CN207587706U - A kind of gold thread in integration packaging is bonded special auxiliary support mechanism - Google Patents
A kind of gold thread in integration packaging is bonded special auxiliary support mechanism Download PDFInfo
- Publication number
- CN207587706U CN207587706U CN201721884843.8U CN201721884843U CN207587706U CN 207587706 U CN207587706 U CN 207587706U CN 201721884843 U CN201721884843 U CN 201721884843U CN 207587706 U CN207587706 U CN 207587706U
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- China
- Prior art keywords
- gold thread
- sliding block
- inverted
- support bar
- auxiliary support
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Abstract
A kind of gold thread in integration packaging is bonded special auxiliary support mechanism, which is characterized in that including:Bar shaped pedestal equipped with inverted T shaped sliding slot;At least one is set on the sliding block in inverted T shaped sliding slot by the inverted T shaped sliding block of bottom;The support bar being set in the vertical chute of sliding block side, the top surface of the support bar is arcwall face, and the arcwall face is upward arch.Applied to gold thread bond sequence, be capable of providing auxiliary support function, avoid the occurrence of bonding bracing wire process occur gold thread arch cave in influence contact stabilization, improve product total quality.
Description
Technical field
The utility model is related to integrated chip packages, are especially bonded special Auxiliary support with the gold thread in a kind of integration packaging
Mechanism is related.
Background technology
In order to which chip or core circuit is allowed to be electrically connected with pin of the layout on housing, in a package, use more
The mode of bonding gold thread is completed.The needs of bonding gold thread form better arch arc in bonding process, to reach most
Good packaging effect caves in if gold thread arch occurs in bonding process and will be unfavorable for integral device and keep good electrical contact,
Influence quality stability.
Utility model content
The gold thread that the utility model is carried in a kind of integration packaging is bonded special auxiliary support mechanism, to solve above-mentioned existing skill
Art is insufficient, applied to gold thread bond sequence, is capable of providing auxiliary support function, avoids the occurrence of bonding bracing wire process and gold thread arch occurs
Shape, which is caved in, influences contact stabilization, improves product total quality.
In order to realize the purpose of this utility model, intend using following technology:
A kind of gold thread in integration packaging is bonded special auxiliary support mechanism, which is characterized in that including:Equipped with inverted T shaped cunning
The bar shaped pedestal of slot;At least one is set on the sliding block in inverted T shaped sliding slot by the inverted T shaped sliding block of bottom;It is set to sliding block side
Support bar in the vertical chute, the top surface of the support bar is arcwall face, and the arcwall face is upward arch.
According to above-mentioned design, the support bar is ceramic material.
The beneficial effects of the utility model are:
The 1st, support bar is placed in the lower section of gold thread bonding, using the arch of its arcwall face, a kind of Auxiliary support is provided, is avoided
Gold thread arch, which occurs, in appearance bonding bracing wire process, which caves in, influences contact stabilization;
2nd, support bar is ceramic material, provides insulation performance and avoids causing other electrical problems;
3rd, support bar can slide up and down in the vertical chute, convenient for mechanism is made to be suitable for the housing base feelings of different height
Condition;
4th, support bar is arranged on sliding block, and sliding block can move on bar shaped pedestal, improve the application range of mechanism, if sliding
Block is 2, can be convenient for being applicable in different Chip-wides and pin distances;If sliding block is set as 3 or more, it can be achieved that mass
Support.
Description of the drawings
Fig. 1 is the utility model lateral structure schematic diagram.
Fig. 2 is schematic top plan view when the utility model is implemented.
Fig. 3 is the A direction views in Fig. 2.
Specific embodiment
As shown in Fig. 1 ~ 3, the gold thread in a kind of integration packaging is bonded special auxiliary support mechanism, including bar shaped pedestal 1, slides
Block 2 and support bar 3, wherein,
Bar shaped pedestal 1 is equipped with inverted T shaped sliding slot 11;
2 bottom of sliding block is equipped with inverted T shaped sliding block 21;
Sliding block 2 is snug fit at by inverted T shaped sliding block 21 on inverted T shaped sliding slot 11;
2 side of sliding block is equipped with the vertical chute 22;
Support bar 3 is ceramic material, and support bar 3 is horizontally disposed, specifically slides and is set in the vertical chute 22;
The top surface of support bar 3 is arcwall face 31, and arcwall face 31 is upward arch, and arch design is close to the one of chip 02
Side arch upward it is high a little arch upward close to the side of pin 03 shorter, whole arch to be achieved is bonded gold thread arc phase with thinking
Match.
Specifically, can have on bar shaped pedestal 1:
One sliding block 2, applied to the unilateral or single situation for needing to be bonded;
Two sliding blocks 2, applied to the bilateral or double situation for needing to be bonded;
Three or more sliding blocks 2;Situation applied to other more batch bondings.
In case of two sliding blocks 2, illustrate application mode, as shown in Figure 2:First, it lifts support bar 3 and slides cunning
Block 2 makes support bar 3 reach the position of 01 top of housing base, puts down support bar 3, and support bar 3 reaches Support Position;Then into
Row is bonded gold thread, and gold thread 04 is bonded out between chip 02 and pin 03, due to there is the arcwall face of support bar 3 to be used as support,
When can prevent unexpected, gold thread arch is avoided, which to cave in, influences electrical contact performance, is respectively provided with well conducive to bonding gold thread is kept
Arc effect.After the completion of bonding, it is displaced outwardly bar shaped pedestal 1, you can extraction support bar 3.
Claims (2)
1. the gold thread in a kind of integration packaging is bonded special auxiliary support mechanism, which is characterized in that including:
Equipped with inverted T shaped sliding slot(11)Bar shaped pedestal(1);
The inverted T shaped sliding block that at least one passes through bottom(21)Set on inverted T shaped sliding slot(11)Interior sliding block(2);
It is set to sliding block(2)The vertical chute of side(22)Interior support bar(3), the support bar(3)Top surface be arcwall face
(31), the arcwall face(31)For upward arch.
2. the gold thread in integration packaging according to claim 1 is bonded special auxiliary support mechanism, which is characterized in that described
Support bar(3)For ceramic material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721884843.8U CN207587706U (en) | 2017-12-29 | 2017-12-29 | A kind of gold thread in integration packaging is bonded special auxiliary support mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721884843.8U CN207587706U (en) | 2017-12-29 | 2017-12-29 | A kind of gold thread in integration packaging is bonded special auxiliary support mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207587706U true CN207587706U (en) | 2018-07-06 |
Family
ID=62740721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721884843.8U Active CN207587706U (en) | 2017-12-29 | 2017-12-29 | A kind of gold thread in integration packaging is bonded special auxiliary support mechanism |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207587706U (en) |
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2017
- 2017-12-29 CN CN201721884843.8U patent/CN207587706U/en active Active
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