CN105402696A - LED power source, filling glue and encapsulating technique for filling glue - Google Patents
LED power source, filling glue and encapsulating technique for filling glue Download PDFInfo
- Publication number
- CN105402696A CN105402696A CN201510796171.4A CN201510796171A CN105402696A CN 105402696 A CN105402696 A CN 105402696A CN 201510796171 A CN201510796171 A CN 201510796171A CN 105402696 A CN105402696 A CN 105402696A
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- China
- Prior art keywords
- glue
- filling glue
- power source
- power
- led power
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/023—Power supplies in a casing
Abstract
The invention relates to the field of design and manufacturing techniques of LED power sources and particularly discloses an LED power source. The LED power source comprises a power source shell, end covers, a power source assembly and filling glue. The two ends of the power source shell are covered with the end covers respectively. The power source assembly is arranged inside the power source shell, and the power source shell is filled with the filling glue. By the adoption of the technical scheme, the power source shell can be filled with the filling glue with a low expansion coefficient, the combined portion of the power source shell is prevented from being squeezed, and the waterproof performance is maintained; meanwhile, the power source assembly is protected against squeeze damage, the service life is prolonged, the filling glue is equivalent to diluted heat conductive potting adhesive, and the production cost is reduced.
Description
Technical field
The present invention relates to LED power design and manufacturing process field thereof, particularly a kind of LED power, filling glue and dosing technology thereof.
Background technology
In order to respond the call that national energy-saving reduces discharging, more energy-conservation LED illumination product progressively instead of the general lighting product of conventional high-power, easy loss, and LED illumination product is widely used in different places and environment.LED illumination product mainly comprises LED lamp and its driving power.Wherein, outdoor lighting is one of classification of LED illumination product.Just because of the complexity of outdoor environment, require higher to the waterproof of LED power and heat dispersion, and in order to the waterproof that improves LED illumination product and heat dispersion, the way of existing most of producer is when production LED power, heat conduction casting glue is poured in LED power housing, utilize heat conduction casting glue be tightly connected install gap, to reach the effect of waterproof and heat radiation.But there is following defect in existing LED power manufacturing process:
1, LED power can produce high temperature when the work of energising, and the coefficient of expansion of heat conduction casting glue own is larger, the inner high temperature produced easily makes heat conduction casting glue expand, the heat conduction casting glue expanded easily produces extruding to the binding site of power shell, binding site is caused to occur gap, finally make water resistance be destroyed, the stress that produced problem also has heat conduction casting glue to produce when expanding simultaneously has the power supply module of certain probability to power source internal to cause crush injury, causes the damage of LED power.The heat conduction casting glue cost of embedding is also quite expensive.
2, heat conduction casting glue cost is higher, causes LED power production cost high.
Summary of the invention
The embodiment of the present invention first goal of the invention is to provide a kind of LED power, apply this technical scheme to fill with more low-expansion filling glue, avoid the extruding of the binding site to power shell, keep water resistance, avoid the crush injury to power supply module simultaneously, improve service life, fill glue and be equal to and dilute heat conduction casting glue, reduce production cost.
The embodiment of the present invention second goal of the invention is the filling glue providing a kind of LED power, apply the thermal expansion coefficients that this technical scheme can reduce colloid, LED power is filled with this filling glue, avoid the extruding of the binding site to power shell, keep water resistance, avoid, to the crush injury of power supply module, improve service life simultaneously, fill glue to be equal to and to dilute heat conduction casting glue, reduce production cost.
The embodiment of the present invention the 3rd goal of the invention is the dosing technology providing a kind of LED power, apply this technical scheme and can fill LED power with more low-expansion filling glue, avoid the extruding of the binding site to power shell, keep water resistance, avoid the crush injury to power supply module simultaneously, improve service life, fill glue and be equal to and dilute heat conduction casting glue, reduce production cost.
In order to realize foregoing invention object, complete skill scheme of the present invention is:
A kind of LED power, comprises power shell, end cap, power supply module and fills glue; The two ends of described power shell are covered with described end cap respectively, be provided with described power supply module and be filled with described filling glue in the inside of described power shell.
A filling glue for above-mentioned LED power, comprises filler and heat conduction casting glue; The component ratio that described filler accounts for is 20% ~ 80%.
Preferably, described filler is any one or a few in quartz sand, bead, ceramic sand.
Preferably, described heat conduction casting glue is any one or a few in silica gel, polyurethane, epoxy resin.
A dosing technology for above-mentioned LED power and filling glue, step is
101, use potting fixture to account for the component ratio of 20% ~ 80% according to filler, filler and heat conduction casting glue mix and blend are made filling glue;
102, put into power shell inside after power supply module being carried out preheating dehumidifying, and the end cap of one end is covered;
103, use the encapsulating head of adhesive injection device that described filling glue is poured into power shell inside, and cover the end cap of the other end, obtain LED power semi-finished product;
104, described LED power semi-finished product being positioned on bumper vibrations fills after glue is evenly distributed to inner, is placed to fill adhesive curing and make LED power finished product.
Therefore, application the present embodiment technical scheme, make a kind of filling glue completely newly and substitute original heat conduction casting glue, the thermal expansion coefficients of filling glue is lower, when being filled into LED power and being inner, fill glue not easily to expand, avoid the situation of the binding site extruding power shell and end cap to occur, maintain water resistance, avoid the damage to power supply module simultaneously, improve service life, decrease the ratio of heat conduction casting glue, production cost is lower.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The LED power structural representation that Fig. 1 provides for the embodiment of the present invention 1;
The encapsulating schematic diagram that Fig. 2 provides for the embodiment of the present invention 1;
The scheme of installation that Fig. 3 provides for the embodiment of the present invention 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
embodiment 1:
As shown in Figure 1, the present embodiment provides a kind of LED power, comprises power shell 2, end cap 1, power supply module 3 and fills glue 4; The two ends of this power shell 2 are covered with end cap 1 respectively, are provided with above-mentioned power supply module 3 and are filled with to fill glue 4 in the inside of power shell 2.
Wherein, fill glue and comprise filler and heat conduction casting glue; The component ratio that filler accounts for is 20% ~ 80%.Filler can be any one or a few the combination in quartz sand, bead, ceramic sand.Heat conduction casting glue can be any one or a few combination in silica gel, polyurethane, epoxy resin.
For above-mentioned LED power manufacture need to provide and fill the dosing technology of glue, as shown in Figures 2 and 3, and there are following steps:
Step 101, use potting fixture account for the component ratio of 20% ~ 80% according to filler, filler and heat conduction casting glue mix and blend are made filling glue;
Step 102, power supply module is carried out preheating dehumidifying after to put into power shell 2 inner, and the end cap of one end to be covered; Wherein the one end being covered with end cap is fixed on fixture 5;
Filling glue 4 is poured into power shell 2 inside by the encapsulating head 6 of step 103, use adhesive injection device, and covers the end cap 1 of the other end, obtains LED power semi-finished product; Wherein end cap 1 utilizes screw 7 to fix.
Step 104, LED power semi-finished product to be positioned on bumper vibrations and to fill after glue is evenly distributed to inner, be placed to and fill adhesive curing and make LED power finished product.
The LED power that method provided by the invention is made, technique is simple, production efficiency is high, fill glue have high temperature resistant, corrosion-resistant, the thermal coefficient of expansion that is heated is little, insulation, cheap, the advantages such as premium properties, while maintenance LED power water proofing property, improve service life, significantly reduce costs, improve power quality.
Above-described embodiment, does not form the restriction to this technical scheme protection domain.The amendment done within any spirit at above-mentioned embodiment and principle, equivalently to replace and improvement etc., within the protection domain that all should be included in this technical scheme.
Claims (5)
1. a LED power, is characterized in that:
Comprise power shell, end cap, power supply module and fill glue;
The two ends of described power shell are covered with described end cap respectively, be provided with described power supply module and be filled with described filling glue in the inside of described power shell.
2. a filling glue for LED power as claimed in claim 1, is characterized in that:
Comprise filler and heat conduction casting glue;
The component ratio that described filler accounts for is 20% ~ 80%.
3. the filling glue of a kind of LED power according to claim 2, is characterized in that:
Described filler is any one or a few in quartz sand, bead, ceramic sand.
4. the filling glue of a kind of LED power according to claim 3, is characterized in that:
Described heat conduction casting glue is any one or a few in silica gel, polyurethane, epoxy resin.
5. a dosing technology for the LED power according to claim 1 and 2 and filling glue, is characterized in that:
Step is
101, use potting fixture to account for the component ratio of 20% ~ 80% according to filler, filler and heat conduction casting glue mix and blend are made filling glue;
102, put into power shell inside after power supply module being carried out preheating dehumidifying, and the end cap of one end is covered;
103, use the encapsulating head of adhesive injection device that described filling glue is poured into power shell inside, and cover the end cap of the other end, obtain LED power semi-finished product;
104, described LED power semi-finished product being positioned on bumper vibrations fills after glue is evenly distributed to inner, is placed to fill adhesive curing and make LED power finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510796171.4A CN105402696A (en) | 2015-11-18 | 2015-11-18 | LED power source, filling glue and encapsulating technique for filling glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510796171.4A CN105402696A (en) | 2015-11-18 | 2015-11-18 | LED power source, filling glue and encapsulating technique for filling glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105402696A true CN105402696A (en) | 2016-03-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510796171.4A Pending CN105402696A (en) | 2015-11-18 | 2015-11-18 | LED power source, filling glue and encapsulating technique for filling glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105402696A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051640A (en) * | 2016-06-24 | 2016-10-26 | 安庆市奥立德光电有限公司 | LED power source and packaging technology for filler of LED power source |
| CN106131997A (en) * | 2016-06-24 | 2016-11-16 | 安庆市奥立德光电有限公司 | A kind of LED power anti-intumescent filler material |
| CN106824727A (en) * | 2016-12-30 | 2017-06-13 | 合肥华耀电子工业有限公司 | The pouring adhesive process method and power supply of a kind of power supply casting glue |
| CN107484370A (en) * | 2017-08-23 | 2017-12-15 | 惠州市华阳光电技术有限公司 | A kind of type of respiration waterproof power supply architecture |
| CN113133233A (en) * | 2020-01-15 | 2021-07-16 | 浙江盘毂动力科技有限公司 | Insulated heat-conducting encapsulated electrical element and encapsulating method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1177190A (en) * | 1996-09-16 | 1998-03-25 | 顾家华 | Yoke coils impregnating and potting compound, and the process thereof |
| CN1428850A (en) * | 2001-12-24 | 2003-07-09 | Abb研究有限公司 | Semiconductor module and mfg. method thereof |
| CN1914129A (en) * | 2004-01-30 | 2007-02-14 | 日本山村硝子株式会社 | Sealing composition |
| CN202475995U (en) * | 2011-11-24 | 2012-10-03 | 深圳桑达百利电器有限公司 | Split type outdoor LED power supply casing |
| CN203136392U (en) * | 2012-12-04 | 2013-08-14 | 茂硕电源科技股份有限公司 | Sealed power source for LED |
-
2015
- 2015-11-18 CN CN201510796171.4A patent/CN105402696A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1177190A (en) * | 1996-09-16 | 1998-03-25 | 顾家华 | Yoke coils impregnating and potting compound, and the process thereof |
| CN1428850A (en) * | 2001-12-24 | 2003-07-09 | Abb研究有限公司 | Semiconductor module and mfg. method thereof |
| CN1914129A (en) * | 2004-01-30 | 2007-02-14 | 日本山村硝子株式会社 | Sealing composition |
| CN202475995U (en) * | 2011-11-24 | 2012-10-03 | 深圳桑达百利电器有限公司 | Split type outdoor LED power supply casing |
| CN203136392U (en) * | 2012-12-04 | 2013-08-14 | 茂硕电源科技股份有限公司 | Sealed power source for LED |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106051640A (en) * | 2016-06-24 | 2016-10-26 | 安庆市奥立德光电有限公司 | LED power source and packaging technology for filler of LED power source |
| CN106131997A (en) * | 2016-06-24 | 2016-11-16 | 安庆市奥立德光电有限公司 | A kind of LED power anti-intumescent filler material |
| CN106824727A (en) * | 2016-12-30 | 2017-06-13 | 合肥华耀电子工业有限公司 | The pouring adhesive process method and power supply of a kind of power supply casting glue |
| CN107484370A (en) * | 2017-08-23 | 2017-12-15 | 惠州市华阳光电技术有限公司 | A kind of type of respiration waterproof power supply architecture |
| CN113133233A (en) * | 2020-01-15 | 2021-07-16 | 浙江盘毂动力科技有限公司 | Insulated heat-conducting encapsulated electrical element and encapsulating method thereof |
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Application publication date: 20160316 |
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