CN103681441B - A kind of thimble jig mechanism for semiconductor die package - Google Patents
A kind of thimble jig mechanism for semiconductor die package Download PDFInfo
- Publication number
- CN103681441B CN103681441B CN201310557719.0A CN201310557719A CN103681441B CN 103681441 B CN103681441 B CN 103681441B CN 201310557719 A CN201310557719 A CN 201310557719A CN 103681441 B CN103681441 B CN 103681441B
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- China
- Prior art keywords
- thimble
- block
- cap
- magnet
- semiconductor die
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of semiconductor chip push pin device, particularly to a kind of thimble jig mechanism for semiconductor die package, including the thimble cap fixed, be enclosed within thimble cap can the thimble tool of oscilaltion, described thimble tool is made up of cup-shaped magnetic receiver, Magnet, thimble block and thimble；This Magnet is fixed on inside magnetic receiver, and thimble block is located at described magnetic receiver rim of a cup end, and contacts with Magnet, and described thimble block is provided with the quantity centre hole more than or equal to the quantity of thimble；Described thimble adsorbs on Magnet through centre hole, the length of this thimble less than bottom the thimble block before jacking to the distance between the upper side of the top board of thimble cap, and more than bottom the thimble block before jacking to the distance between the downside of the top board of thimble cap.The distance between thimble on described thimble jig mechanism, can be adjusted according to the semiconductor chip of different size and specification, it is not necessary to change whole thimble tool, it is to avoid unnecessary waste, reduces production cost.
Description
Technical field
The present invention relates to a kind of semiconductor chip push pin device, particularly to one for semiconductor die package
Thimble jig mechanism.
Background technology
When packaged semiconductor, by semiconductor chip when wafe transfers to other tools, wafe
Having individual ejector pin mechanism below, parts on this ejector pin mechanism are thimble tool, and thimble tool is provided with
Thimble can eject from the hole of thimble cap, thus can the region of interest that wafe contacts with chip up be pushed up,
Chip jack-up the most at last, so can greatly reduce the adhesion strength that chip siphons away from wafe, for different chis
The very little chip with specification, the position at thimble place can be different.In prior art, when semiconductor chip
When size is replaced by another specification, the position being located at the thimble on the thimble tool below wafe also needs
It is replaced by and this scale chips matches, and the position of the thimble on thimble tool is fixing, so one
As be that whole thimble tool is replaced, the most not only cause unnecessary waste, and thimble tool
Renewal process comparatively laborious, and need the thimble tool more finished changing and thimble cap are reorientated so that
Thimble on thimble tool matches with the centre hole on thimble cap, so considerably increases labour force, impact
Work efficiency, thus add production cost.
Summary of the invention
Present invention solves the technical problem that and be: a kind of thimble tool machine for semiconductor die package is provided
Structure, can need for the size of different semiconductor chips and arbitrarily plug the thimble on thimble tool, thus change
Become the positional structure between thimble, it is not necessary to integral replacing thimble tool, simple, convenient, save production cost.
The purpose of the present invention is realized by following technical scheme.
A kind of thimble jig mechanism for semiconductor die package, including the thimble cap fixed, is enclosed in top
In needle cap can the thimble tool of oscilaltion, it is characterised in that:
Described thimble tool is made up of cup-shaped magnetic receiver, Magnet, thimble block and thimble；
Described Magnet is fixed on inside cup-shaped magnetic receiver, and described thimble block is located at described magnetic receiver cup-mouth end
Portion, and contacting with Magnet, described thimble block is laid with a large amount of centre hole, the quantity of centre hole more than or etc.
Quantity in thimble.
Described thimble adsorbs on Magnet through centre hole；The length of described thimble is less than the thimble block before jacking
Bottom to the distance between the upper side of the top board of thimble cap, and more than bottom the thimble block before jacking to thimble
Distance between the downside of the top board of cap, a part for described thimble exposes the top board of thimble cap after jacking
Upper surface.So can ensure that to contract before jacking in the through hole of thimble cap in the tip of thimble, push up after jacking
The tip jacking of pin goes out the through hole of thimble cap, so the tip of thimble is had protective effect so that thimble is not
Frangibility.
Described thimble cap is provided with and is available for thimble jacking and goes out the through hole of thimble cap；The quantity of described through hole, arrangement
Shape is all identical with the centre hole laid on described thimble block with order.The most when mounted to thimble tool and
After thimble cap disposably positions, follow-up being no need for is reorientated, and thimble also plays fixing and protection
Effect.
Wherein, the height of described thimble block is 3-8mm.Preferably, the height of thimble block is 4-6mm.
Wherein, described thimble block and 0.3-1.5 times of length that height is described thimble.So can guarantee that top
In the pin centre hole being fixed in thimble block steadily.
Wherein, the material of described thimble is metallicl magnetic material, can be carbon steel, stainless steel and other metal materials.
Wherein, the side end face of described magnetic receiver is provided with the screw being available for trip bolt.Trip bolt is permissible
It is used for fixing Magnet.
Wherein, the upper surface of described magnetic receiver and the upper end surface of Magnet are in same level.So can protect
The upper side of card Magnet contacts with the downside of thimble block, and thimble just can directly adsorb in Magnet through centre hole
On, thimble is had fixation well.
Wherein, on described thimble block, a large amount of centre holes are center radial arrangement.
Described thimble tool is arranged on jacking axle, jacking axle with can be connected with the actuator of oscilaltion
Connecing, thimble cap is enclosed within outside thimble tool and is fixed on thimble tool seat.
The beneficial effects of the present invention is:
1, this distance being used between the thimble on the thimble jig mechanism of semiconductor die package, can be according to not
It is adjusted with the semiconductor chip of size and specification, it is not necessary to change whole thimble tool, it is to avoid unnecessary
Waste, reduce production cost.
2, the present invention has only to extract thimble in thimble block, then according to the chip size of required jacking,
Reinsert, in suitable centre hole in thimble block, the thimble matched, it is not necessary to thimble tool and
Thimble cap is reorientated, easy and simple to handle, is greatly saved labor time, reduces labour cost.
Accompanying drawing explanation
Fig. 1 is the present invention thimble jig mechanism perspective view for semiconductor die package.
Fig. 2 is the top view of Fig. 1.
Fig. 3 is the profile in the A-A direction of Fig. 2.
Fig. 4 is the cross-sectional view of thimble tool 3.
Fig. 5 is the plan structure schematic diagram of thimble block.
Fig. 6 is the structural representation of the thimble position before jacking axle jacking.
Fig. 7 is the structural representation of the thimble position after jacking axle jacking.
1 is thimble cap, and 2 is through hole, and 3 is thimble tool, and 31 is magnetic receiver, and 32 is Magnet, and 33 is top
Pin block, 34 is thimble, and 35 is screw, and 36 is centre hole.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is further described.
A kind of thimble jig mechanism for semiconductor die package, including the thimble cap 1 fixed, is enclosed in
In thimble cap 1 can the thimble tool 3 of oscilaltion, it is characterised in that:
Described thimble tool 3 is made up of cup-shaped magnetic receiver 31, Magnet 32, thimble block 33 and thimble 34；
It is internal that described Magnet 32 is fixed on cup-shaped magnetic receiver 31, and described thimble block 33 is located at described magnetic receiver 31
Rim of a cup end, and contact with Magnet 32.The upper surface of described magnetic receiver 31 and the upper end surface of Magnet 32 are same
On one horizontal plane.Which ensure that thimble block 33 completely attaches to Magnet 32, do not interspace, the most fixing
With the thimble 34 protected in insertion thimble block.
Being laid with a large amount of centre hole 36 on described thimble block 33, the quantity of centre hole 36 is more than or equal to thimble 34
Quantity；Described thimble 34 adsorbs on Magnet 32 through centre hole 36, and the material of this thimble 34 is metallic magnetic
Property material.Preferably, the material of described thimble 34 is magnetic carbon steel.
Described thimble cap 1 is provided with and is available for thimble 34 jacking and goes out the through hole 2 of thimble cap 1；The number of described through hole 2
Amount, arrangement shape are all identical with the centre hole 36 of laying on described thimble block 33 with order.When mounted, only
Need to the room of the centre hole on thimble tool 3 with the through hole on thimble cap 1 disposably be positioned the most permissible, with
Without reorientating again during rear replacing, simplify job step.
The length of described thimble 34 is less than the upper side of top board to thimble cap 1 bottom the thimble block 33 before jacking
Between distance, and more than bottom the thimble block 33 before jacking between the downside of the top board of thimble cap 1
Distance；A part for described thimble 34 exposes the upper surface of the top board of thimble cap 1 after jacking.The present invention's
The setting of the length of thimble 34, it is ensured that thimble 34 is before jacking, and its end stays in through hole 2, no
Can be reduced in the gap between thimble cap 1 and thimble block 33, after jacking, the end of thimble 34 is from thimble cap
Through hole 2 stretches out, exposes the upper side of thimble cap 1, can be used for jacking semiconductor chip.
0.3-1.5 times of described thimble block 33 and the length that height is described thimble 34.Described thimble block 33
It is highly 3-8mm.
Described centre hole 36 can be in center radial arrangement.
The side end face of described magnetic receiver 31 is provided with the screw 35 being available for trip bolt, is located in magnetic receiver 31
Magnet 32 fixed by trip bolt, so also allow for changing the Magnet in magnetic receiver 31.
During use, first thimble tool 3 is carried out upwards jacking by jacking axle so that thimble 34 is from thimble cap 1
Through hole 2 in expose, for the size of the chip of required jacking, extract original thimble 34, in institute
The position, hole needed is inserted into new thimble, it is not necessary to change whole thimble tool 3, the most simply, convenient, and
And also it is greatly saved labor time, alleviate workload, reduce production cost.
The above is presently preferred embodiments of the present invention, but the present invention should not be limited to this embodiment institute
Disclosure.So every without departing from the equivalence completed under principles of this disclosure or amendment, all fall
Enter the scope of protection of the invention.
Claims (7)
1. for a thimble jig mechanism for semiconductor die package, including the thimble cap (1) fixed, quilt
Be enclosed within thimble cap (1) can the thimble tool (3) of oscilaltion, it is characterised in that:
Described thimble tool (3) by cup-shaped magnetic receiver (31), Magnet (32), thimble block (33) and
Thimble (34) forms；
It is internal that described Magnet (32) is fixed on cup-shaped magnetic receiver (31), and described thimble block (33) is located at
Described magnetic receiver (31) rim of a cup end, and contact with Magnet (32), described thimble block (33) is upper lays
Having centre hole (36), the quantity of centre hole (36) is more than or equal to the quantity of thimble (34)；
Described thimble (34) adsorbs on Magnet (32) through centre hole (36)；Described thimble (34)
Length less than thimble block (33) bottom before jacking to the upper side of the top board of thimble cap (1) between
Distance, and be more than between thimble block (33) bottom to the downside of the top board of thimble cap (1) before jacking
Distance；A part for described thimble (34) exposes the upper surface of the top board of thimble cap (1) after jacking；
Described thimble cap (1) is provided with and is available for thimble (34) jacking and goes out the through hole (2) of thimble cap (1)；
All upper with described thimble block (33) thimble laid of the quantity of described through hole (2), arrangement shape and order
Hole (36) is identical.
Thimble jig mechanism for semiconductor die package the most according to claim 1, its feature exists
In: the height of described thimble block (33) is 3-8mm.
Thimble jig mechanism for semiconductor die package the most according to claim 1, its feature exists
In: described thimble block (33) and the length that height is described thimble (34) 0.3-1.5 times.
Thimble jig mechanism for semiconductor die package the most according to claim 1, its feature exists
In: the material of described thimble (34) is metallicl magnetic material.
Thimble jig mechanism for semiconductor die package the most according to claim 1, its feature exists
The screw (35) being available for trip bolt it is provided with in: the side end face of described magnetic receiver (31).
Thimble jig mechanism for semiconductor die package the most according to claim 1, its feature exists
In: the upper end surface of the upper surface of described magnetic receiver (31) and Magnet (32) is in same level.
Thimble jig mechanism for semiconductor die package the most according to claim 1, its feature exists
In: the upper centre hole (36) of described thimble block (33) is in center radial arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310557719.0A CN103681441B (en) | 2013-11-11 | 2013-11-11 | A kind of thimble jig mechanism for semiconductor die package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310557719.0A CN103681441B (en) | 2013-11-11 | 2013-11-11 | A kind of thimble jig mechanism for semiconductor die package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103681441A CN103681441A (en) | 2014-03-26 |
| CN103681441B true CN103681441B (en) | 2016-08-24 |
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ID=50318590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310557719.0A Expired - Fee Related CN103681441B (en) | 2013-11-11 | 2013-11-11 | A kind of thimble jig mechanism for semiconductor die package |
Country Status (1)
| Country | Link |
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| CN (1) | CN103681441B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093575A (en) * | 2017-05-08 | 2017-08-25 | 大连佳峰自动化股份有限公司 | Thimble system |
| CN109935545B (en) * | 2019-01-22 | 2022-03-18 | 厦门市三安集成电路有限公司 | Thimble module for picking up wafers with different sizes |
| CN110027905B (en) * | 2019-04-19 | 2021-08-17 | 杨照龙 | Chip sorting device |
| CN111128846B (en) * | 2019-12-24 | 2022-02-22 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
| CN111398312A (en) * | 2020-02-19 | 2020-07-10 | 深圳市海铭德科技有限公司 | Thimble test head structure |
| CN113725144B (en) * | 2021-08-27 | 2024-07-23 | 北京北方华创微电子装备有限公司 | Thimble lifting device and semiconductor process equipment |
| CN116525529B (en) * | 2023-05-15 | 2024-02-02 | 深圳德芯微电技术有限公司 | Thimble device for packaging semiconductor chip |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201199754Y (en) * | 2008-03-19 | 2009-02-25 | 曹挺 | Thimble apparatus |
| CN203553126U (en) * | 2013-11-11 | 2014-04-16 | 爱立发自动化设备（上海）有限公司 | Centre jig mechanism for semiconductor chip packaging |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8118940B2 (en) * | 2008-02-07 | 2012-02-21 | Asm Japan K.K. | Clamping mechanism for semiconductor device |
-
2013
- 2013-11-11 CN CN201310557719.0A patent/CN103681441B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201199754Y (en) * | 2008-03-19 | 2009-02-25 | 曹挺 | Thimble apparatus |
| CN203553126U (en) * | 2013-11-11 | 2014-04-16 | 爱立发自动化设备（上海）有限公司 | Centre jig mechanism for semiconductor chip packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103681441A (en) | 2014-03-26 |
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Granted publication date: 20160824 Termination date: 20201111 |
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| CF01 | Termination of patent right due to non-payment of annual fee |