CN202622550U - Wafer conveying device and grinding device - Google Patents
Wafer conveying device and grinding device Download PDFInfo
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- CN202622550U CN202622550U CN 201220315281 CN201220315281U CN202622550U CN 202622550 U CN202622550 U CN 202622550U CN 201220315281 CN201220315281 CN 201220315281 CN 201220315281 U CN201220315281 U CN 201220315281U CN 202622550 U CN202622550 U CN 202622550U
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Abstract
The utility model discloses a wafer conveying device used to convey wafers between a wafer vacuum loading unit and a wafer loading/unloading unit. The wafer conveying device comprises a water tank, a wafer grabbing mechanism and a wafer moving mechanism, wherein the wafer grabbing mechanism is used to clamp or loosen the wafers, the water tank is arranged between the wafer vacuum loading unit and a wafer loading/unloading unit, and the wafer grabbing mechanism drives the wafers to move in the water tank under the action of the wafer moving mechanism. The utility model further discloses a grinding device which comprises the wafer vacuum loading unit and the wafer loading/unloading unit, and the wafer conveying device is arranged between the wafer vacuum loading unit and the wafer loading/unloading unit. The wafer conveying device and the grinding device are simple in structure and convenient to use, and by means of the structure, the wafer conveying device and the grinding device can achieve conveying of the wafers in water, thereby isolating the contact between the wafers and air, reducing impacts on the wafers caused by impurities in the air and light pollution, and effectively improving product yield.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of wafer transfer device and lapping device.
Background technology
CMP technology is meant chemical mechanical milling tech (Chemical Mechanical Polishing), or is called chemical-mechanical planarization technology (Chemical Mechanical Planarization).Chemical mechanical milling tech is the technical process of a complicacy; It is that crystal column surface is contacted with the lapped face of grinding pad; Then; With flattening wafer surface, adopt chemical-mechanical grinding device (being also referred to as lapping device) to carry out chemical mechanical milling tech through the relative motion between crystal column surface and the lapped face usually.Said lapping device comprises a grinding head; When carrying out grinding technics, the wafer that will grind is attached on the grinding head, and this wafer to be ground faces down and contact counterrotating grinding pad; The downforce that grinding head provides is pressed onto this wafer on the grinding pad; Said grinding pad is pasted on the grinding plate, and when rotating under the drive of this grinding plate at motor, grinding head is followed grinding plate and rotated; Simultaneously, lapping liquid is transported on the grinding pad through the lapping liquid supply pipe, and is evenly distributed on the grinding pad through centrifugal force.The employed lapping liquid of grinding technics generally includes chemical mordant and abrasive grains; Chemical reaction through chemical mordant and said surface to be ground generates softer easy to be removed material; Remove from the surface of being ground wafer through the mechanical friction material that these are softer then, to reach the effect of overall planarization.
At present; Lapping device comprises that grinding unit, cleaning unit, wafer vacuum load units, wafer adorn/unload unit (HCLU; Full name is Head Clean Load/Unload), adorn/unload at wafer vacuum load units and wafer and be provided with the wafer transfer device between the unit.Wherein, each grinding unit comprises grinding pad, abrasive disk, grinding head and grinder pad finisher respectively.Each cleaning unit comprises the high temperature rinsing container, scrubs container, dries container etc.Yet; Find that in actual production the wafer transfer device is transported to wafer with wafer from the wafer vacuum load units and adorns/unload the process of unit, because whole process is carried out in air; Receive the influence of airborne impurity and light pollution easily, cause the product yield to reduce.
Therefore, how a kind of wafer transfer device and lapping device of avoiding wafer in transportation, to receive air and light pollution influence being provided is the technical problem that those skilled in the art need to be resolved hurrily.
The utility model content
The purpose of the utility model is to provide a kind of wafer transfer device and lapping device, carries out through the transportation of wafer is changed in the water, can avoid wafer in transportation, to receive air and light pollution influence.
In order to reach above-mentioned purpose, the utility model adopts following technical scheme:
A kind of wafer transfer device; Be used for adorning/unloading transporting wafer between the unit at wafer vacuum load units and wafer; Comprise: tank, the wafer grasping mechanism and the wafer travel mechanism that are used for clamping or unclamp wafer; Said tank is arranged at said wafer vacuum load units and said wafer is adorned/unloaded between the unit, and said wafer grasping mechanism drives wafer and in tank, moves under the effect of wafer travel mechanism.
Preferably; In above-mentioned wafer transfer device; Said wafer travel mechanism comprises driven in translation motor, belt gear and contiguous block; Said belt gear comprises drive pulley, driven pulley and transport tape, and said driven in translation motor drives said transport tape through said drive pulley and moves, and said contiguous block is installed on the said transport tape.
Preferably, in above-mentioned wafer transfer device, also comprise CD-ROM drive motor up and down, said CD-ROM drive motor up and down is installed on the said contiguous block, and said CD-ROM drive motor up and down drives said wafer grasping mechanism and moves up and down.
Preferably, in above-mentioned wafer transfer device, said wafer grasping mechanism comprises folding CD-ROM drive motor and a pair of wafer folder, and said a pair of wafer is clipped in and moves inward under the effect of folding CD-ROM drive motor or outwards move.
Preferably, in above-mentioned wafer transfer device, an end of said tank is provided with water inlet.
Preferably, in above-mentioned wafer transfer device, said wafer transfer device also comprises connecting line, and the two ends of said connecting line are connected to the two ends of said tank.
Preferably, in above-mentioned wafer transfer device, also comprise a pair of deflector apron, the distance between the said a pair of deflector apron is adorned/is unloaded cell orientation along wafer vacuum load units to wafer and diminishes gradually.
The invention also discloses a kind of lapping device, comprise that wafer vacuum load units and wafer adorn/unload the unit, adorn/unload at wafer vacuum load units and wafer and be provided with aforesaid wafer transfer device between the unit.
Wafer transfer device and lapping device that the utility model provides; Simple in structure, easy to use, adopt said structure, can be implemented in the water wafer is transmitted; So; Can completely cut off contacting of wafer and air, reduce the influence that airborne impurity and light pollution cause wafer, effectively improve the product yield.
Description of drawings
The wafer transfer device and the lapping device of the utility model are provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of the lapping device of the utility model one embodiment.
Fig. 2 is the structural representation of the wafer transfer device of the utility model one embodiment.
Fig. 3 is the structural representation of the wafer grasping mechanism among the utility model one embodiment.
Fig. 4 is the tank schematic top plan view among the utility model one embodiment.
Among the figure: unit, 300-wafer transfer device, 301-tank, 302-wafer, 303-driven in translation motor, 304-contiguous block, 305-transport tape, 306-CD-ROM drive motor, 307-folding CD-ROM drive motor, 308-wafer folder, 309-water inlet, 310-connecting line, 311-deflector apron, 312-ultra-pure water are up and down adorned/unloaded to 100-wafer vacuum load units, 200-wafer.
The specific embodiment
Below will do further to describe in detail to the wafer transfer device and the lapping device of the utility model.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented the preferred embodiment of the utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize the advantageous effects of the utility model.Therefore, following description is appreciated that extensively knowing to those skilled in the art, and not as the restriction to the utility model.
For clear, whole characteristics of practical embodiments are not described.In following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development possibly be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose, the characteristic that make the utility model is more obviously understandable, be further described below in conjunction with the specific embodiment of accompanying drawing to the utility model.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 1; Present embodiment discloses a kind of lapping device; Comprise that wafer vacuum load units 100, cleaning unit and wafer adorn/unload unit 200, wafer vacuum load units 100 and wafer adorn/unload be provided with between the unit 200 one wafer is transmitted in water wafer transfer device 300.
See also Fig. 2; And please combine Fig. 1; Said wafer transfer device 300; Be used for adorning/unloading between the unit 200 transporting wafer at wafer vacuum load units 100 and wafer; Comprise: the tank 301 of ultra-pure water 312, wafer grasping mechanism and the wafer travel mechanism (not shown) that is used for clamping or unclamps wafer 302 are housed, and said tank 301 is arranged at said wafer vacuum load units 100 and said wafer is adorned/unloaded between the unit 200, and said wafer grasping mechanism moves in tank 301 at drive wafer 302 under the effect of wafer travel mechanism.Adopt said structure, can be implemented in the water wafer 302 is transmitted, from air, become in the water transmission course of wafer 302; So; Can completely cut off contacting of wafer 302 and air, reduce airborne impurity and light pollution, improve the product yield the influence that wafer 302 causes.
Preferable; Said wafer travel mechanism also comprises driven in translation motor 303, belt gear and contiguous block 304; Said belt gear comprises drive pulley, driven pulley and transport tape 305; Said driven in translation motor 303 drives said transport tape 305 through said drive pulley and moves, and said contiguous block 304 is installed on the said transport tape 305.Adopting as above, the wafer travel mechanism of structure has simple in structure, the advantage stably of moving.
Preferable, said wafer transfer device also comprises CD-ROM drive motor 306 up and down, and said CD-ROM drive motor 306 up and down is installed on the said contiguous block 304, and said CD-ROM drive motor up and down 306 drives said wafer grasping mechanism and moves up and down.Through CD-ROM drive motor 306 up and down is set, behind wafer grasping mechanism clamping wafer 302, can move in the water of tank 301, so that follow-uply in water, transmit.
See also Fig. 3; And please combine Fig. 1 and Fig. 2, preferable, in the present embodiment; Said wafer grasping mechanism comprises folding CD-ROM drive motor 307 and a pair of wafer folder 308, and said a pair of wafer folder 308 moves inward or outwards moves under 307 effects of folding CD-ROM drive motor.Said wafer folder 308 has the arc groove that an edge with said wafer is complementary, and the edge of wafer can stretch in this arc groove.When the wafer grasping mechanism needs clamping wafer 302, drive folding CD-ROM drive motor 307, make wafer folder 308 move inward up to clamping wafer 302.When the wafer grasping mechanism need be decontroled wafer 302, drive folding CD-ROM drive motor 307, make wafer folder 308 outwards move up to unclamping wafer 302.
Please continue to consult Fig. 2, preferable, in the present embodiment, an end of said tank 301 is provided with water inlet 309, supplies ultra-pure waters through water inlet 309 to tank 301.
Preferable, in the present embodiment, said wafer transfer device also comprises connecting line 310, the two ends of said connecting line are connected to the two ends of said tank 301.Through being set, connecting line 310 can make that the ultra-pure water in the tank keeps clean so that the ultra-pure water in the tank 301 constantly circulates.
See also Fig. 4; And please combine Fig. 1, Fig. 2 and Fig. 3, preferable, in the present embodiment; Said wafer transfer device also comprises a pair of deflector apron 311, and the distance between the said a pair of deflector apron 311 is adorned/unloaded cell orientation along wafer vacuum load units to wafer and diminishes gradually.Said deflector apron 311 has guide effect, prevents that the wafer fetching device that has wafer 302 from bumping because of departing from the reverse parts with periphery of proper exercise, thereby effectively protects wafer 302 to improve the product yields.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from the spirit and the scope of the utility model.Like this, belong within the scope of the utility model claim and equivalent technologies thereof if these of the utility model are revised with modification, then the utility model also is intended to comprise these changes and modification interior.
Claims (8)
1. wafer transfer device; Be used for adorning/unloading transporting wafer between the unit at wafer vacuum load units and wafer; It is characterized in that; Comprise: tank, the wafer grasping mechanism and the wafer travel mechanism that are used for clamping or unclamp wafer, said tank is arranged at said wafer vacuum load units and said wafer is adorned/unloaded between the unit, and said wafer grasping mechanism drives wafer and in tank, moves under the effect of wafer travel mechanism.
2. wafer transfer device according to claim 1; It is characterized in that; Said wafer travel mechanism comprises driven in translation motor, belt gear and contiguous block; Said belt gear comprises drive pulley, driven pulley and transport tape, and said driven in translation motor drives said transport tape through said drive pulley and moves, and said contiguous block is installed on the said transport tape.
3. wafer transfer device according to claim 2 is characterized in that, also comprises CD-ROM drive motor up and down, and said CD-ROM drive motor up and down is installed on the said contiguous block, and said CD-ROM drive motor up and down drives said wafer grasping mechanism and moves up and down.
4. wafer transfer device according to claim 3 is characterized in that, said wafer grasping mechanism comprises folding CD-ROM drive motor and a pair of wafer folder, and said a pair of wafer is clipped in and moves inward under the effect of folding CD-ROM drive motor or outwards move.
5. wafer transfer device according to claim 1 is characterized in that, an end of said tank is provided with water inlet.
6. wafer transfer device according to claim 1 is characterized in that, said wafer transfer device also comprises connecting line, and the two ends of said connecting line are connected to the two ends of said tank.
7. wafer transfer device according to claim 1 is characterized in that, also comprises a pair of deflector apron, and the distance between the said a pair of deflector apron is adorned/unloaded cell orientation along said wafer vacuum load units to wafer and diminishes gradually.
8. lapping device comprises that wafer vacuum load units and wafer adorn/unload the unit, it is characterized in that, said wafer vacuum load units and wafer adorn/unload be provided with between the unit as in the claim 1 ~ 7 arbitrarily
A described wafer transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220315281 CN202622550U (en) | 2012-06-29 | 2012-06-29 | Wafer conveying device and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220315281 CN202622550U (en) | 2012-06-29 | 2012-06-29 | Wafer conveying device and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202622550U true CN202622550U (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220315281 Expired - Fee Related CN202622550U (en) | 2012-06-29 | 2012-06-29 | Wafer conveying device and grinding device |
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| CN (1) | CN202622550U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130360A (en) * | 2021-04-15 | 2021-07-16 | 杭州众硅电子科技有限公司 | Chemical mechanical polishing equipment, wafer caching device and wafer caching method thereof |
-
2012
- 2012-06-29 CN CN 201220315281 patent/CN202622550U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130360A (en) * | 2021-04-15 | 2021-07-16 | 杭州众硅电子科技有限公司 | Chemical mechanical polishing equipment, wafer caching device and wafer caching method thereof |
| WO2022217831A1 (en) * | 2021-04-15 | 2022-10-20 | 杭州众硅电子科技有限公司 | Chemical mechanical polishing device as well as wafer caching apparatus and wafer caching method thereof |
| CN113130360B (en) * | 2021-04-15 | 2024-05-07 | 杭州众硅电子科技有限公司 | Chemical mechanical polishing equipment, wafer caching device and wafer caching method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130507 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130507 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20180629 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |