CN203086845U - Circuit board with intelligent heat radiation device - Google Patents
Circuit board with intelligent heat radiation device Download PDFInfo
- Publication number
- CN203086845U CN203086845U CN 201320088932 CN201320088932U CN203086845U CN 203086845 U CN203086845 U CN 203086845U CN 201320088932 CN201320088932 CN 201320088932 CN 201320088932 U CN201320088932 U CN 201320088932U CN 203086845 U CN203086845 U CN 203086845U
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- Prior art keywords
- circuit board
- heat radiation
- hole
- radiation device
- fan
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- Expired - Fee Related
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Abstract
The utility model relates to a circuit board with an intelligent heat radiation device. The circuit board with the intelligent heat radiation device comprises a circuit board and the intelligent heat radiation device, wherein the heat radiation device comprises a heat radiation frame, a fan, a heat radiation device cover plate, a fixed screw, a temperature sensor and a controller, the fan comprises blades and a second through hole, the blades are arranged inside the fan, the second through hole is formed in the bottom of the fan, the second through hole formed in the fan is communicated with a first through hole, the heat radiation device cover plate is arranged on a heat radiation device support frame and is fixed through the fixing screw, a notch is formed in the heat radiation device cover plate, the heat radiation device cover plate covers the fan and the heat radiation device, and the heat radiation device is communicated with the notch and is used for realizing the effect of exhausting hot air out of the heat radiation device. The intelligent heat radiation device of the circuit board is arranged on the circuit board, the heat can be discharged out through the fan and the heat radiation device, the efficient heat radiation effect is obtained, the stable operation of the circuit board is ensured, and in addition, the service life is prolonged.
Description
Technical field
The utility model relates to circuit board heat abstractor field, relates in particular to a kind of circuit board with the intelligent heat dissipation device.
Background technology
Because the electronic product volume dwindles day by day and the continuous rising of chip frequency, make the packaging density of circuit board constantly rise, thereby the heat dissipation problem that is produced is more and more serious, and good cooling measure can promote the heat dissipation of circuit board, the life-span of lift elements effectively.The circuit board that prior art provides can not be monitored in real time to the working temperature of circuit board, and carry out in time, heat radiation effectively, the operational environment of circuit board is comparatively abominable, job stability and reliability are not high.
The utility model content
The utility model purpose is that a kind of circuit board that disposes the intelligent heat dissipation device is provided in order to overcome the deficiencies in the prior art.
The purpose of this utility model is achieved in that a kind of circuit board with the intelligent heat dissipation device, comprise circuit board, Copper Foil and intelligent heat dissipation device, described intelligent heat dissipation device comprises, heat radiation rack, blower fan, heat abstractor cover plate, hold-down screw, temperature sensor, controller, temperature sensor, controller are connected successively with radiator fan, and are installed on the heat radiation rack; Described circuit board also comprises a plurality of through holes and a plurality of obstruct wall; Described circuit board comprises first surface, and described through hole runs through substrate; Described Copper Foil is arranged at substrate first surface and described through-hole wall, and described obstruct wall is convexly set in around the through hole of first surface of described substrate, is used for intercepting scolding tin in welding process and flows in the corresponding through hole.
Further, the bottom of described heat abstractor support is provided with first through hole; Described blower fan comprises fan blade, second through hole; Described fan blade is arranged on blower fan inside, and described second through hole is arranged on the bottom of blower fan; Second through hole on the described blower fan is communicated with first through hole; Described heat abstractor cover plate is located on the heat abstractor support, fixes by hold-down screw; Described radiator cover plate is provided with breach; Described heat abstractor cover plate covers blower fan and radiator; Described radiator is communicated with described breach, to realize that hot blast is discharged from heat abstractor.
The circuit board that intelligent radiator is installed that the utility model provides, the louvre of processing on substrate layer and heat dissipating layer reserved area improved the ventilation condition of circuit board, the temperature sensor that is provided with on the heat dissipating layer can be timely, sense the variations in temperature of circuit board effectively, and the temperature information that collects exported, controller is according to the temperature information that receives, judge whether to be necessary to start radiator fan, when the temperature of circuit board surpasses the temperature upper limit of controller setting, send control signal and start radiator fan, the heat that circuit board is produced discharges apace, controller can be set the temperature upper limit that starts radiator fan work, realized the Based Intelligent Control of circuit board heat radiation has been improved the circuit board heat dissipation capability; Intercept wall and can prevent that scolding tin from flowing to through hole, thereby effectively avoid through hole to get clogged or air is hidden in through hole, increased the yield of product.Guaranteed the stability and the reliability of circuit board work operation, simple in structure, have stronger practicality.
Description of drawings
Fig. 1 is the stereogram of the utility model intelligent heat dissipation device;
Embodiment
Below by embodiment, and in conjunction with the accompanying drawings, the technical solution of the utility model is further described in detail.
Be a kind of circuit board described in the utility model as shown in Figure 1, comprise circuit board 8, Copper Foil and intelligent heat dissipation device with the intelligent heat dissipation device; Described intelligent heat dissipation device is installed on the circuit board; Described intelligent heat dissipation device comprises, heat radiation rack 1, blower fan 2, hold-down screw 3, temperature sensor 4, controller 5; Described circuit board also comprises a plurality of through holes 6 and a plurality of obstruct wall 7; Described circuit board comprises first surface, and described through hole runs through substrate; Described Copper Foil is arranged at substrate first surface and described through-hole wall, and described obstruct wall is convexly set in around the through hole of first surface of described substrate, is used for intercepting scolding tin in welding process and flows in the corresponding through hole.The bottom of described heat abstractor support is provided with first through hole; Described blower fan comprises fan blade, second through hole; Described fan blade is arranged on blower fan inside, and described second through hole is arranged on the bottom of blower fan; Second through hole on the described blower fan is communicated with first through hole; Described heat abstractor cover plate is located on the heat abstractor support, fixes by hold-down screw; Described radiator cover plate is provided with breach; Described heat abstractor cover plate covers blower fan and radiator; Described radiator is communicated with described breach, to realize that hot blast is discharged from heat abstractor; Described radiator is grid-like.
The circuit board of the band intelligent heat dissipation device that the utility model embodiment provides, realized Based Intelligent Control to the circuit board heat radiation, improved the circuit board heat dissipation capability, intercept wall and can prevent that scolding tin from flowing to through hole, thereby effectively avoid through hole to get clogged or air is hidden in through hole, increased the yield of product, guaranteed the stability and the reliability of circuit board work operation, simple in structure, have stronger practicality.
Claims (2)
1. circuit board with the intelligent heat dissipation device, comprise circuit board, Copper Foil and intelligent heat dissipation device, it is characterized in that: described intelligent heat dissipation device comprises, heat radiation rack, blower fan, heat abstractor cover plate, hold-down screw, temperature sensor, controller, temperature sensor, controller are connected successively with radiator fan, and are installed on the heat radiation rack; Described circuit board also comprises a plurality of through holes and a plurality of obstruct wall; Described circuit board comprises first surface, and described through hole runs through circuit board; Described Copper Foil is arranged at circuit board first surface and described through-hole wall, and described obstruct wall is convexly set in around the through hole of first surface of described circuit board, is used for intercepting scolding tin in welding process and flows in the corresponding through hole.
2. according to the circuit board of the described band intelligent heat dissipation of claim 1 device, it is characterized in that: the bottom of heat radiation rack is provided with first through hole; Blower fan comprises fan blade, second through hole; Fan blade is arranged on blower fan inside, and described second through hole is arranged on the bottom of blower fan; Second through hole on the blower fan is communicated with first through hole; The heat abstractor cover plate is located on the heat radiation rack, fixes by hold-down screw; The radiator cover plate is provided with breach; Radiator is communicated with described breach, to realize that hot blast is discharged from heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320088932 CN203086845U (en) | 2013-02-27 | 2013-02-27 | Circuit board with intelligent heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320088932 CN203086845U (en) | 2013-02-27 | 2013-02-27 | Circuit board with intelligent heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203086845U true CN203086845U (en) | 2013-07-24 |
Family
ID=48832640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320088932 Expired - Fee Related CN203086845U (en) | 2013-02-27 | 2013-02-27 | Circuit board with intelligent heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203086845U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104209623A (en) * | 2014-09-26 | 2014-12-17 | 庄景阳 | Conversion device for carrying out touch control on cooling and exhausting of electric soldering iron welding piece |
| CN104227174A (en) * | 2014-09-26 | 2014-12-24 | 庄景阳 | Converting device for manually controlling cooling and exhaust of electric soldering iron weldment |
| CN104227173A (en) * | 2014-09-26 | 2014-12-24 | 庄景阳 | Automatic cooling and exhausting transforming device of electric soldering iron weldment |
| CN105204402A (en) * | 2015-09-29 | 2015-12-30 | 大连罗宾森电源设备有限公司 | Multifunctional module integration PLC control panel |
| CN107807205A (en) * | 2017-10-15 | 2018-03-16 | 佛山净潭机械科技有限公司 | A kind of analyzer of construction engineering cost |
-
2013
- 2013-02-27 CN CN 201320088932 patent/CN203086845U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104209623A (en) * | 2014-09-26 | 2014-12-17 | 庄景阳 | Conversion device for carrying out touch control on cooling and exhausting of electric soldering iron welding piece |
| CN104227174A (en) * | 2014-09-26 | 2014-12-24 | 庄景阳 | Converting device for manually controlling cooling and exhaust of electric soldering iron weldment |
| CN104227173A (en) * | 2014-09-26 | 2014-12-24 | 庄景阳 | Automatic cooling and exhausting transforming device of electric soldering iron weldment |
| CN104227173B (en) * | 2014-09-26 | 2016-02-10 | 石狮市高鑫技术孵化有限公司 | The cooling of electric iron weldment and exhaust automatic transfer equipment |
| CN105204402A (en) * | 2015-09-29 | 2015-12-30 | 大连罗宾森电源设备有限公司 | Multifunctional module integration PLC control panel |
| CN107807205A (en) * | 2017-10-15 | 2018-03-16 | 佛山净潭机械科技有限公司 | A kind of analyzer of construction engineering cost |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN TONGWEIXIN CIRCUIT TECHNOLOGY Co.,Ltd. Assignor: Zheng Qun Contract record no.: 2013440020273 Denomination of utility model: Circuit board with intelligent heat radiation device Granted publication date: 20130724 License type: Exclusive License Record date: 20130918 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130724 |