CN203336546U - High-power LED lamp cooling device - Google Patents
High-power LED lamp cooling device Download PDFInfo
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- CN203336546U CN203336546U CN2013203694509U CN201320369450U CN203336546U CN 203336546 U CN203336546 U CN 203336546U CN 2013203694509 U CN2013203694509 U CN 2013203694509U CN 201320369450 U CN201320369450 U CN 201320369450U CN 203336546 U CN203336546 U CN 203336546U
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- led lamp
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- cooling device
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Abstract
The utility model discloses a high-power LED lamp cooling device. Electric colorized marks are arranged on one end face of each N-type semiconductor element and one end face of each P-type semiconductor element respectively, the N-type semiconductor elements in each row are connected in series through upper conducting strips arranged on an upper beryllia ceramic wafer, the P-type semiconductor elements in each row are connected in series through lower conducting strips arranged on a lower beryllia ceramic wafer, the head ends of the N-type semiconductor elements in each row and the tail ends of the P-type semiconductor elements in each row are connected, or the tail ends of the N-type semiconductor elements in each row and the head ends of the P-type semiconductor elements in each row are connected, the upper conducting strips, connected with the N-type semiconductor elements and the P-type semiconductor elements in each row in series, at the two outermost ends, or the lower conducting strips, connected with the N-type semiconductor elements and the P-type semiconductor elements in each row in series, at the two outermost ends are provided with a wire connected with a direct current power source. The high-power LED lamp cooling device has the advantages of being good in cooling effect, high in working efficiency, low in energy consumption, capable of reducing light failure of an LED lamp and prolonging the service life of a high-power LED lamp and the like.
Description
Technical field
The utility model relates to a kind of high-powered LED lamp cooling device, belongs to high-powered LED lamp radiating and cooling technical field.
Background technology
The luminous efficiency of LED lamp not only depends on the LED bulb quality, the more important thing is the temperature while also depending on the work of LED lamp, particularly high-powered LED lamp is when work, its temperature is more than 55 ℃ the time, every rising once, its luminous efficiency approximately 2% left and right that will descend, therefore process extremely important to LED lamp, particularly cooling during high-powered LED lamp work.Often adopt in the prior art the air-cooled or mode that adopts semiconductor cooling device to the high-powered LED lamp processing of lowering the temperature.Utilize P-type semiconductor element and N-type semiconductor element can, in the characteristics of its generation hot junction, two ends and cold junction different temperatures, to be widely used in and to have made semiconductor refrigerating or heat in devices field when energising.At present, when adopting N-type or P-type semiconductor element to make the cooling device, often do not consider the direction of N-type or P-type semiconductor element, when connecting N-type or P-type semiconductor element, do not consider the tail end of N-type or P-type semiconductor element, but will between N-type or P-type semiconductor element, carry out interconnecting of arbitrary end, this connected mode regardless of tail end has not only reduced the operating efficiency of semiconductor element, but also increased the energy consumption of device of lowering the temperature, and make the cooling device of made not reach due cryogenic temperature.Make the refrigeration cool-down device obtained by this conventional method, the temperature difference at its hot junction and cold junction two ends generally can only reach 60 degree left and right.Therefore, the result of use of the refrigeration cool-down device that existing employing P-type semiconductor element and N-type semiconductor element are made or not ideal enough, be not suitable for using as high-powered LED lamp cooling device especially.
Summary of the invention
The purpose of this utility model is: provide a kind of good cooling effect, operating efficiency is higher, energy consumption is lower high-powered LED lamp cooling device, to overcome the deficiencies in the prior art.
The utility model is to form like this: a kind of high-powered LED lamp cooling device of the present utility model is, this device comprises that the mode of arranging by matrix is arranged in two and is provided with the upper beryllium oxide ceramics sheet of conducting channel and N-type semiconductor element and the P-type semiconductor element between lower beryllium oxide ceramics sheet, all be provided with the color marker of doing of conduction on an end face of N-type semiconductor element and P-type semiconductor element, this is provided with the tail end that the end face of making color marker is N-type semiconductor element or P-type semiconductor element, the other end of not making color marker of N-type semiconductor element or P-type semiconductor element is head end, the N-type semiconductor element of each row is connected by the lower conducting strip as conducting channel that is arranged on the upper conducting strip as conducting channel on upper beryllium oxide ceramics sheet and be arranged on lower beryllium oxide ceramics sheet respectively mutually with the P-type semiconductor element, and the head end of the N-type semiconductor element of each row is connected with the tail end of P-type semiconductor element or the tail end of each row N-type semiconductor element is connected with the head end of P-type semiconductor element, be in series with at each row on the lower conducting strip of the upper conducting strip of two outermost end of N-type semiconductor element and P-type semiconductor element or two outermost end and be provided with the wire for being connected with dc source.
Be fitted with beryllium copper plate briquetting on the upper surface of beryllium oxide ceramics sheet on above-mentioned, be provided with the aluminium base for heat radiation on beryllium copper plate briquetting, be fitted with the heat-conduction even temperature plate by Graphene thermal grease conduction layer on the bottom surface of lower beryllium oxide ceramics sheet, be provided with the high power LED lamp circuit for the mounted LED lamp bubble on the heat-conduction even temperature plate, the two ends of heat-conduction even temperature plate connect as one by screw and aluminium base respectively.
Be provided with the heat pipe installing hole for the installation of heat radiator heat pipe on above-mentioned aluminium base.
Above-mentioned heat-conduction even temperature plate is the printed circuit board (PCB) be provided with for the high power LED lamp circuit of mounted LED lamp bubble.
Owing to having adopted technique scheme, the utility model is on the basis of traditional making N-type semiconductor element and P-type semiconductor element, when carrying out the section of semiconductor crystal bar, it is carried out to the colour code processing, thereby can identify easily head end or the tail end of N-type semiconductor element or P-type semiconductor element, and the orientation of this head end or tail end is consistent with the orientation on crystal bar when not cutting into slices.Like this, when when using semiconductor element of the present utility model, just can pick out easily tail end and head end, thereby avoid in prior art when N-type is connected with the P-type semiconductor element, because distinguishing head end and tail end, and the phenomenon that confusion connects mutually end to end caused.Adopt N-type of the present utility model or P-type semiconductor element when making refrigeration device, can carry out easily head end is connected with the orderly of tail end, can effectively improve the operating efficiency of each N-type and P-type semiconductor element like this, and effectively improve the refrigeration of whole refrigeration cool-down device.The high-powered LED lamp cooling device that adopts the utility model to make, the temperature difference in its cold junction and hot junction reaches 73～78 degree left and right after tested, cooling device of the present utility model is arranged on the high-powered LED lamp of 200 watts and uses, can guarantee that the circuit board long-term stability of this high-powered LED lamp is in the temperature work below 45 ℃, thereby effectively improved the operating efficiency of high-powered LED lamp, and extended the service life of high-powered LED lamp.So compared with prior art, the utility model not only has advantages of that good cooling effect, high efficiency, energy consumption are low to the utility model, but also have advantages of and can effectively reduce the high-powered LED lamp light decay, extend high-powered LED lamp service life.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Description of reference numerals: 1-aluminium base, 2-heat pipe installing hole, 3-beryllium copper plate briquetting, the upper beryllium oxide ceramics sheet of 4-, the upper conducting strip of 5-, 6-N type semiconductor element, 7-P type semiconductor element, conducting strip under 8-, beryllium oxide ceramics sheet under 9-, 10-Graphene thermal grease conduction layer, 11-heat-conduction even temperature plate, the 12-wire, the 13-screw.
The specific embodiment
Below in conjunction with drawings and Examples, the utility model is done further to say in detail.
Embodiment of the present utility model: the utility model is constructed according to the preparation method of following a kind of high-powered LED lamp cooling device, the method comprises and adopts N-type semiconductor element and the P-type semiconductor element cooling module as high-powered LED lamp cooling device, when adopting N-type semiconductor element and P-type semiconductor element as the cooling module of high-powered LED lamp cooling device, in advance when the technique by traditional is made N-type semiconductor element or P-type semiconductor element, the semiconductor crystal bar of making N-type semiconductor element or P-type semiconductor element is made as to a diameter large, the cone shape crystal bar that the other end diameter is little, then the semiconductor crystal bar of this cone shape is cut into slices and made the wafer that thickness is identical, using the smaller diameter end of wafer as head end, larger diameter end is as tail end, and make color marker number on the breech face of every wafer, when making color marker, can adopt the color of conductive material making (as adopted copper, the conductive materials such as aluminium or silver are made into color) showed signs of anger, then the taper seat of every wafer cut to granulation, every wafer is all cut and is granulation into identical polygon cylinder body shape, this polygon cylinder body shape can be determined according to the needs that use, usually can be made into quadrangle cylinder, square column, regular hexagon cylinder, octagon cylinder, regualr decagon cylinder or dodecagon cylinder, the semiconductor of making like this this polygon cylinder body shape obtained is N-type semiconductor element or the P-type semiconductor element that is provided with head end and tail end, the mode of then this N-type semiconductor element and P-type semiconductor element being arranged by classical matrix is arranged between two beryllium oxide ceramics sheets that are provided with conducting channel, the N-type semiconductor element of each row is connected mutually with the P-type semiconductor element, and the head end that makes each be listed as the N-type semiconductor element of series connection is connected with the tail end of P-type semiconductor element or the tail end of N-type semiconductor element is connected with the head end of P-type semiconductor element.
The structural representation of the of the present utility model a kind of high-powered LED lamp cooling device built according to said method as shown in Figure 1, this cooling device comprises that the mode of arranging by matrix is arranged in two and is provided with the upper beryllium oxide ceramics sheet 4 of conducting channel and N-type semiconductor element 6 and the P-type semiconductor element 7 between lower beryllium oxide ceramics sheet 9, all be provided with the color marker of doing of conduction on an end face of N-type semiconductor element 6 and P-type semiconductor element 7, this is provided with the tail end that the end face of making color marker is N-type semiconductor element 6 or P-type semiconductor element 7, the other end of not making color marker of N-type semiconductor element 6 or P-type semiconductor element 7 is head end, the N-type semiconductor element 6 of each row is connected by being arranged on the upper conducting strip 5 on upper beryllium oxide ceramics sheet 4 and the lower conducting strip 8 be arranged on lower beryllium oxide ceramics sheet 9 respectively mutually with P-type semiconductor element 7, and the head end of the N-type semiconductor element 6 of each row is connected with the tail end of P-type semiconductor element 7 or the tail end of each row N-type semiconductor element 6 is connected with the head end of P-type semiconductor element 7, on being in series with the lower conducting strip 8 of the upper conducting strip 5 of two outermost end of N-type semiconductor element 6 and P-type semiconductor element 7 or two outermost end, each row is connected the wire 12(that can be connected with dc source as shown in Figure 1) simultaneously, during making, a beryllium copper plate briquetting 3 of laminating on the upper surface of upper beryllium oxide ceramics sheet 4 is installed an aluminium base 1 for heat radiation on beryllium copper plate briquetting 3, produces the heat pipe installing hole 2 for the installation of heat radiator heat pipe simultaneously on aluminium base 1, pass through a heat-conduction even temperature plate 11 of Graphene thermal grease conduction layer 10 laminating on the bottom surface of lower beryllium oxide ceramics sheet 9, make the high power LED lamp circuit for the mounted LED lamp bubble on this heat-conduction even temperature plate 11 by traditional high power LED lamp circuit, this heat-conduction even temperature plate 11 also can directly adopt the existing printed circuit board (PCB) be provided with for the high power LED lamp circuit of mounted LED lamp bubble, finally the two ends of heat-conduction even temperature plate 11 are connected as one by screw 13 and aluminium base 1 respectively.
While using high-powered LED lamp cooling device of the present utility model, only need this device is arranged in the lampshade of high-powered LED lamp, and the LED bulb is arranged on heat-conduction even temperature plate 11, the heat pipe of radiator is fixed in the heat pipe installing hole 2 of aluminium base 1 simultaneously, and wire 12 can be used respectively with after dc source is connected with the power line on heat-conduction even temperature plate 11.
Claims (4)
1. high-powered LED lamp cooling device, comprise that the mode of arranging by matrix is arranged in two upper beryllium oxide ceramics sheet (4) and the N-type semiconductor element (6) between lower beryllium oxide ceramics sheet (9) and P-type semiconductor elements (7) that are provided with conducting channel, it is characterized in that: the color marker of doing that all is provided with conduction on an end face of N-type semiconductor element (6) and P-type semiconductor element (7), this is provided with the tail end that the end face of making color marker is N-type semiconductor element (6) or P-type semiconductor element (7), the other end of not making color marker of N-type semiconductor element (6) or P-type semiconductor element (7) is head end, the N-type semiconductor element (6) of each row is connected by the lower conducting strip (8) that is arranged on the upper conducting strip (5) on upper beryllium oxide ceramics sheet (4) and be arranged on lower beryllium oxide ceramics sheet (9) respectively mutually with P-type semiconductor element (7), and the head end of the N-type semiconductor element (6) of each row is connected with the tail end of P-type semiconductor element (7) or the tail end of each row N-type semiconductor element (6) is connected with the head end of P-type semiconductor element (7), be in series with at each row on the lower conducting strip (8) of the upper conducting strip (5) of N-type semiconductor element (6) and two outermost end of P-type semiconductor element (7) or two outermost end and be provided with the wire (12) for being connected with dc source.
2. high-powered LED lamp according to claim 1 cooling device, it is characterized in that: be fitted with beryllium copper plate briquetting (3) on the upper surface of upper beryllium oxide ceramics sheet (4), be provided with the aluminium base (1) for heat radiation on beryllium copper plate briquetting (3), be fitted with heat-conduction even temperature plate (11) by Graphene thermal grease conduction layer (10) on the bottom surface of lower beryllium oxide ceramics sheet (9), be provided with the high power LED lamp circuit for the mounted LED lamp bubble on heat-conduction even temperature plate (11), the two ends of heat-conduction even temperature plate (11) connect as one by screw (13) and aluminium base (1) respectively.
3. high-powered LED lamp cooling device according to claim 2, is characterized in that: be provided with the heat pipe installing hole (2) for the installation of heat radiator heat pipe on aluminium base (1).
4. high-powered LED lamp according to claim 2 cooling device, it is characterized in that: heat-conduction even temperature plate (11) is for being provided with the printed circuit board (PCB) for the high power LED lamp circuit of mounted LED lamp bubble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203694509U CN203336546U (en) | 2013-06-25 | 2013-06-25 | High-power LED lamp cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203694509U CN203336546U (en) | 2013-06-25 | 2013-06-25 | High-power LED lamp cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203336546U true CN203336546U (en) | 2013-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203694509U Withdrawn - After Issue CN203336546U (en) | 2013-06-25 | 2013-06-25 | High-power LED lamp cooling device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203336546U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353098A (en) * | 2013-06-25 | 2013-10-16 | 陈志明 | High-power LED lamp cooling device and manufacturing method thereof |
-
2013
- 2013-06-25 CN CN2013203694509U patent/CN203336546U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353098A (en) * | 2013-06-25 | 2013-10-16 | 陈志明 | High-power LED lamp cooling device and manufacturing method thereof |
| WO2014206166A1 (en) * | 2013-06-25 | 2014-12-31 | 苏州伟源新材料科技有限公司 | High-power led lamp cooling device and manufacturing method therefor |
| CN103353098B (en) * | 2013-06-25 | 2015-09-23 | 陈志明 | A kind of high-powered LED lamp cooling device and preparation method thereof |
| US9412925B2 (en) | 2013-06-25 | 2016-08-09 | Zhiming Chen | High-power LED lamp cooling device and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20131211 Effective date of abandoning: 20150923 |
|
| RGAV | Abandon patent right to avoid regrant |