CN103681441A - Thimble fixture mechanism for packaging of semiconductor chips - Google Patents
Thimble fixture mechanism for packaging of semiconductor chips Download PDFInfo
- Publication number
- CN103681441A CN103681441A CN201310557719.0A CN201310557719A CN103681441A CN 103681441 A CN103681441 A CN 103681441A CN 201310557719 A CN201310557719 A CN 201310557719A CN 103681441 A CN103681441 A CN 103681441A
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- thimble
- magnet
- cap
- piece
- semiconductor die
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a thimble apparatus for semiconductor chips, especially to a thimble fixture mechanism for packaging of semiconductor chips. The thimble fixture mechanism comprises a fixed thimble cap and a thimble fixture which is sleeved in the thimble cap and can move up and down. The thimble fixture is composed of a cup-shaped magnet seat, a magnet, a thimble block and thimbles. The magnet is fixed inside the magnet seat. The thimble block is arranged at the cup end portion of the magnet seat and is contacted with the magnet. The thimble block is provided with thimble holes, the number of which is greater than or equal to the number of the thimbles. The thimbles pass through the thimble holes and are absorbed on the magnet. The length of the thimbles is less than the distance from the bottom of the thimble block to the upper side of the top plate of the thimble cap before jacking but is greater than the distance from the bottom of the thimble block to the lower side of the top plate of the thimble cap before jacking. The distance between the thimbles on the thimble fixture mechanism can be adjusted according to semiconductor chips of different dimensions and specifications without the need of replacing the whole thimble fixture. Thus, unnecessary waste is avoided, and production cost is reduced.
Description
Technical field
The present invention relates to a kind of semiconductor chip push pin device, particularly a kind of thimble jig mechanism for semiconductor die package.
Background technology
When packaged semiconductor, when semiconductor chip is transferred to other tools from wafe, below wafe, there is individual ejector pin mechanism, parts on this ejector pin mechanism are thimble tool, and the thimble that thimble tool is provided with can eject from the hole of thimble cap, thereby the region of interest that wafe can be contacted with chip is up pushed up, chip jack-up the most at last, can greatly reduce the adhesion strength that chip siphons away from wafe like this, for the chip of different size and specification, the position at thimble place can be different.In prior art, when the size of semiconductor chip is replaced by another specification, the position that is located at the thimble on the thimble tool below wafe also needs to be replaced by and this size chip matches, and the position of thimble on thimble tool is fixed, so be generally that whole thimble tool is changed, so not only caused unnecessary waste, and the Renewal process of thimble tool is more loaded down with trivial details, and need to reorientate thimble tool and the thimble cap more finished changing, thimble on thimble tool and the centre hole on thimble cap are matched, so greatly increased labour, affected operating efficiency, thereby increased production cost.
Summary of the invention
The technical problem that the present invention solves is: a kind of thimble jig mechanism for semiconductor die package is provided, can need and arbitrarily plug the thimble on thimble tool for the size of different semiconductor chips, thereby the positional structure between change thimble, needn't integral replacing thimble tool, simply, conveniently, saved production cost.
Object of the present invention is realized by following technical scheme.
A thimble jig mechanism for semiconductor die package, comprise fixing thimble cap, be enclosed in thimble cap can oscilaltion thimble tool, it is characterized in that:
Described thimble tool is comprised of cup-shaped magnetic receiver, magnet, thimble piece and thimble;
It is inner that described magnet is fixed on cup-shaped magnetic receiver, and described thimble piece is located at described magnetic receiver rim of a cup end, and contacts with magnet, on described thimble piece, is laid with a large amount of centre holes, and the quantity of centre hole is more than or equal to the quantity of thimble.
Described thimble is adsorbed on magnet through centre hole; The length of described thimble is less than thimble piece before jacking bottom to the distance between the upper side of the top board of thimble cap, and be greater than thimble piece before jacking bottom to the distance between the downside of the top board of thimble cap, a part for described thimble is exposed the upper surface of the top board of thimble cap after jacking.Can guarantee that like this tip of thimble contracts in the through hole of thimble cap before jacking, in the jacking of the tip of jacking back center, go out the through hole of thimble cap, like this tip of thimble be had to protective effect, make not frangibility of thimble.
Described thimble cap is provided with and can goes out for thimble jacking the through hole of thimble cap; The quantity of described through hole, the shape of arranging are with sequentially all identical with the centre hole of laying on described thimble piece.To behind thimble tool and the disposable location of thimble cap, follow-up just without reorientating so when mounted, and thimble has also been played to effect fixing and that protect.
Wherein, the height of described thimble piece is 3-8mm.Preferably, the height of thimble piece is 4-6mm.
Wherein, described thimble piece and 0.3-1.5 times of length that is highly described thimble.Can guarantee like this thimble being fixed in the centre hole in thimble piece steadily.
Wherein, the material of described thimble is metallicl magnetic material, can be carbon steel, stainless steel and other metal materials.
Wherein, be provided with can be for the screw of trip bolt in the side end face of described magnetic receiver.Trip bolt can be used for fixing magnet.
Wherein, the upper surface of described magnetic receiver and the upper end surface of magnet are in same level.The upper side that can guarantee like this magnet contacts with the downside of thimble piece, and thimble just can directly be adsorbed on magnet through centre hole, and thimble is had to fixation well.
Wherein, on described thimble piece, a large amount of centre holes are center radial arrangement.
Described thimble tool is arranged on jacking axle, and jacking axle is connected with actuator that can oscilaltion, and it is outer and be fixed on thimble tool seat that thimble cap is enclosed within thimble tool.
Beneficial effect of the present invention is:
1, should can adjust according to the semiconductor chip of different size and specification for the distance between the thimble on the thimble jig mechanism of semiconductor die package, without changing whole thimble tool, avoid unnecessary waste, reduce production cost.
2, the present invention only need to extract thimble in thimble piece, then according to the chip size of required jacking, in suitable centre hole in thimble piece, reinsert the thimble matching, without thimble tool and thimble cap are reorientated, easy and simple to handle, greatly saved working time, reduced labour cost.
Accompanying drawing explanation
Fig. 1 is that the present invention is for the thimble jig mechanism perspective view of semiconductor die package.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the profile of the A-A direction of Fig. 2.
Fig. 4 is the cross-sectional view of thimble tool 3.
Fig. 5 is the plan structure schematic diagram of thimble piece.
Fig. 6 is the structural representation of the thimble position before the jacking of jacking axle.
Fig. 7 is the structural representation of the thimble position after the jacking of jacking axle.
The 1st, thimble cap, the 2nd, through hole, the 3rd, thimble tool, the 31st, magnetic receiver, the 32nd, magnet, the 33rd, thimble piece, the 34th, thimble, the 35th, screw, the 36th, centre hole.
Embodiment
Below in conjunction with specific embodiment, the present invention is further described.
A thimble jig mechanism for semiconductor die package, comprise fixing thimble cap 1, be enclosed in thimble cap 1 can oscilaltion thimble tool 3, it is characterized in that:
Described thimble tool 3 is comprised of cup-shaped magnetic receiver 31, magnet 32, thimble piece 33 and thimble 34;
Described magnet 32 is fixed on cup-shaped magnetic receiver 31 inside, and described thimble piece 33 is located at described magnetic receiver 31 rim of a cup ends, and contacts with magnet 32.The upper end surface of the upper surface of described magnetic receiver 31 and magnet 32 is in same level.Guaranteed that like this thimble piece 33 contacts completely with magnet 32, do not interspaced, fixed better and protected and inserted the thimble 34 in thimble piece.
On described thimble piece 33, be laid with a large amount of centre holes 36, the quantity of centre hole 36 is more than or equal to the quantity of thimble 34; Described thimble 34 is adsorbed on magnet 32 through centre hole 36, and the material of this thimble 34 is metallicl magnetic material.Preferably, the material of described thimble 34 is magnetic carbon steel.
Described thimble cap 1 is provided with and can goes out for thimble 34 jackings the through hole 2 of thimble cap 1; The quantity of described through hole 2, the shape of arranging and order are all identical with the centre hole 36 of laying on described thimble piece 33.When mounted, only need be just passable to the disposable location, room of the through hole on the centre hole on thimble tool 3 and thimble cap 1, while changing, without reorientating again, simplified job step later.
The length of described thimble 34 is less than thimble piece 33 bottoms before jacking to the distance between the upper side of the top board of thimble cap 1, and is greater than thimble piece 33 bottoms before jacking to the distance between the downside of the top board of thimble cap 1; A part for described thimble 34 is exposed the upper surface of the top board of thimble cap 1 after jacking.The setting of the length of thimble 34 of the present invention, guaranteed that thimble 34 is before jacking, its end just rests in through hole 2, can not be reduced in the gap of 33 of thimble cap 1 and thimble pieces, after jacking, stretch out from the through hole 2 of thimble cap the end of thimble 34, exposes the upper side of thimble cap 1, can be used for jacking semiconductor chip.
Described thimble piece 33 and 0.3-1.5 times of length that is highly described thimble 34.The height of described thimble piece 33 is 3-8mm.
Described centre hole 36 can be center radial arrangement.
The side end face of described magnetic receiver 31 is provided with can be for the screw 35 of trip bolt, and the magnet 32 being located in magnetic receiver 31 is fixed by trip bolt, is so also convenient to change the magnet in magnetic receiver 31.
During use, first by thimble tool 3 by the jacking that makes progress of jacking axle, thimble 34 is exposed from the through hole 2 of thimble cap 1, for the size of the chip of required jacking, extract original thimble 34, in required position, hole, insert new thimble, do not need to change whole thimble tool 3, very simple, convenient, and greatly saved working time, alleviate workload, reduced production cost.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment.So every, do not depart from the equivalence completing under principles of this disclosure or revise, all falling into the scope of protection of the invention.
Claims (7)
1. for a thimble jig mechanism for semiconductor die package, comprise fixing thimble cap (1), be enclosed in thimble cap (1) can oscilaltion thimble tool (3), it is characterized in that:
Described thimble tool (3) is comprised of cup-shaped magnetic receiver (31), magnet (32), thimble piece (33) and thimble (34);
Described magnet (32) is fixed on cup-shaped magnetic receiver (31) inside, described thimble piece (33) is located at described magnetic receiver (31) rim of a cup end, and contact with magnet (32), on described thimble piece (33), be laid with a large amount of centre holes (36), the quantity of centre hole (36) is more than or equal to the quantity of thimble (34);
Described thimble (34) is adsorbed on magnet (32) through centre hole (36); The length of described thimble (34) is less than thimble piece (33) before jacking bottom to the distance between the upper side of the top board of thimble cap (1), and is greater than thimble piece (33) bottom before jacking to the distance between the downside of the top board of thimble cap (1); A part for described thimble (34) is exposed the upper surface of the top board of thimble cap (1) after jacking;
Described thimble cap (1) is provided with the through hole (2) that can supply thimble (34) jacking to go out thimble cap (1); The quantity of described through hole (2), the shape of arranging and order are all identical with the upper centre hole (36) of laying of described thimble piece (33).
2. the thimble jig mechanism for semiconductor die package according to claim 1, is characterized in that: the height of described thimble piece (33) is 3-8mm.
3. the thimble jig mechanism for semiconductor die package according to claim 1, is characterized in that: described thimble piece (33) be highly 0.3-1.5 times of the length of described thimble (34).
4. the thimble jig mechanism for semiconductor die package according to claim 1, is characterized in that: the material of described thimble (34) is metallicl magnetic material.
5. the thimble jig mechanism for semiconductor die package according to claim 1, is characterized in that: the side end face of described magnetic receiver (31) is provided with can be for the screw (35) of trip bolt.
6. the thimble jig mechanism for semiconductor die package according to claim 1, is characterized in that: the upper end surface of the upper surface of described magnetic receiver (31) and magnet (32) is in same level.
7. the thimble jig mechanism for semiconductor die package according to claim 1, is characterized in that: the upper a large amount of centre holes (36) of described thimble piece (33) are center radial arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310557719.0A CN103681441B (en) | 2013-11-11 | 2013-11-11 | A kind of thimble jig mechanism for semiconductor die package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310557719.0A CN103681441B (en) | 2013-11-11 | 2013-11-11 | A kind of thimble jig mechanism for semiconductor die package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103681441A true CN103681441A (en) | 2014-03-26 |
| CN103681441B CN103681441B (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310557719.0A Expired - Fee Related CN103681441B (en) | 2013-11-11 | 2013-11-11 | A kind of thimble jig mechanism for semiconductor die package |
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| CN (1) | CN103681441B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093575A (en) * | 2017-05-08 | 2017-08-25 | 大连佳峰自动化股份有限公司 | Thimble system |
| CN109935545A (en) * | 2019-01-22 | 2019-06-25 | 厦门市三安集成电路有限公司 | A kind of thimble mould group for provoking different wafer sizes |
| CN110027905A (en) * | 2019-04-19 | 2019-07-19 | 王小娟 | A kind of chip sorting device for the high reliablity that adsorption effect is good |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| WO2021129053A1 (en) * | 2019-12-24 | 2021-07-01 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
| CN113725144A (en) * | 2021-08-27 | 2021-11-30 | 北京北方华创微电子装备有限公司 | Thimble lifting device and semiconductor process equipment |
| CN116525529A (en) * | 2023-05-15 | 2023-08-01 | 深圳德芯微电技术有限公司 | Thimble device for packaging semiconductor chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201199754Y (en) * | 2008-03-19 | 2009-02-25 | 曹挺 | Thimble apparatus |
| US20090200251A1 (en) * | 2008-02-07 | 2009-08-13 | Asm Japan K.K. | Clamping mechanism for semiconductor device |
| CN203553126U (en) * | 2013-11-11 | 2014-04-16 | 爱立发自动化设备（上海）有限公司 | Centre jig mechanism for semiconductor chip packaging |
-
2013
- 2013-11-11 CN CN201310557719.0A patent/CN103681441B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090200251A1 (en) * | 2008-02-07 | 2009-08-13 | Asm Japan K.K. | Clamping mechanism for semiconductor device |
| CN201199754Y (en) * | 2008-03-19 | 2009-02-25 | 曹挺 | Thimble apparatus |
| CN203553126U (en) * | 2013-11-11 | 2014-04-16 | 爱立发自动化设备（上海）有限公司 | Centre jig mechanism for semiconductor chip packaging |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093575A (en) * | 2017-05-08 | 2017-08-25 | 大连佳峰自动化股份有限公司 | Thimble system |
| CN109935545A (en) * | 2019-01-22 | 2019-06-25 | 厦门市三安集成电路有限公司 | A kind of thimble mould group for provoking different wafer sizes |
| CN109935545B (en) * | 2019-01-22 | 2022-03-18 | 厦门市三安集成电路有限公司 | Thimble module for picking up wafers with different sizes |
| CN110027905A (en) * | 2019-04-19 | 2019-07-19 | 王小娟 | A kind of chip sorting device for the high reliablity that adsorption effect is good |
| WO2021129053A1 (en) * | 2019-12-24 | 2021-07-01 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN113725144A (en) * | 2021-08-27 | 2021-11-30 | 北京北方华创微电子装备有限公司 | Thimble lifting device and semiconductor process equipment |
| CN116525529A (en) * | 2023-05-15 | 2023-08-01 | 深圳德芯微电技术有限公司 | Thimble device for packaging semiconductor chip |
| CN116525529B (en) * | 2023-05-15 | 2024-02-02 | 深圳德芯微电技术有限公司 | Thimble device for packaging semiconductor chip |
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| Publication number | Publication date |
|---|---|
| CN103681441B (en) | 2016-08-24 |
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