CN215680620U - Chip pushing device - Google Patents

Abstract

The embodiment of the disclosure provides a pushing device of a chip. The pushing device includes a plurality of motors, a drive mechanism, and a plurality of push pins. The driving mechanism comprises a plurality of driving modules, and each driving module in the plurality of driving modules is connected with a corresponding motor. Each drive module comprises at least one drive member. The plurality of promotion includes a plurality of regions. The push pins of each area are driven independently of each other by the driving components of the corresponding driving modules. This thrust unit can ensure need not to dismantle again and reinstall thrust unit when chip bonding and chip pick up the conversion of process at every turn, can also be applicable to not unidimensional chip, weak point consuming time, efficient, it is with low costs.

Description

Chip pushing device

Technical Field

Embodiments of the present disclosure relate to a pushing device of a chip.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The encapsulation process generally includes: scribing, mounting, jointing, plastic packaging, testing, packaging and shipping. Generally, a semiconductor wafer after forming elements is separated along dicing lines and chip dividing lines, and a plurality of semiconductor chips (for example, also referred to as dies or cut pieces, hereinafter simply referred to as chip die) are formed by dicing. These chips are attached to an adhesive tape (Dicing tape) or an adhesive sheet (also referred to as DAF film, DieAttachFilm, for example), and the chips are picked up from the adhesive sheet, separated from the adhesive sheet, and subjected to a mounting process such as a mounting process for lead frames and automatic tape bonding and a packaging process for packaging to complete the semiconductor device.

SUMMERY OF THE UTILITY MODEL

At least one embodiment of the present disclosure provides a pushing device for a chip, which includes a plurality of motors, a driving mechanism, and a plurality of push pins. The driving mechanism comprises a plurality of driving modules, and each driving module in the plurality of driving modules is connected with a corresponding motor. Each drive module comprises at least one drive member. The plurality of promotion includes a plurality of regions. The push pins of each zone are driven independently of each other by the drive components of the corresponding drive module.

In at least one embodiment of the present disclosure, the plurality of drive modules of the drive mechanism includes a central cylinder and one or more hollow cylinders coaxial therewith and nested within one another.

In at least one embodiment of the present disclosure, the cylinder of each driving module includes at least one mounting hole, and at least one driving part is fixedly mounted in the mounting hole.

In at least one embodiment of the present disclosure, the plurality of regions includes a solid rectangular region located at the center and one or more hollow rectangular regions nested in sequence from inside to outside around the solid rectangular region.

In at least one embodiment of the present disclosure, the drive components corresponding to the push pins in the solid rectangular area are disposed in the center of a central cylinder; the driving parts corresponding to the push pins in the hollow rectangular region are uniformly arranged in a rectangular shape along the circumferential direction of the corresponding hollow cylinder.

In at least one embodiment of the present disclosure, each push pin is rectangular or circular in cross-section.

The pushing device of at least one embodiment of the present disclosure further includes a replaceable cartridge. The sleeve is sleeved at one end of the driving mechanism close to the pushing pin. The kit comprises: a hollow first surface configured to provide a space for an axial movement of the push pin along the cylinder; a second surface having a plurality of through holes, opposite to the first surface in the axial direction; and a plurality of push rods configured to pass through the plurality of through holes. A plurality of push rods connect the corresponding drive members and push pins to cause the drive members to push the push pins via the push rods for movement along the axial direction of the cylindrical body.

At least one embodiment of this disclosure provides that the pushing device further comprises a controller. The controller is connected with the plurality of motors and is configured to independently control each motor in the plurality of motors so as to control the motion state of the driving part of the driving module corresponding to each motor.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a front view of a pushing device for a chip according to some embodiments of the present disclosure;

FIG. 2 is a top view of a plurality of drive modules provided in some embodiments of the present disclosure;

fig. 3 is a disassembled schematic view of each of a plurality of drive modules provided by some embodiments of the present disclosure;

fig. 4 is an assembly schematic diagram of a plurality of drive modules provided by some embodiments of the present disclosure;

fig. 5 and 6 are schematic perspective views of a pushing device for a chip according to some embodiments of the present disclosure;

FIG. 7 is a schematic illustration of a plurality of regions comprised by a plurality of promotion provided by some embodiments of the present disclosure;

fig. 8 is a schematic view of a lower surface of a kit provided by some embodiments of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

Unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

The terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", and the like used in the embodiments of the present disclosure indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, or orientations or positional relationships that a product of the embodiments is conventionally placed in use, only for convenience in describing the embodiments of the present disclosure and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present disclosure.

The use of "first," "second," and similar terms in the embodiments of the disclosure is not intended to indicate any order, quantity, or importance, but rather to distinguish one element from another. The use of the terms "a" and "an" or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. Likewise, the word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The steps preceding or following the method of embodiments of the present disclosure are not necessarily performed in exact order. Rather, various steps may be processed in reverse order or simultaneously. Meanwhile, other operations may be added to the processes, or a certain step or steps may be removed from the processes.

Currently, the die attach and die pick-up process is a known throughput bottleneck stage in the back-end process of manufacturing semiconductor devices. For example, when chips are mounted on a DAF and separated from the DAF before chip packaging, the time required for each conversion is long, such as taking an average of many hours to complete. If different chip sizes are used on the same pusher, the conversion time is long and the frequency of device replacement is high, thereby reducing the overall productivity of the chips.

The inventors have also found that the current devices that perform the conversion of the chip attach and chip pick up processes mainly use a single motor pusher device corresponding to the chip size. If any change in chip size occurs, it is necessary to remove and install a specific single motor pusher. Such setup switching is time consuming and labor dependent. In other words, if the size of the chip to be picked changes, the chip picking apparatus needs to be disassembled again and a new single motor pusher needs to be installed again.

At least one embodiment of the present disclosure provides a pushing device for a chip, including: a plurality of motors, a drive mechanism, and a plurality of push pins. The driving mechanism comprises a plurality of driving modules, each driving module in the plurality of driving modules is connected with a corresponding motor, and each driving module comprises at least one driving part. The plurality of promotion includes a plurality of regions. The push pins of each zone are driven independently of each other by the drive components of the corresponding drive module.

According to the pushing device of the above embodiment of the present disclosure, a driving mechanism including a plurality of driving modules and a plurality of push pins divided into a plurality of areas are adopted, so that each driving module is independently controlled by one motor respectively, and the driving mechanism is used for controlling the motion state of the driving component of the driving module corresponding to each motor, so as to push the push pins of each area to move independently. This makes it unnecessary to dismantle again and reinstall thrust unit when the conversion of chip pick-up process every time, just can be applicable to the chip of different sizes, and consuming time is short, and is efficient, and is with low costs.

Embodiments of the present disclosure and examples thereof are described in detail below with reference to the accompanying drawings.

Fig. 1 is a front view of a pushing device for a chip according to some embodiments of the present disclosure.

As shown in fig. 1, the pushing device 10000 of the chip includes a driving mechanism 11000, a plurality of motors 12000, and a plurality of push pins 13000.

The drive mechanism 11000 includes a plurality of drive modules 11100. For example, the number of the plurality of driving modules 11100 is the same as the number of the plurality of motors 12000, that is, the plurality of driving modules 11100 correspond to the plurality of motors 12000 one by one. Thus, each of the plurality of drive modules 11000 is connected to a corresponding one of the motors 12000. Each drive module 11100 includes at least one drive component 11110.

It should be noted that, in the following and corresponding figures, the driving mechanism 11000 includes four driving modules 11100 mainly for example, which is beneficial for the reader to understand the embodiment of the present disclosure, but the present disclosure does not limit the number of the driving modules 11100 included in the driving mechanism 11000 and the number of the driving components 11110 included in each driving module 11100, and the present disclosure is not exhaustive nor repeated.

Fig. 2 is a top view of a plurality of drive modules provided in some embodiments of the present disclosure. Fig. 3 is a disassembled schematic view of each of a plurality of driver modules provided in some embodiments of the present disclosure. Fig. 4 is an assembly diagram of a plurality of driving modules according to some embodiments of the present disclosure.

As shown in fig. 1-4, the plurality of drive modules 11100 of the drive mechanism 11000 include a central cylinder 11120 (e.g., central cylinder 11120a) and one or more hollow cylinders 11120 (e.g., cylinders 11120b, cylinders 11120c, cylinders 11120d) coaxial therewith and nested within one another.

The central cylinder 11120 may be a solid cylinder, or a hollow cylinder (i.e. a sleeve), which is not limited by the present disclosure, as long as the cylinder can be mounted with a corresponding driving component to achieve the driving function, and will not be described herein again.

In one example, if the drive mechanism 11000 includes two drive modules 11100 and each drive module 11100 includes a corresponding one of the cylinders 11120, the two drive modules 11100 can be arranged as a central cylinder 11120 and one hollow cylinder 11120 coaxial with and nested outside of the central cylinder 11120.

In other examples, if the drive mechanism 11000 includes N (N is an integer greater than or equal to 3) drive modules 11100 and each drive module 11100 includes a corresponding one of the cylinders 11120, the N drive modules 11100 may be arranged as one central cylinder 11120 and N-1 hollow cylinders 11120 coaxial therewith and nested with one another.

Fig. 3 illustrates a cylinder 11120a, a cylinder 11120b, a cylinder 11120c, and a cylinder 11120b corresponding to each drive module 11100 disassembled in the drive mechanism 11000, and fig. 4 illustrates a nested assembly structure of the cylinder 11120a, the cylinder 11120b, the cylinder 11120c, and the cylinder 11120b corresponding to each drive module 11100 in the drive mechanism 11000.

In the example of fig. 3 and 4, cylinder 11120a is a solid cylinder, cylinder 11120b is a hollow cylinder (i.e., sleeve-like) and the inner diameter of cylinder 11120b is greater than the outer diameter of cylinder 11120a to enable cylinder 11120b to fit outside of cylinder 11120a, cylinder 11120c is a hollow cylinder and the inner diameter of cylinder 11120c is greater than the outer diameter of cylinder 11120b to enable cylinder 11120c to fit outside of cylinder 11120b, and cylinder 11120d is a hollow cylinder and the inner diameter of cylinder 11120d is greater than the outer diameter of cylinder 11120c to enable cylinder 11120d to fit outside of cylinder 11120 c.

The corresponding cylinder 11120 of each drive module 11000 is coupled to a corresponding one of the motors 12000 such that the motor 12000 powers the corresponding drive module 11000. For example, in the example of fig. 1 and 3, cylinder 11120a is coupled to motor 12000a, cylinder 11120b is coupled to motor 12000b, cylinder 11120c is coupled to motor 12000c, and cylinder 11120d is coupled to motor 12000 d.

As shown in fig. 1 and 2, the cylindrical body 11120 of each driving module 11100 includes at least one mounting hole 11121, and at least one driving member 11110 is fixedly mounted in the mounting hole 11121. The driving members 11110 correspond one-to-one to the mounting holes 11121. That is, each of the driving parts 11110 in the cylindrical body 11120 of each of the driving modules 11100 is fixedly installed in a corresponding one of the installation holes 11121. The axial direction of each drive member 11110 of each drive module 11100 is parallel to the axial direction of the cylindrical body 11120.

It should be noted that, for convenience of description herein, in some embodiments of the present disclosure, a side of the driving member close to the chip is referred to as an upper side and a side of the driving member away from the chip is referred to as a lower side, for example, a direction of the axial direction in some embodiments of the present disclosure may be referred to as an up-down direction in the drawing and a direction perpendicular to the axial direction may be referred to as a left-right direction or a transverse direction in the drawing, but the up-down direction, the left-right direction and the left-right direction in the present disclosure both represent orientations in the drawing and do not affect the orientation in practical application, and the present disclosure does not limit the orientation.

As shown in fig. 2, the central cylinder 11120 (e.g., cylinder 11120a) includes one mounting hole 11121, and each of the hollow cylinders 11120 (e.g., cylinder 11120b, cylinder 11120c, cylinder 11120d) includes four mounting holes 11121. Of course, this is merely exemplary and not a limitation of the present disclosure, for example, the hollow cylindrical body 11120 may include eight or sixteen mounting holes, which are not exhaustive or described herein.

In the example of fig. 1 and 5, the chip 20000 to be picked up is placed on the surface of the push pin 13000. For example, the chip 20000 is adhered to the surface of the adhesive sheet 30000 near the push pin 13000 side. I.e. the adhesive wafer 30000 is attached to the back surface of the chip 20000 or the adhesive wafer 30000 is attached to the lower surface of the chip 20000. The whole of the chip 20000 and the adhesive sheet 30000 or an adhesive tape (not shown) comprising a plurality of chips 20000 and the adhesive sheet 30000 is placed on the surface of the push pin 13000.

As shown in fig. 1, a pickup device 40000 (e.g., a rubber suction nozzle) is disposed above the chip 20000. The pick-up device 40000 is configured to pick up the chip 20000 to separate the chip 20000 and the adhesive sheet 30000 or to separate the chip 20000 and the adhesive sheet 30000 as a whole from the adhesive tape.

Fig. 5 and 6 are schematic perspective views of a pushing device for a chip according to some embodiments of the present disclosure.

As shown in fig. 1, 5, and 6, the plurality of promotion pins 13000 includes a plurality of areas 14000. For example, the plurality of promotion pins 13000 are divided into a plurality of areas 14000 and each area 14000 includes at least one promotion pin 13000. The push pins 13000 of each region 14000 are driven by the drive components 11110 of the corresponding drive module 11100, respectively.

The number of drive modules 11100 included in the drive mechanism 11000 is not less than the number of regions 14000 included in the plurality of push pins 13000. For example, each region 14000 corresponds to a corresponding one of the drive modules 11100.

In the example of fig. 5, a first region 14000a corresponds to a driving module 11100 (for example, referred to as a first driving module) in which cylinder 11120a is located and is driven by a driving member 11110 included in the first driving module to move, a second region 14000b corresponds to a driving module 11100 (for example, referred to as a second driving module) in which cylinder 11120b is located and is driven by a driving member 11110 included in the second driving module to move, a third region 14000c corresponds to a driving module 11100 (for example, referred to as a third driving module) in which cylinder 11120c is located and is driven by a driving member 11110 included in the third driving module to move, and a fourth region 14000d corresponds to a driving module 11100 (for example, referred to as a fourth driving module) in which cylinder 11120d is located and is driven by a driving member 11110 included in the fourth driving module to move.

In some examples, the plurality of regions 14000 includes one solid rectangular region in the center (e.g., region 14000a) and one or more hollow rectangular regions (e.g., region 14000b, region 14000c, region 14000d) nested sequentially from inside to outside around the solid rectangle.

In the example of fig. 5, the region 14000a is located at the center of the innermost side, the region 14000b surrounds the outside of the region 14000a, the region 14000c surrounds the outside of the region 14000b, and the region 14000d surrounds the outside of the region 14000c, i.e., the region 14000b, the region 14000c, and the region 14000d are all hollow rectangular regions.

It should be noted that, the present disclosure does not limit the number of the plurality of regions 14000 into which the plurality of push pins 13000 are divided, the positions where the regions 14000 are located, and the number of the push pins 13000 included in the regions 14000, as long as the divided regions 14000 can be driven by the corresponding driving modules 11100 to move (in other words, the plurality of push pins 13000 can be mechanically grouped by the plurality of driving modules 11100 of the driving mechanism 11000 and divided into the corresponding plurality of regions 14000), which is not described herein again.

Thus, some embodiments of the present disclosure can determine the number of different regions 14000 and push pins 13000 of the regions 14000 to be raised or lowered based on the corresponding chip size, such that the pushing device need not be re-detached and re-installed at each transition of the chip attach and chip pick up process.

In addition, the pushing device of at least one embodiment of the present disclosure may be designed to select different numbers of push pins 13000 according to their respective chip sizes, for example, may cover multiple ranges of different BiCS (3,4,5) generation and storage capacities (128Gb, 256Gb, 512Gb, 1Tb), without limitation.

Fig. 7 is a schematic illustration of a plurality of regions comprised by a plurality of promotion provided by some embodiments of the present disclosure.

In some embodiments of the present disclosure, the solid rectangular area 14000a can be a complete solid and seamless local area, i.e., the push pins 13000 corresponding to the solid rectangular area 14000a are disposed next to each other. Of course, the present disclosure is not limited thereto, for example, the solid rectangular area 14000a may also be a rectangular area formed by a plurality of push pins 13000 uniformly arranged at the same interval from each other, as shown in fig. 7, wherein the area of the innermost dashed frame is the solid rectangular area 14000a and there is a gap between each push pin 13000 in the area of the innermost dashed frame, for example, the solid rectangular area 14000a in fig. 7 includes the innermost 3 × 5 (i.e., 3 rows × 5 columns in fig. 7) push pins 13000. Of course, this is merely exemplary and not a limitation of the present disclosure.

In some embodiments of the present disclosure, the hollow rectangular regions (e.g., region 14000b, region 14000c, region 14000d) can be a rectangular outline with edges of a certain width left except for the regions inside, i.e., push pins 13000 corresponding to the hollow rectangular regions are disposed next to each other along the rectangular edges. Of course, the present disclosure is not limited thereto, for example, the hollow rectangular region may also be a rectangular region formed by a plurality of push pins 13000 uniformly arranged along the edges of the rectangle at the same interval, as shown in fig. 7, wherein a region formed between the second and first dashed frames from the inside to the outside is the hollow rectangular region and a region formed between the third and second dashed frames from the inside to the outside is the hollow rectangular region.

As shown in fig. 5 to 7, each push pin 13000 has a rectangular or circular cross section. Of course, this is merely exemplary, not limiting of the present disclosure, and may be freely adjusted depending on the actual situation.

For example, the drive component 11110 corresponding to the push pin 13000 in the solid rectangular area (e.g., area 14000a) is disposed in the center of the central cylinder 11120 (e.g., cylinder 11120 a); the driving members 11110 corresponding to the push pin 13000 in the hollow rectangular region (e.g., region 14000b, region 14000c, region 14000d) are uniformly arranged in a rectangular shape along the circumferential direction of the corresponding hollow cylinder 11120 (e.g., cylinder 11120b corresponding to region 14000b, cylinder 11120c corresponding to region 14000c, cylinder 11120d corresponding to region 14000 d).

As shown in fig. 2, the center of the cylindrical body 11120a is provided with a mounting hole 11121 for mounting the fixed driving member 11110, the cylindrical body 11120b is uniformly provided with four mounting holes 11121 along its circumference, and the connecting lines of the four mounting holes 11121 may form a rectangle. Likewise, the cylindrical body 11120c is uniformly provided with four mounting holes 11121 along the circumference thereof and the connecting lines of the four mounting holes 11121 may also form a rectangle, and the cylindrical body 11120d is uniformly provided with four mounting holes 11121 along the circumference thereof and the connecting lines of the four mounting holes 11121 may form a rectangle.

It should be noted that the shape of each of the plurality of regions 14000 demarcated in the plurality of push pins 13000 of the present disclosure is not limited to the rectangle, but may be a circle, which may be determined according to practical situations, and is not limited and exhaustive here.

Fig. 8 is a schematic view of a lower surface of a kit provided by some embodiments of the present disclosure.

As shown in fig. 5, fig. 6 and fig. 8, the pushing device 10000 further comprises a replaceable sleeve 15000, wherein the sleeve 15000 is sleeved on one end of the driving mechanism 11000 close to the push pin 13000 (for example, the sleeve 15000 is sleeved on the upper end of the driving mechanism 11000).

As shown in fig. 5 and 8, the set 15000 includes a first surface, a second surface, and a plurality of push rods 15300. The second surface is configured to be opposite to the first surface along the axial direction, for example, the first surface is an upper surface 15100 and the second surface is a lower surface 15200.

For example, upper surface 15100 can be a hollow upper surface (e.g., at least a portion of upper surface 15100 can be hollowed out to provide a void for push pin 13000 to move axially along cylindrical body 11120). Additionally, the hollow portion of the upper surface 15100 is located at the center of the upper surface 15100.

For example, the lower surface 15200 has a plurality of through holes 15210. For example, a plurality of push rods 15300 are configured to pass through the plurality of through holes 15210 and each push rod 15300 passes through the corresponding through hole 15210 in a one-to-one correspondence along the axial direction of the cylindrical body 11120. Each push rod 15300 of the plurality of push rods 15300 is coupled to a corresponding driving member 11110 and push pin 13000 (e.g., the push rod 15300 is fixedly coupled at a lower end to the driving member 11110 and at an upper end to the push pin 13000) such that the driving member 11110 drives the push rod 15300 to move up and down and pushes the push pin 13000 to move up and down.

For example, the lower end of each push rod 15300 is provided with a slot 15310 and the upper end of the drive member 11110 mates with the slot 15310 of the push rod 15300 to fixedly couple the push rod 15300 and the drive member 11110. Therefore, the driving part 11110 of some embodiments of the present disclosure can accurately and effectively push the push pins 13000 of the corresponding area 14000 through the push rod 15300 of the kit 15000, in other words, the kit 15000 can also be used as an adapter to realize that the driving parts 11110 of a plurality of driving modules 11100 smoothly and effectively push the push pins 13000 of the corresponding area, and avoid the driving modules 11100 from ineffectively pushing the push pins 13000 of some areas or inefficiently or erroneously.

For example, the push rod 15300 and the push pin 13000 may be directly connected or indirectly connected, which is not limited in this disclosure as long as the push rod 15300 can be driven to drive the push pin 13000 to move up and down, and details thereof are not described here.

As shown in fig. 5, optionally, the remaining portion of the upper surface 15100 of the set 15000 except the hollow portion can also be provided with a plurality of positioning holes 15110 as a position reference to achieve the positioning function for the region 14000 and the chip 20000.

For example, the pushing device 10000 further comprises a controller (not shown) connected to the plurality of motors 12000 and configured to independently control each motor 12000 of the plurality of motors 12000 to control a motion state of the driving part 11110 of the driving module 11100 corresponding to each motor 12000.

The controller may control the drive module 11100 for each motor 12000. For example, the controller controls the cylinder 11120 or the driving member 11110 of the driving module 11100 to move in the up-down direction at a preset speed and to a preset height. The preset speed and the preset height can be realized by presetting parameters on the controller, and specific design parameters can be determined according to actual application conditions or user requirements, which are not described herein.

Therefore, the pushing device of some embodiments of the present disclosure can be programmed for different chip sizes by using a programmable automatic controller, and can control the speed and height of the driving component of each driving module respectively, so as to realize programmable, automatic and independent control of the speed and height of the promotion of each area, and the pushing device has strong adjustability and is suitable for various chip sizes.

Hereinafter, an operation method of the pushing device of at least one embodiment of the present disclosure will be described. The method comprises the following steps: (1) starting one or more motors 12000 to drive the driving part 11110 of the corresponding driving module 11100 to move up and down; (2) the driving part 11110 pushes the push pin 13000 of the corresponding area 14000 to move upward or downward so that the push pin 13000 pushes the chip 20000 to move upward or the push pin 13000 in contact with the chip 20000 is separated from the back of the chip 20000.

For the method of operation, in some examples, comprising: (a) firstly, all the driving modules 11100 of the driving mechanism 11000 are controlled to move upwards (i.e. ascend) at the same speed and reach the same height, so that all the driving modules 11100 of the driving mechanism 11000 are in contact with the back surface of the chip 20000 to support the chip 20000; (b) then, controlling the driving module 11100 corresponding to the hollow rectangular area (e.g. the area 14000d in the example of fig. 5) at the outermost side to move downward at a certain speed and reach a certain height (i.e. descend), so that the push pin 13000 corresponding to the corresponding driving module 11100 is separated from the back of the chip 20000, and at this time, the driving modules 11100 corresponding to the other areas do no action; (c) similarly, for other hollow rectangular areas (such as the area 14000c and the area 14000b) from outside to inside in sequence, the corresponding driving module 11100 is controlled to move downwards at a certain speed and height in sequence, so that the corresponding push pin 13000 of the corresponding driving module 11100 is separated from the back surface of the chip 20000. For example, the push pin 13000 corresponding to the region 14000c is separated from the back of the chip 20000 as the corresponding driving module 11100 moves downwards, and then the push pin 13000 corresponding to the region 14000b is separated from the back of the chip 20000 as the corresponding driving module 11100 moves downwards; (d) the driving module 11100 corresponding to the innermost solid rectangular region (e.g. solid rectangular region 14000a) does no action and remains at the original raised height to support the chip 20000.

Thus, the chip 20000 and the adhesive sheet 30000 or the adhesive tape can be separated and peeled off slowly, and the risk of breakage of the chip when pushed out by the pushing device can be minimized, without the need to detach and reattach the pushing device again, reducing the changeover time, improving productivity, and reducing the production cost.

It should be noted that, the present disclosure does not limit the operation method or application scenario of the pushing device in the above embodiments, that is, the present disclosure is not limited to the above illustrated operation method or application scenario, and may also be any reasonable scenario that can utilize multiple motors, multiple driving modules, and multiple promotion areas to perform driving motions, which is not exhaustive and repeated herein.

The following points need to be explained:

(1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to common designs.

(2) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.

The above description is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be subject to the scope of the claims.

Claims (8)

1. A pushing apparatus for a chip, comprising:

a plurality of motors;

a drive mechanism comprising a plurality of drive modules, each of the plurality of drive modules being connected to a corresponding one of the motors, each of the drive modules comprising at least one drive component;

and the push pins comprise a plurality of areas, and the push pins of each area are driven by the driving parts of the corresponding driving modules independently.

2. The pushing device of claim 1,

the plurality of drive modules of the drive mechanism include a central cylinder and one or more hollow cylinders coaxial therewith and nested within one another.

3. The pushing device of claim 2,

the cylinder of each of the drive modules includes at least one mounting hole in which the at least one drive member is fixedly mounted.

4. The pushing device of claim 2,

the plurality of regions comprise a solid rectangular region positioned in the center and one or more hollow rectangular regions which are nested from inside to outside around the solid rectangular region.

5. The pushing device of claim 4,

a drive member corresponding to a push pin in the solid rectangular area is disposed in the center of the central cylinder;

and the driving parts corresponding to the push pins in the hollow rectangular area are uniformly arranged along the circumferential direction of the corresponding hollow cylinder according to the rectangular shape.

6. The pushing device of claim 1,

each of the push pins has a rectangular or circular cross section.

7. The pushing device of claim 3 further comprising a replaceable sleeve disposed over an end of the drive mechanism proximate the push pin, wherein the sleeve comprises:

a hollow first surface configured to provide space for axial movement of the push pin along the cylinder;

a second surface having a plurality of through holes, opposite to the first surface along the axial direction; and

a plurality of push rods configured to pass through the plurality of through holes, the plurality of push rods connecting corresponding drive members and the push pins so that the drive members push the push pins via the push rods to move along the axial direction of the cylinder.

8. The pushing device as recited in any one of claims 1 to 7, further comprising a controller connected to the plurality of motors and configured to independently control each of the plurality of motors to control a motion state of a driving component of a driving module corresponding to each of the plurality of motors.

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