostatic chuck electrostatic force provided by the present invention and apply the system detectio
The method of electrostatic chuck electrostatic force can be fast when being not apparent from expanding in the gap of chip and electrostatic chuck by micro- power contact unit
Speed, transient process when chip departs from is accurately detected, the detection process sensitivity is high, so as to reduce systematic error.
Brief description of the drawings
The structured flowchart for the electrostatic chuck electrostatic force detection system that Fig. 1 provides for the present invention.
The structure that micro- power contact unit, electrostatic chuck, chip and the gas back of the body that Fig. 2 provides for the present invention blow control unit is shown
It is intended to.
Fig. 3 blows control unit structured flowchart for the gas back of the body that the present invention is provided.
Fig. 4 for the present invention provide automatically control and collecting unit structured flowchart.
Fig. 5 blows the principle schematic of equivalent action area for the dead-weight balanced method demarcation chip gas back of the body that the present invention is provided.
Main element symbol description
Detecting system | 10 |
Chip | 11 |
Electrostatic chuck | 12 |
The back of the body blows passage | 120 |
Pedestal | 121 |
Air inlet | 122 |
Dielectric layer | 123 |
Micro- power contact unit | 13 |
The micro- power probe assembly of son | 130 |
Feed mechanism | 131 |
Fixing end | 1310 |
Mobile terminal | 1311 |
Micro-force sensor | 132 |
Probe | 133 |
The gas back of the body blows control unit | 14 |
Source of the gas | 140 |
Electromagnetic direction valve | 141 |
Mechanical relief valve | 142 |
Electronic proportioning valve | 143 |
Gas pressure intensity transmitter | 144 |
Gas mass flow gauge | 145 |
Automatically control and collecting unit | 15 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
The system for describing detection electrostatic chuck electrostatic force provided in an embodiment of the present invention in detail below with reference to accompanying drawing.
Referring to Fig. 1, the present invention provides a kind of detecting system 10 of electrostatic chuck electrostatic force, including:One chip 11, one is quiet
Electric card disk 12, a micro- power contact unit 13, the gas back of the body blow control unit 14, one and automatically controlled and collecting unit 15.
The electrostatic chuck 12 has the first surface and second surface being oppositely arranged, and the first surface is used to place described
Chip 11, the second surface has an air inlet 122;Micro- power contact unit 13 is arranged at the chip 11 away from electrostatic
The side of chuck 12, for contacting the chip 11;The gas back of the body blows control unit 14 and the air inlet of the electrostatic chuck 12
Mouth 122 is connected, and stable, controllable gas pressure intensity is provided to the electrostatic chuck 12;It is described to automatically control with collecting unit 15 certainly
It is dynamic to control the electrostatic chuck electrostatic force detection system 10, gather in real time and store micro- power contact unit 13 and the gas back of the body blows control
Various data in unit 14 processed.
Referring to Fig. 2, the chip 11 is placed horizontally at a surface of the electrostatic chuck 12, the chip 11 can be
Semiconductor wafer, chip glass.Preferably, the chip 11 is circle, and the diameter of chip 11 is more than the first of the electrostatic chuck
The diameter on surface.In the present embodiment, the chip 11 is circle, and thickness is 1 millimeter, 11 a diameter of 300 millimeters of the chip, institute
It is 294 millimeters that electrostatic chuck 12, which is stated, close to the surface diameter of the chip 11.
The electrostatic chuck 12 includes a pedestal 121, a dielectric layer 123, and the dielectric layer 123 is arranged at the pedestal 121
A surface, surface of the pedestal 121 away from the dielectric layer 123 have an air inlet 122;The dielectric layer 123 has
The back of the body of multiple up/down perforations blows passage 120, and the back of the body for passing the gas through pedestal 121 into the dielectric layer 123 blows passage 120 and blown
The surface contacted to the chip 11 with the electrostatic chuck 12.An electrode is provided with the electrostatic chuck 12(Do not show in figure),
For introducing electric energy to the electrostatic chuck 12, make to produce electrostatic force between the electrostatic chuck 12 and the chip 11.It is described
Electrostatic chuck 12 can be using the general electrostatic chuck of in the market.
Micro- power contact unit 13 includes at least one sub micro- power probe assembly 130.Sub micro- power probe assembly 130 is wrapped
Include a feed mechanism 131, a Micro-force sensor 132 and a probe 133.The feed mechanism 131 has the He of a fixing end 1310
One mobile terminal 1311, the fixing end 1310 of the feed mechanism 131 is fixed on a platform, one end of the Micro-force sensor 132
The mobile terminal 1311 of the feed mechanism 131 is fixed on, the probe 133 is fixed on the other end of the Micro-force sensor 132.
The center of gravity of the feed mechanism 131, the Micro-force sensor 132 and the probe 133 is located along the same line.The feeding machine
The mobile terminal of structure 131 is vertically moved about 1311 can drive the probe 133 to move, and control the probe 133 and the crystalline substance
Piece 11 is contacted, the Micro-force sensor 132 in real time detection driving during it is described probe 133 stressing conditions, by control into
To mechanism 131 with ensure it is described probe 133 stress within the 5% of the full scale of Micro-force sensor 132.Micro- power is passed
The range ability selection of sensor 132 is selected according to the model of the electrostatic chuck 12.
In the present embodiment, micro- power contact unit 13 includes the micro- power probe assembly 130 of 4 sons.The feed mechanism 131
Effective travel is 10 millimeters, and repetitive positioning accuracy is1.5 microns, the stroke of the feed mechanism 131 is small, sensitivity and precision
It is high;The Micro-force sensor 132 has high-resolution, and the range span of the Micro-force sensor 132 is 0mN ~ 100mN;
It is described probe 133 be ruby probe, with hardness it is high the characteristics of.
Stop after the driving probe 133, start the gas back of the body and blow control unit 14, the gas back of the body blows control unit 14
Connected by tracheae with the air inlet 122 of the electrostatic chuck 12, to be passed through gas to the electrostatic chuck 12.Refer to figure
3, the gas back of the body blows control unit 14 includes a source of the gas 140, an electromagnetic direction valve 141, a mechanical relief valve 142, one successively
The gas pressure intensity transmitter 144 of electronic proportioning valve 143 and one.The source of the gas 140, electromagnetic direction valve 141, mechanical relief valve 142, electronics
Connected respectively by tracheae between proportioning valve 143 and gas pressure intensity transmitter 144.The electronic proportioning valve 143 and the gas
Any one place is connected by tracheae with the air inlet 122 of the electrostatic chuck 12 between pressure transmitter 144, it is ensured that the gas
The pressure that pressure transmitter 144 is measured is the pressure at the air inlet 122 of the electrostatic chuck 12 all the time.The connection of the tracheae
Place must ensure that sealing is good.The source of the gas 140 is used to provide gas, can be air, inert gas etc..The gas is successively
By the electromagnetic direction valve 141, mechanical relief valve 142, electronic proportioning valve 143, entering by the electrostatic chuck 12 afterwards
Gas port 122 blows passage 120 into the back of the body, now, the pressure at air inlet 122 can be measured using the gas pressure intensity transmitter 144
By force.
The gas back of the body, which blows control unit 14, can further comprise a gas mass flow gauge 145, the gas flowmeter 145
It is connected between the electronic proportioning valve 143 and the gas pressure intensity transmitter 144, now gas mass flow gauge 145 and institute
Any one place stated between gas pressure intensity transmitter 144 is connected by tracheae with the electrostatic chuck air inlet 122, the gas matter
Amount flowmeter 145 can monitor the gas flow in real time.In the present embodiment, the gas back of the body, which blows control unit 14, includes gas
Mass flowmenter 145.
The electromagnetic direction valve 141 mainly plays overvoltage protection, Micro-force sensor 132 can be avoided to be damaged, when this
Gas when electromagnetic direction valve 141 is powered in the source of the gas 140 can enter the electrostatic chuck 12 by electromagnetic direction valve 141
Air inlet 122, during power-off gas then can not pass through electromagnetic direction valve 141 reach air inlet 122;The mechanical relief valve 142
Entrance and outlet between have the adjustable aperture of an aperture, its aperture is by back pressure by diaphragm negative feedback control, and gas passes through
After electromagnetic direction valve 141, the pressure that the mechanical relief valve 142 can adjust the gas on a large scale makes it in the electronics
In the range ability of proportioning valve 143, it is ensured that the inlet pressure that the electronic proportioning valve 143 is connected with mechanical relief valve 142 is constant,
And reduce the influence of gas pressure intensity fluctuation;After gas enters electronic proportioning valve 143, the electronic proportioning valve 143 enters one
Step minutely adjusts the gas pressure intensity;The gas pressure intensity transmitter 145 is that a kind of pressure conversion is standard output signals
Sensor, the gas pressure intensity that record enters at the air inlet 122 of the electrostatic chuck 12 in real time.
Referring to Fig. 4, described automatically control with collecting unit 15 using data collecting card, PLC and computer phase
With reference to mode, data collecting card collection micro- power contact unit 13 and gas back of the body blows the data in control unit 14,
And communicated by data acquisition communication board and computer, computer is stored, and computer is sent according to the data of storage
Logical order, is communicated to data collecting card, and on the one hand the data collecting card blows control unit 14 to the gas back of the body and send electricity
Signal is flowed, on the other hand voltage signal is sent to the PLC, so that controlling micro- power contact unit 13 and gas to carry on the back blows control
Unit 14 processed.The frequency acquisition of the data collecting card may range from 1000Hz ~ 2000Hz.
The data collecting card includes a bridge signal capture card, a current signal capture card, a voltage output card.It is described
Bridge signal capture card is electrically connected with the Micro-force sensor 132, and the Micro-force sensor 132 is to the bridge signal capture card
Send 0mV ~ 5mV voltage signal;The current signal capture card is electrically connected with the gas pressure intensity transmitter 144, the gas
Body pressure transmitter 145 sends 4mA ~ 20mA current signal to the current signal capture card;Computer is according to collecting
Voltage output card described in data communication, the voltage output card sends 4mA ~ 20mA current signal to the electronic proportioning valve, together
Shi Suoshu voltage outputs card exports 0V ~ 10V voltage signal to the PLC, and the PLC sends high-speed pulse
The feed mechanism 131 is controlled, on the other hand with electromagnetic direction valve 141 described in 24V leakage type output controls.The voltage output card
It is auto-power on that the voltage signal exported to the PLC includes feed mechanism automatic localization reset signal, electromagnetic direction valve
Power-off signal.
The detecting system of electrostatic chuck electrostatic force provided in an embodiment of the present invention is accurately sentenced by introducing micro- power contact unit
Disconnected chip departs from the momentary status of electrostatic chuck, on the other hand realizes the automation of detection process, substantially increases detection effect
Rate, mass efficient data can be obtained in a short time, provided for the generation of further investigation electrostatic force and elimination mechanism necessary soft
Hardware foundation.
According to said system, the embodiment of the present invention further provides for a kind of above-mentioned electrostatic chuck electrostatic force detection system of application
The method for detecting electrostatic chuck electrostatic force, comprises the following steps:
S1, electrostatic chuck 12, positive placement location are adsorbed in by chip 11;
S2, controls micro- power contact unit 13 to decline, and micro- power contact unit 13 includes a Micro-force sensor 132, when this is micro-
Contact force size between power contact unit 13 and the chip 11 when within the 5% of the full scale of Micro-force sensor 132,
Micro- power contact unit 13 is controlled to stop declining;
S3, starts the gas back of the body and blows control unit 14, gas is passed through until the chip 11 departs to the electrostatic chuck 12
The electrostatic chuck 12, control unit 14 and micro- power spy are blown while automatically controlling and gathering the gas back of the body with collecting unit 15
Data in head unit 13;
S4, analyzes above-mentioned data and finds the strong P of gas back of the body blow pressure that the chip 11 departs from the moment of electrostatic chuck 121,
Depart from the electrostatic card by the chip 11 is obtained using above-mentioned same method after chip 11 and the upside down of electrostatic chuck 12
The strong P of gas back of the body blow pressure of the moment of disk 122, by P1, P2Electrostatic force is substituted into calculate
Formula,
Wherein, P0For atmospheric pressure, S is the gross area of wafer surface, and G is the gross weight of chip.
In the S1 steps, chip 11 is positioned on electrostatic chuck 12, it is ensured that the center of gravity of the chip 11 and the electrostatic
The center of gravity of chuck 12 is overlapped;Apply voltage to the electrode of the electrostatic chuck 12, now, electrostatic chuck 12 is electrically charged, in chip
Electrostatic force is produced between 11 and electrostatic chuck 12, regulation voltage makes the chip 11 fully be adsorbed by electrostatic force and be held in electrostatic
On chuck 12.
In the S2 steps, micro- power contact unit 13 is moved with least 100 microns per second of speed to the chip 11.
During micro- power contact unit 13 is contacted with chip 11, the contact force is continually changing, and the contact force numerical value passes through institute
State Micro-force sensor 132 in micro- power contact unit 13 to reflect, while the numerical value of the Micro-force sensor 132 becomes in whole contact process
Change is gathered and stored with collecting unit 15 by described automatically control." contact force " refers to pop one's head in micro- power contact unit
The stress of 133 probes 133 when being contacted with chip 11, the contact force need to be far smaller than electrostatic force, that is to say, that the contact force
Size can be ignored when within the 5% of the Micro-force sensor full scale.
Specifically, the contact process of micro- power contact unit 13 and the chip 11 is:Start micro- power probe single
The feed mechanism 131 of a certain micro- power probe assembly 130 of height in member 13, driving probe 133 declines and contacts the chip 11, institute
State to automatically control and gather numerical value in the Micro-force sensor 132 in real time with collecting unit 15;The remaining sub micro- power of same control is visited
Probe 133 in head assembly 130 declines and contacted with the chip 11.Preferably, in a certain sub micro- power probe assembly 130
Probe 133 be distributed in probe in the center of the chip 11, the micro- power probe assembly 130 of its minor along the surface of chip 11
Edge be uniformly distributed, with obtain comprehensively it is described probe 133 contact force data.
After micro- 13 stop motion of power contact unit, in the S3 steps, specifically, it is single that the gas back of the body blows control
Member 14 be passed through processes from gas to the electrostatic chuck 12 be:Open the source of the gas 140 and produce gas, automatically control single with collection
Computer in member 15 automatically controls the mechanical relief valve 142 and the electronic proportioning valve 143 by PLC, makes to enter electrostatic
The gas pressure intensity of the air inlet 122 of chuck 12 slowly equably increases, when micro- power in the micro- power probe assembly 130 of any one height is passed
When obvious increase occurs in the reading of sensor 132, illustrate that the beginning of chip 11 departs from the electrostatic chuck 12, now, continue
Slowly equably increase gas pressure intensity;When the reading of Micro-force sensor 132 in the micro- power probe assembly 130 of any one height reaches it
Full scale numerical value 60% ~ 90% when, stop supply;Described automatically control exports with the Computer communication voltage of collecting unit 15
Card, voltage output card sends the current signal for stopping supply to the electromagnetic direction valve 141.In the present embodiment, the automatic control
System with collecting unit 15 gather in real time during supply and store the Micro-force sensor 132, gas pressure intensity transmitter 144 and
The numerical value of gas mass flow gauge 145;Stop carrying when any one reading of Micro-force sensor 132 reaches the 80% of its full scale
Supplied gas.
In the S4 steps, described automatically control gathers the numerical value of Micro-force sensor 132, gas pressure intensity in real time with collecting unit 15
The numerical value of transmitter 145 is simultaneously stored in a computer, and analysis reaches the data of the Micro-force sensor 132 of full scale 60% ~ 90%, finds
The gas pressure intensity when Micro-force sensor 132 correspondence 133 stress of probe are significantly increased, i.e., the described moment of chip 11 departs from described quiet
The gas pressure intensity P of electric card disk 121.The chip 11 and electrostatic chuck 12 are just being put 180 ° are reversed above and below device(It is inverted), use
Same method finds the gas pressure intensity P for departing from the electrostatic chuck 12 moment of chip 112;By P1, P2Electrostatic is substituted into respectively
Power calculation formula, calculate electrostatic force.
Specifically, the formulaAccording toObtain,
Wherein, the back of the body blowing equivalent action area S of the chip 11 in the case of demarcation real work is calculated using dead-weight balanced method1,
That is gas and the contact area S of chip 111.As shown in figure 5, for chip 11 and electrostatic chuck 12 just putting with chip 11 with it is quiet
Electric card disk 12 is inverted both states, applies identical voltage respectively, it is ensured that identical adsorption conditionses, completes the gas back of the body and blows balance
Experiment, respectively obtains the back of the body blowing pressure P just put with when departing under inversion state1And P2。
When chip 11 and electrostatic chuck 12 are just put, the stress balance equation of the chip 11 is:
;
After chip 11 and electrostatic chuck 12 are inverted, the stress balance equation of the chip 11 is:
;
Wherein, P0For atmospheric pressure, P1And P2The moment of chip 11 departs from the electrostatic card when respectively just putting and be inverted
The gas back of the body blow pressure of disk 12 is strong(Relative to atmospheric pressure), S1For wafer back blowing equivalent action area, S is the surface of chip 11
The gross area, G be chip 11 gross weight, F is electrostatic force.
Above-mentioned two formula is subtracted each other, and is obtained:
;
Have:
。
The detection method of above-mentioned electrostatic chuck electrostatic force can further comprise a subsequent processes, specifically including following
Step:
S51, automatically controls micro- power contact unit 13 and rises reset respectively;
S52, the electrostatic chuck 12 is powered off;
S53, the first surface of the chip 11 from the electrostatic chuck 12 is removed.
In S52 steps, by two lead short circuits of electrode in the electrostatic chuck 12, residual charge is eliminated, it is to avoid residual
Remaining electrostatic force influence, it is ensured that the independence of each testing result.
The detection method for the electrostatic chuck electrostatic force that the present invention is provided to the initial data gathered in detection process by entering
The corresponding analysis of row and processing, judge that chip departs from the moment of electrostatic chuck, so that the back of the body blow pressure obtained when chip departs from is strong.Should
Product of the blow pressure by force with back of the body blowing equivalent action area is carried on the back, the as back of the body blows gross pressure of the channel gas to chip, further according to flat
Weighing apparatus relation is that can obtain electrostatic force size.First, the detection method is by controlling micro- power contact unit to make at whole detecting system
In quasistatic or it is slowly varying during, it is to avoid the systematic error that transient process is produced, improve measurement accuracy;Second,
The sensitivity of detection method is high, is not apparent from quickly and accurately detecting break-off when expanding in gap, reduces part
The influence of disengaging, reduces measurement error;3rd, the back of the body blowing for the chip that this detection method is difficult to obtain to theoretical and emulation
Equivalent action area has carried out effective demarcation, simple to operate, practical.
In addition, those skilled in the art can also do other changes in spirit of the invention, certainly, these are according to present invention essence
The change that god is done, should all be included within scope of the present invention.
Claims (10)
1. a kind of detecting system of electrostatic chuck electrostatic force, it is characterised in that including:
One chip;
One electrostatic chuck, the electrostatic chuck has the first surface and second surface being oppositely arranged, and first surface is used to place institute
Chip is stated, second surface has an air inlet;
One micro- power contact unit, micro- power contact unit is arranged at side of the chip away from the electrostatic chuck, for connecing
Touch the chip;
The one gas back of the body blows control unit, and the gas back of the body blows control unit and connected with the air inlet of the electrostatic chuck, for institute
State electrostatic chuck and gas is provided;
One automatically controls and collecting unit, gather in real time and store micro- power contact unit and gas the back of the body blow in control unit
Data, automatically control the electrostatic chuck electrostatic force detection system.
2. the detecting system of electrostatic chuck electrostatic force as claimed in claim 1, it is characterised in that micro- power contact unit includes
At least one sub micro- power probe assembly, each micro- power probe assembly of height includes a feed mechanism, a Micro-force sensor and one
Probe, the feed mechanism drives described pop one's head in be moved to the chip, and the Micro-force sensor detects the probe in real time
Stress.
3. the detecting system of electrostatic chuck electrostatic force as claimed in claim 2, it is characterised in that the feed mechanism has one to move
The mobile terminal of the feed mechanism is fixed in moved end, one end of the Micro-force sensor, and the other end of the Micro-force sensor is used
In the fixed probe.
4. the detecting system of electrostatic chuck electrostatic force as claimed in claim 1, it is characterised in that the gas back of the body blows control unit
Include a source of the gas, an electromagnetic direction valve, a mechanical relief valve, an electronic proportioning valve and a gas pressure intensity transmitter successively.
5. the detecting system of electrostatic chuck electrostatic force as claimed in claim 4, it is characterised in that it is single that the gas back of the body blows control
Member further comprises a gas mass flow gauge, the tracheae between the gas mass flow gauge and the gas pressure intensity transmitter with
The air inlet connection of the electrostatic chuck.
6. the detecting system of electrostatic chuck electrostatic force as claimed in claim 1, it is characterised in that described to automatically control and collection list
Member includes data collecting card, PLC and computer, and the data collecting card blows with micro- power contact unit and gas back of the body
Control unit is electrically connected, and is gathered micro- the power contact unit and gas and is carried on the back the data blown in control unit, the data collecting card
Communicated by a data acquisition communication board and the computer, computer sends logical order, be communicated to the data and adopt
On the one hand truck, the data collecting card blows control unit to the gas back of the body and sends current signal, on the other hand to the PLC
Controller sends voltage signal.
7. the detecting system of electrostatic chuck electrostatic force as claimed in claim 6, it is characterised in that the data collecting card includes one
Bridge signal capture card, a current signal capture card, a voltage output card, the bridge signal capture card are popped one's head in micro- power
Unit is electrically connected, and the current signal capture card blows control unit with the gas back of the body and electrically connected, the voltage output card and institute
State PLC electrical connection.
8. a kind of detection method of electrostatic chuck electrostatic force, comprises the following steps:
There is provided the detecting system of electrostatic chuck electrostatic force as claimed in claim 1 by S1;
S2, electrostatic chuck, positive placement location are adsorbed in by chip;
S3, controls micro- power contact unit to decline, and micro- power contact unit includes a Micro-force sensor, when micro- power contact unit with
Contact force size between the chip controls micro- power probe single when within the 5% of the Micro-force sensor full scale
Member stops declining;
S4, starts the gas back of the body and blows control unit, and gas is passed through until the chip departs from the electrostatic card to the electrostatic chuck
Disk, the data blown in control unit and micro- power contact unit are carried on the back while automatically controlling and gathering the gas with collecting unit;
S5, analyzes above-mentioned data and finds the strong P of gas back of the body blow pressure that the chip departs from the electrostatic chuck moment1, by chip and quiet
The gas back of the body for obtaining the chip disengaging electrostatic chuck moment using above-mentioned same method after electric card disk upside down blows
Pressure P2, by P1, P2Substitute into electrostatic force formula
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<mo>&CenterDot;</mo>
<mi>S</mi>
<mo>,</mo>
</mrow>
Wherein, P0For atmospheric pressure, S is the gross area of wafer surface, and G is the gross weight of chip.
9. the detection method of electrostatic chuck electrostatic force as claimed in claim 8, it is characterised in that micro- power contact unit includes
At least one sub micro- power probe assembly, micro- power probe assembly includes a probe, controls at least one described son micro- respectively successively
Power probe assembly declines, wherein the probe of the micro- power probe assembly of any one height is distributed in the center of the chip, its minor is micro-
Edge of the probe of power probe assembly along the wafer surface is uniformly distributed.
10. the detection method of electrostatic chuck electrostatic force as claimed in claim 8, it is characterised in that the formulaAccording toObtain, wherein, calculated and marked using dead-weight balanced method
Determine the back of the body blowing equivalent action area S of the chip in the case of real work1:
When chip and electrostatic chuck are just put, the stress balance equation of chip is:
(P0+P1)·S1=P0·S+G+F (1);
When chip and electrostatic chuck are inverted, the stress balance equation of chip is:
(P0+P2)·S1=P0·S-G+F (2);
Wherein, P0For atmospheric pressure, P1And P2The chip departs from the gas of the electrostatic chuck moment when respectively just putting and be inverted
Body back of the body blow pressure is strong, S1For wafer back blowing equivalent action area, S is the gross area of wafer surface, and G is the gross weight of chip, F
For electrostatic force,
Above-mentioned formula (1) subtracts formula (2), obtains:
(P1-P2)·S1=2G;
Have:
<mrow>
<msub>
<mi>S</mi>
<mn>1</mn>
</msub>
<mo>=</mo>
<mfrac>
<mrow>
<mn>2</mn>
<mi>G</mi>
</mrow>
<mrow>
<msub>
<mi>P</mi>
<mn>1</mn>
</msub>
<mo>-</mo>
<msub>
<mi>P</mi>
<mn>2</mn>
</msub>
</mrow>
</mfrac>
<mo>.</mo>
</mrow>
2
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CN110434363A (en) * | 2019-09-20 | 2019-11-12 | 咸阳圣亚机电设备有限公司 | End face positions workpiece holding structure and detection method |
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