CN202712255U

CN202712255U - Patch led

Info

Publication number: CN202712255U
Application number: CN 201220234797
Authority: CN
Inventors: 李海涛; 李海浪
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-05-23
Filing date: 2012-05-23
Publication date: 2013-01-30
Anticipated expiration: 2022-05-23

Abstract

The utility model provides a patch LED which comprises metallic conduction pins, insulation plastics, an LED chip and an LED chip protection glue. The insulation plastics are thermosetting resins. The insulation plastics are fixed on the upper and lower side of a metallic conduction pin and gaps between metallic conduction pins by injection molding. An upper accommodation concave cavity is arranged in the insulation plastic at the upper side of the metallic conduction pin. A lower accommodation concave cavity is arranged in the insulation plastic at the lower side of the metallic conduction pin. The metallic conduction pin is exposed at the bottom of the upper accommodation concave cavity. The bent metallic conduction pin coats the outside of the insulation plastic at the lower side of the metallic conduction pin. The LED chip is fixed on the metallic conduction pin in the upper accommodation concave cavity. An electrode point of the LED chip and an electrode point of the corresponding metallic conduction pin are connected through wire bonding. An LED chip protection glue is arranged in the space between the outside of the LED chip and the upper accommodation concave cavity. According to the utility model, the patch LED has great thermal stability and effectively avoids the phenomenon of broken circuit when an LED works in high temperature.

Description

Paster LED

Technical field

The utility model relates to the LED field, specifically, relates to a kind of paster LED.

Background technology

The insulation plastic cement of existing paster LED bracket is selected the PPA plastic cement, and its characteristic is thermoplasticity, and it is moulding to carry out heating for multiple times to it.But the glass transition temperature of PPA plastic cement be generally less than 90 degrees centigrade (℃); in case the PPA plastic cement near 90 degrees centigrade (℃) outdoor hot environment in work; its coefficient of linear expansion can be multiplied; and the glass transition temperature of the LED wafer protection glue in the finished product LED cavity generally is higher than 135 degree; last result often both coefficient of expansion is asynchronous; the swelling internal stress of insulation plastic cement can promote the LED wafer protection glue in the cavity; LED wafer protection glue is finally separated with the binding site of PPA plastic cement; and break the wire that connects between LED electrode and the metallic conduction pin; also can cause the problem of LED inner inlet corrosion, the one by one inefficacy that LED can be slowly.

The utility model content

The technical problems to be solved in the utility model is, the deficiency for existing LED exists provides a kind of paster LED, the paster LED internal break that its plastic cement that can effectively prevent from insulating causes because of high-temperature expansion.

For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of paster LED, comprise metallic conduction pin, insulation plastic cement, LED wafer, LED wafer protection glue, wherein said insulation plastic cement is thermosetting resin, described insulation plastic cement is fixed on described metallic conduction pin up and down in the slit between both sides and the metallic conduction pin by injection moulding, have in the insulation plastic cement of described metallic conduction pin upside and hold cavity, have down in the insulation plastic cement of described metallic conduction underfooting side and hold cavity; On hold that cavity bottom is exposed a metallic conduction pin; the insulation plastic cement that is coated on its downside after the metallic conduction pin bending in the described insulation plastic cement outside is peripheral; described LED wafer is fixed on the metallic conduction pin that holds in the cavity; the electrode points of LED wafer is communicated with by wire bonds with electrode points on the corresponding metallic conduction pin, described LED wafer peripheral and on hold in the space between the cavity and be provided with LED wafer protection glue.

As a kind of preferred version, hold being provided with the filling colloid in the cavity under described.

As a kind of preferred version, described filling colloid is resin, silicones or silica gel.

As a kind of preferred version, described LED wafer protection glue is resin, silicones or silica gel.

As a kind of preferred version, also be provided with the filler for diffused light source in the described LED wafer protection glue.

Implement paster LED of the present utility model, have following beneficial effect: the insulation plastic cement of paster LED bracket adopts the higher thermosetting resin of glass transition temperature, the characteristics of its thermosetting resin are that curing time is short, good fluidity during thermosetting, this thermosetting resin is can only one-time heating moulding, and the later stage can't heat moulding to it again.Characteristic for its good fluidity, can not be according to existing paster LED bracket production procedure operation construction, why in the insulation plastic cement, two cavitys are set, be to go to the metallic conduction pin surface that holds in the cavity for the plastic cement that insulate prevents colloid during injection moulding under condition of high voltage, cause bonding wire bad when affecting back segment LED wafer welding lead.The insulation plastic cement is selected thermosetting resin; LED wafer protection glue in the cavity of finished product LED also is thermosetting resin in addition; so it is more firm closely that two kinds of plastic cement are all the molecule link between the two of resin system material, the LED that makes with this material can obtain better heatproof, water-fast, decay resistance.Paster LED of the present utility model can use failsafe for a long time under higher outdoor environment temperature, also extensiblely be applied to outdoor LED display screen, engineering illumination etc., and therefore the scope of application of the present utility model is wider.

Overall structure advantages of simple of the present utility model, economical with materials, Effective Raise production efficiency, the LED light display is shown satisfactory for result, brightness is high, and the visual angle is evenly broad, and resistance to elevated temperatures is superior, it is relatively low to decay, and long working life has truly been realized the Surface Mount LED for outdoor LED display screen.

Description of drawings

The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:

Fig. 1 is the profile of paster LED.

Among the figure, 1, the insulation plastic cement; 2, hold cavity on; 3, metallic conduction pin; 4, hold down cavity; 5, LED wafer; 6, wire; 7, wafer protection glue; 8, fill colloid; 9, die bond colloid.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with embodiment and accompanying drawing, the utility model is further described.

For sake of convenience, direction described in the literary composition is consistent with direction among the figure, but this direction is not construed as limiting structure of the present utility model.

As can be seen from Figure 1, paster LED of the present utility model comprises at least two metallic conduction pin 3, on hold on the metallic conduction pin 3 in the cavity 2 and be fixed with at least one LEDs wafer 5, this LED wafer 5 can be fixed therein on the metallic conduction pin 3 of a side, also can be fixed on the two metallic conduction pin 3.This LED wafer 5 can be fixing by die bond colloid 9, also can adopt other usual manners to fix, and the electrode points of LED wafer 5 is passed through wire 6 connection electric attributes with corresponding metallic conduction pin 3.All be provided with insulation plastic cement 1 by the injection moulding mode in the upper and lower both sides of metallic conduction pin 3 and the engraved structure space between the metallic conduction pin 3, this insulation plastic cement 1 is thermosetting resin, leave in the insulation plastic cement 1 of metallic conduction pin 3 upsides and hold cavity 2, leave down in the insulation plastic cement 1 of metallic conduction pin 3 downsides and hold cavity 4.On hold and be filled with LED wafer protection glue 7 in the cavity 2, this LED wafer protection glue 7 can be resin, silicones, silica gel, also can add the filler (not shown) that is used for diffused light source in colloid.Under hold cavity 4 and can fill colloid 8, to improve integrally-built compactness and strong degree, guarantee the service behaviour of this LED when high temperature, this fills colloid 8 can be resin, silicones, silica gel.Paster LED insulation plastic cement 1 of the present utility model is selected heat cured resin, is characterized in that curing time short, good fluidity during thermosetting.Simultaneously; thermosetting resin is compared with PPA plastic cement commonly used; its glass transition temperature exceeds a lot, is unlikely to so that the plastic cement 1 that insulate separates with the binding site of wafer protection glue 7 when temperature raises in the paster LED use procedure, prevents that effectively the internal circuit of LED is because intaking or opening circuit and damage.The metallic conduction pin 3 of insulation plastic cement 1 outer end is bending shape, make on its at least part of insulation plastic cement 1 that is coated on metallic conduction pin 3 downsides, metallic conduction pin 3 shown in the figure is coated on the outside of insulation plastic cement 1, and metallic conduction pin 3 downsides all bend inwards in opposite directions.Like this, the compactedness that can improve also is beneficial to installation.

More than show and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims

1. paster LED, comprise metallic conduction pin, insulation plastic cement, LED wafer, LED wafer protection glue, it is characterized in that: described insulation plastic cement is thermosetting resin, described insulation plastic cement is fixed on described metallic conduction pin up and down in the slit between both sides and the metallic conduction pin by injection moulding, have in the insulation plastic cement of described metallic conduction pin upside and hold cavity, have down in the insulation plastic cement of described metallic conduction underfooting side and hold cavity; On hold that cavity bottom is exposed a metallic conduction pin; the insulation plastic cement that is coated on its downside after the metallic conduction pin bending in the described insulation plastic cement outside is peripheral; described LED wafer is fixed on the metallic conduction pin that holds in the cavity; the electrode points of LED wafer is communicated with by wire bonds with electrode points on the corresponding metallic conduction pin, described LED wafer peripheral and on hold in the space between the cavity and be provided with LED wafer protection glue.

2. paster LED as claimed in claim 1 is characterized in that, holds being provided with the filling colloid in the cavity under described.

3. paster LED as claimed in claim 2 is characterized in that, described filling colloid is resin, silicones or silica gel.

4. such as each described paster LED in the claims 1 to 3, it is characterized in that: described LED wafer protection glue is resin, silicones or silica gel.