CN203104946U - Printed circuit board (PCB) - Google Patents
Printed circuit board (PCB) Download PDFInfo
- Publication number
- CN203104946U CN203104946U CN 201320059171 CN201320059171U CN203104946U CN 203104946 U CN203104946 U CN 203104946U CN 201320059171 CN201320059171 CN 201320059171 CN 201320059171 U CN201320059171 U CN 201320059171U CN 203104946 U CN203104946 U CN 203104946U
- Authority
- CN
- China
- Prior art keywords
- substrate body
- heat
- circuit board
- pcb
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a printed circuit board (PCB), comprising a substrate body; the substrate body is internally provided with leads and a chip interface; the chip interface is internally provided with a heat radiation layer; one end of the substrate body is provided with a flat cable interface; the flat cable interface is connected with a flat cable; four corners of the substrate body are all provided with a fixing hole; the bottom part of the substrate body is provided with heat conduction apparatuses; the top part of each heat conduction apparatus is provided with a top rod; and each heat conduction apparatus is internally provided with a spring. The beneficial effects of the PCB are that as the substrate body is provided with anticorrosion green paint, the service life of the PCB is prolonged; by arranging the spring in each heat conduction apparatus, the substrate body is protected and fixed effectively, and heat is conducted through the heat conduction apparatuses; and the PCB is simple in structure, strong in practicality and easy to produce.
Description
Technical field
The utility model relates to the PCB circuit board of a kind of perfect heat-dissipating of circuit electricity field.
Background technology
In recent ten years, China's printed circuit board (Printed Circuit Board is called for short PCB) manufacturing development is rapid, and the gross output value, total output occupy the first in the world in pairs.Because electronic product makes rapid progress, price war has changed the structure of supply chain, and China has industry distribution, cost and the market advantage concurrently, has become global most important printed circuit board production base.Along with the development of SMD technology, the PCB circuit board has been realized advantages such as packaging density height, electronic product volume be little, in light weight.Yet, the heat that the components and parts that mount on the PCB circuit board are produced in the course of work can produce certain infringement to PCB circuit board and components and parts thereof, thereby influence the useful life of components and parts and even monoblock PCB circuit board, and the PCB circuit board of prior art lacks the function that the help components and parts carry out efficiently radiates heat.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of long service life, the PCB circuit board of good heat dissipation effect.
The utility model is achieved through the following technical solutions: a kind of PCB circuit board of the present utility model, comprise substrate body, be provided with lead and chip interface in the described substrate body, be provided with heat dissipating layer in the described chip interface, described substrate body one end is provided with the winding displacement interface, described winding displacement interface is connected with winding displacement, described substrate body is equipped with a fixing hole on four angles, described substrate body bottom is provided with heat-transfer device, described heat-transfer device top is provided with push rod, is provided with spring in the described heat-transfer device.
As optimized technical scheme, described heat dissipating layer is made as heat-conducting silicon rubber.
As optimized technical scheme, described heat-transfer device is arranged on substrate body ground connection place.
As optimized technical scheme, described substrate body is provided with anticorrosion green lacquer.
The beneficial effects of the utility model are: owing on the substrate body anticorrosion green lacquer is set, improve useful life, by being provided with spring in the heat-transfer device; can effectively protect and the fixing base body, and by heat-transfer device conduction heat, it is simple in structure; practical, be easy to produce.
Description of drawings
In order to be easy to explanation, the utility model is done to describe in detail by following specific embodiment and accompanying drawing.
Fig. 1 is a kind of PCB circuit board upward view of the present utility model;
Fig. 2 is a kind of PCB circuit board front view of the present utility model;
Fig. 3 is the utility model heat-transfer device structural representation.
Embodiment
As shown in Figure 1-Figure 3, a kind of PCB circuit board of the present utility model, comprise substrate body 1, be provided with lead 7 and chip interface 5 in the described substrate body 1, be provided with heat dissipating layer 6 in the described chip interface 5, described substrate body 1 one ends are provided with winding displacement interface 4, described winding displacement interface 4 is connected with winding displacement 3, and described substrate body is equipped with a fixing hole 2 on 1 four angles, and described substrate body 1 bottom is provided with heat-transfer device 9, described heat-transfer device 9 tops are provided with push rod 8, are provided with spring 10 in the described heat-transfer device 9.
Wherein, described heat dissipating layer 6 is made as heat-conducting silicon rubber, has heat conductivility and stability, electrical insulation capability, advantages such as resistance to elevated temperatures.
Described heat-transfer device 9 is arranged on substrate body 1 ground connection place, and the heat that produces in the substrate body 1 is sent on the outside cabinet.
Described substrate body 1 is provided with anticorrosion green lacquer, and intrinsic circuit of protective substrate and chip be not by anticorrosion and influence useful life.
The beneficial effects of the utility model are: owing on the substrate body anticorrosion green lacquer is set, improve useful life, by being provided with spring in the heat-transfer device; can effectively protect and the fixing base body, and by heat-transfer device conduction heat, it is simple in structure; practical, be easy to produce.
The above only is an embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any variation or replacement of expecting without creative work all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range that claims were limited.
Claims (4)
1. PCB circuit board, it is characterized in that: comprise substrate body, be provided with lead and chip interface in the described substrate body, be provided with heat dissipating layer in the described chip interface, described substrate body one end is provided with the winding displacement interface, and described winding displacement interface is connected with winding displacement, described substrate body is equipped with a fixing hole on four angles, described substrate body bottom is provided with heat-transfer device, and described heat-transfer device top is provided with push rod, is provided with spring in the described heat-transfer device.
2. according to the described PCB circuit board of claim 1, it is characterized in that: described heat dissipating layer is made as heat-conducting silicon rubber.
3. according to the described PCB circuit board of claim 1, it is characterized in that: described heat-transfer device is arranged on substrate body ground connection place.
4. according to the described PCB circuit board of claim 1, it is characterized in that: described substrate body is provided with anticorrosion green lacquer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320059171 CN203104946U (en) | 2013-02-03 | 2013-02-03 | Printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320059171 CN203104946U (en) | 2013-02-03 | 2013-02-03 | Printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203104946U true CN203104946U (en) | 2013-07-31 |
Family
ID=48856313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320059171 Expired - Fee Related CN203104946U (en) | 2013-02-03 | 2013-02-03 | Printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203104946U (en) |
-
2013
- 2013-02-03 CN CN 201320059171 patent/CN203104946U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20140203 |