CN202721893U - 全铝基线路板和led灯带 - Google Patents
全铝基线路板和led灯带 Download PDFInfo
- Publication number
- CN202721893U CN202721893U CN2012203020380U CN201220302038U CN202721893U CN 202721893 U CN202721893 U CN 202721893U CN 2012203020380 U CN2012203020380 U CN 2012203020380U CN 201220302038 U CN201220302038 U CN 201220302038U CN 202721893 U CN202721893 U CN 202721893U
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- Prior art keywords
- circuit board
- aluminum
- layer
- based circuit
- full aluminum
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 55
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000004411 aluminium Substances 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 46
- 239000000463 material Substances 0.000 abstract description 24
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000011889 copper foil Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000928 Yellow copper Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012203020380U CN202721893U (zh) | 2012-06-26 | 2012-06-26 | 全铝基线路板和led灯带 |
Applications Claiming Priority (1)
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CN2012203020380U CN202721893U (zh) | 2012-06-26 | 2012-06-26 | 全铝基线路板和led灯带 |
Publications (1)
Publication Number | Publication Date |
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CN202721893U true CN202721893U (zh) | 2013-02-06 |
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CN2012203020380U Expired - Fee Related CN202721893U (zh) | 2012-06-26 | 2012-06-26 | 全铝基线路板和led灯带 |
Country Status (1)
Country | Link |
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CN (1) | CN202721893U (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103237410A (zh) * | 2013-05-06 | 2013-08-07 | 田茂福 | 无蚀刻铝基板及制造方法 |
CN104701443A (zh) * | 2013-12-05 | 2015-06-10 | 董挺波 | 一种适用于简单线路cob封装形式的led基板及制备方法 |
CN105407638A (zh) * | 2015-12-01 | 2016-03-16 | 杨小荣 | 一种高导热低成本柔性线路板及其生产方法 |
CN106090662A (zh) * | 2016-06-30 | 2016-11-09 | 何忠亮 | 一种具有安全保护结构的led灯及其制造方法 |
CN106287260A (zh) * | 2016-09-29 | 2017-01-04 | 东莞市善时照明科技有限公司 | Led灯线路板及led灯及消除led灯断电后微亮的应用方法 |
CN108718485A (zh) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | 一种制造细线厚铜双面fpc的半加成法技术 |
CN110505754A (zh) * | 2019-08-09 | 2019-11-26 | 珠海市沃德科技有限公司 | 一种用于led的铝基覆膜板的生产方法 |
-
2012
- 2012-06-26 CN CN2012203020380U patent/CN202721893U/zh not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103237410A (zh) * | 2013-05-06 | 2013-08-07 | 田茂福 | 无蚀刻铝基板及制造方法 |
CN104701443A (zh) * | 2013-12-05 | 2015-06-10 | 董挺波 | 一种适用于简单线路cob封装形式的led基板及制备方法 |
CN105407638A (zh) * | 2015-12-01 | 2016-03-16 | 杨小荣 | 一种高导热低成本柔性线路板及其生产方法 |
CN106090662A (zh) * | 2016-06-30 | 2016-11-09 | 何忠亮 | 一种具有安全保护结构的led灯及其制造方法 |
CN106090662B (zh) * | 2016-06-30 | 2023-01-17 | 何忠亮 | 一种具有安全保护结构的led灯及其制造方法 |
CN106287260A (zh) * | 2016-09-29 | 2017-01-04 | 东莞市善时照明科技有限公司 | Led灯线路板及led灯及消除led灯断电后微亮的应用方法 |
CN106287260B (zh) * | 2016-09-29 | 2022-08-05 | 东莞市善时照明科技有限公司 | Led灯线路板及led灯及消除led灯断电后微亮的应用方法 |
CN108718485A (zh) * | 2018-06-07 | 2018-10-30 | 珠海元盛电子科技股份有限公司 | 一种制造细线厚铜双面fpc的半加成法技术 |
CN108718485B (zh) * | 2018-06-07 | 2021-02-02 | 珠海元盛电子科技股份有限公司 | 一种制造细线厚铜双面fpc的半加成法技术 |
CN110505754A (zh) * | 2019-08-09 | 2019-11-26 | 珠海市沃德科技有限公司 | 一种用于led的铝基覆膜板的生产方法 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160126 Address after: 516269, No. three, No. 309, Longsheng Road, Dayawan, Guangdong, Huizhou Patentee after: Huizhou tandem Electronic Technology Co., Ltd. Address before: 516269 Guangdong Province, Huizhou city Huiyang District freshwater Agrocybe Folong Sha Tin Industrial Zone of Huizhou City Series Electronic Technology Co. Ltd. Patentee before: Tian Maofu |
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DD01 | Delivery of document by public notice |
Addressee: Tian Maofu Document name: Notification of Passing Examination on Formalities |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20170626 |