CN203325851U - Pedestal system and chemical mechanical grinding device - Google Patents
Pedestal system and chemical mechanical grinding device Download PDFInfo
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- CN203325851U CN203325851U CN2013203357187U CN201320335718U CN203325851U CN 203325851 U CN203325851 U CN 203325851U CN 2013203357187 U CN2013203357187 U CN 2013203357187U CN 201320335718 U CN201320335718 U CN 201320335718U CN 203325851 U CN203325851 U CN 203325851U
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- carrying platform
- seat support
- wafer carrying
- inner chamber
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Abstract
The utility model discloses a pedestal system comprising a pedestal cavity, a water path, an air path, a water valve and an air valve. The pedestal system is characterized in that the water path and the air path are respectively and independently connected with the pedestal cavity, the water valve is arranged on the water path, and the air valve is arranged on the air path. The utility model also discloses a chemical mechanical grinding device comprising a grinding head and the pedestal system. The pedestal described in the utility model is characterized in that the water path and the air path are controlled in a separated manner, structural complexity can be lowered, and the water path and the air path can be controlled conveniently.
Description
Technical field
The utility model relates to semi-conductor device technology field, particularly relates to a kind of base systems and chemical mechanical polishing device.
Background technology
Along with the development of very lagre scale integrated circuit (VLSIC), integrated circuit fabrication process becomes and becomes increasingly complex with meticulous.In order to improve integrated level, reduce manufacturing cost, the characteristic size of device constantly diminishes, the number of elements of chip unit are constantly increases, plane routing has been difficult to meet the requirement that the element high density distributes, adopt polylaminate wiring technique, utilize the vertical space of chip, can further improve the integration density of device.
But the application of polylaminate wiring technique can cause crystal column surface uneven, extremely unfavorable to graphic making.So, need to carry out planarization (Planarization) to uneven crystal column surface and process.At present, chemical mechanical milling method (Chemical Mechanical Polishing, CMP) be the best approach of reaching overall planarization, especially, after semiconductor fabrication process enters submicrometer field, cmp has become an indispensable Manufacturing Techniques.
Chemical mechanical milling method (CMP) is a kind of flattening method that the method that combines by chemical reaction and mechanical lapping is removed the material layer on semiconductor structure surface.Refer to Fig. 1, the chemical mechanical polishing device that Fig. 1 is prior art.Described chemical mechanical polishing device 100 comprises that grinding head 110 and base systems (claim again grinding head to clean and wafer handling unit, head clean load/unload, HCLU), when described grinding head 110 has the wafer of loading task (not specifically illustrating described wafer in Fig. 1), described base systems provides the terminal of a wafer load and unloading, and the wafer be placed on described base systems is implemented to cleaning action.
Described base systems comprises: wafer carrying platform 121, pedestal inner chamber 122, base seat support 123, for controlling the handling unit 124 that described wafer carrying platform moves, water route 125, gas circuit 126 and control line 127, described base seat support 123 supports described wafer carrying platform 121, described wafer carrying platform 121 is for placing wafer to be loaded, described pedestal inner chamber 122 is positioned at the inside of described wafer carrying platform 121 and the inside of described base seat support 123, described water route 125 and gas circuit 126 connect described pedestal inner chamber 122, to described wafer, to provide water or vacuum pressure, and control water or vacuum pressure are provided by described control line 127.When wafer is placed on described wafer carrying platform 121, described control line 127 is controlled described gas circuit 126 and is provided negative pressure by described pedestal inner chamber 122 to described wafer, by described wafer adsorption on described wafer carrying platform 121.Then, described control line 127 is controlled described water route 125 provides water by described pedestal inner chamber 122 to described wafer, so that described wafer is cleaned.
But, in the described base systems of prior art, described handling unit 124 is three pedestal cylinders (pedestal cylinder), three pedestal cylinders (pedestal cylinder) are evenly outside described base seat support 123, be the angle of 120 ° between every two pedestal cylinders, as shown in Figure 2.Also have a sealing shroud 131 between described handling unit 124 and described base seat support 123, and sealed by sealing ring (pedestal seal) 132 and O type circle (O-ring) 133.Described handling unit 124 surrounds the described pedestal inner chamber 122 in described base seat support 123, makes seal structure complex; And, when described handling unit 124 moves up and down when wafer is loaded and unloaded, described sealing ring 132 and O type circle 133 can wearing and tearing, thereby affect sealing.
The utility model content
The purpose of this utility model is, a kind of base systems and chemical mechanical polishing device are provided, and can prevent that liquid backflow from entering vacuum pump, and can be collected and process liquid easily.
For solving the problems of the technologies described above, the utility model provides a kind of base systems, comprise pedestal inner chamber, water route, gas circuit, water valve and air valve, it is characterized in that, described water route and gas circuit connect separately respectively described pedestal inner chamber, described water valve is arranged on described water route, and described air valve is arranged on described gas circuit.
Further, in described base systems, described base systems also comprises wafer carrying platform and base seat support, and described base seat support supports described wafer carrying platform, and described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of at least part of described base seat support.
Further, in described base systems, described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of described base seat support and described wafer carrying platform coupling part.
Further, in described base systems, described base systems also comprises the handling unit moved for controlling described wafer carrying platform, and described handling unit Independent is placed in by described base seat support.
Further, in described base systems, described handling unit is a pedestal cylinder.
Further, in described base systems, described wafer carrying platform has some through holes away from a side of described base seat support, and described through hole passes to described pedestal inner chamber.
According to another side of the present utility model, the utility model also provides a kind of chemical mechanical polishing device, comprises grinding head and described base systems.
Compared with prior art, the utility model provides base systems and chemical mechanical polishing device have the following advantages:
1, the utility model provides a kind of base systems and chemical mechanical polishing device, described water route and gas circuit connect separately respectively described pedestal inner chamber, described water valve is arranged on described water route, described air valve is arranged on described gas circuit, compared with prior art, the utility model is separately controlled described water route and gas circuit, reduces the complexity of structure, conveniently described water route and gas circuit is controlled; And, described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of described base seat support and described wafer carrying platform coupling part, make near the described base seat support in described handling unit and do not have described pedestal inner chamber, thereby reduce the complexity of hermetically-sealed construction.
2, the utility model provides a kind of base systems and chemical mechanical polishing device, and described handling unit is a pedestal cylinder, thereby reduces the complexity of structure; And described handling unit can be placed in by described base seat support by Independent, thereby avoid using sealing ring and O type circle, when described handling unit moves up and down when wafer is loaded and unloaded, the wearing and tearing to described sealing ring and O type circle have further been avoided, thereby, in the simplified structure complexity, improve useful life.
The accompanying drawing explanation
The schematic diagram that Fig. 1 is chemical mechanical polishing device of the prior art;
Fig. 2 is the profile of Fig. 1 along AA ' line;
The schematic diagram of the base systems that Fig. 3 is the utility model one embodiment;
Fig. 4 is the profile of Fig. 3 along BB ' line;
The schematic diagram of the chemical mechanical polishing device that Fig. 5 is the utility model one embodiment;
The schematic diagram of the chemical mechanical polishing device that Fig. 6 is another embodiment of the utility model.
Embodiment
Below in conjunction with schematic diagram, base systems of the present utility model and chemical mechanical polishing device are described in more detail, wherein meaned preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
With way of example, the utility model is more specifically described with reference to accompanying drawing in the following passage.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, the utility model provides a kind of base systems, comprise pedestal inner chamber, water route, gas circuit, water valve and air valve, described water route and gas circuit connect separately respectively described pedestal inner chamber, described water valve is arranged on described water route, and described air valve is arranged on described gas circuit, and described water route and gas circuit are separately controlled, reduce the complexity of structure, conveniently described water route and gas circuit are controlled.
Further, in conjunction with the said base system, the utility model also provides a kind of chemical mechanical polishing device, comprises grinding head and described base systems.
Illustrate the base systems of the present embodiment below in conjunction with Fig. 3, the schematic diagram of the base systems that Fig. 3 is the utility model one embodiment.
As shown in Figure 3, described base systems 220 comprises wafer carrying platform 221, pedestal inner chamber 222, base seat support 223, the 224, water route, handling unit 225, gas circuit 226, water valve 227 and the air valve 228 that move for controlling described wafer carrying platform.When wafer that needs are processed is placed on described wafer carrying platform 121, described gas circuit 126 provides negative pressure by described pedestal inner chamber 122 to described wafer, by described wafer adsorption on described wafer carrying platform 121.Then, described water route 125 provides water by described pedestal inner chamber 122 to described wafer, so that described wafer is cleaned.
Described base seat support 223 supports described wafer carrying platform 221, in the present embodiment, described pedestal inner chamber 222 is positioned at the inside of described wafer carrying platform 211 and the inside of described base seat support 223 and described wafer carrying platform 221 coupling parts, described water route 225 and gas circuit 226 connect separately respectively described pedestal inner chamber 222, preferably, described water route 225 and gas circuit 226 all are connected with the described pedestal inner chamber 222 of described wafer carrying platform 221 inside, coupling part with described base seat support 223, thereby can provide water or vacuum pressure to described wafer easily.Described water valve 227 is arranged on described water route 225, individually the water that cleans use is controlled; Described air valve 228 is arranged on described gas circuit 226, individually pressure is controlled.The utility model is separately controlled described water route 225 and gas circuit 226, reduces the complexity of structure, conveniently described water route and gas circuit is controlled.And, described pedestal inner chamber 222 is positioned at the inside of described wafer carrying platform 221 and the inside of described base seat support 223 and described wafer carrying platform 221 coupling parts, make near the described base seat support 223 in described handling unit 224 and do not have described pedestal inner chamber 222, thereby reduce the complexity of hermetically-sealed construction.
In the present embodiment, it is other that described handling unit 224 Independents are placed in described base seat support 223, by sealing ring and O type circle and described base seat support 223, be not tightly connected, as shown in Figure 4, thereby avoid using sealing ring and O type circle, when described handling unit moves up and down when wafer is loaded and unloaded, the wearing and tearing to described sealing ring and O type circle have further been avoided, thereby, in the simplified structure complexity, improve useful life.Wherein, described handling unit 224 is a pedestal cylinder, thereby reduces the complexity of structure.But it is a pedestal cylinder that described handling unit 224 is not limited to, can also be the pedestal cylinder of a plurality of arrangements, as long as can drive described wafer carrying platform 221 moves up and down the handling wafer, also within thought range of the present utility model.
In the present embodiment, described wafer carrying platform 221 has some through holes 229 away from a side of described base seat support 223, and described through hole 229 passes to described pedestal inner chamber 222, to described wafer, to provide water or vacuum pressure.
In the present embodiment, described base systems 220 can be used for preparing chemical mechanical polishing device, for the grinding head of chemical mechanical polishing device carries out the handling of wafer.The schematic diagram of the chemical mechanical polishing device that as shown in Figure 5, Fig. 5 is the utility model one embodiment.In Fig. 5, described chemical mechanical polishing device 200 comprises grinding head 210 and above-mentioned base systems, and described grinding head 210 is positioned at the side of described wafer carrying platform 221 away from described base seat support 223.
Described base systems of the present utility model is not limited to above-described embodiment, described pedestal inner chamber 222 is not limited to be positioned at the inside of described wafer carrying platform 211 and the inside of described base seat support 223 and described wafer carrying platform 221 coupling parts, described pedestal inner chamber 222 also is positioned at the inside of described wafer carrying platform 221 and the inside of the described base seat support 223 of part, as shown in Figure 6, or described pedestal inner chamber 222 inside that also is positioned at the inside of described wafer carrying platform 221 and runs through described base seat support 223, can also realize described water route and gas circuit are separately controlled, thereby reach the complexity that reduces structure, the convenient beneficial effect that described water route and gas circuit are controlled, also within thought range of the present utility model.
In sum, the utility model provides a kind of base systems, comprise the wafer carrying platform, the pedestal inner chamber, base seat support, for controlling the handling unit that described wafer carrying platform moves, water route, gas circuit, water valve and air valve, described base seat support supports described wafer carrying platform, described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of at least part of described base seat support, described water route and gas circuit connect separately respectively described pedestal inner chamber, described water valve is arranged on described water route, described air valve is arranged on described gas circuit, described water route and gas circuit are separately controlled, reduce the complexity of structure, conveniently described water route and gas circuit are controlled.Compared with prior art, the utility model provides base systems and chemical mechanical polishing device have the following advantages:
1, the utility model provides a kind of base systems and chemical mechanical polishing device, described water route and gas circuit connect separately respectively described pedestal inner chamber, described water valve is arranged on described water route, described air valve is arranged on described gas circuit, compared with prior art, the utility model is separately controlled described water route and gas circuit, reduces the complexity of structure, conveniently described water route and gas circuit is controlled; And, described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of described base seat support and described wafer carrying platform coupling part, make near the described base seat support in described handling unit and do not have described pedestal inner chamber, thereby reduce the complexity of hermetically-sealed construction.
2, the utility model provides a kind of base systems and chemical mechanical polishing device, and described handling unit is a pedestal cylinder, thereby reduces the complexity of structure; And described handling unit can be placed in by described base seat support by Independent, thereby avoid using sealing ring and O type circle, when described handling unit moves up and down when wafer is loaded and unloaded, the wearing and tearing to described sealing ring and O type circle have further been avoided, thereby, in the simplified structure complexity, improve useful life.
Obviously, those skilled in the art can carry out various changes and modification and not break away from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model also is intended to comprise these changes and modification interior.
Claims (7)
1. a base systems, comprise pedestal inner chamber, water route, gas circuit, water valve and air valve, it is characterized in that, described water route and gas circuit connect separately respectively described pedestal inner chamber, and described water valve is arranged on described water route, and described air valve is arranged on described gas circuit.
2. base systems as claimed in claim 1, it is characterized in that, described base systems also comprises wafer carrying platform and base seat support, and described base seat support supports described wafer carrying platform, and described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of at least part of described base seat support.
3. base systems as claimed in claim 2, is characterized in that, described pedestal inner chamber is positioned at the inside of described wafer carrying platform and the inside of described base seat support and described wafer carrying platform coupling part.
4. as base systems as described in any one in claim 2-3, it is characterized in that, described base systems also comprises the handling unit moved for controlling described wafer carrying platform, and described handling unit Independent is placed in by described base seat support.
5. base systems as claimed in claim 4, is characterized in that, described handling unit is a pedestal cylinder.
6. base systems as claimed in claim 2, is characterized in that, described wafer carrying platform has some through holes away from a side of described base seat support, and described through hole passes to described pedestal inner chamber.
7. a chemical mechanical polishing device, comprise grinding head and as base systems as described in any one in claim 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203357187U CN203325851U (en) | 2013-06-09 | 2013-06-09 | Pedestal system and chemical mechanical grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203357187U CN203325851U (en) | 2013-06-09 | 2013-06-09 | Pedestal system and chemical mechanical grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203325851U true CN203325851U (en) | 2013-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203357187U Expired - Fee Related CN203325851U (en) | 2013-06-09 | 2013-06-09 | Pedestal system and chemical mechanical grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203325851U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907922A (en) * | 2014-03-11 | 2015-09-16 | 上海华虹宏力半导体制造有限公司 | Base and deionized water control device thereof for preventing silicon wafers from having X-type defects |
| CN106625207A (en) * | 2016-09-27 | 2017-05-10 | 天津华海清科机电科技有限公司 | Wafer discharging method, wafer discharging auxiliary device, wafer discharging device and CMP equipment comprising wafer discharging device |
-
2013
- 2013-06-09 CN CN2013203357187U patent/CN203325851U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907922A (en) * | 2014-03-11 | 2015-09-16 | 上海华虹宏力半导体制造有限公司 | Base and deionized water control device thereof for preventing silicon wafers from having X-type defects |
| CN106625207A (en) * | 2016-09-27 | 2017-05-10 | 天津华海清科机电科技有限公司 | Wafer discharging method, wafer discharging auxiliary device, wafer discharging device and CMP equipment comprising wafer discharging device |
| CN106625207B (en) * | 2016-09-27 | 2018-11-20 | 天津华海清科机电科技有限公司 | Unloading piece method, auxiliary device, device and the CMP tool with it of wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20190609 |