CN203072248U - Intelligent heat-dissipating circuit board provided with blind hole structure - Google Patents
Intelligent heat-dissipating circuit board provided with blind hole structure Download PDFInfo
- Publication number
- CN203072248U CN203072248U CN 201320088158 CN201320088158U CN203072248U CN 203072248 U CN203072248 U CN 203072248U CN 201320088158 CN201320088158 CN 201320088158 CN 201320088158 U CN201320088158 U CN 201320088158U CN 203072248 U CN203072248 U CN 203072248U
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- CN
- China
- Prior art keywords
- circuit board
- dissipating
- heat
- blind hole
- hole structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an intelligent heat-dissipating circuit board provided with a blind hole structure. The intelligent heat-dissipating circuit board provided with the blind hole structure includes a circuit board, an intelligent heat-dissipating device, a temperature sensor and a controller. The heat-dissipating device includes a heat-dissipating fan. The temperature sensor and the controller are connected with the heat-dissipating fan, and the temperature sensor, the controller and the heat-dissipating fan are installed on a heat-dissipating stand together. The temperature sensor arranged on a heat-dissipating layer can sense temperature changes of the intelligent heat-dissipating circuit board provided with the blind hole structure timely and effectively and output collected temperature information. The controller judges whether the heat-dissipating fan needs to be started or not according to the received temperature information and realizes real-time monitoring of the intelligent heat-dissipating circuit board provided with the blind hole structure. By arranging a blind hole in the intelligent heat-dissipating circuit board provided with the blind hole structure, the interconnection between layers can be realized, so that a problem that requirements of clients cannot be met since circuit integration density of a prior circuit board becomes higher and higher and line width spacing of the prior circuit board is reduced continuously is solved.
Description
Technical field
The utility model relates to circuit board heat abstractor field, relates in particular to a kind of intelligent heat dissipation circuit board with blind hole structure.
Background technology
Because the electronic product volume dwindles day by day and the continuous rising of chip frequency, make the packaging density of circuit board constantly rise, thereby the heat dissipation problem that produces is more and more serious, and good cooling measure can promote the heat dissipation of circuit board, the life-span of lift elements effectively.The circuit board that prior art provides can not be monitored in real time to the working temperature of circuit board, and carry out in time, heat radiation effectively, the operational environment of circuit board is comparatively abominable, job stability and reliability are not high; The circuit integration density of printed circuit board is increasing, and the live width spacing is also constantly being dwindled, and in order to allow limited board area that more more high performance parts can be set, this conducting that forces printed circuit board to expedite the emergence of and use a kind of good scheme to realize interlayer interconnects.
The utility model content
The utility model purpose is that a kind of blind hole circuit board that disposes the intelligent heat dissipation device is provided in order to overcome the deficiencies in the prior art.
The purpose of this utility model is achieved in that a kind of intelligent heat dissipation circuit board with blind hole structure, comprise circuit board, intelligent heat dissipation device, temperature sensor, controller, described circuit board comprises central layer, be positioned at the last lamina rara externa on central layer top and be positioned at the end lamina rara externa of central layer bottom, described central layer and lamina rara externa are provided with the blind hole of connection, and blind hole only is communicated with one deck lamina rara externa and central layer; Described intelligent heat dissipation device comprises fan, heat radiation rack, and described temperature sensor, controller are connected successively with radiator fan, and are installed on the heat radiation rack together.
The intelligent heat dissipation circuit board that has blind hole structure that the utility model provides, the louvre of processing on substrate layer and heat dissipating layer reserved area improved the ventilation condition of circuit board, the temperature sensor that arranges on the heat dissipating layer can be timely, sense the variations in temperature of circuit board effectively, and the temperature information that collects exported, controller is according to the temperature information that receives, judge whether to be necessary to start radiator fan, when the temperature of circuit board surpasses the temperature upper limit of controller setting, send control signal and start radiator fan, the heat that circuit board is produced discharges rapidly, and controller can be set the temperature upper limit that starts radiator fan work; The setting of blind hole can be satisfied the demand that allows limited board area that more more high performance parts can be set, and can carry more number of electronic components simultaneously, improves dense degree and the integrated degree of circuit; The utility model has been realized the Based Intelligent Control of circuit board heat radiation has been improved the circuit board heat dissipation capability, has guaranteed stability and the reliability of circuit board work operation, and is simple in structure, has stronger practicality.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1 is the utility model intelligent heat dissipation device stereogram;
Fig. 2 is the utility model board structure of circuit figure.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is further described in detail.
Be illustrated in figure 1 as the intelligent heat dissipation device of a kind of circuit board described in the utility model, comprise the intelligent heat dissipation device; Described intelligent heat dissipation device is installed on the circuit board; Described intelligent heat dissipation device comprises, heat radiation rack 1, blower fan 2, hold-down screw 3, temperature sensor 4, controller 5; The bottom of described heat abstractor support is provided with first through hole; Described blower fan comprises fan blade, second through hole; Described fan blade is arranged on blower fan inside, and described second through hole is arranged on the bottom of blower fan; Second through hole on the described blower fan is communicated with first through hole; Described heat abstractor cover plate is located on the heat abstractor support, fixes by hold-down screw; Described radiator cover plate is provided with breach; Described heat abstractor cover plate covers blower fan and radiator; Described radiator is communicated with described breach, to realize that hot blast is discharged from heat abstractor.
Be illustrated in figure 2 as blind hole 6 structure charts of the present utility model, comprise one deck central layer 7, be positioned at the last lamina rara externa 8 on central layer top and be positioned at the end lamina rara externa 9 of central layer bottom, described central layer and lamina rara externa are provided with the blind hole of connection, and blind hole only is communicated with one deck lamina rara externa and central layer.
The intelligent heat dissipation circuit board of the band blind hole structure that the utility model embodiment provides, realized the Based Intelligent Control of circuit board heat radiation has been improved the circuit board heat dissipation capability, guaranteed stability and the reliability of circuit board work operation, simple in structure, have stronger practicality.
Claims (1)
1. intelligent heat dissipation circuit board with blind hole structure, comprise circuit board, intelligent heat dissipation device, temperature sensor, controller, it is characterized in that, described circuit board comprises central layer, be positioned at the last lamina rara externa on central layer top and be positioned at the end lamina rara externa of central layer bottom, described central layer and lamina rara externa are provided with the blind hole of connection, and blind hole only is communicated with one deck lamina rara externa and central layer; Described intelligent heat dissipation device comprises fan, heat radiation rack, and described temperature sensor, controller are connected successively with radiator fan, and are installed on the heat radiation rack together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320088158 CN203072248U (en) | 2013-02-27 | 2013-02-27 | Intelligent heat-dissipating circuit board provided with blind hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320088158 CN203072248U (en) | 2013-02-27 | 2013-02-27 | Intelligent heat-dissipating circuit board provided with blind hole structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203072248U true CN203072248U (en) | 2013-07-17 |
Family
ID=48770987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320088158 Expired - Lifetime CN203072248U (en) | 2013-02-27 | 2013-02-27 | Intelligent heat-dissipating circuit board provided with blind hole structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203072248U (en) |
-
2013
- 2013-02-27 CN CN 201320088158 patent/CN203072248U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN 988 ELECTRONIC CO., LTD. Free format text: FORMER OWNER: LAI FEIZHEN Effective date: 20141022 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Xiaoming Inventor before: Lai Feizhen |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LAI FEIZHEN TO: WANG XIAOMING Free format text: CORRECT: ADDRESS; FROM: 514500 MEIZHOU, GUANGDONG PROVINCE TO: 518129 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141022 Address after: Bantian street Longgang District of Shenzhen City, Guangdong province 518129 Daihatsu Po community Pu Street No. 7 Dezhong industrial park two building 2 floor No. 2 Patentee after: SHENZHEN JIUBABA ELECTRONICS Co.,Ltd. Address before: 514500 Guangdong city of Meizhou province Xingning city in the village of Huang Ji Tang Yonghe Town, No. 122 Patentee before: Lai Feizhen |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130717 |
|
| CX01 | Expiry of patent term |