CN116525529B - Thimble device for packaging semiconductor chip - Google Patents
Thimble device for packaging semiconductor chip Download PDFInfo
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- CN116525529B CN116525529B CN202310540528.7A CN202310540528A CN116525529B CN 116525529 B CN116525529 B CN 116525529B CN 202310540528 A CN202310540528 A CN 202310540528A CN 116525529 B CN116525529 B CN 116525529B
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- ejector pin
- fixedly connected
- thimble
- positioning
- seat
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 239000004593 Epoxy Substances 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
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- 238000001514 detection method Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WGPCGCOKHWGKJJ-UHFFFAOYSA-N sulfanylidenezinc Chemical compound [Zn]=S WGPCGCOKHWGKJJ-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of semiconductor chips and discloses a thimble device for packaging the semiconductor chips, which comprises a thimble seat, wherein a positioning mechanism is arranged at the lower end of the inside of the thimble seat, positioning blocks are fixedly connected to the periphery of the inside of the thimble seat, the upper parts of the four positioning blocks are provided with the same mounting mechanism, a plurality of thimble bodies are arranged on the mounting mechanism, a cover plate is arranged at the upper part of the thimble seat, a plurality of sockets are arranged on the cover plate, the top ends of the thimbles penetrate through the sockets, a protection frame is arranged at the upper part of the cover plate, and the positioning mechanism comprises a rotating rod, two threaded sleeves and a plurality of L-shaped inserted rods; when the ejector pin is used, the ejector pin is convenient to mount a proper number of ejector pin bodies according to the sizes of the chips, so that the ejector pin is convenient to jack up the chips with different sizes, and the protection of the ejector pin bodies is greatly improved.
Description
Technical Field
The invention relates to the technical field of semiconductor chips, in particular to a thimble device for packaging a semiconductor chip.
Background
Substances and materials in nature can be classified into three categories, namely conductors, semiconductors and insulators according to the conductivity. The resistivity of the semiconductor is in the range of 1mΩ·cm to 1gΩ·cm (the upper limit is taken by Xie Jiakui electronic circuits, and 1/10 or 10 times of the upper limit is taken, and the current description is temporarily used because the corner mark is not available). In general, the semiconductor conductivity decreases with increasing temperature. Semiconductor materials having both of the above characteristics can fall within the scope of semiconductor materials. Reflecting the intrinsic basic properties of semiconductors are the physical effects and phenomena caused by various external factors such as light, heat, magnetism, electricity, etc. acting on the semiconductor, which may be collectively referred to as the semiconductor properties of semiconductor materials. The vast majority of the matrix materials that make up solid state electronic devices are semiconductors, and it is the various semiconductor properties of these semiconductor materials that impart different functions and characteristics to various different types of semiconductor devices. The basic chemical characteristics of semiconductors are the existence of saturated covalent bonds between atoms. Typical characteristics of covalent bonds are that they are represented by tetrahedral structures on lattice structures, so that typical semiconductor materials have a structure of diamond or sphalerite (ZnS). Since the mineral deposits of the earth are mostly chemical compounds, the semiconductor materials that were used the earliest are chemical compounds, for example galena (PbS) has long been used for radio detection, cuprous oxide (Cu 2O) has been used as a solid rectifier, sphalerite (ZnS) is a well-known solid luminescent material, and rectifying detection of silicon carbide (SiC) has also been used earlier. Selenium (Se) was the earliest discovered and utilized elemental semiconductor, and was an important material for solid state rectifiers and photovoltaic cells. The discovery of elemental semiconductor germanium (Ge) amplification opens up a new page of semiconductor history, from which electronic devices transistors were implemented. Chinese semiconductor research and production began with the first preparation of high purity (99.999999% to 99.9999999%) germanium in 1957. After the adoption of elemental semiconductor silicon (Si), not only are the types and varieties of transistors increased and the performance improved, but also the era of large-scale and very large-scale integrated circuits is brought forward. The discovery of group iii-v compounds represented by gallium arsenide (GaAs) has prompted the rapid development of microwave devices and photovoltaic devices;
the integrated circuits fabricated on the surface of the semiconductor chip are also known as thin-film (thin-film) integrated circuits. Another thick-film integrated circuit (hybrid integrated circuit) is a miniaturized circuit composed of stand-alone semiconductor devices and passive components integrated into a substrate or wiring board;
when packaging a semiconductor chip, transferring the semiconductor chip from the semiconductor chip fixing mechanism to other jigs, adopting a thimble device below the semiconductor chip fixing mechanism, and ejecting the thimble from a hole of a thimble cap through a thimble arranged on the thimble device, so that the relevant part of the semiconductor chip fixing mechanism, which is contacted with the chip, can be pushed upwards, and finally the chip is pushed upwards.
However, in the process of using the existing ejector pins, because the sizes of all chips are different, the ejector pins are required to be matched with the chips with the sizes, and the ejector pins are fixed on the ejector pin base, so that the whole ejector pin base is generally replaced, waste is caused, and the replacement process of the ejector pin base is complicated. Accordingly, one skilled in the art provides a thimble device for packaging a semiconductor chip to solve the above-mentioned problems.
Disclosure of Invention
In order to solve the problem that different ejector pins are required to be replaced according to chips with different sizes, the invention provides an ejector pin device for packaging semiconductor chips.
The invention provides a thimble device for packaging a semiconductor chip, which adopts the following technical scheme: the utility model provides a thimble device for semiconductor chip encapsulation, includes the thimble seat, the inside lower extreme of thimble seat is provided with positioning mechanism, the inside of thimble seat all around fixedly connected with locating piece, four the upper portion of locating piece is provided with same installation mechanism, be provided with a plurality of thimble bodies on the installation mechanism, the upper portion of thimble seat is provided with the apron, just a plurality of sockets have been seted up on the apron, the top of thimble runs through out the socket, the upper portion of apron is provided with the protection frame.
Preferably, the positioning mechanism comprises a rotating rod, two thread sleeves and a plurality of L-shaped inserting rods, wherein the rotating rod is rotationally connected to the lower end of the inner part of the ejector pin seat, opposite threads are respectively formed on the left side and the right side of the rotating rod, the two thread sleeves are in threaded connection with the rotating rod, and the L-shaped inserting rods are respectively and fixedly connected to the upper parts of the corresponding thread sleeves.
Preferably, the mounting mechanism comprises a flat plate and a plurality of thread heads, wherein the flat plate is placed on the upper parts of the four positioning blocks, and the thread heads are fixedly connected on the upper parts of the flat plate.
Preferably, the left and right sides of the bottom of the flat plate are fixedly connected with connecting plates, one side, close to each other, of each connecting plate is provided with a plurality of positioning ports matched with the L-shaped inserted bars, and the L-shaped inserted bars are inserted into the positioning ports.
Preferably, the front side and the rear side of the rotating rod at the lower end of the inner part of the ejector pin seat are fixedly connected with guide rods, the threaded sleeve is in sliding connection with the guide rods, the lower end of the right side of the ejector pin seat is connected with a handle, and the handle is connected with the right end of the rotating rod.
Preferably, the outside of protection frame all around fixedly connected with connecting block, the first magnet of bottom fixedly connected with of connecting block, the circle mouth has all been seted up around the upper portion of apron, the inside fixedly connected with second magnet of circle mouth, just the bottom of circle mouth is laminated with the upper portion of second magnet, first magnet and second magnet each other are different kinds of magnet.
Preferably, the bottom of thimble body fixedly connected with screw thread sleeve, just screw thread sleeve and thread head threaded connection.
Preferably, the left side and the right side of the top needle seat and the cover plate are fixedly connected with mounting blocks, and the two mounting blocks are connected through a plurality of positioning bolts and positioning nuts.
Preferably, the outer side of the top needle seat is coated with epoxy zinc-rich primer.
Preferably, the bottom side of the top needle seat is fixedly provided with an anti-slip pad.
Compared with the prior art, the invention has the beneficial effects that:
1. the mounting mechanism, the cover plate and the threaded sleeve are arranged, the thimble bodies are convenient to mount through the matched use of the threaded sleeve and the threaded head, and a proper number of thimble bodies can be selected according to the size of a chip to mount on a flat plate, so that the use effect of the chip when the chip is jacked is greatly improved;
2. the invention also provides the positioning mechanism and the connecting plate, when the screw thread on the outer side of the screw thread head is worn in the long-term use process, the flat plate is convenient to disassemble through the matching use of the positioning mechanism and the connecting plate, and the flat plate is convenient to take out from the top needle seat, so that the screw thread head is convenient to replace;
3. the ejector pin body is protected through the protection frame, so that the ejector pin body is not easy to damage due to collision, and the protection frame is directly taken off from the cover plate when the ejector pin body is used, so that the ejector pin is simple and convenient;
4. the invention also provides an epoxy zinc-rich primer coated on the outer side of the top needle seat, thereby improving the appearance aesthetic property of the top needle seat and the corrosion resistance of the surface of the top needle seat, prolonging the service life and reducing the later maintenance cost;
5. the invention also provides an anti-slip pad, which can effectively increase the friction between the contact surface and the top needle seat when the top needle seat is placed, thereby improving the stability.
Drawings
FIG. 1 is a schematic view of a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 2 is a schematic cross-sectional view of a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 3 is a schematic cross-sectional view of a header pin in a header pin assembly for semiconductor chip package according to the present invention;
FIG. 4 is a schematic view of a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 5 is a schematic view showing the structure of a thimble seat in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 6 is a schematic view of an exploded view of a cover plate in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 7 is a schematic view of a mounting mechanism for use in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 8 is a schematic view showing a connection structure between a hub and a positioning mechanism in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 9 is a schematic view of an explosion connection structure of a positioning mechanism and a connection plate in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 10 is a schematic view showing a connection structure between a threaded sleeve and a threaded head in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 11 is a schematic view of an explosion connection between two bottom plates in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 12 is an enlarged schematic view of the portion A of FIG. 2 in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 13 is an enlarged schematic view of the portion B of FIG. 2 in a thimble device for packaging a semiconductor chip according to the present invention;
FIG. 14 is an enlarged schematic view of the portion C of FIG. 3 in a thimble device for packaging a semiconductor chip according to the present invention;
fig. 15 is an enlarged view of the part D of fig. 4 in a thimble device for packaging a semiconductor chip according to the present invention.
Reference numerals illustrate: 1. a needle holder; 2. a positioning mechanism; 201. a rotating lever; 202. a thread sleeve; 203. an L-shaped insert rod; 3. a positioning block; 4. a mounting mechanism; 401. a flat plate; 402. a thread head; 5. a thimble body; 6. a cover plate; 7. a socket; 8. a protective frame; 9. a connecting plate; 10. a positioning port; 11. a guide rod; 12. a handle; 13. a connecting block; 14. a first magnet; 15. a round opening; 16. a second magnet; 17. a threaded sleeve; 18. a mounting block; 19. positioning bolts; 20. and positioning the screw cap.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The embodiment of the invention discloses a thimble device for packaging a semiconductor chip. Referring to fig. 1-15, a thimble device for packaging a semiconductor chip comprises a thimble seat 1, wherein a positioning mechanism 2 is arranged at the lower end of the inner part of the thimble seat 1, positioning blocks 3 are fixedly connected to the periphery of the inner part of the thimble seat 1, the same mounting mechanism 4 is arranged at the upper parts of the four positioning blocks 3, a plurality of thimble bodies 5 are arranged on the mounting mechanism 4, a cover plate 6 is arranged at the upper part of the thimble seat 1, a plurality of sockets 7 are arranged on the cover plate 6, the top ends of the thimbles 5 penetrate through the sockets 7, and a protection frame 8 is arranged at the upper part of the cover plate 6;
referring to fig. 9 and 14, the positioning mechanism 2 includes a rotating rod 201, two threaded sleeves 202, and a plurality of L-shaped inserting rods 203, the rotating rod 201 is rotatably connected to the inner lower end of the ejector pin seat 1, opposite threads are respectively provided on the left and right sides of the rotating rod 201, the two threaded sleeves 202 are both in threaded connection with the rotating rod 201, and the plurality of L-shaped inserting rods 203 are respectively fixedly connected to the upper parts of the corresponding threaded sleeves 202; the bottom left and right sides of dull and stereotyped 401 is all fixedly connected with connecting plate 9, and a plurality of locating ports 10 that cooperate with L shape inserted bar 203 to use have all been seted up to the one side that two connecting plates 9 are close to each other, and L shape inserted bar 203 and locating port 10 peg graft, use the screw thread head 402 of wearing and tearing on being convenient for dull and stereotyped 401 through positioning mechanism 2 and connecting plate 9's cooperation and be convenient for dismantle dull and stereotyped 401, then change.
Referring to fig. 7 and 10, the mounting mechanism 4 includes a flat plate 401 placed on the upper portions of the four positioning blocks 3, and a plurality of screw heads 402, each of which is fixedly connected to the upper portion of the flat plate 401; the bottom fixedly connected with screw thread sleeve 17 of thimble body 5, and screw thread sleeve 17 and screw thread head 402 threaded connection use through the cooperation of installation mechanism 4 and screw thread sleeve 17 makes the thimble body 5 of the different quantity of installation according to the size of chip, then is convenient for jack-up the chip of equidimension.
Referring to fig. 8 and 9, both front and rear sides of the inner lower end rotating rod 201 of the ejector pin seat 1 are fixedly connected with a guide rod 11, and the threaded sleeve 202 is slidably connected with the guide rod 11, the right lower end of the ejector pin seat 1 is connected with a handle 12, and the handle 12 is connected with the right end of the rotating rod 201, so that the threaded sleeve 202 is more stable when moving through the guide rod 11.
Referring to fig. 12, the connecting block 13 is fixedly connected to the periphery of the outer side of the protection frame 8, the first magnet 14 is fixedly connected to the bottom of the connecting block 13, the round opening 15 is formed in the periphery of the upper portion of the cover plate 6, the second magnet 16 is fixedly connected to the inner portion of the round opening 15, the bottom of the round opening 15 is attached to the upper portion of the second magnet 16, the first magnet 14 and the second magnet 16 are opposite magnets, the protection frame 8 is conveniently limited and fixed through the cooperation of the first magnet 14 and the second magnet 16, and the protection performance of the thimble body 5 is improved through the protection frame 8.
Referring to fig. 11, the left and right sides of the top needle seat 1 and the cover plate 6 are fixedly connected with mounting blocks 18, the two mounting blocks 18 are connected through a plurality of positioning bolts 19 and positioning nuts 20, and the cover plate 6 is convenient to disassemble and assemble with the top needle seat 1 through the cooperation of the positioning bolts 19 and the positioning nuts 20.
Working principle: when the ejector pin body 5 is required to jack up the chip, the ejector pin body 5 with proper number can be selected according to the size of the chip, then the bottom end of the ejector pin body 5 passes through the socket 7 on the cover plate 6, the threaded sleeve 17 at the bottom end of the ejector pin body 5 is screwed with the threaded head 402, the ejector pin body 5 is installed, the ejector pin body 5 with proper number is convenient to select so as to jack up the chips with different sizes, then when the threads on the outer side of the threaded head 402 are worn in the long-term use process, the rotating handle 12 drives the rotating rod 201 to rotate, the rotating rod 201 rotates through the matching of the guide rod 11 so that the two threaded sleeves 202 are mutually close, then the L-shaped inserted link 203 is moved out of the positioning opening 10 on the connecting plate 9, the cover plate 6 can be detached from the ejector pin seat 1 through the positioning bolt 19 and the positioning nut 20 at the moment, then the flat plate 401 can be directly taken out of the ejector pin seat 1, so that the threaded head 402 on the flat plate 401 can be conveniently replaced, then the ejector pin body 5 is afraid of being damaged due to external collision when the ejector pin body 5 is not used, the protection frame 8 is directly placed on the upper portion of the cover plate 6, the first magnet 14 is placed in the circular opening 15, the first magnet 14 and the second magnet 16 are adsorbed and attached to limit and fix the protection frame 8, the ejector pin body 5 can be effectively protected through the protection frame 8, and the protection frame 8 can be directly taken away when the ejector pin body 5 is used, so that the ejector pin is simple and convenient.
When the ejector pin disclosed by the invention is used, the ejector pin body 5 with proper number is convenient to install according to the size of the chip, so that the ejector pin is convenient to jack up chips with different sizes, and the protection of the ejector pin body 5 is greatly improved.
In embodiment two:
the embodiment of the invention discloses a thimble device for packaging a semiconductor chip. Referring to fig. 1-15, a thimble device for packaging a semiconductor chip comprises a thimble seat 1, wherein a positioning mechanism 2 is arranged at the lower end of the inner part of the thimble seat 1, positioning blocks 3 are fixedly connected to the periphery of the inner part of the thimble seat 1, the same mounting mechanism 4 is arranged at the upper parts of the four positioning blocks 3, a plurality of thimble bodies 5 are arranged on the mounting mechanism 4, a cover plate 6 is arranged at the upper part of the thimble seat 1, a plurality of sockets 7 are arranged on the cover plate 6, the top ends of the thimbles 5 penetrate through the sockets 7, and a protection frame 8 is arranged at the upper part of the cover plate 6;
referring to fig. 9 and 14, the positioning mechanism 2 includes a rotating rod 201, two threaded sleeves 202, and a plurality of L-shaped inserting rods 203, the rotating rod 201 is rotatably connected to the inner lower end of the ejector pin seat 1, opposite threads are respectively provided on the left and right sides of the rotating rod 201, the two threaded sleeves 202 are both in threaded connection with the rotating rod 201, and the plurality of L-shaped inserting rods 203 are respectively fixedly connected to the upper parts of the corresponding threaded sleeves 202; the bottom left and right sides of dull and stereotyped 401 is all fixedly connected with connecting plate 9, and a plurality of locating ports 10 that cooperate with L shape inserted bar 203 to use have all been seted up to the one side that two connecting plates 9 are close to each other, and L shape inserted bar 203 and locating port 10 peg graft, use the screw thread head 402 of wearing and tearing on being convenient for dull and stereotyped 401 through positioning mechanism 2 and connecting plate 9's cooperation and be convenient for dismantle dull and stereotyped 401, then change.
Referring to fig. 7 and 10, the mounting mechanism 4 includes a flat plate 401 placed on the upper portions of the four positioning blocks 3, and a plurality of screw heads 402, each of which is fixedly connected to the upper portion of the flat plate 401; the bottom fixedly connected with screw thread sleeve 17 of thimble body 5, and screw thread sleeve 17 and screw thread head 402 threaded connection use through the cooperation of installation mechanism 4 and screw thread sleeve 17 makes the thimble body 5 of the different quantity of installation according to the size of chip, then is convenient for jack-up the chip of equidimension.
Referring to fig. 8 and 9, both front and rear sides of the inner lower end rotating rod 201 of the ejector pin seat 1 are fixedly connected with a guide rod 11, and the threaded sleeve 202 is slidably connected with the guide rod 11, the right lower end of the ejector pin seat 1 is connected with a handle 12, and the handle 12 is connected with the right end of the rotating rod 201, so that the threaded sleeve 202 is more stable when moving through the guide rod 11.
Referring to fig. 12, the connecting block 13 is fixedly connected to the periphery of the outer side of the protection frame 8, the first magnet 14 is fixedly connected to the bottom of the connecting block 13, the round opening 15 is formed in the periphery of the upper portion of the cover plate 6, the second magnet 16 is fixedly connected to the inner portion of the round opening 15, the bottom of the round opening 15 is attached to the upper portion of the second magnet 16, the first magnet 14 and the second magnet 16 are opposite magnets, the protection frame 8 is conveniently limited and fixed through the cooperation of the first magnet 14 and the second magnet 16, and the protection performance of the thimble body 5 is improved through the protection frame 8.
Referring to fig. 11, the left and right sides of the top needle seat 1 and the cover plate 6 are fixedly connected with mounting blocks 18, the two mounting blocks 18 are connected through a plurality of positioning bolts 19 and positioning nuts 20, and the cover plate 6 is convenient to disassemble and assemble with the top needle seat 1 through the cooperation of the positioning bolts 19 and the positioning nuts 20.
Referring to fig. 1, the outer side of the top needle seat 1 is coated with an epoxy zinc-rich primer, and the outer side of the top needle seat 1 is coated with the epoxy zinc-rich primer, so that the appearance aesthetic property of the top needle seat 1 can be improved, the corrosion resistance of the surface of the top needle seat 1 can be improved, the service life can be prolonged, and the later maintenance cost can be reduced.
Referring to fig. 1, an anti-slip pad is fixedly installed at the bottom side of the top needle seat 1, and by providing the anti-slip pad, the anti-slip pad can effectively increase the friction between the top needle seat 1 and the contact surface when placed, thereby improving the stability.
Working principle: when the ejector pin body 5 is required to jack up the chip, the ejector pin body 5 with proper number can be selected according to the size of the chip, then the bottom end of the ejector pin body 5 passes through the socket 7 on the cover plate 6, the threaded sleeve 17 at the bottom end of the ejector pin body 5 is screwed with the threaded head 402, the ejector pin body 5 is installed, the ejector pin body 5 with proper number is convenient to select so as to jack up the chips with different sizes, then when the threads on the outer side of the threaded head 402 are worn in the long-term use process, the rotating handle 12 drives the rotating rod 201 to rotate, the rotating rod 201 rotates to enable the two threaded sleeves 202 to approach each other through the matching of the guide rod 11, the L-shaped inserting rod 203 is removed from the positioning port 10 on the connecting plate 9, then the cover plate 6 can be detached from the ejector pin seat 1 through the positioning bolt 19 and the positioning nut 20, then the flat plate 401 can be directly taken out from the ejector pin seat 1, so that the threaded head 402 on the flat plate 401 is convenient to replace, then the ejector pin body 5 is afraid of being damaged by external collision when the ejector pin body 5 is not used, at the moment, the protection frame 8 is directly placed on the upper part of the cover plate 6, the first magnet 14 is placed in the round opening 15, the first magnet 14 and the second magnet 16 are adsorbed and attached to limit and fix the protection frame 8, the ejector pin body 5 can be effectively protected through the protection frame 8, the protection frame 8 can be directly taken away when the ejector pin body 5 is used, simplicity and convenience are realized, the outer side of the ejector pin seat 1 is coated with epoxy zinc-rich primer, so that the appearance aesthetic property of the ejector pin seat 1 can be improved, the corrosion resistance of the surface can be improved, the service life can be prolonged, the later maintenance cost is reduced, and the anti-slip pad can effectively increase the friction force between the contact surface and the ejector pin seat 1 when being placed, so that the stability can be improved.
The remainder was the same as in example one.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A thimble device for semiconductor chip packaging, comprising a thimble seat (1), characterized in that: the novel ejector pin comprises an ejector pin seat (1), and is characterized in that a positioning mechanism (2) is arranged at the lower end of the inside of the ejector pin seat (1), positioning blocks (3) are fixedly connected to the periphery of the inside of the ejector pin seat (1), the same mounting mechanism (4) is arranged at the upper parts of the positioning blocks (3), a plurality of ejector pin bodies (5) are arranged on the mounting mechanism (4), a cover plate (6) is arranged at the upper part of the ejector pin seat (1), a plurality of sockets (7) are formed in the cover plate (6), the top ends of the ejector pin bodies (5) penetrate through the sockets (7), and a protection frame (8) is arranged at the upper part of the cover plate (6); the positioning mechanism (2) comprises a rotating rod (201), two threaded sleeves (202) and a plurality of L-shaped inserting rods (203), wherein the rotating rod (201) is rotationally connected to the inner lower end of the ejector pin seat (1), opposite threads are respectively formed on the left side and the right side of the rotating rod (201), the two threaded sleeves (202) are both in threaded connection with the rotating rod (201), and the L-shaped inserting rods (203) are respectively and fixedly connected to the upper parts of the corresponding threaded sleeves (202); the mounting mechanism (4) comprises a flat plate (401) and a plurality of thread heads (402), the flat plate (401) is arranged on the upper parts of the four positioning blocks (3), and the thread heads (402) are fixedly connected on the upper parts of the flat plate (401); the left side and the right side of the bottom of the flat plate (401) are fixedly connected with connecting plates (9), one side, close to each other, of each connecting plate (9) is provided with a plurality of positioning ports (10) matched with the L-shaped inserting rods (203), and the L-shaped inserting rods (203) are inserted into the positioning ports (10); the front side and the rear side of a rotating rod (201) at the lower end of the inside of the top needle seat (1) are fixedly connected with guide rods (11), the threaded sleeve (202) is in sliding connection with the guide rods (11), the lower end of the right side of the top needle seat (1) is connected with a handle (12), and the handle (12) is connected with the right end of the rotating rod (201); the bottom of thimble body (5) is fixedly connected with screw thread sleeve (17), just screw thread sleeve (17) and screw thread head (402) threaded connection.
2. A thimble device for a semiconductor chip package according to claim 1, wherein: the protection frame is characterized in that a connecting block (13) is fixedly connected to the periphery of the outer side of the protection frame (8), a first magnet (14) is fixedly connected to the bottom of the connecting block (13), a round opening (15) is formed in the periphery of the upper portion of the cover plate (6), a second magnet (16) is fixedly connected to the inside of the round opening (15), the bottom of the round opening (15) is attached to the upper portion of the second magnet (16), and the first magnet (14) and the second magnet (16) are opposite magnets.
3. A thimble device for a semiconductor chip package according to claim 1, wherein: the left side and the right side of the top needle seat (1) and the cover plate (6) are fixedly connected with mounting blocks (18), and the two mounting blocks (18) are connected through a plurality of positioning bolts (19) and positioning nuts (20).
4. A thimble device for a semiconductor chip package according to claim 1, wherein: the outer side of the top needle seat (1) is coated with epoxy zinc-rich primer.
5. A thimble device for a semiconductor chip package according to claim 1, wherein: the bottom side of the top needle seat (1) is fixedly provided with an anti-slip pad.
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| CN202310540528.7A CN116525529B (en) | 2023-05-15 | 2023-05-15 | Thimble device for packaging semiconductor chip |
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| CN202310540528.7A CN116525529B (en) | 2023-05-15 | 2023-05-15 | Thimble device for packaging semiconductor chip |
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| CN116525529B true CN116525529B (en) | 2024-02-02 |
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| CN215680620U (en) * | 2021-06-25 | 2022-01-28 | 西部数据技术公司 | Chip pushing device |
| CN217521958U (en) * | 2022-06-13 | 2022-09-30 | 无锡红光微电子股份有限公司 | Chip demoulding device |
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| US7470120B2 (en) * | 2005-12-01 | 2008-12-30 | Asm Assembly Automation, Ltd. | Configurable die detachment apparatus |
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| KR20000031458A (en) * | 1998-11-06 | 2000-06-05 | 윤종용 | Loading and unloading device |
| CN103681441A (en) * | 2013-11-11 | 2014-03-26 | 爱立发自动化设备（上海）有限公司 | Thimble fixture mechanism for packaging of semiconductor chips |
| CN103730333A (en) * | 2013-12-23 | 2014-04-16 | 华中科技大学 | Multi-centre chip stripping device |
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| CN116525529A (en) | 2023-08-01 |
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