CN102306698A - Novel LED packaging structure - Google Patents
Novel LED packaging structure Download PDFInfo
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- CN102306698A CN102306698A CN201110305524A CN201110305524A CN102306698A CN 102306698 A CN102306698 A CN 102306698A CN 201110305524 A CN201110305524 A CN 201110305524A CN 201110305524 A CN201110305524 A CN 201110305524A CN 102306698 A CN102306698 A CN 102306698A
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- pedestal
- encapsulating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention discloses a novel light emitting diode (LED) packaging structure. The structure comprises: a pedestal; a recessed cavity, which is formed in the pedestal; a heat sink, which is fixed in the recessed cavity; a cup bowl, which is formed on the heat sink; and an LED chip, which is fixed in the cup bowl. Besides, a pair of conductive feet are extended and are fixed in the pedestal; the LED chip is electrically connected with the conductive feet; a lens is formed on the pedestal and enables the LED chip and a part of conductive feet to be sealedly capped; and an external surface of the lens are provided with a layer of phosphor coating. According to the LED packaging structure provided in the invention, a traditional LED packaging mode is broken; a phosphor coating is directly transferred from an original chip surface to a surface of a lens, so that the phosphor coating is thoroughly far away from an LED chip and a luminous decay is substantially reduced; moreover, a shape and a thickness of the phosphor coating can be controlled accurately and an excitation area of the phosphor coating can be enlarged, so that an occurrence of a yellow ring can be avoided, a light extraction efficiency is improved and color temperatures of the phosphor coating are highly consistent.
Description
[technical field]
The present invention relates to a kind of LED structure, refer in particular to a kind of White-light LED package structure.
[background technology]
Light-emitting diode (Light Emitting Diode; LED) have power saving, light and handy and life-span and characteristic such as grow; Reached at present the target of high briliancy, multicolor and high-luminous-efficiency; Also cast more turn of the market simultaneously for consumption electronic products and related application commodity; In the flat-panel screens product; LED has become the main application market of mobile phone backlight; In future, LED will make the main shaft of development towards large scale flat-panel screens backlight, and be the target of effort with high briliancy, multicolor and high-luminous-efficiency.At present; White light-emitting diodes is to use very wide a kind of light-emitting diode at lighting field; Its monochromatic light that sends through wafer excites the luminous white light that produces of the fluorescence packaging body that is mixed with fluorescent material; The encapsulating structure of traditional white hair optical diode is the wafer surface that directly the fluorescence packaging body is covered; Fluorescent glue is aging, yellow but the heat that wafer produces in the long-term work process can make; Thereby make that the brightness decay of white hair optical diode is very fast; Especially in the structure of making great power LED; Light decay is more serious, has a strong impact on useful life.For example existing white light emitting diode generally is through directly on blue chip, covering yttrium-aluminium-garnet (YAG:Ce3+) fluorescent material; The blue light that utilizes blue chip to send is not absorbed part and is subjected to the green-yellow light of blue-light excited ejaculation to mix the formation white light with fluorescent material; Because temperature is very high during chip light emitting; The direct contact chip of fluorescent material causes fluorescent material sharply to be decayed.Fluorescent material is directly on chip in addition; The area that fluorescent material is stimulated is very little; Launching efficiency is not high; Hot spot is inhomogeneous; And the some glue of fluorescent material is owing to the flowability of colloid makes its shape and highly wayward; Such structure makes the LED colour temperature of working it out be easy to occur deviation, and light extraction efficiency is limited.
[summary of the invention]
Technical problem such as the LED light decay to existing in the prior art is fast, hot spot is inhomogeneous, colour temperature is unbalanced and light extraction efficiency is low the object of the present invention is to provide that a kind of light decay is little, hot spot good uniformity, color temperature equilibrium, Novel LED encapsulating structure that light extraction efficiency is high.
In order to reach above-mentioned technical purpose; The technical scheme that the present invention taked is a kind of Novel LED encapsulating structure; Comprise pedestal, be formed at the cavity in the pedestal; Be fixed in the cavity heat sink, be formed at the cup bowl on heat sink and be fixed on the led chip in the cup bowl; The pair of conductive pin extends and is fixed in the pedestal; Said led chip is electrically connected with said conductive feet; One lens shaped is formed on the pedestal led chip and the capping of partially conductive pin, and the outer surface of said lens is provided with the layer of fluorescent powder coating.
LED encapsulating structure of the present invention has been broken the pattern of traditional LED encapsulation; Fluorescent coating directly is transferred to the surface of lens from original chip surface; Make fluorescent coating thoroughly away from led chip; Significantly reduced light decay; And make the shape of fluorescent coating and the thickness can be precisely controlled, and can significantly promote the uniformity of hot spot, can enlarge the area that is stimulated of fluorescent coating; Improve light extraction efficiency, and make its colour temperature height consistent.Fluorescent coating of the present invention in addition directly is coated in the surface of lens, and its thickness is very little, and the baking required time is short, can significantly promote production efficiency of products, saves production cost.
Preferably, the surface of said lens is a matsurface, and the total reflection of light can be reduced in coarse surface, improves the light extraction efficiency.
Preferably, said led chip is that peak luminous wavelength is the blue chip of 430～480nm, and said fluorescent coating is that the peak wavelength that is stimulated is the yellow fluorescent powder of 550～580nm.
Preferably, said led chip is that peak luminous wavelength is the blue chip of 470nm, and said fluorescent coating is that the peak wavelength that is stimulated is the yellow fluorescent powder of 570nm.
Preferably, said led chip is that peak luminous wavelength is the blue chip of 430～480nm, and said fluorescent coating is the green emitting phosphor and the red fluorescence powder coating of mutual superposition.
Preferably, the wavelength peak that said green emitting phosphor coating is stimulated is 520～530nm, and the wavelength peak that said red fluorescence powder coating is stimulated is 610～620nm.
Preferably, said green emitting phosphor coating directly is coated on the outer surface of lens, and said red fluorescence powder coating is coated on the green emitting phosphor coating.
Preferably, also be coated with the protective layer of layer of transparent on the said red fluorescence powder coating, this protective layer has good light transmittance and corrosion proof function, has anti-UV function simultaneously, and preferred nano level macromolecule light transmissive material is made.
Preferably, the surface of said protective layer is a matsurface.
Preferably, on the said cup bowl astigmat is installed.
[description of drawings]
Shown in Figure 1 for the structural representation of pedestal of the present invention;
Shown in Figure 2 is overall structure sketch map of the present invention;
Fig. 3 is the structural representation of A-A section shown in Figure 2;
Fig. 4 is the partial structurtes enlarged diagram of B part shown in Figure 3;
Shown in Figure 5 is the structural representation of the preferred embodiment of the present invention.
Fig. 6 is the partial structurtes enlarged diagram of C part shown in Figure 5.
[embodiment]
For further detailed elaboration technical scheme of the present invention, be elaborated below in conjunction with accompanying drawing.
Like Fig. 1, Fig. 2, shown in Figure 3; A kind of Novel LED encapsulating structure; Comprise pedestal 1, be formed at the cavity 10 in the pedestal 1; Be fixed on heat sink 4, the led chip 2 that is formed at the cup bowl 40 on heat sink 4 and is fixed in the cup bowl 40 in the cavity 10; Pair of conductive pin 3a, 3b extend and are fixed in the pedestal 1; Said led chip 2 is electrically connected with said conductive feet 3a, 3b; One lens 5 are formed on the pedestal 1 led chip 2 and the capping of partially conductive pin, and the outer surface of said lens 5 is provided with layer of fluorescent powder coating 6.
LED encapsulating structure of the present invention has been broken the pattern of traditional LED encapsulation; Fluorescent coating directly is transferred to the surface of lens from original chip surface; Make fluorescent coating thoroughly away from led chip; Significantly reduced light decay; And make the shape of fluorescent coating and the thickness can be precisely controlled; Can significantly promote the uniformity of hot spot; Can enlarge the area that is stimulated of fluorescent coating; Improve light extraction efficiency; And make its colour temperature height consistent (can later stage of LED finished product in the correction of carrying out fluorescent coating, i.e. attenuate or thicken, also or add the fluorescent coating of other wave band; Change colour temperature, improve apparent the finger).Fluorescent coating of the present invention in addition directly is coated in the surface of lens, and its thickness is very little, and the baking required time is short, can significantly promote production efficiency of products, saves production cost.
The surface of lens 5 of the present invention is a matsurface 61, and the total reflection of light can be reduced in coarse surface, improves the light extraction efficiency, as shown in Figure 4.
It is the blue chip of 430～480nm that led chip 2 of the present invention can be selected peak luminous wavelength for use, and said fluorescent coating 6 is the yellow fluorescent powder of 550～580nm for the peak wavelength that is stimulated.
It is the blue chip of 470nm that led chip 2 of the present invention also can be selected peak luminous wavelength for use, and said fluorescent coating 6 is the yellow fluorescent powder of 570nm for the peak wavelength that is stimulated.
Like Fig. 5, shown in Figure 6, it is the blue chip of 430～480nm that led chip 2 of the present invention can be selected peak luminous wavelength for use, and the fluorescent coating 6 of this moment is the green emitting phosphor 63 and the red fluorescence powder coating 62 of mutual superposition.Adopt the hierarchy of mutual superposition to be convenient in the process that applies fluorescent material thickness according to actual conditions adjustment fluorescent coating.The wavelength peak that said green emitting phosphor coating 63 is stimulated is 520～530nm, and the wavelength peak that said red fluorescence powder coating 62 is stimulated is 610～620nm.Said green emitting phosphor coating 63 directly is coated on the outer surface of lens 5, and said red fluorescence powder coating 62 is coated on the green emitting phosphor coating 63.Also be coated with the protective layer 60 of layer of transparent on the said red fluorescence powder coating 62; This protective layer 60 has good light transmittance and corrosion proof function; Has anti-UV function simultaneously; Preferred nano level macromolecule light transmissive material is made; Matsurface 64 can be made in the surface of certainly said transparent protective layer 60, to improve external quantum efficiency.
The light of cup bowl 40 middle sections was very concentrated when led chip 2 was luminous; In order to make light be evenly distributed on the surface of lens; Can install an astigmat 7 additional at (between lens 5 and the led chip 2) above the chip; Astigmat 7 promptly is installed on cup bowl 4; Earlier naked core is carried out the optics luminous intensity distribution one time; Light with the part that central area light is intensive is dispersed to peripheral part; Make light be evenly distributed on the surface of lens 5; Can make led chip 2 when exciting the fluorescent coating 6 on lens 5 surfaces, the uneven hot spot of light and shade can not occur like this, improve the uniformity of hot spot.Aforesaid astigmat 7 can be selected hemispherical lens or shape of a saddle lens for use.
The above only with convenient explanation the present invention, in not breaking away from creation spirit category of the present invention, knows any simple modification and the distortion that personnel did of this technology, still belongs to protection scope of the present invention.
Claims (10)
1. Novel LED encapsulating structure; Comprise pedestal, be formed at the cavity in the pedestal; Be fixed in the cavity heat sink, be formed at the cup bowl on heat sink and be fixed on the led chip in the cup bowl; The pair of conductive pin extends and is fixed in the pedestal; Said led chip is electrically connected with said conductive feet; One lens shaped is formed on the pedestal led chip and the capping of partially conductive pin, and it is characterized in that: the outer surface of said lens is provided with the layer of fluorescent powder coating.
2. a kind of Novel LED encapsulating structure according to claim 1 is characterized in that: the surface of said lens is a matsurface.
3. a kind of Novel LED encapsulating structure according to claim 2 is characterized in that: said led chip is that peak luminous wavelength is the blue chip of 430～480nm, and said fluorescent coating is that the peak wavelength that is stimulated is the yellow fluorescent powder of 550～580nm.
4. a kind of Novel LED encapsulating structure according to claim 3 is characterized in that: said led chip is that peak luminous wavelength is the blue chip of 470nm, and said fluorescent coating is that the peak wavelength that is stimulated is the yellow fluorescent powder of 570nm.
5. a kind of Novel LED encapsulating structure according to claim 1 is characterized in that: said led chip is that peak luminous wavelength is the blue chip of 430～480nm, and said fluorescent coating is the green emitting phosphor and the red fluorescence powder coating of mutual superposition.
6. a kind of Novel LED encapsulating structure according to claim 5 is characterized in that: the wavelength peak that said green emitting phosphor coating is stimulated is 520～530nm, and the wavelength peak that said red fluorescence powder coating is stimulated is 610～620nm.
7. a kind of Novel LED encapsulating structure according to claim 6 is characterized in that: said green emitting phosphor coating directly is coated on the outer surface of lens, and said red fluorescence powder coating is coated on the green emitting phosphor coating.
8. a kind of Novel LED encapsulating structure according to claim 7 is characterized in that: the protective layer that also is coated with layer of transparent on the said red fluorescence powder coating.
9. a kind of Novel LED encapsulating structure according to claim 8 is characterized in that: the surface of said protective layer is a matsurface.
10. according to each described a kind of Novel LED encapsulating structure of claim 1 to 9, it is characterized in that: on the said cup bowl astigmat is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110305524A CN102306698A (en) | 2011-09-30 | 2011-09-30 | Novel LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110305524A CN102306698A (en) | 2011-09-30 | 2011-09-30 | Novel LED packaging structure |
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| CN102306698A true CN102306698A (en) | 2012-01-04 |
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| CN201110305524A Pending CN102306698A (en) | 2011-09-30 | 2011-09-30 | Novel LED packaging structure |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103542326A (en) * | 2013-09-30 | 2014-01-29 | 易美芯光（北京）科技有限公司 | Optical device capable of realizing high-color-gamut backlight |
| CN108400221A (en) * | 2018-04-28 | 2018-08-14 | 华南理工大学 | A kind of LED quantum dot light emittings device and its packaging method |
| CN110578912A (en) * | 2014-07-28 | 2019-12-17 | 晶元光电股份有限公司 | Light emitting assembly |
| CN110767795A (en) * | 2019-12-27 | 2020-02-07 | 华引芯（武汉）科技有限公司 | Miniature LED light-emitting device and preparation method thereof |
| CN112151657A (en) * | 2020-10-16 | 2020-12-29 | 佛山市馨园照明科技有限公司 | Packaging structure of LED lamp for sow breeding and using method thereof |
| US11165000B2 (en) | 2014-07-28 | 2021-11-02 | Epistar Corporation | Light-emitting apparatus |
Citations (5)
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|---|---|---|---|---|
| US20020079506A1 (en) * | 1997-09-01 | 2002-06-27 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
| CN1836339A (en) * | 2002-08-30 | 2006-09-20 | 吉尔科有限公司 | Light emitting diode with improved effience |
| CN101556023A (en) * | 2009-05-14 | 2009-10-14 | 上海广电光电子有限公司 | LED light source with wide-angle lens |
| CN101696790A (en) * | 2009-10-27 | 2010-04-21 | 彩虹集团公司 | High-power LED heat-dissipation packaging structure |
| CN101794856A (en) * | 2009-01-30 | 2010-08-04 | 索尼公司 | Optical element package and manufacture method thereof |
-
2011
- 2011-09-30 CN CN201110305524A patent/CN102306698A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020079506A1 (en) * | 1997-09-01 | 2002-06-27 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
| CN1836339A (en) * | 2002-08-30 | 2006-09-20 | 吉尔科有限公司 | Light emitting diode with improved effience |
| CN101794856A (en) * | 2009-01-30 | 2010-08-04 | 索尼公司 | Optical element package and manufacture method thereof |
| CN101556023A (en) * | 2009-05-14 | 2009-10-14 | 上海广电光电子有限公司 | LED light source with wide-angle lens |
| CN101696790A (en) * | 2009-10-27 | 2010-04-21 | 彩虹集团公司 | High-power LED heat-dissipation packaging structure |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103542326A (en) * | 2013-09-30 | 2014-01-29 | 易美芯光（北京）科技有限公司 | Optical device capable of realizing high-color-gamut backlight |
| CN110578912A (en) * | 2014-07-28 | 2019-12-17 | 晶元光电股份有限公司 | Light emitting assembly |
| CN110578912B (en) * | 2014-07-28 | 2021-04-06 | 晶元光电股份有限公司 | Light emitting assembly |
| US11165000B2 (en) | 2014-07-28 | 2021-11-02 | Epistar Corporation | Light-emitting apparatus |
| CN108400221A (en) * | 2018-04-28 | 2018-08-14 | 华南理工大学 | A kind of LED quantum dot light emittings device and its packaging method |
| CN110767795A (en) * | 2019-12-27 | 2020-02-07 | 华引芯（武汉）科技有限公司 | Miniature LED light-emitting device and preparation method thereof |
| CN110767795B (en) * | 2019-12-27 | 2020-05-05 | 华引芯（武汉）科技有限公司 | Miniature LED light-emitting device and preparation method thereof |
| CN112151657A (en) * | 2020-10-16 | 2020-12-29 | 佛山市馨园照明科技有限公司 | Packaging structure of LED lamp for sow breeding and using method thereof |
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Application publication date: 20120104 |