CN202425185U - 新型led线路板 - Google Patents
新型led线路板 Download PDFInfo
- Publication number
- CN202425185U CN202425185U CN2011202681502U CN201120268150U CN202425185U CN 202425185 U CN202425185 U CN 202425185U CN 2011202681502 U CN2011202681502 U CN 2011202681502U CN 201120268150 U CN201120268150 U CN 201120268150U CN 202425185 U CN202425185 U CN 202425185U
- Authority
- CN
- China
- Prior art keywords
- layer
- wiring board
- utility
- model
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims abstract description 105
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000002356 single layer Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 58
- 229910052759 nickel Inorganic materials 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000002161 passivation Methods 0.000 claims description 10
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 229910001021 Ferroalloy Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 33
- 239000011889 copper foil Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 14
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 abstract 3
- 238000004080 punching Methods 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010010 raising Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 18
- 230000004888 barrier function Effects 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 229910000990 Ni alloy Inorganic materials 0.000 description 7
- 241001232787 Epiphragma Species 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910000928 Yellow copper Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000006388 chemical passivation reaction Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202681502U CN202425185U (zh) | 2011-07-27 | 2011-07-27 | 新型led线路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202681502U CN202425185U (zh) | 2011-07-27 | 2011-07-27 | 新型led线路板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202425185U true CN202425185U (zh) | 2012-09-05 |
Family
ID=46749904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202681502U Expired - Fee Related CN202425185U (zh) | 2011-07-27 | 2011-07-27 | 新型led线路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202425185U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595783A (zh) * | 2011-07-27 | 2012-07-18 | 田茂福 | 新型led线路板及方法 |
WO2013097314A1 (zh) * | 2011-12-31 | 2013-07-04 | 苏州晶品光电科技有限公司 | 无电路基板led阵列光源 |
-
2011
- 2011-07-27 CN CN2011202681502U patent/CN202425185U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595783A (zh) * | 2011-07-27 | 2012-07-18 | 田茂福 | 新型led线路板及方法 |
WO2013097314A1 (zh) * | 2011-12-31 | 2013-07-04 | 苏州晶品光电科技有限公司 | 无电路基板led阵列光源 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102595783A (zh) | 新型led线路板及方法 | |
CN206100596U (zh) | 一种含多功能铝箔制成的led灯带线路板模组 | |
CN202535642U (zh) | 用多条导线制作的led单面线路板 | |
CN202721893U (zh) | 全铝基线路板和led灯带 | |
CN202697035U (zh) | 具有导电胶线路的柔性led线路板和led灯带 | |
CN201860505U (zh) | 组合型双面线路板 | |
CN102630119A (zh) | Led线路板及方法 | |
CN106413249A (zh) | 一种含多功能铝箔制成的led灯带线路板模组及制造方法 | |
CN103491706B (zh) | 高导热印制电路板的制作方法及印制电路板 | |
CN103237410A (zh) | 无蚀刻铝基板及制造方法 | |
KR20070039006A (ko) | 메탈 인쇄회로기판용 알루미늄절연기판 | |
CN203072249U (zh) | 用于安装led灯的铝基板 | |
CN202679796U (zh) | 具有涂锡焊点的柔性线路板和led灯带 | |
CN103167724B (zh) | 用四条导线制作的led双面线路板 | |
CN202425185U (zh) | 新型led线路板 | |
CN202262031U (zh) | 散热型led柔性线路板 | |
CN210225864U (zh) | 多层编织线柔性线路板 | |
CN202455644U (zh) | 用单条导线制作的串联型led单面线路板 | |
CN202535629U (zh) | 用两条导线制作的串联型led单面线路板 | |
CN202135398U (zh) | Led线路板 | |
CN102711375A (zh) | 具有改良的可焊性的柔性线路板和方法 | |
CN202799390U (zh) | 具有改良的可焊性的柔性线路板和led灯带 | |
CN102625578B (zh) | Led线路板组件 | |
CN202121857U (zh) | 一种多层柔性电路板 | |
CN201797655U (zh) | 用并置扁平导线制作的双面线路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HUIZHOUSHI CHUANLIAN TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: TIAN MAOFU Effective date: 20130218 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 516269 HUIZHOU, GUANGDONG PROVINCE TO: 516000 HUIZHOU, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130218 Address after: Sha Tian Zhen Tian tou Industrial Zone in Guangdong province Huizhou Folong 516000 District of Huiyang City Patentee after: Huizhou tandem Electronic Technology Co., Ltd. Address before: 516269 Guangdong province Huizhou city Huiyang District Huizhou Town Industrial Zone, Sha Tin Tiantou Folong Series Electronic Technology Co. Ltd. Patentee before: Tian Maofu |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20170727 |
|
CF01 | Termination of patent right due to non-payment of annual fee |