CN202713892U - 电子零件安装机 - Google Patents

电子零件安装机 Download PDF

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Publication number
CN202713892U
CN202713892U CN 201220215876 CN201220215876U CN202713892U CN 202713892 U CN202713892 U CN 202713892U CN 201220215876 CN201220215876 CN 201220215876 CN 201220215876 U CN201220215876 U CN 201220215876U CN 202713892 U CN202713892 U CN 202713892U
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CN
China
Prior art keywords
electronic component
installation region
substrate
suction nozzle
fitting machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220215876
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English (en)
Chinese (zh)
Inventor
岩城范明
滨根刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Application granted granted Critical
Publication of CN202713892U publication Critical patent/CN202713892U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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CN 201220215876 2011-05-13 2012-05-14 电子零件安装机 Expired - Fee Related CN202713892U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011108193A JP5730664B2 (ja) 2011-05-13 2011-05-13 電子部品実装機
JP2011-108193 2011-05-13

Publications (1)

Publication Number Publication Date
CN202713892U true CN202713892U (zh) 2013-01-30

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Family Applications (1)

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CN 201220215876 Expired - Fee Related CN202713892U (zh) 2011-05-13 2012-05-14 电子零件安装机

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JP (1) JP5730664B2 (ja)
CN (1) CN202713892U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105188333A (zh) * 2014-06-19 2015-12-23 亚企睦自动设备有限公司 装配装置以及装配方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6990826B2 (ja) * 2017-10-11 2022-01-12 パナソニックＩｐマネジメント株式会社 部品搭載装置
KR102436661B1 (ko) * 2017-11-02 2022-08-26 한화정밀기계 주식회사 부품 실장기용 노즐 장치
JP2022036802A (ja) * 2020-08-24 2022-03-08 ハンファ精密機械株式会社 実装ヘッド
KR102534302B1 (ko) * 2021-01-08 2023-05-19 주식회사 쎄크 플립 칩 본더

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH053223A (ja) * 1991-06-24 1993-01-08 Toshiba Corp 平行出し機構と平行出し方法及びこの平行出し機構或いは平行出し方法を用いたインナリ−ドボンデイング装置とインナリ−ドボンデイング方法
JPH11297764A (ja) * 1998-04-14 1999-10-29 Ricoh Co Ltd ボンディングツール及びそれを用いた半導体チップのボンディング方法
JP4081246B2 (ja) * 2001-04-27 2008-04-23 シーケーディ株式会社 スライダ支持機構及び倣い装置
JP3780214B2 (ja) * 2002-01-25 2006-05-31 キヤノン株式会社 Ｉｃの加圧圧着方法
JP2003297879A (ja) * 2002-04-03 2003-10-17 Sony Corp 半導体チップ圧着装置
JP4367669B2 (ja) * 2008-04-01 2009-11-18 株式会社アドウェルズ 保持装置
JP5417655B2 (ja) * 2008-12-16 2014-02-19 株式会社アドウェルズ 傾き調整方法および傾き調整装置並びにその傾き調整方法において調整されるデバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105188333A (zh) * 2014-06-19 2015-12-23 亚企睦自动设备有限公司 装配装置以及装配方法

Also Published As

Publication number Publication date
JP2012238791A (ja) 2012-12-06
JP5730664B2 (ja) 2015-06-10

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Aichi Japan vertical city

Patentee after: Fuji Corporation

Address before: Aichi Japan vertical city

Patentee before: Fuji Machinery Manufacturing Co., Ltd.

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130130

Termination date: 20190514

CF01 Termination of patent right due to non-payment of annual fee