CN203277343U - Quartz loading stage for silicon slice thermal treatment - Google Patents
Quartz loading stage for silicon slice thermal treatment Download PDFInfo
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- CN203277343U CN203277343U CN 201320301994 CN201320301994U CN203277343U CN 203277343 U CN203277343 U CN 203277343U CN 201320301994 CN201320301994 CN 201320301994 CN 201320301994 U CN201320301994 U CN 201320301994U CN 203277343 U CN203277343 U CN 203277343U
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- quartz
- quartzy
- loading stage
- loading
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Abstract
The utility model relates to a quartz loading stage for silicon slice thermal treatment. The quartz loading stage comprises a quartz pedestal with thickness from 4 to 6 mm and a quartz cover. The center of the quartz pedestal is a circular loading zone. The area of the circular loading zone is less than that of the quartz pedestal. Multiple quartz columns are vertically disposed on a semicircular arc of the circular loading zone. Multiple quartz rods are vertically disposed on the other semicircular arc of the circular loading zone. The bottoms of the quartz columns are fixedly connected with the quartz pedestal. The tops of the quartz columns are connected together through quartz connecting levers. The bottoms of the quartz rods are detachably connected with the quartz pedestal. The quartz loading stage has characteristics of light weight and convenient taking and carrying and advantages of effectively fixing silicon slices and preventing the silicon slices from dropping and smashing by accident.
Description
Technical field
The utility model relates to the semiconductor silicon wafer manufacture process technical field, is specifically related to the quartzy loading stage that uses in the wafer heat process.
Background technology
The technique (section) that one step mechanical reduction silicon wafer thickness is arranged in the production process of unilateral diode, can produce slight warpage deformation through silicon chip after this operation, increased its fragility in the following process process, in order to eliminate above-mentioned mechanical stress, need that the silicon chip after attenuate is put into baking box and carry out high-temperature baking (heat treatment), need a device to load silicon chip during baking, this device is quartzy loading stage.
At present traditional quartzy loading stage is comprised of quartzy base (band quartz column), quartz cover and quartz boat fork three parts, and quartzy base plays the carrying silicon chip, and quartz cover applies constant weight and works to press silicon chip, and quartz boat forks transportation.But above-mentioned quartzy loading stage in use exposes some shortcomings: thicker the laying particular stress on of (1) quartzy base is not easy to carrying when loading more silicon chip; 2. be that the control scald needs to use boat to pitch the loading stage of taking after baking is completed, loading stage full load boat fork frangibility; 3. the quartz column position-limiting action on base is not strong, and landing easily occurs the full load silicon chip.
The utility model content
For conventional quartz loading stage above shortcomings, the purpose of this utility model is to provide a kind of wafer heat quartzy loading stage, and this loading stage quality is light and handy, takes and convenient in carrying, and effectively fixing silicon chip prevents that its unexpected landing from breaking into pieces.
The technical solution of the utility model is as follows:
The quartzy loading stage of a kind of wafer heat comprises quartzy base and quartz cover; Quartzy base thickness is 4 ~ 6mm, and its central authorities are circular loading area, and circular loading area area is less than quartzy base area; On one semi arch of circular loading area 3, many quartz columns are set vertically, many quartz pushrods vertically are set on second half circular arc; Be fixedly connected with bottom quartz column with between quartzy base, the top connects thick stick by quartz and is connected in one; Be detachable the connection bottom quartz pushrod with between quartzy base.
Its further technical scheme is:
Described quartzy base is rectangle, and area is 332.64 ~ 347.44cm
2
Described circular loading area area is 125.6 ~ 127.6 cm
2
Described quartz column is set to four.
Described quartz pushrod is set to two.
Described quartz pushrod bottom is inserted in the jack of quartzy base 1.
Be provided with handle 7 on described quartz cover.
The quartzy thick stick 6 that connects of described silicon chip full load contact plays the effect of restriction loading height.
The utlity model has following advantage:
On the basis of conventional quartz loading stage, the quartzy base reduced thickness of the utility model length simultaneously increases, and not only quality is light and handy, and its both sides exceed the formation Handheld Division, position of circular loading area, need not to use the quartz boat fork, hold this Handheld Division and can conveniently take and carry loading stage; The design of fixed quartz column, detachable quartz pushrod has position-limiting action, coordinates the effect of pressing of quartz cover, and effectively fixing silicon chip prevents that its unexpected landing from breaking into pieces; The silicon chip full load will contact the quartzy thick stick that connects, and be used in conjunction with quartz cover and play the effect of restriction silicon slice loading height, be conducive to standardization and produce.
Description of drawings
Fig. 1 is front view of the present utility model.
Fig. 2 is the vertical view of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, the utility model is specifically described.
As depicted in figs. 1 and 2, the utility model comprises quartzy base 1 and quartz cover 2, and quartzy base 1 is
The rectangle of 200mm * 170mm, thickness 5mm is provided with handle 7 on quartz cover 2; Quartzy base 1 central authorities are circular loading area 3, and area is 126.6cm
2, vertical and four quartz columns 4 evenly are set on a semi arch of circular loading area 3, be fixedly connected with between bottom and quartzy base 1, the top is connected in one by three quartzy connection thick sticks 6; Two quartz pushrods 5 vertically also evenly are set on second half circular arc, and its bottom is inserted in the detachable connection of the interior formation of jack of quartzy base 1.
Before heat treatment, first disassemble two quartz pushrods 5, with mode smooth be stacked in circular loading area 3 on of silicon chip 8 with stack, quartz cover 2 is added a cover at the top, plug quartz pushrod 5, the Handheld Division (position that quartzy base 1 both sides exceed circular loading area 3 forms the Handheld Division) of holding quartzy base 1 both sides is positioned over quartzy loading stage in baking box; Toast completely, put on anti-high temperature gloves, hold quartzy base 1 Handheld Division and quartzy loading stage can be taken out baking box, dismounting quartz cover 2 and quartz pushrod 5 take out silicon chip 8.
Compare with the conventional quartz loading stage, quartzy base 1 attenuate of the utility model thickness increased simultaneously length, can form the Handheld Division and conveniently take, need not to use the quartz boat fork; Quartz column 4, quartz pushrod 5 and quartz cover 2 be used in conjunction with effectively fixedly silicon chip, prevent that its unexpected landing from breaking into pieces; The silicon chip full load will contact the quartzy thick stick that connects, and be used in conjunction with quartz cover and play the effect of restriction silicon slice loading height, be conducive to standardization and produce.
Above description is to explanation of the present utility model, is not the restriction to utility model, and the utility model limited range within protection range of the present utility model, can be done any type of modification referring to claim.
Claims (8)
1. quartzy loading stage of wafer heat, comprise quartzy base (1) and quartz cover (2), it is characterized in that: quartzy base (1) thickness is 4 ~ 6mm, and its central authorities are circular loading area (3), and circular loading area (3) area is less than quartzy base (1) area; On one semi arch of circular loading area (3), many quartz columns (4) are set vertically, many quartz pushrods (5) vertically are set on second half circular arc; Be fixedly connected with bottom quartz column (4) with between quartzy base (1), the top connects thick stick (6) by quartz and is connected in one; Be detachable the connection bottom quartz pushrod (5) with between quartzy base (1).
2. the quartzy loading stage of wafer heat as claimed in claim 1, it is characterized in that: described quartzy base (1) is rectangle, and area is 332.64 ~ 347.44cm
2
3. the quartzy loading stage of wafer heat as claimed in claim 1, it is characterized in that: described circular loading area (3) area is 125.6 ~ 127.6 cm
2
4. the quartzy loading stage of wafer heat as claimed in claim 1, it is characterized in that: described quartz column (4) is set to four.
5. the quartzy loading stage of wafer heat as claimed in claim 1, it is characterized in that: described quartz pushrod (5) is set to two.
6. the quartzy loading stage of wafer heat as claimed in claim 1 is characterized in that: described quartz pushrod (5) bottom is inserted in the jack of quartzy base (1).
7. the quartzy loading stage of wafer heat as claimed in claim 1, is characterized in that: be provided with handle (7) on described quartz cover (2).
8. the quartzy loading stage of wafer heat as claimed in claim 1 is characterized in that: the quartzy thick stick (6) that connects of described silicon chip full load contact, play the effect of restriction loading height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320301994 CN203277343U (en) | 2013-05-29 | 2013-05-29 | Quartz loading stage for silicon slice thermal treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320301994 CN203277343U (en) | 2013-05-29 | 2013-05-29 | Quartz loading stage for silicon slice thermal treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203277343U true CN203277343U (en) | 2013-11-06 |
Family
ID=49507697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320301994 Expired - Lifetime CN203277343U (en) | 2013-05-29 | 2013-05-29 | Quartz loading stage for silicon slice thermal treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203277343U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244011A (en) * | 2018-09-05 | 2019-01-18 | 黄家仓 | A kind of semiconductor integrates disk production and uses annealing device |
| CN109887873A (en) * | 2019-02-14 | 2019-06-14 | 扬州美和光电科技有限公司 | A kind of production and processing method of high-quality quartz boat |
-
2013
- 2013-05-29 CN CN 201320301994 patent/CN203277343U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244011A (en) * | 2018-09-05 | 2019-01-18 | 黄家仓 | A kind of semiconductor integrates disk production and uses annealing device |
| CN109244011B (en) * | 2018-09-05 | 2021-07-23 | 黄家仓 | Heat treatment device for semiconductor integrated wafer production |
| CN109887873A (en) * | 2019-02-14 | 2019-06-14 | 扬州美和光电科技有限公司 | A kind of production and processing method of high-quality quartz boat |
| CN109887873B (en) * | 2019-02-14 | 2021-02-23 | 扬州美和光电科技有限公司 | Production and processing method of high-quality quartz boat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: LITTELFUSE SEMICONDUCTOR (WUXI) CO., LTD. Free format text: FORMER NAME: CONCORD ELECTRONIC (WUXI) CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: New area, industrial park road six Zhenfa 214142 Jiangsu province Wuxi City No. three Patentee after: LITTELFUSE SEMICONDUCTOR (WUXI) CO.,LTD. Address before: New area, industrial park road six Zhenfa 214142 Jiangsu province Wuxi City No. three Patentee before: Kangke Electronic (Wuxi) Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20131106 |
|
| CX01 | Expiry of patent term |