CN105199611B - A kind of heat-conducting glue with high heat conduction and highly resistance aging characteristics and its preparation method and application - Google Patents
A kind of heat-conducting glue with high heat conduction and highly resistance aging characteristics and its preparation method and application Download PDFInfo
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- CN105199611B CN105199611B CN201410307734.4A CN201410307734A CN105199611B CN 105199611 B CN105199611 B CN 105199611B CN 201410307734 A CN201410307734 A CN 201410307734A CN 105199611 B CN105199611 B CN 105199611B
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Abstract
The present invention disclose a kind of heat-conducting glue with high heat conduction and highly resistance aging characteristics, is made of solvent, inorganic nano tacky resin and the heat-conducting filler that is filled in inorganic nano tacky resin, quality proportioning is heat-conducting filler：Inorganic nano tacky resin=70%：30%, inorganic nano tacky resin：Solvent=1：5~8.The invention also discloses the preparation methods of the heat-conducting glue.The invention also discloses purposes of the heat-conducting glue in LED radiator.Heat-conducting glue provided by the invention with high heat conduction and highly resistance aging characteristics, by changing formula rate, has the following advantages：(1) compared with conventional pilot hot glue, there is higher heat conductivility；(2) compared with conventional pilot hot glue, there are better highly resistance aging characteristics；(3) compared with conventional pilot hot glue, when high-termal conductivity and high ageing resistance is had both, the also advantage with cheap and suitable industrialization.
Description
Technical field
The present invention relates to heat-conducting glue technical field more particularly to a kind of heat-conducting glues with high heat conduction and highly resistance aging characteristics
And its preparation method and application.
Background technology
The electric energy of LED high power products output only has 20% to be converted into light source, and remaining 80% can be converted to heat
Energy.In general, if generated thermal energy can not remittance abroad when LED shines, it will makes LED junction face temperature excessively high, and then influences production
How the life cycles of product, luminous efficiency and stability, solve the radiating management of LED information display system with being designed in order to which one important
Problem.
Heat-conducting glue is widely used in when being easily worked in LED cooling systems because its mature production technology, heat conduction plastic cement master
The plastic cement for having nylon, PBT etc. heat-resist adds in the inorganic filler of high heat conduction, such as aluminium nitride, boron nitride, itself is led
Hot coefficient is not very high, generally only 1~6w/m.k or so.With the heat dissipation effect of the separately made LED radiator of heat-conducting glue
Nor it is highly desirable, the LED product of smaller power is only used for, therefore actual heat conduction plastic heat sink is by heat conduction plastic cement
With embedded aluminum component two parts with reference to and form, embedded aluminum component be using punching press aluminium, thermal conductivity factor in more than 200w/m.k, this
The effect of kind of aluminum-plastic composite heat radiator can even approach or quite with the heat dissipation effect of die casting aluminium radiator, still, this to lead
The price of thermoplastic is fairly expensive, takes around 200~300 yuan/kg of RMB, and the cost of manufactured radiator also compares die casting aluminium
Cost it is much higher, although in the major company of some production LED lamps, such as there are some applications in PHILIPS Co., in the recent period
It is interior largely to replace fulfilling radiator.
In addition to heat conduction is not ideal enough, the aging of heat-conducting glue is also a great problem for perplexing LED producers, heat-conducting glue it is old
Change causes the thermal conductivity factor of heat-conducting glue drastically to decline, and then reduces the service life of LED lamp, while also limits high power
The exploitation design of LED lamp.
The content of the invention
It is provided a kind of with high thermal conductivity, height it is an object of the invention to overcome above-mentioned the deficiencies in the prior art part
Anti-aging property and cheap heat-conducting glue, high-termal conductivity, high ageing resistance and valency can not be provided simultaneously with by solving heat-conducting glue
On the one hand the cheap problem of lattice extends the service life of LED lamp, is on the other hand carried for R ＆ D design high power LED lamp
Precondition is supplied.
To achieve the above object, the technical solution taken of the present invention is：It is a kind of with high heat conduction and highly resistance aging characteristics
Heat-conducting glue is made of solvent, inorganic nano tacky resin and the heat-conducting filler that is filled in inorganic nano tacky resin,
In, the mass ratio of heat-conducting filler and inorganic nano tacky resin is heat-conducting filler：Inorganic nano tacky resin=70%：
30%, the mass ratio of inorganic nano tacky resin and solvent is inorganic nano tacky resin：Solvent=1:5~8.
As the preferred embodiment of the heat-conducting glue of the present invention with high heat conduction and highly resistance aging characteristics, the heat conduction
Filler is made of the raw material of following mass ratio：Silver：Aluminium：Red copper：Brass：Iron=0.5~3：50~70：1~4：1~4：3~
8。
As the preferred embodiment of the heat-conducting glue of the present invention with high heat conduction and highly resistance aging characteristics, the heat conduction
Filler is made of the raw material of following mass ratio：Silver：Aluminium：Red copper：Brass：Iron=1：60：2：2：5.
It is described inorganic as the preferred embodiment of the heat-conducting glue of the present invention with high heat conduction and highly resistance aging characteristics
Nanometer tacky resin is made of the raw material of following mass ratio：Butyl glycol ether：Carborundum：Silica=10%~30%：
10%~40%：20%~60%, it is preferred that the quality proportioning of inorganic nano tacky resin is：Butyl glycol ether：Carborundum：
Silica=3：3：4.
As the preferred embodiment of the heat-conducting glue of the present invention with high heat conduction and highly resistance aging characteristics, the solvent
For at least one of deionized water or isopropanol.
Secondly, it is described the present invention also provides a kind of preparation method of the heat-conducting glue with high heat conduction and highly resistance aging characteristics
Method comprises the following steps：
(1) butyl glycol ether, carborundum and silica are prepared by inorganic nano gluing tree using sol-gel method
Fat；
(2) by the inorganic nano tacky resin and thermal conductivity filler that are prepared in step (1) using mass ratio as heat-conducting filler：
Inorganic nano tacky resin=70%：30% ratio is sufficiently mixed and forms jelly, and the jelly has actually become
The heat-conducting glue haveing excellent performance；
(3) solvent is added in step (2) described jelly, then is sufficiently mixed, after baking, that is, form heat-conducting glue,
Wherein, add in the weight of solvent to add in 5~8 times of inorganic nano tacky resin weight, and must when 24 is small within add,
The effect for adding in solvent is to adjust the viscosity of heat-conducting glue.
Finally, the present invention also provides a kind of heat-conducting glue with high heat conduction and highly resistance aging characteristics in LED radiator
Purposes.
Heat-conducting glue provided by the invention with high heat conduction and highly resistance aging characteristics, by changing formula rate, have with
Lower advantage：(1) compared with conventional pilot hot glue, there is higher heat conductivility；(2) compared with conventional pilot hot glue, have better
Highly resistance aging characteristics；(3) compared with conventional pilot hot glue, when high-termal conductivity and high ageing resistance is had both, also with price
The advantage of cheap and suitable industrialization.
Specific embodiment
To better illustrate the object, technical solutions and advantages of the present invention, below in conjunction with specific embodiment to the present invention
It is described further.
Embodiment 1
The raw material by following mass ratio described in the present embodiment with the heat-conducting glue of high heat conduction and highly resistance aging characteristics is made：
Heat-conducting filler：Inorganic nano tacky resin：Deionized water=7：3：15, the wherein quality proportioning of heat-conducting filler
For：Silver：Aluminium：Red copper：Brass：Iron=0.5：50：1：1：3, the quality proportioning of inorganic nano tacky resin is：Butyl glycol ether：
Carborundum：Silica=3：3：4.
The preparation process of heat-conducting glue described in the present embodiment, comprises the following steps：
(1) silver, aluminium, red copper, brass, iron, butyl glycol ether, carbonization are weighed successively according to the quality proportioning in above-mentioned formula
Butyl glycol ether, carborundum and silica are prepared into nothing by silicon, silica and deionized water using sol-gel method
Machine nanometer tacky resin, thermal conductivity filler is formed after silver, aluminium, red copper, brass and iron are sufficiently mixed；
(2) by inorganic nano tacky resin in step (1) and thermal conductivity filler using mass ratio as heat-conducting filler：It is inorganic to receive
Rice glue viscosity resin=70%：30% ratio, which is sufficiently mixed, forms jelly；
(3) deionized water of weighing is added in the jelly, is sufficiently mixed, after baking, i.e., led needed for formation
Hot glue.
Embodiment 2
The raw material by following mass ratio described in the present embodiment with the heat-conducting glue of high heat conduction and highly resistance aging characteristics is made：
Heat-conducting filler：Inorganic nano tacky resin：Isopropanol=7：3：24, the wherein quality proportioning of heat-conducting filler
For：Silver：Aluminium：Red copper：Brass：Iron=3：70：4：4：8, the quality proportioning of inorganic nano tacky resin is：Butyl glycol ether：Carbon
SiClx：Silica=3：3：4.
The preparation process of heat-conducting glue described in the present embodiment, comprises the following steps：
(1) silver, aluminium, red copper, brass, iron, butyl glycol ether, carbonization are weighed successively according to the quality proportioning in above-mentioned formula
Butyl glycol ether, carborundum and silica are prepared into inorganic by silicon, silica and isopropanol using sol-gel method
Nanometer tacky resin, thermal conductivity filler is formed after silver, aluminium, red copper, brass and iron are sufficiently mixed；
(2) by inorganic nano tacky resin in step (1) and thermal conductivity filler using mass ratio as heat-conducting filler：It is inorganic to receive
Rice glue viscosity resin=70%：30% ratio, which is sufficiently mixed, forms jelly；
(3) isopropanol of weighing is added in the jelly, is sufficiently mixed, after baking, i.e. heat conduction needed for formation
Glue.
Embodiment 3
The raw material by following mass ratio described in the present embodiment with the heat-conducting glue of high heat conduction and highly resistance aging characteristics is made：
Heat-conducting filler：Inorganic nano tacky resin：Isopropanol=7：3：21, the wherein quality proportioning of heat-conducting filler
For：Silver：Aluminium：Red copper：Brass：Iron=1：60：2：2：5, the quality proportioning of inorganic nano tacky resin is：Butyl glycol ether：Carbon
SiClx：Silica=3：3：4.
The preparation process of heat-conducting glue described in the present embodiment is the same as embodiment 2.
Comparative example 1
This comparative example is that the temperature being applied to heat-conducting glue in embodiment 1-3 and conventional pilot hot glue in LED cooling systems is surveyed
Examination, wherein, the conventional pilot hot glue is mainly made of nylon, PBT, aluminium nitride, boron nitride.This contrast experiment is 25 in room temperature
DEG C, 4 and 12 2835 lamp beads of string, 38 volts of voltage, 270 milliamperes of electric current, lamp bead luminescence band is carries out under conditions of yellow light, comparison knot
Fruit is as shown in Table-1.
Temperature difference test under the conditions of -1 yellow light of table
It can be seen from table -1 under yellow light, inside and outside temperature difference T1-T2 of the conventional pilot hot glue after the 1-2h that works is about
For 6.20 DEG C~7.56 DEG C, and inside and outside temperature difference T1-T2 of the heat-conducting glue of the present embodiment 1-3 after the 1-2h that works is about 1.96
DEG C~3.12 DEG C, it is lower than the former, illustrate that the present embodiment 1-3 has better thermal conductivity, LED lamp will work more stable, make
Use longer life expectancy.
Comparative example 2
This comparative example is that the temperature being applied to heat-conducting glue in embodiment 1-3 and conventional pilot hot glue in LED cooling systems is surveyed
Examination, wherein, the conventional pilot hot glue is mainly made of nylon, PBT, aluminium nitride, boron nitride.This contrast experiment is 25 in room temperature
DEG C, 4 and 12 2835 lamp beads of string, 38 volts of voltage, 270 milliamperes of electric current, lamp bead luminescence band is carries out under conditions of white light, comparison knot
Fruit is as shown in table -2.
Temperature difference test under -2 white light conditions of table
It can be seen from table -2 under white light illumination, inside and outside temperature difference T1-T2 of the conventional pilot hot glue after the 1-2h that works be about
For 15.48 DEG C~16.22 DEG C, and inside and outside temperature difference T1-T2 of the heat-conducting glue of the present embodiment 1-3 after the 1-2h that works is about
It is 1.98 DEG C~3.08 DEG C, 13.14 DEG C~13.5 DEG C lower than the former, it is evident that the present embodiment 1-3 has better thermal conductivity,
LED lamp will work more stable, and service life is longer.
Test case 1
The degradation that heat-conducting glue in embodiment 1-3 is applied to LED cooling systems by this test case is tested, and test result is such as
Shown in table -3, T1：Internal base plate temperature (DEG C)；T2：External heat sink temperature (DEG C)；T3：Environment temperature (DEG C)；T1-T2：The temperature difference
(℃)；TestDate：2014.3.26；t：Ageing time point.
- 3 heat-conducting glue burn-in test of table
When heat-conducting glue is applied to LED cooling systems in the present embodiment 1-3 it can be seen from table -3, in equal-wattage (1,2
Signal lamp power is all 5w) and different capacity (3 signal lamps be 12w) under the conditions of, after 260min, internal base plate is dissipated with outside
The temperature difference of hot device is respectively 1 signal lamp：1.19 DEG C~2.5 DEG C；2 signal lamps：1.24 DEG C~1.9 DEG C；3 signal lamps：3.18 DEG C~3.37
℃.Explanation：For applying when in the LED light of equal-wattage, the heat-conducting glue of the present embodiment 1-3 has good stability, right
In applying when in the LED light of different capacity, the heat-conducting glue of the present embodiment 1-3 has good anti-aging characteristic.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than the present invention is protected
The limitation of scope is protected, although being explained in detail with reference to preferred embodiment to the present invention, those of ordinary skill in the art should
Understand, technical scheme can be modified or replaced equivalently, without departing from the essence of technical solution of the present invention
And scope.
Claims (6)
1. a kind of heat-conducting glue with high heat conduction and highly resistance aging characteristics, by solvent, inorganic nano tacky resin and is filled in nothing
Heat-conducting filler composition in machine nanometer tacky resin, wherein, the mass ratio of heat-conducting filler and inorganic nano tacky resin is
Heat-conducting filler: inorganic nano tacky resin=70%: 30%, the mass ratio of inorganic nano tacky resin and solvent is received to be inorganic
Rice glue viscosity resin: solvent=1: 5~8；The inorganic nano tacky resin is made of the raw material of following mass ratio：
Butyl glycol ether: carborundum: silica=10%~30%: 10%~40%: 20%~60%.
2. there is the heat-conducting glue of high heat conduction and highly resistance aging characteristics according to claim 1, which is characterized in that the heat conduction is filled out
It fills object to be made of the raw material of following mass ratio: silver: aluminium: red copper: brass: iron=0.5~3: 50~70: 1~4: 1~4: 3~8.
3. the heat-conducting glue according to claim 1 or claim 2 with high heat conduction and highly resistance aging characteristics, which is characterized in that described to lead
Hot filler is made of the raw material of following mass ratio: silver: aluminium: red copper: brass: iron=1: 60: 2: 2: 5.
4. there is the heat-conducting glue of high heat conduction and highly resistance aging characteristics according to claim 1, which is characterized in that the solvent is
At least one of deionized water or isopropanol.
5. a kind of preparation method of heat-conducting glue with high heat conduction and highly resistance aging characteristics as described in claim 1-4 is any,
It is characterized in that, the described method comprises the following steps：
(1) butyl glycol ether, carborundum and silica are prepared by inorganic nano tacky resin using sol-gel method；
(2) by the inorganic nano tacky resin and thermal conductivity filler that are prepared in step (1) using mass ratio as heat-conducting filler: inorganic
Nanometer tacky resin=70%: 30% ratio, which is sufficiently mixed, forms jelly；
(3) solvent is added in step (2) described jelly, then is sufficiently mixed, after baking, that is, form heat-conducting glue, wherein,
The weight of solvent is added in add in 5~8 times of inorganic nano tacky resin weight.
6. a kind of have the heat-conducting glue of high heat conduction and highly resistance aging characteristics in LED radiator as described in claim 1-4 is any
Purposes.
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| JPH05179209A (en) * | 1991-12-26 | 1993-07-20 | Sumitomo Bakelite Co Ltd | Highly heat-conductive filmy adhesive capable of hot press-bonding |
| CN1288921A (en) * | 2000-10-24 | 2001-03-28 | 华东理工大学 | Self-curing inorganic heat-conducting daub |
| CN101089108A (en) * | 2007-05-17 | 2007-12-19 | 钢铁研究总院 | Inorganic insulating adhesive for soft magentic metal powder core andits prepn process |
| CN101555388A (en) * | 2009-05-19 | 2009-10-14 | 无锡市儒兴科技开发有限公司 | Inorganic adhesive for aluminum paste of silicon solar cells and preparation method thereof |
| CN102533130A (en) * | 2010-12-07 | 2012-07-04 | 上海务宝机电科技有限公司 | Waterproof self-curing inorganic heat-conducting cement |
| CN103045101A (en) * | 2012-12-21 | 2013-04-17 | 郝勇 | Heat conducting glue for high-power LED encapsulation and preparation method thereof |
-
2014
- 2014-06-30 CN CN201410307734.4A patent/CN105199611B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05179209A (en) * | 1991-12-26 | 1993-07-20 | Sumitomo Bakelite Co Ltd | Highly heat-conductive filmy adhesive capable of hot press-bonding |
| CN1288921A (en) * | 2000-10-24 | 2001-03-28 | 华东理工大学 | Self-curing inorganic heat-conducting daub |
| CN101089108A (en) * | 2007-05-17 | 2007-12-19 | 钢铁研究总院 | Inorganic insulating adhesive for soft magentic metal powder core andits prepn process |
| CN101555388A (en) * | 2009-05-19 | 2009-10-14 | 无锡市儒兴科技开发有限公司 | Inorganic adhesive for aluminum paste of silicon solar cells and preparation method thereof |
| CN102533130A (en) * | 2010-12-07 | 2012-07-04 | 上海务宝机电科技有限公司 | Waterproof self-curing inorganic heat-conducting cement |
| CN103045101A (en) * | 2012-12-21 | 2013-04-17 | 郝勇 | Heat conducting glue for high-power LED encapsulation and preparation method thereof |
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