CN203038974U - Large power COB-LED light source device structure with adjustable light and color - Google Patents

Large power COB-LED light source device structure with adjustable light and color Download PDF

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Publication number
CN203038974U
CN203038974U CN2013200084296U CN201320008429U CN203038974U CN 203038974 U CN203038974 U CN 203038974U CN 2013200084296 U CN2013200084296 U CN 2013200084296U CN 201320008429 U CN201320008429 U CN 201320008429U CN 203038974 U CN203038974 U CN 203038974U
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CN
China
Prior art keywords
led
source device
light source
device structure
stacker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013200084296U
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Chinese (zh)
Inventor
江向东
江浩澜
李少娟
吴小军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
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ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN2013200084296U priority Critical patent/CN203038974U/en
Application granted granted Critical
Publication of CN203038974U publication Critical patent/CN203038974U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The utility model discloses a large power COB-LED light source device structure with adjustable light and color, and the structure comprises a plurality of LED blue light chips and a bearing seat. The structure is characterized in that the bearing seat is divided into two parts through enclosure wall glue, and the plurality of LED blue light chips are equally distributed and fixed on the two parts of the bearing seat through base glue; the two parts on the bearing seat are filled and covered by glue body of the LED blue light chips, wherein the glue body on one part is warm white fluorescent glue body, and the glue body on the other part is cold white fluorescent glue body; and anodes and cathodes among the LED blue light chips are connected through guide lines. The large power COB-LED light source device structure with adjustable light and color is wide in application, low in thermal resistance, high in luminescence efficiency, low in cost, simple in procedure, is replaceable and realizable, and satisfies illumination core value.

Description

A kind of high-power COB-LED light source device structure of tunable optical toning
Technical field
The utility model relates to a kind of high-power COB-LED light source device structure of tunable optical toning, belongs to lighting field.
Background technology
Along with constantly bringing forth new ideas and domestic and international energy-saving and emission-reduction policy execution of LED encapsulation technology, led light source device, the ratio that led light source is applied in lighting field increases day by day, and new packing forms is constantly released.LED still is focus in the performance aspect heat radiation, light efficiency, reliability, the cost performance, COB (Chip on Board) the LED encapsulating products that industry is released under this background just, compare traditional discrete LED encapsulating products, possesses a better heat-sinking capability, highdensity luminous flux output.The utility model can carry out regulating to the multiple color of cold white light from warm white according to different demands, have be widely used, replaceability, distinguishing features such as thermal resistance is low, luminous efficiency is high, cost is low, technology is simple, realizability, satisfy the light source device of illumination core value.
Summary of the invention
Technical problem to be solved in the utility model be to provide a kind of have be widely used, replaceability, distinguishing features such as thermal resistance is low, luminous efficiency is high, cost is low, technology is simple, realizability, satisfy a kind of high-power COB-LED light source device structure of tunable optical toning of the light source device of illumination core value.
A kind of high-power COB-LED light source device structure of tunable optical toning, comprise some LEDs blue chips and a stacker, it is characterized in that: described stacker is divided into two parts by enclosure wall glue, described some LEDs blue chips distribute in the two parts that are fixed on the stacker by the primer equal portions, and the two parts on the stacker are filled and are covered the colloid of LED blue chip, wherein Yi Bufen colloid is warm white fluorescent colloid, another part is cold white fluorescent colloid, and described LED blue chip links to each other by lead with positive and negative electrode between the LED blue chip.
The thickness of described primer is the 1/4-1/2 of LED blue chip height.
Described stacker adopts pottery, copper material or aluminium any one material wherein to make.
The beneficial effects of the utility model are: a stacker is divided into two parts by enclosure wall glue, and is filled with dim white fluorescent colloid and cold white fluorescent colloid respectively, can realize that warm white arrives the high-power COB-LED light source of the tunable optical toning of cold white light different colours.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As shown in Figure 1: a kind of high-power COB-LED light source device structure of tunable optical toning, comprise some LEDs blue chips 1 and a stacker 2, stacker 2 is divided into two parts by enclosure wall glue 3, some LEDs blue chips 1 distribute in the two parts that are fixed on the stacker 2 by primer 4 equal portions, and the two parts on the stacker 2 are filled and are covered the colloid 5 of LED blue chip 1, wherein Yi Bufen colloid is warm white fluorescent colloid 51, another part is cold white fluorescent colloid 52, between LED blue chip 1 and the LED blue chip 1 just, negative pole links to each other by lead 6.
The thickness of primer 4 is 1/4-1/2 of LED blue chip 1 height.
Stacker 2 adopts pottery, copper material or aluminium any one material wherein to make.
More than show and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (3)

1. the high-power COB-LED light source device structure of tunable optical toning, comprise some LEDs blue chips and a stacker, it is characterized in that: described stacker is divided into two parts by enclosure wall glue, described some LEDs blue chips distribute in the two parts that are fixed on the stacker by the primer equal portions, and the two parts on the stacker are filled and are covered the colloid of LED blue chip, wherein Yi Bufen colloid is warm white fluorescent colloid, another part is cold white fluorescent colloid, between described LED blue chip and the LED blue chip just, negative pole links to each other by lead.
2. according to the high-power COB-LED light source device structure of the described a kind of tunable optical toning of claim 1, it is characterized in that: the thickness of described primer is the 1/4-1/2 of LED blue chip height.
3. according to the high-power COB-LED light source device structure of the described a kind of tunable optical toning of claim 1, it is characterized in that: described stacker adopts pottery, copper material or aluminium any one material wherein to make.
CN2013200084296U 2013-01-09 2013-01-09 Large power COB-LED light source device structure with adjustable light and color Expired - Fee Related CN203038974U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013200084296U CN203038974U (en) 2013-01-09 2013-01-09 Large power COB-LED light source device structure with adjustable light and color

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013200084296U CN203038974U (en) 2013-01-09 2013-01-09 Large power COB-LED light source device structure with adjustable light and color

Publications (1)

Publication Number Publication Date
CN203038974U true CN203038974U (en) 2013-07-03

Family

ID=48691067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013200084296U Expired - Fee Related CN203038974U (en) 2013-01-09 2013-01-09 Large power COB-LED light source device structure with adjustable light and color

Country Status (1)

Country Link
CN (1) CN203038974U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130703

Termination date: 20210109

CF01 Termination of patent right due to non-payment of annual fee