CN202817024U

CN202817024U - LED packaging structure using double-layer lens

Info

Publication number: CN202817024U
Application number: CN 201220451744
Authority: CN
Inventors: 卢志荣
Original assignee: Shenzhen Haotian Optoelectronics Co ltd
Current assignee: Shenzhen Haotian Optoelectronics Co ltd
Priority date: 2012-09-06
Filing date: 2012-09-06
Publication date: 2013-03-20
Anticipated expiration: 2022-09-06

Abstract

The utility model discloses an LED packaging structure using double-layer lenses. The LED packaging structure comprises a support and an LED chip fixed in the support. The LED chip is covered by lenses. The lenses are double-layer lenses, comprising a first lens and a second lens disposed outside the first lens. A gap is reserved to fill in fluorescent glue between the first lens and the second lens. The gap is filled with the fluorescent glue to form a fluorescent layer. The LED packaging structure makes dosage of the fluorescent glue, thickness of the fluorescent layer, and shape of the fluorescent layer can be accurately controlled, and meanwhile makes fluorescent powders be far away from the LED chip. The LED packaging structure solves technical problems of large LED light attenuation, nonuniform light spots, low luminous efficiency and excitation efficiency, and color temperature is easy to deviate, etc., and improves lighting effect of LEDs and uniformity of light spots.

Description

A kind of LED encapsulating structure that uses double layer lens

Technical field

The utility model relates to the encapsulating structure of a kind of LED, specifically a kind of LED encapsulating structure that uses double layer lens.

Background technology

Light-emitting diode (Light Emitting Diode; LED) have the characteristics such as power saving, light and handy and life-span be long, the semiconductor lighting product of use LED is the environmental protection and energy saving product that present country widelys popularize, and market and application prospect are boundless.At present, the encapsulating structure of semiconductor lighting product is directly fluorescent glue to be covered on the LED chip surface, the luminous monochromatic light with not absorbed by fluorescent material of monochromatic light excitated fluorescent powder that sends by LED chip mixes and produces white light, then covers lens to improve the light extraction efficiency of LED.The temperature when but LED chip is luminous is very high, and because fluorescent material in traditional LED encapsulating structure directly overlays on the LED chip surface, the high temperature of chip causes the fluorescent material sharp-decay.On the other hand, fluorescent glue is directly to put on LED chip by the mode of a glue now, and make fluorescent glue cover LED chip, but because the mobility of colloid makes the finally shaped shape of fluorescent glue and highly is difficult to control, therefore the fluorescent coating that usually forms is irregular convex, as shown in Figure 4, fluorescent coating 100 is the thin irregular convex in thick both sides, top, so the monochromatic ability difference that fluorescent material all directions absorption chip sends is too large, caused the hot spot non-uniform phenomenon, colour temperature also is easy to occur deviation, and light extraction efficiency is limited; Also having is exactly a bit that directly point is on chip due to fluorescent material, and the area that is stimulated of fluorescent material is very little, and launching efficiency is not high.

The utility model content

Large for the LED light decay that exists in prior art, color spot is inhomogeneous, the technical problems such as deviation, light extraction efficiency and launching efficiency are low easily appear in colour temperature, the purpose of this utility model is to provide that a kind of LED of allowing product light decay diminishes, hot spot evenly, colour temperature is not easy the high LED encapsulating structure of deviation, light extraction efficiency and launching efficiency.

In order to reach above-mentioned technical purpose, the utility model uses following technical scheme:

A kind of LED encapsulating structure that uses double layer lens, comprise support and the LED chip that is fixed on the support the inside, described LED chip is covered by lens, described lens are a kind of double layer lens, described double layer lens comprises first lens and is nested with the second lens outside first lens, be reserved with the gap of filling fluorescent glue between described first lens and the second lens, fill up fluorescent glue in described gap and form fluorescence coating.

Beneficial effect: the utility model has replaced traditional fluorescent glue point on chip, then covers the encapsulating structure of lens, makes fluorescent material away from LED chip, reduced on the one hand light decay, extend the useful life of LED, increased on the other hand the area that is stimulated of fluorescent material, thereby improved its launching efficiency; With respect to traditional fluorescent glue point rubber seal assembling structure, due to size and the shape thereof of the utility model by accurate control fluorescent coating, thereby accurately control the consumption of fluorescent glue, the thickness of fluorescence coating and the shape of fluorescence coating, increased substantially the hot spot uniformity of LED, avoided " yellow circle " or " blue circle " phenomenon, make colour temperature be not easy to occur deviation, and improved the light extraction efficiency of LED.

Preferably, described the second lens bottom part ring is established an annular fixed head, evenly be provided with a plurality of locating notches on described annular fixed head, described first lens bottom protruding a plurality of and the locating clamp plate that described locating notch is complementary, described locating clamp plate are arranged on that locating notch is interior fixes first lens and the second lens position.

Preferably, the bottom of described locating clamp plate is provided with alignment pin, is provided with the location hole that is complementary with described alignment pin on described support, and described alignment pin is arranged in location hole.

Preferably, the lens body of described first lens, the second lens is the hemisphere of hollow shape, the semiellipsoid of hollow shape or the hollow body of saddle.

Preferably, the width of described fluorescence coating at 0.5mm between 2mm.

Preferably, the width of described fluorescence coating is 1.0mm or 1.5mm.

Preferably, described alignment pin is stair-stepping column.

Preferably, the refractive index of described first lens is less than the refractive index of the second lens.

Description of drawings

Fig. 1 is lens arrangement decomposing schematic representation of the present utility model.

Fig. 2 is lens assembling structure schematic diagram of the present utility model.

Fig. 3 is internal structure schematic diagram of the present utility model.

Fig. 4 is the structural representation of prior art.

Fig. 5 is STRUCTURE DECOMPOSITION schematic diagram of the present utility model.

Embodiment

For further detailed elaboration the technical solution of the utility model, be elaborated below in conjunction with embodiment and accompanying drawing.

the utility model discloses a kind of encapsulating structure that uses double-deck LED lens, Fig. 1, 2 are depicted as a kind of double-deck LED lens that use in the utility model, comprise first lens 1 and be nested with the second lens 2 outside first lens 1, the second lens 2 bottom part ring are established an annular fixed head 3, evenly be provided with locating notch 3a on annular

fixed head

3, 3b, 3c, 3d, protruding and the described locating notch 3a in first lens bottom, 3b, 3c, the locating clamp plate 4a that 3d is complementary, 4b, 4c, 4d, locating

clamp plate

4a, 4b, 4c, 4d is arranged on locating

notch

3a, 3b, 3c, in 3d, thereby locate first lens 1 and the second lens 2 fixing, locating

clamp plate

4a, 4b, 4c, be provided with alignment pin 6a on 4d, 6b, 6c, 6d, described

alignment pin

6a, 6b, 6c, 6d is stair-stepping cylinder, its first order ladder is that diameter is 3mm, height is the cylinder of 1mm, second level ladder is that diameter is 2mm, height is the cylinder of 1.5mm.

As shown in Fig. 1,5, be provided with location hole 7a, the 7b, 7c, the 7d that are complementary with described

alignment pin

6a, 6b, 6c, 6d on support 11, described

alignment pin

6a, 6b, 6c, 6d are arranged in

location hole

6a, 6b, 6c, 6d, can make the utility model accurately cover on LED chip when encapsulating and be not easy displacement by

alignment pin

6a, 6b, 6c, 6d and

location hole

7a, 7b, 7c, 7d.

The main body 10 of first lens 1, the main body 20 of the second lens 2 can take different shapes according to the luminous intensity distribution demand of reality, as being the hemisphere of hollow shape, the semiellipsoid of hollow shape or the hollow body of saddle, be the hemisphere of hollow shape as shown in Figure 1 and Figure 2.

As shown in Figure 3, after first lens 1 and the second lens 2 are fixing, in the gap between fluorescent glue injection first lens 1 and the second lens 2, form fluorescence coating 5(or first fluorescent glue be placed in the second lens 2, then first lens 1 and the second lens 2 combinations, compressing by 1 pair of the second lens 2 of when combination first lens forms phosphor powder layer 5), the width of fluorescence coating 5 at 0.5mm between 2mm, preferred 1.0mm or 1.5mm.

The utility model comprises support 11, by elargol 8, LED chip 12 is fixed on heat sink 9 in support 10, then covers above-mentioned double-deck LED lens and get final product.

As shown in Fig. 3,4, with respect to traditional fluorescent glue point rubber seal assembling structure, the utility model can directly be transferred to from original chip surface (fluorescent coating 100) the double-deck LED lens the insides (fluorescence coating 5) that the utility model uses with fluorescence coating, thereby make fluorescent material away from LED chip, reduced on the one hand light decay, extend the useful life of LED, increased on the other hand the area that is stimulated of fluorescent material, thereby improved its launching efficiency; With respect to traditional fluorescent glue point rubber seal assembling structure, because size and the shape in double-deck LED lens gap in the utility model are determined, so can accurately control thickness and the shape of fluorescent coating 5, increased substantially the hot spot uniformity of LED, avoided " yellow circle " or " blue circle " phenomenon, make colour temperature be not easy to occur deviation, and improved the light extraction efficiency of LED.

In addition, the refractive index of first lens 1 of the present utility model is less than the refractive index of the second lens 2, thereby further improved the light extraction efficiency of LED.

Above-described embodiment is the better execution mode of the utility model; but the novel execution mode of this use is not restricted to the described embodiments; anyly do not deviate from the change done under Spirit Essence of the present utility model and principle, modification, substitute, combination, simplify; all should be the substitute mode of equivalence, within being included in protection range of the present utility model.

Claims

1. LED encapsulating structure that uses double layer lens, comprise support and be fixed on the interior LED chip of support, be covered with lens on described support, described lens cover LED chip, it is characterized in that, described lens are double layer lens, and described double layer lens comprises first lens and is nested with the second lens outside first lens, be reserved with the gap of filling fluorescent glue between described first lens and the second lens, fill up fluorescent glue in described gap and form fluorescence coating.

2. a kind of LED encapsulating structure that uses double layer lens according to claim 1, it is characterized in that: described the second lens bottom part ring is provided with an annular fixed head, evenly be provided with a plurality of locating notches on described annular fixed head, described first lens bottom protruding a plurality of and the locating clamp plate that described locating notch is complementary, described locating clamp plate are arranged on that locating notch is interior fixes first lens and the second lens position.

3. a kind of LED encapsulating structure that uses double layer lens according to claim 2, it is characterized in that: the bottom of described locating clamp plate is provided with alignment pin, be provided with the location hole that is complementary with described alignment pin on described support, described alignment pin is arranged in location hole.

4. a kind of LED encapsulating structure that uses double layer lens according to claim 3, it is characterized in that: the lens body of described first lens, the second lens is the semiellipsoid of the hemisphere of hollow shape, hollow shape or the hollow body of saddle.

5. the described a kind of LED encapsulating structure that uses double layer lens of according to claim 1 to 4 any one is characterized in that: the width of described fluorescence coating at 0.5mm between 2mm.

6. a kind of LED encapsulating structure that uses double layer lens according to claim 5, it is characterized in that: the width of described fluorescence coating is 1.0mm or 1.5mm.

7. a kind of LED encapsulating structure that uses double layer lens according to claim 6, it is characterized in that: described alignment pin is stair-stepping column.

8. a kind of LED encapsulating structure that uses double layer lens according to claim 7, it is characterized in that: the refractive index of described first lens is less than the refractive index of the second lens.