CN1177190A - Yoke coils impregnating and potting compound, and the process thereof - Google Patents

Abstract

The matrix of material is formed by mxing in groups and solidfying dimethyl siloxane and methyl hydric siloxane with about ten kinds of mixed additive (quatz sand etc), surface processing agent and catalytic agent together. The solidifying and forming technology are as follows: to fill the surround of pouring-sealing workpiece in model with quatz sand by vibrating and seal the model, then to evacuate and preheat, to pour N groups of mixture into the model, then to evacuate and preheat, to pour N groups of mixture into the model, to discharge vacuum and vibrate continuously. The mixture expands when temp. raises to flow flat temp. region, the mixture is vulcanized and coagulated on jelling temp. region, the mixture, workpiece and quatz sand are solidified to one object on solidifying temp. region. To open the model when temp. reduced to one object on solidifying temp. region. To open the model when temp. reduced to 80 to deg. C. It is used in aviation, nuclear power, subway device and..

Description

A kind of yoke coil dipping Embedding Material and technology thereof

The present invention relates to a kind of Embedding Material and technology thereof, relate in particular to a kind of solvent-less organosilicon resin Embedding Material and manufacturing process thereof.

At first begun organosilicon manufacture method and performance study with former Soviet Union chemist An Deli Arnold husband in nineteen thirty-five, nineteen thirty-nine has been made various organic siliconresins.Then in the U.S., but successively produce organosilicon in Japan.The organosilicon brand has kind more than 3,000 in the world at present, and formal product has more than 500.There are more than ten of Shanghai Resin Factory, Jilin Chemical Industry Company in domestic production producer, and producing organosilicon has more than 60.

Organosilicon is with its remarkable high-and low-temperature resistance, excellent electric insulation, and a series of excellent properties such as outstanding waterproof and dampproof property and good weather resisteant and physiology inert extremely are widely used in war industry and civilian industry.But because organosilyl intermolecular interaction is little, therefore, its mechanical strength is lower, often according to the purposes difference, improves its mechanical strength by various modifications in the practical application.

Organosilicon divides four classes usually: 1, silicone oil; 2, silicones; 3, silicon rubber; 4, silane coupler.

Wherein the silicones classification by use has: dipping with, varnished glass cloth with, micarex with, mold pressing with, laminated sheet with, color painting wire with, cover with, ablate and use.

At present, there are two kinds as embedding with the silicones moulded plastic.A kind of is the solvent-free organic silicon moulded plastic, be by Chinese Academy of Sciences chemistry succeeded in developing in 1973, go into operation by two subsidiary factories of morning twilight chemical research institute, its technology path is: quantitative diphenyl dichlorosilane, methylchlorosilane, dimethylchlorosilane mixture slowly are added drop-wise in the hydrolysis kettle that water and toluene are housed, and the liquid temperature control is about 30 ℃.After dripping, continue to stir 30min, standing demix is removed the sour water layer, and oil reservoir is washed with water to neutrality, and further polycondensation becomes solvent-free solid, shaped resin then.Add a certain amount of filler again, as white carbon, silica flour, mica powder, glass fibre etc., catalyst and other additives, through mixing, roll sheet, make the solvent-free organic silicon moulded plastic.Condition of moulding: temperature is at 160～180 ℃, pressure 1Mpa～10Mpa, 2min～5min curing molding.Its purposes is: be used for encapsulating electronic components, semiconductor transistor, integrated circuit etc. also can be used for the encapsulation of resistor, capacitor, high voltage silicon stack and silicon controlled rectifier.

Another kind is the organosilicon moulded plastic, in nineteen sixty Beijing Chemical Research Institute's development, to go into operation in Shanghai Resin Factory, its technology path is: with the mold pressing silicones is basic pattern, add fillers such as an amount of asbestos, silica flour, white carbon, form moulded plastic through mixed pressure, pulverizing.Condition of moulding: 125～150 ℃ of mold temperatures, briquetting pressure 12Mpa～16Mpa, press time 5min～20min.This material applications; Be used for rocket, aerospace, aircraft manufacturing, radio, electronics and other industry.

Above-mentioned two kinds of organosilicon moulded plastics, though can be widely used in various industrial circles, because the defective of organosilyl material itself usually could improve its mechanical strength by various modifications.

The purpose of this invention is to provide a kind of Embedding Material that floods usefulness, this material, its basis material is cheap, and it is low to mix the requirement of enhancing filling additive, and the composition of Embedding Material is controlled easily, stable performance, thereby embedding steady quality.

Another object of the present invention provides a kind of process of producing this Embedding Material, the process that is proposed, and its method is simple, and equipment investment is little, and properties of product are stable, can satisfy multiple occasion needs.

The dipping Embedding Material of the present invention's design, with ethenyl blocking dimethyl siloxane and methyl silane containing hydrogen is basis material, mixed ten kinds of filling additive such as magnesium hydroxide, mica powder, quartz sands etc., and be equipped with surface conditioning agent, catalyst, grouping according to a certain ratio mixes, and is cured moulding again.

The cure process technology that the present invention proposes comprises that coil goes into mould and fix, and irritates the sand vibratory compaction, the dehumidifying of preliminary drying vacuum, and the vibration dipping, pre-thermal vibration levelling, normal temperature intensification gel, normal pressure heat up and solidify cooling and demolding.

Below in conjunction with accompanying drawing and exemplary embodiments Embedding Material of the present invention and process thereof are described further.

Fig. 1 is the Embedding Material process chart.

The Main Ingredients and Appearance of dipping Embedding Material:

1, basis material: a, ethenyl blocking dimethyl siloxane; B, methyl hydrogen-containing siloxane.

2, mix enhancing and fill additive, have ten kinds, its title and particle size are:

A, magnesium hydroxide 40～80 μ m; B, mica powder 10～80 μ m; C, solid glass micro-bead 10～100 μ m; D, boron nitride 40～80 μ m; E, silica 40～80 μ m; F, magnesium oxide 40～80 μ m; G, aluminium oxide 30～120 μ m; H, zinc oxide 20～100 μ m; I, beryllium oxide 10～100 μ m; J, quartz sand 20～100 μ m.

3, filling surface needs to handle with inorganic agent, and its inorganic agent is: (1) silane coupler; (2) titanate coupling agent; (3) nitrogen silane coupler repeatedly.

4, catalyst is a platinum chloric acid complex compound.

With basis material, additive, inorganic agent, catalyst, mix by proportioning: 1a: 1b: 2a: 2b: 2c: 2d: 2e: 2f: 2g: 2h: 2i: 2j: 4=(0.7～1.2): (0.09～0.53): (0.1～0.25): (0.1～0.5): (0.1～0.5): (0.1～0.5): (0.1～0.5): (0.1～0.25): (0.1～0.5): (0.1～0.5): (0.1～0.5): (0.75～1.57): (0.02～0.13).

Above-mentioned 1a refers to a of basis material, b, a that 2a refers to additive package, the b that 2b refers to additive package that 1b refers to basis material ..., 4 refer to catalyst.

Here said additive need carry out surface treatment earlier.Magnesium hydroxide is handled with the chelating type titanate coupling agent.Mica powder azide silane coupling agent treatment.Quartz sand is handled with silane coupler.Other fillers are all handled with silane coupler.

The sealing of quartz sand after the surface treatment is stored, stand-by as the M component.Will be through all the other fillers after the surface treatment and the rare basic end-blocking dimethyl siloxane of second, methyl hydrogen-containing siloxane and platinum chloric acid complex compound mix.In mixed process, notice that the heat of mixture distributes and temperature control, and make mixture remain on temperature less than below 40 ℃, after mixing, stand-by as the N component.

Finish above-mentioned material proportioning and after treatment, the preparation of two components of Embedding Material is finished.

In the cure process technology of design, undertaken by the described method step of Fig. 1: flow process among Fig. 1 [1] is gone into mould for coil and is fixed; [2] for irritating the sand vibratory compaction; [3] be the dehumidifying of preliminary drying vacuum; [4] be vacuum vibration dipping; [5] be normal pressure vibration dipping; [6] be pre-thermal vibration levelling; [7] be normal pressure intensification gel; [8] for heating up, normal pressure solidifies; [9] be cooling and demolding.

Be described in detail as follows: [1] so-called coil is gone into mould and is fixed, and exactly the embedding workpiece is inserted the die for special purpose internal fixation.[2] for being that quartz sand after the surface treatment injects in the mould with the M component, irritate sand with method for oscillating and enrich, the matched moulds sealing.[3] be the preliminary drying mould, workpiece and quartz sand, and moisture, impurity and air are discharged mould with vacuum pumping method.[4] so-called vacuum vibration dipping, remain in ambient temperature and mold temperature exactly≤40 ℃, and make and keep vacuum state in the mould, the N component mixture is injected mould inside, quartz sand and dipping workpiece to embedding flood infiltration, and, make mixture to permeating in workpiece and the quartz sand space with the vibration of mountain peak method of slight.[5] so-called normal pressure vibration dipping unloads vacuum exactly, keeps mold temperature and ambient temperature all at≤40 ℃, under the atmospheric pressure of vacuum with about 0.1Mpa, continues vibration in the relative mould of normal pressure.After waiting to enrich, stop to inject N group mixture.[6] so-called pre-thermal vibration levelling is exactly under above-mentioned state, and pre-heating temperature elevation is to the levelling warm area, mixture expanded by heating levelling, and accelerate the interior levelling of die cavity with vibration.[7] so-called normal pressure intensification gel is exactly under aforesaid state, is warming up to the gel warm area, makes workpiece, quartz sand layer and mixture in the mould slowly vulcanize gel equably.[8] the so-called intensification solidified, and is exactly under atmospheric pressure state, is warming up to the curing warm area, makes the above-mentioned material of sulfuration gel be cured as one lentamente.[9] so-called cooling and demolding is stopping heating die sinking when allowing it naturally cool to 80 ℃～60 ℃ exactly, takes out the goods of dipping embedding moulding.Through after above-mentioned nine steps, whole technical process promptly comes to an end.

This dipping Embedding Material divides two components (being M component and N component), and cost of material is lower, and manufacturing process is easy, storing condition tolerance, and dipping and embedding can one-step solidification mouldings.Integral rigidity is good after the moulding, and internal stress distribution is even.Can in-70 ℃～250 ℃ temperature environments, use for a long time.Be characterized in: molding shrinkage is little, and radiation hardness is corrosion-resistant, electric property and mechanical strength height, and quality is solid or the like.Can be applicable to the fields such as motor of aviation, nuclear power, subway equipment, large-size machine and the above class of insulation of H level, it is bigger particularly to adapt to goods, and negligible amounts needs the parts of embedding, dipping to make occasion.

The critical piece of technological equipment is: mould, vacuum pump, vibration machine, baking oven, compound storage tank etc.

Claims (4)

1, a kind of dipping Embedding Material, it is characterized in that: its Main Ingredients and Appearance comprises basis material, filler additive, surface conditioning agent, catalyst, described basis material is rare basic end-blocking dimethyl siloxane of second and methyl hydrogen-containing siloxane, described filler additive has magnesium hydroxide, mica powder, quartz sand and a small amount of other additives, and after the affine processing in surface and catalyst mix curing molding then together by proportioning with basis material.

2, dipping Embedding Material according to claim 1 is characterized in that, filler additive and particle size range thereof are: a, magnesium hydroxide 40～80 μ m; B, mica powder 10～80 μ m; C, solid glass micro-bead 10～100 μ m; D, boron nitride 40～80 μ m; E, silica 40～80 μ m; F, magnesium oxide 40～80 μ m; G, aluminium oxide 30～120 μ m; H, zinc oxide 20～100 μ m; I, beryllium oxide 10～100 μ m; J, quartz sand 20～100 μ m mix by following proportioning: 1a: 1b: 2a: 2b: 2c: 2d: 2e: 2f: 2g: 2h: 2i: 2j: 4=(0.7～1.2): (0.09～0.53): (0.1～0.25): (0.1～0.5): (0.1～0.5): (0.1～0.5): (0.1～0.5): (0.1～0.25): (0.1～0.5): (0.1～0.5): (0.1～0.5): (0.75～1.57): (0.02～0.13).

3, dipping Embedding Material according to claim 1 and 2, it is characterized in that: after grouping mixes, in the environment of low temperature drying with the airtight storage of the quartz sand after the surface treatment, stand-by as the M component, to be that a to i mixes with the rare basic end-blocking dimethyl siloxane of second, methyl hydrogen-containing siloxane and platinum chloric acid complex compound through all the other fillers after the surface treatment, mix the back as N component airtight stored for future use in less than the link of 40 ℃ low temperature drying.

4, a kind of cure process that floods Embedding Material, its process step is: [1] workpiece is gone into mould and is fixed, [2] irritate the sand vibratory compaction, [3] vacuum preheating dehumidifying, [4] vacuum vibration dipping, [5] normal pressure vibration dipping, [6] pre-thermal vibration levelling, [7] normal pressure intensification gel, [8] normal pressure heats up and solidifies, [9] cooling and demolding, described [4] vacuum vibration dipping, finger is in ambient temperature and mold temperature≤40 ℃ the time, make and keep vacuum state in the mould, the N component mixture is injected in the mould, the dipping workpiece and the quartz sand layer of going into mould in advance carried out the vacuum impregnation infiltration, and vibrated, described [5] normal pressure vibration dipping promptly unloads vacuum, when temperature keeps≤40 ℃, in the relative mould of normal pressure, under the atmospheric pressure of vacuum with about 0.1Mpa, continue vibration, stop to inject the N component mixture after enriching, described [6] pre-thermal vibration levelling, promptly under atmospheric pressure state, be warming up to the levelling warm area, N component mixture expanded by heating levelling in the mould, stop vibration thereafter, described [7] normal pressure intensification gel promptly ought be warming up to the gel warm area, makes the N component mixture in interior workpiece of mould and the quartz sand layer space, slowly, vulcanize gel equably, described [8] are heated up and are solidified, and promptly are warming up to the curing warm area, make interior workpiece of mould and quartz sand layer and N component mixture be cured as one, described [9] cooling and demolding, when promptly naturally cooling to 80 ℃～60 ℃, the goods of dipping embedding moulding are taken out in die sinking.

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