CN204178305U - A kind of computer CPU heat sink - Google Patents

A kind of computer CPU heat sink Download PDF

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Publication number
CN204178305U
CN204178305U CN201420691838.5U CN201420691838U CN204178305U CN 204178305 U CN204178305 U CN 204178305U CN 201420691838 U CN201420691838 U CN 201420691838U CN 204178305 U CN204178305 U CN 204178305U
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CN
China
Prior art keywords
fan
heat sink
temperature sensor
heating column
heat absorption
Prior art date
Application number
CN201420691838.5U
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Chinese (zh)
Inventor
朱伟
Original Assignee
朱伟
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 朱伟 filed Critical 朱伟
Priority to CN201420691838.5U priority Critical patent/CN204178305U/en
Application granted granted Critical
Publication of CN204178305U publication Critical patent/CN204178305U/en

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Abstract

The utility model discloses a kind of computer CPU heat sink, comprise upper cover, fan, heating column, heat absorption base plate and CPU, thermal conductive silicon lipid layer is provided with between heat absorption base plate and heating column, the space that baffle plate and heating column inside are formed is filled with foam copper, fan is provided with Air Filter, heat absorption plate outer side is also provided with temperature sensor, and temperature sensor is electrically connected controller, and controller is electrically connected fan.The utility model is by being provided with temperature sensor at plate outer side, temperature sensor is electrically connected controller, controller is electrically connected fan, and the motor of fan is variable-frequency motor, this just can adjust the revolution of fan, increase its radiating effect, and on fan, be provided with Air Filter, when can effectively prevent from dispelling the heat for a long time, the dust of heat emission fan accumulation, rotary glass cotton material is provided with in upper cover, effectively can reduce noise, heat absorption base plate is alumina based material, and cost is low, also by adopting foam copper, effectively raise its radiating effect.

Description

A kind of computer CPU heat sink

Technical field

The utility model relates to field of computer technology, is specially a kind of computer CPU heat sink.

Background technology

CPU (central processing unit) is the core component in computing machine, is also maximum heater members simultaneously.The normal working temperature of electron device lower than 65 degrees Celsius, should exceed this scope, and components and parts performance will significantly decline, can not steady operation and affect reliability of operation.In order to make CPU normally work, just effectively must dispel the heat to it, in multiple radiating mode, mainly adopting forced air cooling mode, namely utilizing the effect of fan, the heat of heat radiator is scattered and disappeared by forced convertion mode.Along with the development of infotech, the exploitation of central processing unit (CPU) obtains significant progress, computing velocity is greatly improved, but, the raising of this computing velocity is integrated by the superelevation of chip and based on power consumption, in order to ensure that chip normally works, science, reasonable, efficient cooling measure will be adopted to chip.In order to meet the needs of high heat-sinking capability, people increase volume, the weight of traditional heat sinks one after another, change material category simultaneously, to improve radiating efficiency, copper is the high thermal conductivity materials being only second to noble silver, and therefore people quote copper one after another to do thermal component, but the density of copper is very high, the weight of each heat interchanger can be made very high, and CPU is in the process of long-time heat radiation, the noise of generation is relatively also larger, and time in radiation processes, temperature is too high, and CPU can be made to damage.

Utility model content

The purpose of this utility model is to provide a kind of computer CPU heat sink, to solve the problem proposed in above-mentioned background technology.

For achieving the above object, the utility model provides following technical scheme: a kind of computer CPU heat sink, comprise upper cover, fan, baffle plate, heating column, heat absorption base plate and CPU, described CPU upper surface fits tightly with heat absorption base plate, thermal conductive silicon lipid layer is provided with between described heat absorption base plate and heating column, a baffle plate is installed with above described heating column, the space that described baffle plate and heating column inside are formed is filled with foam copper, thermal hole is offered below described baffle plate, top is installed with fan, described fan is provided with Air Filter, upper cover is installed with above described Air Filter, described upper cover to be positioned at above baffle plate and to be fixedly connected with screw fit by screw, described heat absorption plate outer side is also provided with temperature sensor, described temperature sensor is electrically connected controller, described controller is electrically connected fan.

Preferably, what described fan adopted is centrifugal fan, and the motor of fan is variable-frequency motor.

Preferably, described temperature sensor is arranged on 3 millimeters to the 5 millimeters places of distance CPU, and the number that temperature sensor is arranged is no less than one.

Preferably, rotary glass cotton material is provided with in described upper cover.

Preferably, described heating column is convex structure, and heating column number can have 3 to 5.

Preferably, the number that described thermal hole is offered is no less than one.

Preferably, described foam copper is mainly made open celled foam state by brass and other impurity and is formed.

Preferably, the material of described heat absorption base plate can be aluminum or aluminum alloy.

Compared with prior art, the beneficial effects of the utility model are: the utility model is by being provided with temperature sensor at plate outer side, heating radiator internal temperature can be detected, temperature sensor is electrically connected controller, controller is electrically connected fan, and the motor of fan is variable-frequency motor, this just just can adjust the revolution of fan, increase its radiating effect, and on fan, be provided with Air Filter, when can effectively prevent from dispelling the heat for a long time, the dust of heat emission fan accumulation, rotary glass cotton material is provided with in upper cover, effectively can reduce noise, heat absorption base plate is alumina based material, cost is low, also by adopting foam copper, effectively raise its radiating effect.

Accompanying drawing explanation

Fig. 1 is the utility model structural representation;

Fig. 2 is theory structure block diagram of the present utility model.

In figure: 1 upper cover, 2 baffle plates, 3 thermal holes, 4 heating columns, 5 thermal conductive silicon lipid layer, 6 heat absorption base plate, 7CPU, 8 temperature sensors, 9 controllers, 10 Air Filters, 11 fans, 12 foam coppers.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.

Refer to Fig. 1-2, the utility model provides a kind of technical scheme: a kind of computer CPU heat sink, comprise upper cover 1, fan 11, baffle plate 2, heating column 4, heat absorption base plate 6 and CPU7, CPU7 upper surface fits tightly with heat absorption base plate 1, thermal conductive silicon lipid layer 5 is provided with between heat absorption base plate 1 and heating column 4, thermal conductive silicon lipid layer 5 is used for conducting the heat that comes out of CPU7, making CPU7 temperature remain on one can the level of steady operation, prevent CPU7 because heat radiation is bad and damage, and increase the service life, the material of heat absorption base plate 1 can be aluminum or aluminum alloy, aluminum or aluminum alloy material is cheap, which reduces cost, a baffle plate 2 is installed with above heating column 4, the space that baffle plate 2 is formed with heating column 4 inside is filled with foam copper 12, foam copper 12 is mainly made open celled foam state by brass and other impurity and is formed, can effectively improve its radiating effect, heating column 4 is convex structure, and heating column 4 number can have 3 to 5, thermal hole 3 is offered below baffle plate 2, and the number that thermal hole 3 is offered is no less than one, fan 11 is also installed with above baffle plate 2, fan 11 is provided with Air Filter 10, upper cover 1 is installed with above Air Filter 10, rotary glass cotton material is provided with in upper cover 1, upper cover 1 to be positioned at above baffle plate 2 and to be fixedly connected with screw fit by screw, temperature sensor 8 is also provided with outside heat absorption base plate 6, temperature sensor 8 is arranged on 3 millimeters to the 5 millimeters places of distance CPU7, and the number that temperature sensor 8 is arranged is no less than one, temperature sensor 8 is electrically connected controller 9, controller 9 is electrically connected fan 11, what fan 11 adopted is centrifugal fan, and the motor of fan 11 is variable-frequency motor.

To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.

In addition, be to be understood that, although this instructions is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of instructions is only for clarity sake, those skilled in the art should by instructions integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.

Claims (8)

1. a computer CPU heat sink, comprise upper cover, fan, baffle plate, heating column, heat absorption base plate and CPU, it is characterized in that: described CPU upper surface fits tightly with heat absorption base plate, thermal conductive silicon lipid layer is provided with between described heat absorption base plate and heating column, a baffle plate is installed with above described heating column, the space that described baffle plate and heating column inside are formed is filled with foam copper, thermal hole is offered below described baffle plate, top is installed with fan, described fan is provided with Air Filter, upper cover is installed with above described Air Filter, described upper cover to be positioned at above baffle plate and to be fixedly connected with screw fit by screw, described heat absorption plate outer side is also provided with temperature sensor, described temperature sensor is electrically connected controller, described controller is electrically connected fan.
2. a kind of computer CPU heat sink according to claim 1, is characterized in that: what described fan adopted is centrifugal fan, and the motor of fan is variable-frequency motor.
3. a kind of computer CPU heat sink according to claim 1, is characterized in that: described temperature sensor is arranged on 3 millimeters to the 5 millimeters places of distance CPU, and the number that temperature sensor is arranged is no less than one.
4. a kind of computer CPU heat sink according to claim 1, is characterized in that: be provided with rotary glass cotton material in described upper cover.
5. a kind of computer CPU heat sink according to claim 1, is characterized in that: described heating column is convex structure, and heating column number can have 3 to 5.
6. a kind of computer CPU heat sink according to claim 1, is characterized in that: the number that described thermal hole is offered is no less than one.
7. a kind of computer CPU heat sink according to claim 1, is characterized in that: described foam copper is mainly made open celled foam state by brass and other impurity and formed.
8. a kind of computer CPU heat sink according to claim 1, is characterized in that: the material of described heat absorption base plate can be aluminum or aluminum alloy.
CN201420691838.5U 2014-11-07 2014-11-07 A kind of computer CPU heat sink CN204178305U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420691838.5U CN204178305U (en) 2014-11-07 2014-11-07 A kind of computer CPU heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420691838.5U CN204178305U (en) 2014-11-07 2014-11-07 A kind of computer CPU heat sink

Publications (1)

Publication Number Publication Date
CN204178305U true CN204178305U (en) 2015-02-25

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CN (1) CN204178305U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105487625A (en) * 2015-11-26 2016-04-13 国家电网公司 Dampproof and dustproof computer CPU cooling fan
CN106190058A (en) * 2016-07-25 2016-12-07 深圳天珑无线科技有限公司 A kind of composite heat conducting material, its preparation method and application
CN106444572A (en) * 2016-07-21 2017-02-22 中交信通(天津)科技有限公司 Unmanned aerial vehicle safety monitoring and warning device based on Beidou system
CN106704239A (en) * 2017-02-14 2017-05-24 国网新疆电力公司信息通信公司 Temperature control device and variable-speed fan
CN107031257A (en) * 2017-05-16 2017-08-11 安庆市宏大涛业精啄数控科技有限公司 A kind of engraving machine dustproof heat abstractor
CN107340836A (en) * 2017-06-30 2017-11-10 东莞市翰胜金属制品有限公司 A kind of microprocessor is heat radiator dedicated and its processing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105487625A (en) * 2015-11-26 2016-04-13 国家电网公司 Dampproof and dustproof computer CPU cooling fan
CN106444572A (en) * 2016-07-21 2017-02-22 中交信通(天津)科技有限公司 Unmanned aerial vehicle safety monitoring and warning device based on Beidou system
CN106190058A (en) * 2016-07-25 2016-12-07 深圳天珑无线科技有限公司 A kind of composite heat conducting material, its preparation method and application
CN106704239A (en) * 2017-02-14 2017-05-24 国网新疆电力公司信息通信公司 Temperature control device and variable-speed fan
CN107031257A (en) * 2017-05-16 2017-08-11 安庆市宏大涛业精啄数控科技有限公司 A kind of engraving machine dustproof heat abstractor
CN107031257B (en) * 2017-05-16 2018-11-27 安庆市宏大涛业精啄数控科技有限公司 A kind of engraving machine dustproof radiator
CN107340836A (en) * 2017-06-30 2017-11-10 东莞市翰胜金属制品有限公司 A kind of microprocessor is heat radiator dedicated and its processing method

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160328

Address after: 723003 Hantai District, Shaanxi, Chaoyang Road, Shaanxi University of Technology, Hanzhoung

Patentee after: Shaanxi Science and Engineering College

Address before: 723003 Hanzhoung province Shaanxi city Hantai District Hedong District West of 1 family members of Shaanxi University of Technology

Patentee before: Zhu Wei

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150225

Termination date: 20151107