CN202616288U - Phosphor-coated LED with box dam - Google Patents
Phosphor-coated LED with box dam Download PDFInfo
- Publication number
- CN202616288U CN202616288U CN 201220145502 CN201220145502U CN202616288U CN 202616288 U CN202616288 U CN 202616288U CN 201220145502 CN201220145502 CN 201220145502 CN 201220145502 U CN201220145502 U CN 201220145502U CN 202616288 U CN202616288 U CN 202616288U
- Authority
- CN
- China
- Prior art keywords
- led
- phosphor
- box dam
- emitting diode
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a phosphor-coated LED with a box dam and relates to an improvement technology of the LED. The phosphor-coated LED comprises the LED (1) and is characterized in that an epoxy-resin glue box dam (2) which is upwardly convex is arranged along surface circumference of the LED (1), A phosphor silica-gel coating (3) is mounted in an area enclosed by the epoxy-resin glue box dam (2) on the surface of the LED (1). The phosphor-coated LED provided by the utility model solves a problem that excessive phosphor silica gel flows down around from the surface of the LED, thereby causing waste when the phosphor silica gel is coated on the surface of the LED.
Description
Technical field
The utility model relates to the improvement technology of light-emitting diode.
Background technology
As market is increasing to the light-emitting diode demand, and is also increasingly high to the encapsulation requirement of light-emitting diode.What present domestic light-emitting diode industry will adopt is traditional dosing technology; Directly in chip surface spot printing phosphor gel; Be about to fluorescent powder and colloid (like silica gel) by certain than mixing, process powder and starch, stir; With instrument it is coated on chip surface with the fine needle head then, forms the coating that is similar to the spherical crown shape.
In the above-mentioned coating operating process, have unnecessary fluorescent powder silica gel from LED surface to around flow down, cause waste.
Summary of the invention
The utility model provides a kind of fluorescent material that box dam arranged to apply light-emitting diode, when the utility model has solved LED surface and has applied fluorescent powder silica gel, have unnecessary fluorescent powder silica gel from LED surface to around flow down wasting problem.
For addressing the above problem; The utility model adopts following technical scheme: have the fluorescent material of box dam to apply light-emitting diode; Comprise light-emitting diode (1); Around light-emitting diode (1) surface, the epoxide-resin glue box dam (2) that raises up is arranged, fluorescent powder silica gel coating (3) is arranged in the zone that the surperficial epoxide-resin glue box dam of light-emitting diode (1) (2) surrounds.
The utility model applies around light-emitting diode chip for backlight unit with epoxy resin glue earlier, and the baking back forms a little more than chip, is similar to the material of " box dam "; In this " box dam ", carry out fluorescent material and apply, fluorescent material only is distributed on the chip, guarantee the uniformity that applies; Thereby improve the characteristics of luminescence of white light product; Promote efficient, and can reduce the use amount of fluorescent material, thereby reduce cost.
Description of drawings
Fig. 1 is the utility model structural representation.
Symbol description among the figure: light-emitting diode 1, epoxide-resin glue box dam 2, fluorescent powder silica gel coating 3.
Embodiment
With illustrated embodiments the utility model is done detailed explanation below.
As shown in Figure 1; There is the fluorescent material of box dam to apply light-emitting diode; Comprise light-emitting diode (1); Around light-emitting diode (1) surface, the epoxide-resin glue box dam (2) that raises up is arranged, fluorescent powder silica gel coating (3) is arranged in the zone that the surperficial epoxide-resin glue box dam of light-emitting diode (1) (2) surrounds.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to execution mode.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all execution modes.And conspicuous variation of being amplified out thus or change still are among the protection range of the utility model.
Claims (1)
1. there is the fluorescent material of box dam to apply light-emitting diode; Comprise light-emitting diode (1); It is characterized in that; Around light-emitting diode (1) surface, the epoxide-resin glue box dam (2) that raises up is arranged, fluorescent powder silica gel coating (3) is arranged in the zone that the surperficial epoxide-resin glue box dam of light-emitting diode (1) (2) surrounds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220145502 CN202616288U (en) | 2012-04-09 | 2012-04-09 | Phosphor-coated LED with box dam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220145502 CN202616288U (en) | 2012-04-09 | 2012-04-09 | Phosphor-coated LED with box dam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202616288U true CN202616288U (en) | 2012-12-19 |
Family
ID=47349960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220145502 Expired - Fee Related CN202616288U (en) | 2012-04-09 | 2012-04-09 | Phosphor-coated LED with box dam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202616288U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105322071A (en) * | 2014-07-29 | 2016-02-10 | 深圳大学 | Chip-level white light LED and manufacturing method thereof |
-
2012
- 2012-04-09 CN CN 201220145502 patent/CN202616288U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105322071A (en) * | 2014-07-29 | 2016-02-10 | 深圳大学 | Chip-level white light LED and manufacturing method thereof |
| CN105322071B (en) * | 2014-07-29 | 2018-08-14 | 深圳大学 | A kind of chip-scale white light LEDs and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103199183B (en) | A kind of encapsulating structure improving vertical LED chip brightness | |
| CN104789186A (en) | Single-component LED (light-emitting diode) filament thixotrope without oil discharge and preparation method thereof | |
| CN102130227B (en) | Encapsulation process for white light LED with optical lens | |
| CN203300701U (en) | Light emitting diode device | |
| CN104505447B (en) | One kind height ash matt SMD LED and its gluing process | |
| CN202616288U (en) | Phosphor-coated LED with box dam | |
| CN105826453A (en) | Preparation method of COB optical module and COB optical module | |
| CN103022326B (en) | Intensive packaging method of LEDs | |
| CN102148298A (en) | Multipoint dispensing process and LED (light emitting diode) device | |
| US20150364662A1 (en) | LED Lighting Device and Packaging Method | |
| CN111048653A (en) | Process for improving brightness and output availability of LED lamp beads | |
| CN104300067B (en) | Bendable LED encapsulation | |
| CN102263193B (en) | Luminous chip capable of increasing brightness of light-emitting diode and packaging method for luminous chip | |
| CN204216087U (en) | A kind of Novel LED encapsulating structure | |
| CN208862020U (en) | A kind of white chip adds the LED encapsulation structure of Zener chip | |
| CN203377253U (en) | Small module high strength LED package structure with green chip and red fluorescence powder | |
| CN202469602U (en) | LED (Light-Emitting Diode) light source with omnibearing luminescence | |
| CN203434190U (en) | Green chip and red fluorescence powder small module high luminous flux LED package structure | |
| CN202048403U (en) | Anti-aging LED (Light-Emitting Diode) illuminating lamp with long service life based on composite fluorescent membrane | |
| CN201167098Y (en) | Low light-decline small power white light LED | |
| CN205560360U (en) | LED is revealed to low blue light | |
| CN203415613U (en) | Square type high-refractive-index LED packaging structure with red phosphor cured on green chip | |
| CN203434189U (en) | Green chip and red fluorescence powder strip-shaped high strength LED package structure | |
| CN203415614U (en) | Rectangular type high-light-flux LED packaging structure with red phosphor cured on green chip | |
| CN105655467B (en) | White light LED device and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121219 Termination date: 20130409 |