CN203055988U - 曲面反射腔的smd发光二极管 - Google Patents

曲面反射腔的smd发光二极管 Download PDF

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CN203055988U
CN203055988U CN2013200617587U CN201320061758U CN203055988U CN 203055988 U CN203055988 U CN 203055988U CN 2013200617587 U CN2013200617587 U CN 2013200617587U CN 201320061758 U CN201320061758 U CN 201320061758U CN 203055988 U CN203055988 U CN 203055988U
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emitting diode
reflection cavity
chip
smd light
smd
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张汉春
傅文越
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HANGZHOU MULTI-COLOR OPTOELECTRONICS Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

Abstract

本实用新型提供了一种曲面反射腔的SMD发光二极管,包括支架和芯片,所述支架呈方形,所述支架上设有碗状的反射腔,所述芯片设置于所述反射腔的底部上,所述反射腔内填充有外封胶,所述反射腔的侧壁是内凹的曲面。通过将反射腔的侧壁由斜面或者垂直面改成内凹的曲面,一方面,可以使得芯片发出的光线从外封胶进入空气的入射角更小,从而能够使得更多的光线折射出外封胶即提高了光取出效率,可以提高SMD发光二极管的亮度,另一方面,内凹的曲面具有聚光作用,光线可以经曲面的反射腔反射后全部向上折射出来,进而可以提高轴向亮度,从而进一步提高SMD发光二极管的亮度。

Description

曲面反射腔的SMD发光二极管
技术领域
本实用新型涉及半导体制造领域,尤其涉及一种曲面反射腔的SMD发光二极管。
背景技术
最近几年,我国LED(发光二极管,Light Emitting Diode)封装行业,如雨后春笋般崛起,虽然发展的速度令人吃惊,但是与世界一流的水平还是有很大的距离,其中最主要的就是产品的质量以及可靠性。
其中,LED支架是LED产品最主要的原物料之一,是LED产品中负责导电与散热部件,并且与芯片的金属引脚相连,起到非常重要的作用。
LED支架大致可分为LAMP支架(即直插式LED支架)、SMD支架(即贴片式LED支架)、食人鱼支架以及大功率支架。在LED封装时,将数个LED支架连接在一起,到封装胶体后将其断开。
请参阅图1和图2,目前,公知的SMD LED即贴片式发光二极管,主要包括支架(SMD支架)1、芯片2、外封胶、引线4以及金属引脚5。图1所示的SMD发光二极管的反射腔的侧壁12为斜面,即所述侧壁12与所述反射腔的底部11之间的夹角是锐角。图2所示的SMD发光二极管的反射腔的侧壁12为垂直面,即所述侧壁12与所述反射腔的底部11之间的夹角是直角。图1所示的SMD发光二极管,由于其反射基本为镜面反射,且外封胶3的折射率为1.4-1.5左右,空气的折射率为1,根据全反射公式sinA=1/n在光线射出外封胶进入空气时,入射角大于34度的光线会发生全反射,导致部分光线会被反射回反射腔内,从而无法射出反射腔。图2所示的SMD发光二极管,由于反射腔的侧壁12是垂直面,其对光线的反射效果相比图1所示的SMD发光二极管更差。
因此,面对市场对产品亮度的要求越来越高的趋势下,在芯片亮度提升有限的情况下,如何尽可能多地将光线反射出发射腔,以提高其亮度是本领域技术人员亟待解决的一个技术问题。
实用新型内容
本实用新型的目的在于提供一种曲面反射腔的SMD发光二极管,通过将反射腔的侧壁由斜面或者垂直面改成内凹的曲面,可以使得更多的光线折射出外封胶,并且可以提高轴向亮度,从而提高SMD发光二极管的亮度。
为了达到上述的目的,本实用新型采用如下技术方案:
一种曲面反射腔的SMD发光二极管,包括支架和芯片,所述支架呈方形,所述支架上设有碗状的反射腔,所述芯片设置于所述反射腔的底部上,所述反射腔内填充有外封胶,所述反射腔的侧壁是内凹的曲面。
优选的,在上述的曲面反射腔的SMD发光二极管中,所述反射腔的侧壁是球面结构。
优选的,在上述的曲面反射腔的SMD发光二极管中,还包括引线和引脚,所述芯片通过引线和所述金属引脚电连接。
优选的,在上述的曲面反射腔的SMD发光二极管中,所述芯片通过固晶胶设置于所述反射腔的底部上。
本实用新型提供的曲面反射腔的SMD发光二极管,通过将反射腔的侧壁由斜面或者垂直面改成内凹的曲面,一方面,可以使得芯片发出的光线从外封胶进入空气的入射角更小,从而能够使得更多的光线折射出外封胶即提高了光取出效率,可以提高SMD发光二极管的亮度,另一方面,内凹的曲面具有聚光作用,光线可以经曲面的反射腔反射后全部向上折射出来,进而可以提高轴向亮度,从而进一步提高SMD发光二极管的亮度。本实用新型由于可以提高SMD发光二极管的亮度,因此可以延伸出以下两个优点:
(1)可以降低对芯片的亮度要求,选用低亮度的芯片,即可满足需求,从而降低成本;
(2)芯片本身不变的情况下,通过降低电流,即可满足亮度需求,从而减小功耗,节能环保。
附图说明
本实用新型的曲面反射腔的SMD发光二极管由以下的实施例及附图给出。
图1是现有的斜面型反射腔侧壁的SMD发光二极管的结构示意图;
图2是现有的垂直面型反射腔侧壁的的SMD发光二极管的结构示意图;
图3是本实用新型一实施例的曲面反射腔的SMD发光二极管的结构示意图。
图4是本实用新型一实施例的曲面反射腔的SMD发光二极管的光线路径图。
图中,1-支架、11-底部、12-侧壁、2-芯片、3-外封胶、4-引线、5-金属引脚、6-光线。
具体实施方式
下面将参照附图对本实用新型进行更详细的描述,其中表示了本实用新型的优选实施例,应该理解本领域技术人员可以修改在此描述的本实用新型而仍然实现本实用新型的有益效果。因此,下列描述应当被理解为对于本领域技术人员的广泛知道,而并不作为对本实用新型的限制。
为使本实用新型的目的、特征更明显易懂,下面结合附图对本实用新型的具体实施方式作进一步的说明。需说明的是,附图均采用非常简化的形式且均使用非精准的比率,仅用以方便、明晰地辅助说明本实用新型实施例的目的。
请参阅图3和图4,其中,图3所示是本实用新型一实施例的曲面反射腔的SMD发光二极管的结构示意图,图4所示是本实用新型一实施例的曲面反射腔的SMD发光二极管的光线路径图。
本实施例提供的曲面反射腔的SMD发光二极管,包括支架1和芯片2,所述支架1呈方形,所述支架1上设有碗状的反射腔,所述芯片2设置于所述反射腔的底部11上,所述反射腔内填充有外封胶3,所述外封胶3用于保护芯片2,并使得芯片2发出的光线6透射出反射腔。所述反射腔的侧壁12是内凹的曲面。通过将反射腔的侧壁12由斜面或者垂直面改成内凹的曲面,一方面,如图4所示,并比照图1和图2,可以使得芯片2发出的光线6从外封胶3进入空气的入射角更小,从而能够使得更多的光线6折射出外封胶3,另一方面,内凹的曲面具有聚光作用,光线6可以经曲面的反射腔反射后全部向上折射出来,可以提高轴向亮度,从而提高SMD发光二极管的亮度。该产品与图1和图2所示的SMD发光二极管相比,能将尽可能多的光反射出反射腔,据理论计算最小可提高30%的亮度。
优选的,在本实施例的曲面反射腔的SMD发光二极管中,所述反射腔的侧壁12是球面结构。侧壁12的曲率可以根据需要设置。
优选的,在本实施例的曲面反射腔的SMD发光二极管中,还包括引线4和引脚5,所述芯片2通过引线4和所述金属引脚5电连接。通过设置引线4和金属引脚5可以将芯片外引。
优选的,在本实施例的曲面反射腔的SMD发光二极管中,所述芯片2通过固晶胶(未图示)设置于所述反射腔的底部11上。通过设置固晶胶可以将芯片2牢固地粘贴于所述反射腔的底部11上。
此外,与斜面式和垂直式的反射腔相比,曲面反射腔在加工上难度没有增加。支架1的生产流程主要包括:金属片冲压、电镀、注塑PPA、折脚、刷墨等步骤。支架1在注塑工序时,通过注塑模具的设计,将注塑成型的碗杯反射腔侧壁设计成球面结构,然后进行一系列的折脚和刷墨工艺。此后按照LED的封装制程封装芯片2。在支架1生产时可根据采用芯片2的尺寸和支架1本身的尺寸,并在塑胶注塑后能脱模的情况下,可以设计成任意曲率。本专利适用于所有的SMD发光二极管产品。
综上所述,本实用新型提供的曲面反射腔的SMD发光二极管,通过将反射腔的侧壁由斜面或者垂直面改成内凹的曲面,可以使得芯片发出的光线从外封胶进入空气的入射角更小,从而能够使得更多的光线折射出外封胶,其次,内凹的曲面具有聚光作用,光线可以经曲面的反射腔反射后全部向上折射出来,可以提高轴向亮度,从而提高SMD发光二极管的亮度。本实施例通过提高光取出效率,从而提高SMD发光二极管亮度。此发明可以用在显示屏,照明等LED相关领域。
显然,本领域的技术人员可以对本实用新型进行各种改动和变型而不脱离本实用新型的精神和范围。这样,倘若本实用新型的这些修改和变型属于本实用新型权利要求及其等同技术的范围之内,则本实用新型也意图包含这些改动和变型在内。

Claims (4)

1.一种曲面反射腔的SMD发光二极管,其特征在于,包括支架和芯片,所述支架呈方形,所述支架上设有碗状的反射腔,所述芯片设置于所述反射腔的底部上,所述反射腔内填充有外封胶,所述反射腔的侧壁是内凹的曲面。 
2.根据权利要求1所述的曲面反射腔的SMD发光二极管,所述反射腔的侧壁是球面结构。 
3.根据权利要求1或2所述的曲面反射腔的SMD发光二极管,其特征在于,还包括引线和引脚,所述芯片通过引线和所述引脚电连接。 
4.根据权利要求1或2所述的曲面反射腔的SMD发光二极管,其特征在于,所述芯片通过固晶胶设置于所述反射腔的底部上。 
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105336838A (zh) * 2014-08-05 2016-02-17 Lg伊诺特有限公司 发光器件封装
WO2016078010A1 (zh) * 2014-11-19 2016-05-26 史伯梅 Led支架及led发光单元
CN110491985A (zh) * 2019-09-26 2019-11-22 宁波升谱光电股份有限公司 一种贴片led光源

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105336838A (zh) * 2014-08-05 2016-02-17 Lg伊诺特有限公司 发光器件封装
US10236427B2 (en) 2014-08-05 2019-03-19 Lg Innotek Co., Ltd. Light emitting device package
CN105336838B (zh) * 2014-08-05 2019-06-04 Lg伊诺特有限公司 发光器件封装
WO2016078010A1 (zh) * 2014-11-19 2016-05-26 史伯梅 Led支架及led发光单元
CN110491985A (zh) * 2019-09-26 2019-11-22 宁波升谱光电股份有限公司 一种贴片led光源

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