CN105241599A - Detection system and detection method for electrostatic force of electrostatic chuck - Google Patents
Detection system and detection method for electrostatic force of electrostatic chuck Download PDFInfo
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- CN105241599A CN105241599A CN201510743907.1A CN201510743907A CN105241599A CN 105241599 A CN105241599 A CN 105241599A CN 201510743907 A CN201510743907 A CN 201510743907A CN 105241599 A CN105241599 A CN 105241599A
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Abstract
The invention discloses a detection system for an electrostatic force of an electrostatic chuck. The detection system comprises a wafer, an electrostatic chuck, a micro force probe unit, a gas back blowing control unit and an automatic control and acquisition unit, wherein the electrostatic chuck is provided with a first surface and a second surface which are opposite, the first surface is used for placing the wafer, and the second surface is provided with an air inlet; the micro force probe unit is arranged on one side of the wafer away from the electrostatic chuck and used for contacting the wafer; the gas back blowing control unit is communicated with the air inlet of the electrostatic chuck and used for providing gas for the electrostatic chuck; and the automatic control and acquisition unit is used for acquiring in real time and storing the data in the micro force probe unit and the gas back blowing control unit, and automatically controlling the detection system for the electrostatic force of the electrostatic chuck. The invention further relates to a method for detecting the electrostatic force of the electrostatic chuck by using the detection system.
Description
Technical field
The present invention relates to a kind of detection system of electrostatic chuck electrostatic force and apply the method for this systems axiol-ogy electrostatic chuck electrostatic force.
Background technology
Electrostatic chuck is general purpose module important in all kinds of IC manufacturing equipment, be widely used in the occasions such as the clamping of wafer, carrying, its main operational principle is by applying high voltage on electrostatic attraction electrode, produces equally distributed electrostatic force, chip sucking is attached in the ceramic dielectric layers on its surface.Electrostatic force is the topmost performance index of electrostatic chuck, and its size and degree of uniformity directly or indirectly affect size and other performance index such as distribution, wafer flatness of chip temperature, are one of main targets of design optimization.Because electrostatic force belongs to the internal force in wafer and electrostatic chuck composition system, thus not easily directly measure.
At present, when utilizing the system and method for existing detection electrostatic force to detect that wafer is separated with electrostatic chuck, in fact wafer may generating portion depart from already, the gap of wafer and electrostatic chuck also changes already, cause the electrostatic force recorded often to be less than the electrostatic force of actual working state, produce larger systematic error.
Summary of the invention
In view of this, necessaryly provide a kind of and can reduce the detection system of the electrostatic chuck electrostatic force of systematic error and apply the method for this systems axiol-ogy electrostatic chuck electrostatic force.
A detection system for electrostatic chuck electrostatic force, comprising: a wafer; One electrostatic chuck, this electrostatic chuck has the first surface and second surface that are oppositely arranged, and first surface is for placing described wafer, and second surface has an air intake opening; One micro-power contact unit, this micro-power contact unit is arranged at the side of described wafer away from described electrostatic chuck, for contacting described wafer; The one gas back of the body blows control module, and this gas back of the body blows control module and is communicated with the air intake opening of described electrostatic chuck, for providing gas to described electrostatic chuck; One automatically controls and collecting unit, and Real-time Collection also stores described micro-power contact unit and gas carry on the back the data of blowing in control module, the described electrostatic chuck electrostatic force detection system of control automatically.
A detection method for electrostatic chuck electrostatic force, comprises the following steps:
S1, provides the detection system of electrostatic chuck electrostatic force as claimed in claim 1;
S2, invests electrostatic chuck by chip sucking, is just putting and is putting;
S3, control micro-power contact unit to decline, this micro-power contact unit comprises a Micro-force sensor, when the contact force size between this micro-power contact unit and described wafer is within 5% of described Micro-force sensor full scale, controls described micro-power contact unit and stops declining;
S4, starts the gas back of the body and blows control module, pass into gas until described wafer departs from described electrostatic chuck to described electrostatic chuck, automatically controls to gather described gas with collecting unit simultaneously and carries on the back the data of blowing in control module and described micro-power contact unit;
S5, analyzes above-mentioned data and finds described wafer to depart from the strong P of gas back of the body blow pressure of described electrostatic chuck moment
1, obtain described wafer by adopting above-mentioned same method after wafer and electrostatic chuck upside down and depart from institute
State the strong P of gas back of the body blow pressure of electrostatic chuck moment
2, by P
1, P
2substitute into electrostatic force computing formula
，
Wherein, P
0for atmospheric pressure, S is the total area of wafer surface, and G is the general assembly (TW) of wafer.
Compared with prior art, the transient process when detection system of electrostatic chuck electrostatic force provided by the present invention and the method for applying this systems axiol-ogy electrostatic chuck electrostatic force can detect when the gap of wafer and electrostatic chuck does not obviously expand that wafer departs from quickly and accurately by micro-power contact unit, this testing process is highly sensitive, thus reduces systematic error.
Accompanying drawing explanation
Fig. 1 is the structured flowchart of electrostatic chuck electrostatic force detection system provided by the invention.
Fig. 2 is the structural representation that micro-power contact unit provided by the invention, electrostatic chuck, wafer and the gas back of the body blows control module.
Fig. 3 is that the gas provided by the invention back of the body blows control module structured flowchart.
Fig. 4 is the structured flowchart of automatic control provided by the invention and collecting unit.
Fig. 5 is the principle schematic that dead-weight balanced method provided by the invention demarcates that the wafer gas back of the body blows equivalent action area.
Main element symbol description
| Detection system | 10 |
| Wafer | 11 |
| Electrostatic chuck | 12 |
| The back of the body blows passage | 120 |
| Pedestal | 121 |
| Air intake opening | 122 |
| Dielectric layer | 123 |
| Micro-power contact unit | 13 |
| The micro-power probe assembly of son | 130 |
| Feed mechanism | 131 |
| Stiff end | 1310 |
| Mobile terminal | 1311 |
| Micro-force sensor | 132 |
| Probe | 133 |
| The gas back of the body blows control module | 14 |
| Source of the gas | 140 |
| Electromagnetic direction valve | 141 |
| Machinery reduction valve | 142 |
| Electronic proportioning valve | 143 |
| Gas pressure intensity transmitter | 144 |
| Mass-flow gas meter | 145 |
| Automatic control and collecting unit | 15 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The system of the detection electrostatic chuck electrostatic force that the embodiment of the present invention provides is described in detail below with reference to accompanying drawing.
Refer to Fig. 1, the invention provides a kind of detection system 10 of electrostatic chuck electrostatic force, comprising: micro-power contact unit 13, the gas back of the body of wafer 11, electrostatic chuck 12, blows control module 14, and automatically controls and collecting unit 15.
Described electrostatic chuck 12 has the first surface and second surface that are oppositely arranged, and this first surface is for placing described wafer 11, and described second surface has an air intake opening 122; Described micro-power contact unit 13 is arranged at the side of described wafer 11 away from electrostatic chuck 12, for contacting described wafer 11; The described gas back of the body blows control module 14 and is communicated with the air intake opening 122 of described electrostatic chuck 12, provides stable, controlled gas pressure intensity to described electrostatic chuck 12; Described automatic control and collecting unit 15 control this electrostatic chuck electrostatic force detection system 10 automatically, and Real-time Collection also stores described micro-power contact unit 13 and gas carries on the back the various data of blowing in control module 14.
Refer to Fig. 2, described wafer 11 is placed horizontally at a surface of described electrostatic chuck 12, and described wafer 11 can be semiconductor wafer, chip glass.Preferably, this wafer 11 is circular, and this wafer 11 diameter is greater than the diameter of the first surface of described electrostatic chuck.In the present embodiment, described wafer 11 is circular, and thickness is 1 millimeter, and described wafer 11 diameter is 300 millimeters, and described electrostatic chuck 12 is 294 millimeters near the surface diameter of described wafer 11.
Described electrostatic chuck 12 comprises pedestal 121, dielectric layer 123, and this dielectric layer 123 is arranged at a surface of described pedestal 121, and described pedestal 121 has an air intake opening 122 away from the surface of described dielectric layer 123; The back of the body that described dielectric layer 123 has multiple up/down perforation blows passage 120, makes gas blow passage 120 by the back of the body that pedestal 121 enters described dielectric layer 123 and blows to the surface that described wafer 11 contacts with described electrostatic chuck 12.Being provided with an electrode (not shown) in described electrostatic chuck 12, for introducing electric energy to described electrostatic chuck 12, making to produce electrostatic force between described electrostatic chuck 12 and described wafer 11.Described electrostatic chuck 12 can adopt electrostatic chuck general on market.
Described micro-power contact unit 13 comprises the micro-power probe assembly 130 of at least one height.This sub micro-power probe assembly 130 comprises feed mechanism 131, Micro-force sensor 132 and a probe 133.Described feed mechanism 131 has stiff end 1310 and a mobile terminal 1311, the stiff end 1310 of described feed mechanism 131 is fixed on a platform, the mobile terminal 1311 of described feed mechanism 131 is fixed in one end of described Micro-force sensor 132, and described probe 133 is fixed on the other end of described Micro-force sensor 132.The center of gravity of described feed mechanism 131, described Micro-force sensor 132 and described probe 133 is located along the same line.The vertical movement in mobile terminal about 1311 of described feed mechanism 131 can drive described probe 133 to move, control described probe 133 to contact with described wafer 11, described Micro-force sensor 132 detects the stressing conditions of probe 133 described in driving process in real time, by controlling feed mechanism 131 to ensure the stressed within 5% of described Micro-force sensor 132 full scale of described probe 133.The range ability of described Micro-force sensor 132 is selected to select according to the model of described electrostatic chuck 12.
In the present embodiment, described micro-power contact unit 13 comprises 4 micro-power probe assemblies 130 of son.The effective travel of this feed mechanism 131 is 10 millimeters, and repetitive positioning accuracy is
1.5 microns, the stroke of described feed mechanism 131 is little, sensitivity and precision high; Described Micro-force sensor 132 has high-resolution, and the range span of this Micro-force sensor 132 is 0mN ~ 100mN; Described probe 133 is ruby probe, has the advantages that hardness is high.
After stopping driving described probe 133, start the described gas back of the body and blow control module 14, this gas back of the body is blown control module 14 and is communicated with by the air intake opening 122 of tracheae with described electrostatic chuck 12, to pass into gas to described electrostatic chuck 12.Refer to Fig. 3, the described gas back of the body blows control module 14 and comprises source of the gas 140, electromagnetic direction valve 141, mechanical reduction valve 142, electronic proportioning valve 143 and a gas pressure intensity transmitter 144 successively.Connect respectively by tracheae between this source of the gas 140, electromagnetic direction valve 141, mechanical reduction valve 142, electronic proportioning valve 143 and gas pressure intensity transmitter 144.Between described electronic proportioning valve 143 with described gas pressure intensity transmitter 144, any place is connected by the air intake opening 122 of tracheae with described electrostatic chuck 12, guarantees that pressure that described gas pressure intensity transmitter 144 is measured is the pressure at air intake opening 122 place of described electrostatic chuck 12 all the time.The junction of described tracheae must ensure that sealing is good.Described source of the gas 140, for providing gas, can be air, inert gas etc.Described gas is successively by described electromagnetic direction valve 141, mechanical reduction valve 142, electronic proportioning valve 143, enter the back of the body by the air intake opening 122 of described electrostatic chuck 12 afterwards and blow passage 120, now, described gas pressure intensity transmitter 144 is utilized can to record the pressure at air intake opening 122 place.
The described gas back of the body blows control module 14 and can comprise a mass-flow gas meter 145 further, this gas meter 145 is connected between described electronic proportioning valve 143 and described gas pressure intensity transmitter 144, any place now between mass-flow gas meter 145 with described gas pressure intensity transmitter 144 is connected with described electrostatic chuck air intake opening 122 by tracheae, and this mass-flow gas meter 145 can gas flow described in Real-Time Monitoring.In the present embodiment, the described gas back of the body blows control module 14 and comprises mass-flow gas meter 145.
Described electromagnetic direction valve 141 mainly plays overvoltage protection, Micro-force sensor 132 can be avoided impaired, gas when this electromagnetic direction valve 141 is energized in described source of the gas 140 can enter the air intake opening 122 of described electrostatic chuck 12 by electromagnetic direction valve 141, during power-off, gas then cannot arrive air intake opening 122 by electromagnetic direction valve 141; The aperture having an aperture adjustable between the entrance of described mechanical reduction valve 142 and outlet, its aperture passes through diaphragm negative feedback control by back pressure, gas is by after electromagnetic direction valve 141, described mechanical reduction valve 142 can regulate the pressure of described gas to make it in the range ability of described electronic proportioning valve 143 on a large scale, ensure that the inlet pressure that described electronic proportioning valve 143 is connected with mechanical reduction valve 142 is constant, and reduce the impact of gas pressure intensity fluctuation; After gas enters described electronic proportioning valve 143, described electronic proportioning valve 143 regulates described gas pressure intensity further minutely; The sensor of described gas pressure intensity transmitter 145 to be a kind of pressure conversion be standard output signals, real time record enters the gas pressure intensity at air intake opening 122 place of described electrostatic chuck 12.
Refer to Fig. 4, described automatic control and collecting unit 15 adopt data collecting card, the mode that PLC and computing machine combine, described data collecting card gathers described micro-power contact unit 13 and gas carries on the back the data of blowing in control module 14, and communicated mutually with computing machine by data acquisition communication board, computing machine stores, computing machine sends logical order according to the data stored, be communicated to data collecting card, described data collecting card blows control module 14 to the described gas back of the body on the one hand and sends current signal, voltage signal is sent on the other hand to described PLC, thus control micro-power contact unit 13 and gas the back of the body blow control module 14.The frequency acquisition scope of described data collecting card can be 1000Hz ~ 2000Hz.
Described data collecting card comprises a bridge signal capture card, a current signal capture card, a voltage output card.Described bridge signal capture card is electrically connected with described Micro-force sensor 132, and described Micro-force sensor 132 sends the voltage signal of 0mV ~ 5mV to described bridge signal capture card; Described current signal capture card is electrically connected with described gas pressure intensity transmitter 144, and described gas pressure intensity transmitter 145 sends the current signal of 4mA ~ 20mA to described current signal capture card; Computing machine is voltage output card according to the data communication collected, this voltage output card sends the current signal of 4mA ~ 20mA to described electronic proportioning valve, described voltage output card exports the voltage signal of 0V ~ 10V to described PLC simultaneously, described PLC sends high-speed pulse and controls described feed mechanism 131, exports on the other hand control described electromagnetic direction valve 141 with 24V leakage type.Described voltage output card comprises feed mechanism automatic localization reset signal to the voltage signal that described PLC exports, electromagnetic direction valve is energized power-off signal automatically.
By introducing micro-power contact unit, the detection system of the electrostatic chuck electrostatic force that the embodiment of the present invention provides accurately judges that wafer departs from the momentary status of electrostatic chuck, achieve the robotization of testing process on the other hand, substantially increase detection efficiency, mass efficient data can be obtained at short notice, provide necessary software and hardware basis for further investigation electrostatic force produces with elimination mechanism.
According to said system, the embodiment of the present invention provides a kind of further and applies the method that above-mentioned electrostatic chuck electrostatic force detection system detects electrostatic chuck electrostatic force, comprises the following steps:
S1, is adsorbed in electrostatic chuck 12 by wafer 11, just puts;
S2, control micro-power contact unit 13 to decline, this micro-power contact unit 13 comprises a Micro-force sensor 132, when the contact force size between this micro-power contact unit 13 and described wafer 11 is within 5% of described Micro-force sensor 132 full scale, controls described micro-power contact unit 13 and stops declining;
S3, start the gas back of the body and blow control module 14, pass into gas until described wafer 11 departs from described electrostatic chuck 12 to described electrostatic chuck 12, automatically control to gather described gas with collecting unit 15 simultaneously and carry on the back the data of blowing in control module 14 and described micro-power contact unit 13;
S4, analyzes above-mentioned data and finds described wafer 11 to depart from the strong P of gas back of the body blow pressure of described electrostatic chuck 12 moment
1, obtain described wafer 11 by adopting above-mentioned same method after wafer 11 and electrostatic chuck 12 upside down and depart from the described electrostatic chuck 12 strong P of gas back of the body blow pressure instantaneously
2, by P
1, P
2substitution electrostatic force calculates
Formula
,
Wherein, P
0for atmospheric pressure, S is the total area of wafer surface, and G is the general assembly (TW) of wafer.
In this S1 step, wafer 11 is positioned on electrostatic chuck 12, guarantees that the center of gravity of described wafer 11 overlaps with the center of gravity of described electrostatic chuck 12; To the electrode application voltage of described electrostatic chuck 12, now, electrostatic chuck 12 is charged, between wafer 11 and electrostatic chuck 12, produce electrostatic force, and regulation voltage makes described wafer 11 fully be adsorbed by electrostatic force and be held on electrostatic chuck 12.
In this S2 step, described micro-power contact unit 13 moves to described wafer 11 with the speed of 100 microns at least per second.In the process that described micro-power contact unit 13 contacts with wafer 11, described contact force constantly changes, this contact force numerical value is reflected by Micro-force sensor 132 in described micro-power contact unit 13, and in whole contact process, the numerical value change of this Micro-force sensor 132 is gathered by described automatic control and collecting unit 15 and stores simultaneously.When described " contact force " refers to that in described micro-power contact unit, probe 133 contacts with wafer 11, described probe 133 is stressed, this contact force need be far smaller than electrostatic force, that is, it is negligible when this contact force size is within 5% of described Micro-force sensor full scale.
Particularly, described micro-power contact unit 13 with the contact process of described wafer 11 is: the feed mechanism 131 starting the micro-power probe assembly 130 of a certain height in described micro-power contact unit 13, probe 133 is driven to decline and contact described wafer 11, numerical value in Micro-force sensor 132 described in described automatic control and collecting unit 15 Real-time Collection; Probe 133 in the same sub micro-power probe assembly 130 of control residue declines and contacts with described wafer 11.Preferably, probe 133 in described a certain son micro-power probe assembly 130 is distributed in the center of described wafer 11, probe in its minor micro-power probe assembly 130 is uniformly distributed along the edge on described wafer 11 surface, to obtain the contact force data of described probe 133 comprehensively.
When after the stop motion of described micro-power contact unit 13, in this S3 step, particularly, the described gas back of the body blows the process that control module 14 passes into gas to described electrostatic chuck 12: open described source of the gas 140 and produce gas, computing machine in automatic control and collecting unit 15 controls described mechanical reduction valve 142 and described electronic proportioning valve 143 automatically by PLC, the gas pressure intensity entering electrostatic chuck 12 air intake opening 122 is slowly increased equably, when obviously increasing appears in Micro-force sensor 132 reading in any one sub micro-power probe assembly 130, illustrate that described wafer 11 beginning departs from described electrostatic chuck 12, now, continue slowly to increase gas pressure intensity equably, when Micro-force sensor 132 reading in any one sub micro-power probe assembly 130 reaches 60% ~ 90% of its full scale numerical value, stop air feed, described automatic control and collecting unit 15 Computer communication voltage output card, voltage output card sends the current signal stopping air feed to described electromagnetic direction valve 141.In the present embodiment, described automatic control and collecting unit 15 Real-time Collection store the numerical value of described Micro-force sensor 132, gas pressure intensity transmitter 144 and mass-flow gas meter 145 in air feed process; Stop when any one Micro-force sensor 132 reading reaches 80% of its full scale providing gas.
In this S4 step, described automatic control and collecting unit 15 Real-time Collection Micro-force sensor 132 numerical value, gas pressure intensity transmitter 145 numerical value also store in a computer, analysis reaches the data of the Micro-force sensor 132 of full scale 60% ~ 90%, find gas pressure intensity during this Micro-force sensor 132 correspondence probe 133 stressed obvious increase, namely described wafer 11 departs from the gas pressure intensity P of described electrostatic chuck 12 instantaneously
1.Described wafer 11 and electrostatic chuck 12 are just being put device to reverse up and down 180 ° (inversions), adopting uses the same method finds described wafer 11 to depart from the gas pressure intensity P of described electrostatic chuck 12 instantaneously
2; By P
1, P
2substitute into electrostatic force computing formula respectively
, calculate electrostatic force.
Concrete, described formula
according to
obtain, wherein, utilize dead-weight balanced method to calculate to demarcate the back of the body blowing equivalent action area S of described wafer 11 in real work situation
1, i.e. gas and described wafer 11 contact area S
1.As shown in Figure 5, wafer 11 and electrostatic chuck 12 are just being put and is being inverted this two states with wafer 11 and electrostatic chuck 12, applying identical voltage respectively, ensure identical adsorption conditions, complete gas the back of the body blow balance test, just put respectively with inversion state under depart from time back of the body blowing pressure P
1and P
2.
When wafer 11 is just put with electrostatic chuck 12, the stress balance equation of described wafer 11 is:
；
After wafer 11 and electrostatic chuck 12 are inverted, the stress balance equation of described wafer 11 is:
；
Wherein, P
0for atmospheric pressure, P
1and P
2be respectively the gas back of the body blow pressure strong (relative to atmospheric pressure) that described wafer 11 when just putting and be inverted departs from described electrostatic chuck 12 instantaneously, S
1for wafer back blowing equivalent action area, S is the total area on wafer 11 surface, and G is the general assembly (TW) of wafer 11, and F is electrostatic force.
Above-mentioned two formulas are subtracted each other:
；
Namely have:
。
The detection method of above-mentioned electrostatic chuck electrostatic force can comprise a subsequent processes further, and concrete comprises the following steps:
S51, automatically controls the rising of micro-power contact unit 13 respectively and resets;
S52, by the power-off of described electrostatic chuck 12;
S53, takes off the first surface of described wafer 11 from described electrostatic chuck 12.
In S52 step, by two of electrode in described electrostatic chuck 12 lead-in wire short circuits, eliminate residual charge, avoid residual static electricity power to affect, ensure the independence of each testing result.
The detection method of electrostatic chuck electrostatic force provided by the invention, by carrying out corresponding treatment and analysis to the raw data gathered in testing process, judges that wafer departs from the moment of electrostatic chuck, thus the back of the body blow pressure obtained when wafer departs from is strong.The strong product with carrying on the back blowing equivalent action area of this back of the body blow pressure, is the back of the body and blows the general pressure of channel gas to wafer, then can obtain electrostatic force size according to equilibrium relation.The first, this detection method makes whole detection system be in the process of quasistatic or slowly change by controlling micro-power contact unit, avoids the systematic error that transient process produces, improves measuring accuracy; The second, detection method highly sensitive, can detect break-off when obviously not expanding in gap quickly and accurately, reduces the impact that local departs from, reduces measuring error; 3rd, the back of the body blowing equivalent action area of this detection method to the wafer that theoretical and emulation not easily obtain has carried out effective demarcation, simple to operate, practical.
In addition, those skilled in the art also can do other changes in spirit of the present invention, and certainly, these changes done according to the present invention's spirit, all should be included within the present invention's scope required for protection.
Claims (10)
1. a detection system for electrostatic chuck electrostatic force, is characterized in that, comprising:
One wafer;
One electrostatic chuck, this electrostatic chuck has the first surface and second surface that are oppositely arranged, and first surface is for placing described wafer, and second surface has an air intake opening;
One micro-power contact unit, this micro-power contact unit is arranged at the side of described wafer away from described electrostatic chuck, for contacting described wafer;
The one gas back of the body blows control module, and this gas back of the body blows control module and is communicated with the air intake opening of described electrostatic chuck, for providing gas to described electrostatic chuck;
One automatically controls and collecting unit, and Real-time Collection also stores described micro-power contact unit and gas carry on the back the data of blowing in control module, the described electrostatic chuck electrostatic force detection system of control automatically.
2. the detection system of electrostatic chuck electrostatic force as claimed in claim 1, it is characterized in that, described micro-power contact unit comprises the micro-power probe assembly of at least one height, the micro-power probe assembly of this each height comprises a feed mechanism, a Micro-force sensor and a probe, described feed mechanism drives described probe to described movement of wafers, and described Micro-force sensor detects the stressed of described probe in real time.
3. the detection system of electrostatic chuck electrostatic force as claimed in claim 2, it is characterized in that, described feed mechanism has a mobile terminal, and the mobile terminal of described feed mechanism is fixed in one end of described Micro-force sensor, and the other end of described Micro-force sensor is used for fixing described probe.
4. the detection system of electrostatic chuck electrostatic force as claimed in claim 1, is characterized in that, the described gas back of the body blows control module and comprises a source of the gas, an electromagnetic direction valve, a mechanical reduction valve, an electronic proportioning valve and a gas pressure intensity transmitter successively.
5. the detection system of electrostatic chuck electrostatic force as claimed in claim 4, it is characterized in that, the described gas back of the body blows control module and comprises a mass-flow gas meter further, and the tracheae between this mass-flow gas meter with described gas pressure intensity transmitter is connected with the air intake opening of described electrostatic chuck.
6. the detection system of electrostatic chuck electrostatic force as claimed in claim 1, it is characterized in that, described automatic control and collecting unit comprise data collecting card, PLC and computing machine, described data collecting card and described micro-power contact unit and gas are carried on the back and are blown control module and be electrically connected, gather described micro-power contact unit and gas carries on the back the data of blowing in control module, described data collecting card is communicated mutually with described computing machine by a data acquisition communication board, computing machine sends logical order, be communicated to described data collecting card, described data collecting card blows control module to the described gas back of the body on the one hand and sends current signal, voltage signal is sent on the other hand to described PLC.
7. the detection system of electrostatic chuck electrostatic force as claimed in claim 6, it is characterized in that, described data collecting card comprises a bridge signal capture card, a current signal capture card, a voltage output card, described bridge signal capture card is electrically connected with described micro-power contact unit, described current signal capture card and described gas are carried on the back and are blown control module and be electrically connected, and described voltage output card is electrically connected with described PLC.
8. a detection method for electrostatic chuck electrostatic force, comprises the following steps:
S1, provides the detection system of electrostatic chuck electrostatic force as claimed in claim 1;
S2, invests electrostatic chuck by chip sucking, is just putting and is putting;
S3, control micro-power contact unit to decline, this micro-power contact unit comprises a Micro-force sensor, when the contact force size between this micro-power contact unit and described wafer is within 5% of described Micro-force sensor full scale, controls described micro-power contact unit and stops declining;
S4, starts the gas back of the body and blows control module, pass into gas until described wafer departs from described electrostatic chuck to described electrostatic chuck, automatically controls to gather described gas with collecting unit simultaneously and carries on the back the data of blowing in control module and described micro-power contact unit;
S5, analyzes above-mentioned data and finds described wafer to depart from the strong P of gas back of the body blow pressure of described electrostatic chuck moment
1, obtain described wafer by adopting above-mentioned same method after wafer and electrostatic chuck upside down and depart from institute
State the strong P of gas back of the body blow pressure of electrostatic chuck moment
2, by P
1, P
2substitute into electrostatic force formula
，
Wherein, P
0for atmospheric pressure, S is the total area of wafer surface, and G is the general assembly (TW) of wafer.
9. the detection method of electrostatic chuck electrostatic force as claimed in claim 8, it is characterized in that, described micro-power contact unit comprises the micro-power probe assembly of at least one height, this micro-power probe assembly comprises a probe, control the micro-power probe assembly of described at least one height successively respectively to decline, wherein the probe of any one sub micro-power probe assembly is distributed in the center of described wafer, and the probe of its minor micro-power probe assembly is uniformly distributed along the edge of described wafer surface.
10. the detection method of electrostatic chuck electrostatic force as claimed in claim 8, is characterized in that, described formula
according to
obtain, wherein, utilize dead-weight balanced method to calculate to demarcate the back of the body blowing equivalent action area S of described wafer in real work situation
1:
When wafer and electrostatic chuck are just put, the stress balance equation of wafer is:
；
When wafer and electrostatic chuck are inverted, the stress balance equation of wafer is:
；
Wherein, P
0for atmospheric pressure, P
1and P
2be respectively described wafer when just putting and be inverted and depart from the gas back of the body blow pressure of described electrostatic chuck moment by force, S
1for wafer back blowing equivalent action area, S is the total area of wafer surface, and G is the general assembly (TW) of wafer, and F is electrostatic force,
Above-mentioned two formulas are subtracted each other:
；
Namely have:
。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434363A (en) * | 2019-09-20 | 2019-11-12 | 咸阳圣亚机电设备有限公司 | End face positions workpiece holding structure and detection method |
| CN110873640A (en) * | 2018-08-13 | 2020-03-10 | 北京华卓精科科技股份有限公司 | Electrostatic chuck performance detection device and detection method |
| CN114608771A (en) * | 2022-03-21 | 2022-06-10 | 天津大学 | Calibration device and method for current collecting magnetic force and electrostatic force based torsion scale thrust frame |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7719294B1 (en) * | 2002-11-04 | 2010-05-18 | Kla-Tencor Technologies Corp. | Systems configured to perform a non-contact method for determining a property of a specimen |
| CN103376176A (en) * | 2013-06-21 | 2013-10-30 | 清华大学 | Device for measuring electrostatic force of electrostatic chuck |
| CN203443718U (en) * | 2013-06-21 | 2014-02-19 | 清华大学 | Apparatus for measuring electrostatic force of electrostatic chuck |
| CN103698068A (en) * | 2013-12-06 | 2014-04-02 | 清华大学 | Electrostatic chuck basic performance detection device and detection method thereof |
| CN103698070A (en) * | 2013-12-17 | 2014-04-02 | 北京华卓精科科技有限公司 | Device for measuring electrostatic adsorption force and desorption time of electrostatic chuck |
| CN203657947U (en) * | 2013-12-06 | 2014-06-18 | 清华大学 | Electrostatic chuck basic performance detection apparatus |
| CN205192672U (en) * | 2015-11-05 | 2016-04-27 | 清华大学 | Detecting system of electrostatic chuck electrostatic force |
-
2015
- 2015-11-05 CN CN201510743907.1A patent/CN105241599B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN203657947U (en) * | 2013-12-06 | 2014-06-18 | 清华大学 | Electrostatic chuck basic performance detection apparatus |
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