CN204178305U - A kind of computer CPU heat sink - Google Patents
A kind of computer CPU heat sink Download PDFInfo
- Publication number
- CN204178305U CN204178305U CN201420691838.5U CN201420691838U CN204178305U CN 204178305 U CN204178305 U CN 204178305U CN 201420691838 U CN201420691838 U CN 201420691838U CN 204178305 U CN204178305 U CN 204178305U
- Authority
- CN
- China
- Prior art keywords
- fan
- heat sink
- temperature sensor
- heating column
- heat absorption
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000010521 absorption reactions Methods 0.000 claims abstract description 21
- 239000006260 foams Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 239000000463 materials Substances 0.000 claims abstract description 12
- 239000003570 air Substances 0.000 claims abstract description 11
- 239000010410 layers Substances 0.000 claims abstract description 6
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 6
- 239000010703 silicon Substances 0.000 claims abstract description 6
- -1 silicon lipid Chemical class 0.000 claims abstract description 6
- 229920000742 Cotton Polymers 0.000 claims abstract description 5
- 239000011521 glasses Substances 0.000 claims abstract description 5
- 229910000838 Al alloys Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 229910003726 AI2O3 Inorganic materials 0.000 abstract description 2
- 238000009825 accumulation Methods 0.000 abstract description 2
- 239000000428 dust Substances 0.000 abstract description 2
- 239000000306 components Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000034 methods Methods 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 239000000956 alloys Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 239000008358 core components Substances 0.000 description 1
- 238000010586 diagrams Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Abstract
Description
Technical field
The utility model relates to field of computer technology, is specially a kind of computer CPU heat sink.
Background technology
CPU (central processing unit) is the core component in computing machine, is also maximum heater members simultaneously.The normal working temperature of electron device lower than 65 degrees Celsius, should exceed this scope, and components and parts performance will significantly decline, can not steady operation and affect reliability of operation.In order to make CPU normally work, just effectively must dispel the heat to it, in multiple radiating mode, mainly adopting forced air cooling mode, namely utilizing the effect of fan, the heat of heat radiator is scattered and disappeared by forced convertion mode.Along with the development of infotech, the exploitation of central processing unit (CPU) obtains significant progress, computing velocity is greatly improved, but, the raising of this computing velocity is integrated by the superelevation of chip and based on power consumption, in order to ensure that chip normally works, science, reasonable, efficient cooling measure will be adopted to chip.In order to meet the needs of high heat-sinking capability, people increase volume, the weight of traditional heat sinks one after another, change material category simultaneously, to improve radiating efficiency, copper is the high thermal conductivity materials being only second to noble silver, and therefore people quote copper one after another to do thermal component, but the density of copper is very high, the weight of each heat interchanger can be made very high, and CPU is in the process of long-time heat radiation, the noise of generation is relatively also larger, and time in radiation processes, temperature is too high, and CPU can be made to damage.
Utility model content
The purpose of this utility model is to provide a kind of computer CPU heat sink, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the utility model provides following technical scheme: a kind of computer CPU heat sink, comprise upper cover, fan, baffle plate, heating column, heat absorption base plate and CPU, described CPU upper surface fits tightly with heat absorption base plate, thermal conductive silicon lipid layer is provided with between described heat absorption base plate and heating column, a baffle plate is installed with above described heating column, the space that described baffle plate and heating column inside are formed is filled with foam copper, thermal hole is offered below described baffle plate, top is installed with fan, described fan is provided with Air Filter, upper cover is installed with above described Air Filter, described upper cover to be positioned at above baffle plate and to be fixedly connected with screw fit by screw, described heat absorption plate outer side is also provided with temperature sensor, described temperature sensor is electrically connected controller, described controller is electrically connected fan.
Preferably, what described fan adopted is centrifugal fan, and the motor of fan is variable-frequency motor.
Preferably, described temperature sensor is arranged on 3 millimeters to the 5 millimeters places of distance CPU, and the number that temperature sensor is arranged is no less than one.
Preferably, rotary glass cotton material is provided with in described upper cover.
Preferably, described heating column is convex structure, and heating column number can have 3 to 5.
Preferably, the number that described thermal hole is offered is no less than one.
Preferably, described foam copper is mainly made open celled foam state by brass and other impurity and is formed.
Preferably, the material of described heat absorption base plate can be aluminum or aluminum alloy.
Compared with prior art, the beneficial effects of the utility model are: the utility model is by being provided with temperature sensor at plate outer side, heating radiator internal temperature can be detected, temperature sensor is electrically connected controller, controller is electrically connected fan, and the motor of fan is variable-frequency motor, this just just can adjust the revolution of fan, increase its radiating effect, and on fan, be provided with Air Filter, when can effectively prevent from dispelling the heat for a long time, the dust of heat emission fan accumulation, rotary glass cotton material is provided with in upper cover, effectively can reduce noise, heat absorption base plate is alumina based material, cost is low, also by adopting foam copper, effectively raise its radiating effect.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is theory structure block diagram of the present utility model.
In figure: 1 upper cover, 2 baffle plates, 3 thermal holes, 4 heating columns, 5 thermal conductive silicon lipid layer, 6 heat absorption base plate, 7CPU, 8 temperature sensors, 9 controllers, 10 Air Filters, 11 fans, 12 foam coppers.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1-2, the utility model provides a kind of technical scheme: a kind of computer CPU heat sink, comprise upper cover 1, fan 11, baffle plate 2, heating column 4, heat absorption base plate 6 and CPU7, CPU7 upper surface fits tightly with heat absorption base plate 1, thermal conductive silicon lipid layer 5 is provided with between heat absorption base plate 1 and heating column 4, thermal conductive silicon lipid layer 5 is used for conducting the heat that comes out of CPU7, making CPU7 temperature remain on one can the level of steady operation, prevent CPU7 because heat radiation is bad and damage, and increase the service life, the material of heat absorption base plate 1 can be aluminum or aluminum alloy, aluminum or aluminum alloy material is cheap, which reduces cost, a baffle plate 2 is installed with above heating column 4, the space that baffle plate 2 is formed with heating column 4 inside is filled with foam copper 12, foam copper 12 is mainly made open celled foam state by brass and other impurity and is formed, can effectively improve its radiating effect, heating column 4 is convex structure, and heating column 4 number can have 3 to 5, thermal hole 3 is offered below baffle plate 2, and the number that thermal hole 3 is offered is no less than one, fan 11 is also installed with above baffle plate 2, fan 11 is provided with Air Filter 10, upper cover 1 is installed with above Air Filter 10, rotary glass cotton material is provided with in upper cover 1, upper cover 1 to be positioned at above baffle plate 2 and to be fixedly connected with screw fit by screw, temperature sensor 8 is also provided with outside heat absorption base plate 6, temperature sensor 8 is arranged on 3 millimeters to the 5 millimeters places of distance CPU7, and the number that temperature sensor 8 is arranged is no less than one, temperature sensor 8 is electrically connected controller 9, controller 9 is electrically connected fan 11, what fan 11 adopted is centrifugal fan, and the motor of fan 11 is variable-frequency motor.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this instructions is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of instructions is only for clarity sake, those skilled in the art should by instructions integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420691838.5U CN204178305U (en) | 2014-11-07 | 2014-11-07 | A kind of computer CPU heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420691838.5U CN204178305U (en) | 2014-11-07 | 2014-11-07 | A kind of computer CPU heat sink |
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| CN204178305U true CN204178305U (en) | 2015-02-25 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105487625A (en) * | 2015-11-26 | 2016-04-13 | 国家电网公司 | Dampproof and dustproof computer CPU cooling fan |
| CN106190058A (en) * | 2016-07-25 | 2016-12-07 | 深圳天珑无线科技有限公司 | A kind of composite heat conducting material, its preparation method and application |
| CN106444572A (en) * | 2016-07-21 | 2017-02-22 | 中交信通（天津）科技有限公司 | Unmanned aerial vehicle safety monitoring and warning device based on Beidou system |
| CN106704239A (en) * | 2017-02-14 | 2017-05-24 | 国网新疆电力公司信息通信公司 | Temperature control device and variable-speed fan |
| CN107031257A (en) * | 2017-05-16 | 2017-08-11 | 安庆市宏大涛业精啄数控科技有限公司 | A kind of engraving machine dustproof heat abstractor |
| CN107340836A (en) * | 2017-06-30 | 2017-11-10 | 东莞市翰胜金属制品有限公司 | A kind of microprocessor is heat radiator dedicated and its processing method |
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2014
- 2014-11-07 CN CN201420691838.5U patent/CN204178305U/en not_active IP Right Cessation
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105487625A (en) * | 2015-11-26 | 2016-04-13 | 国家电网公司 | Dampproof and dustproof computer CPU cooling fan |
| CN106444572A (en) * | 2016-07-21 | 2017-02-22 | 中交信通（天津）科技有限公司 | Unmanned aerial vehicle safety monitoring and warning device based on Beidou system |
| CN106190058A (en) * | 2016-07-25 | 2016-12-07 | 深圳天珑无线科技有限公司 | A kind of composite heat conducting material, its preparation method and application |
| CN106704239A (en) * | 2017-02-14 | 2017-05-24 | 国网新疆电力公司信息通信公司 | Temperature control device and variable-speed fan |
| CN107031257A (en) * | 2017-05-16 | 2017-08-11 | 安庆市宏大涛业精啄数控科技有限公司 | A kind of engraving machine dustproof heat abstractor |
| CN107031257B (en) * | 2017-05-16 | 2018-11-27 | 安庆市宏大涛业精啄数控科技有限公司 | A kind of engraving machine dustproof radiator |
| CN107340836A (en) * | 2017-06-30 | 2017-11-10 | 东莞市翰胜金属制品有限公司 | A kind of microprocessor is heat radiator dedicated and its processing method |
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