CN105655467B - White light LED device and manufacturing method thereof - Google Patents
White light LED device and manufacturing method thereof Download PDFInfo
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- CN105655467B CN105655467B CN201410629647.0A CN201410629647A CN105655467B CN 105655467 B CN105655467 B CN 105655467B CN 201410629647 A CN201410629647 A CN 201410629647A CN 105655467 B CN105655467 B CN 105655467B
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Abstract
The invention provides a white light LED device and a manufacturing method thereof. The white light LED device includes: a blue LED chip; and the wavelength conversion layer is arranged on the luminous surface of the blue LED chip and is a mixture comprising fluorescent powder, glass powder and organic binder. The glass powder in the wavelength conversion layer has the advantages of good transparency, high hardness, high temperature resistance, uniform particle size distribution and the like, so that blue light emitted by a blue light LED chip in the white light LED device can pass through the glass powder, namely the glass powder does not absorb the blue light; meanwhile, most of organic binders are replaced by the glass powder, so that the influence of the change of the light transmission performance of the organic binders with low content at high temperature on the white light LED device is limited, and the color temperature drift of the white light LED device is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor light emitting, in particular to a white light LED device and a manufacturing method of the white light LED device.
Background
The existing white light LED device mainly uses blue light emitted from a blue LED chip to excite phosphor powder to generate white light. The manufacturing method comprises the following steps: firstly, mixing and stirring liquid colloid and fluorescent powder to form a mixture; then, the mixture is coated on the surface of the chip; and finally, heating and curing to enable the fluorescent glue to be well adhered to the light emitting surface of the LED blue light chip. The manufacturing method has the characteristics of low cost, simple manufacturing process and the like, and is widely applied to the production of the LED industry.
In the manufacturing method, the color temperatures of the manufactured white light LEDs are different due to the different mixing ratios of the colloid and the fluorescent powder, namely, the white light LEDs which are formed when the fluorescent powder is less and the colloid is more generate high color temperatures, and the white light LEDs which are formed when the fluorescent powder is more and the colloid is less generate low color temperatures. In addition, the white light LED is suitable for different powers because the colloids made of different materials have different heat resistance. For example, epoxy resin colloids have poor heat resistance and are only suitable for low-power white light LEDs; the phenyl silica gel has medium heat resistance and is suitable for a medium-power white light LED; and the methyl silicone adhesive has good heat resistance and is suitable for high-power white light LEDs.
In the working process of the white light LED, the blue light emitted by the LED blue light chip in the white light LED lighting work passes through the colloid and the fluorescent powder, and meanwhile, part of the heat of the LED blue light chip is also accumulated inside the mixture of the colloid and the fluorescent powder. Therefore, both the gel and the phosphor are subjected to high-brightness blue light and high-temperature working environments. However, the white LED changes in color temperature when it is operated for a long time under the operating environmental conditions, i.e., a problem of color temperature drift occurs, and the drift of high color temperature is more severe than that of low color temperature.
Analysis according to the prior art shows that the main influencing factor of the color temperature shift of the white light LED is colloid. That is, the light transmittance of the paste is deteriorated under a high temperature environment, thereby causing a color temperature shift. Compared with the white light LED with low color temperature, the white light LED with high color temperature has more colloid and less fluorescent powder, so that the color temperature drift amplitude is larger. At present, although the color temperature drift is slowed down by optimizing the performances of heat resistance, glue crack resistance and the like of the glue, the color temperature drift of the white light LED is still serious when the white light LED works for a long time. In view of the above problems, no effective solution exists at present.
Disclosure of Invention
The present invention is directed to a white LED device and a method for manufacturing the same, so as to improve color temperature shift of the white LED device.
In order to achieve the above object, according to one aspect of the present invention, there is provided a white LED device including: a blue LED chip; and the wavelength conversion layer is arranged on the luminous surface of the blue LED chip and is a mixture comprising fluorescent powder, glass powder and organic binder.
Further, the refractive index of the glass frit is the same as or similar to that of the organic binder.
Further, in the wavelength conversion layer, the mass percentage of the organic binder is 15-20%.
Furthermore, the particle size of the glass powder is 2-50 μm.
Further, the white light LED device also comprises a substrate, and the blue light LED chip is fixed on the substrate through solder, plastic package material or pouring sealant.
Further, the white light LED device also comprises a support bowl, the blue light LED chip is fixed in the support bowl through the wavelength conversion layer, and the wavelength conversion layer covers the whole surface of the blue light LED chip.
In order to achieve the above object, according to one aspect of the present invention, there is provided a method of fabricating a white LED device, the method comprising the steps of: providing a blue LED chip; and forming a wavelength conversion layer on the light emitting surface of the blue LED chip, wherein the wavelength conversion layer is a mixture comprising fluorescent powder, glass powder and organic binder.
Further, the step of forming a wavelength conversion layer includes: mixing and stirring fluorescent powder, glass powder and liquid binder to form a mixed material; coating the mixed material on the light emitting surface of the blue light LED chip; and carrying out heating curing treatment to form the wavelength conversion layer.
Further, the manufacturing method further comprises the step of fixing the blue LED chip on the substrate through a welding process, a plastic package process or a glue filling process.
Further, the manufacturing method further comprises the step of covering the whole surface of the blue LED chip with the wavelength conversion layer through a dispensing process and fixing the blue LED chip in the support bowl cup.
By applying the technical scheme of the invention, the wavelength conversion layer in the white light LED device provided by the invention is a mixture comprising fluorescent powder, glass powder and organic binder. The glass powder in the wavelength conversion layer has the advantages of good transparency, high hardness, high temperature resistance, uniform particle size distribution and the like, so that blue light emitted by a blue light LED chip in the white light LED device can pass through the glass powder, namely the glass powder does not absorb the blue light; meanwhile, most of organic binders are replaced by the glass powder, so that the influence of the change of the light transmission performance of the organic binders with low content at high temperature on the white light LED device is limited, and the color temperature drift of the white light LED device is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 illustrates a schematic cross-sectional view of a white LED device provided in accordance with a preferred embodiment of the present invention;
FIG. 2 shows a schematic cross-sectional view of a white LED device provided in accordance with another preferred embodiment of the present invention;
FIG. 3 illustrates a schematic cross-sectional view of a white LED device provided in accordance with yet another preferred embodiment of the present invention; and
fig. 4 shows a schematic cross-sectional view of a white LED device according to another preferred embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As known in the background art, the existing white light LED has the problem of color temperature drift. The inventors of the present invention have made studies to solve the above problems and have proposed a white LED device. The white light LED device includes: a blue LED chip; and the wavelength conversion layer is arranged on the luminous surface of the blue LED chip and is a mixture comprising fluorescent powder, glass powder and organic binder.
The glass powder in the wavelength conversion layer has the advantages of good transparency, high hardness, high temperature resistance, uniform particle size distribution and the like, so that blue light emitted by a blue light LED chip in the white light LED device can pass through the glass powder, namely the glass powder does not absorb the blue light; meanwhile, most of organic binders are replaced by the glass powder, so that the influence of the change of the light transmission performance of the organic binders with low content at high temperature on the white light LED device is limited, and the color temperature drift of the white light LED device is improved.
The phosphor in the wavelength conversion layer can be configured arbitrarily as required, and can be a phosphor capable of generating broad-spectrum light after being excited, or a mixture of multiple phosphors capable of emitting light of different colors, for example, the phosphor can be a yellow phosphor, or a mixture of a red phosphor and a green phosphor, and the like.
Furthermore, the invention also adopts the glass powder with the refractive index which is the same as or similar to that of the organic binder, so that blue light emitted by the blue LED chip has no interface when passing through the organic binder and the glass powder, thereby further improving the color temperature drift of the white LED device. It should be noted that the close refractive indices of the glass frit and the organic binder mean that the refractive index difference between the two is small, for example, the difference is not greater than 0.07. For example, glass frit having a refractive index of 1.47, and an organic binder having a refractive index of 1.41 may be used. Of course, the glass frit and the organic binder are not limited to the above-described examples, and a glass frit and an organic binder having a refractive index difference of not more than 0.07 may be used.
In the wavelength conversion layer, the mass percentage of the organic binder may be set according to actual process requirements. In order to further improve the color temperature drift of the white light LED device, the organic binder is preferably 15-20% by mass. Wherein, the particle size of the glass powder can also be set by adopting the actual process requirement. Preferably, the particle size of the glass powder is 2-50 μm. In general, the particle size of the glass frit is 2.5. mu.m. The particle shape of the glass frit is preferably circular, although other shapes may be used.
Fig. 1 to 4 show schematic cross-sectional views of a white LED device provided according to a preferred embodiment of the present invention. An exemplary embodiment of a white LED device provided according to the present invention will be described in more detail below with reference to fig. 1 to 4. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those skilled in the art.
As shown in fig. 1, in a preferred embodiment of the present invention, the white LED device further includes a substrate 30, and the blue LED chip 10 is fixed on the substrate 30 by a solder 50. The substrate 30 may be a PCB or the like; the blue LED chip 10 is soldered to the substrate 30 by solder 50.
In another preferred embodiment of the present invention, as shown in fig. 2, the white LED device further includes a substrate 30, and the blue LED chip 10 is fixed on the substrate 30 by a molding compound 60. The substrate 30 may be a PCB or the like; the molding compound 60 covers the entire surfaces of the blue LED chip 10 and the wavelength conversion layer 20, and the molding compound 60 is formed through a plastic molding process.
In another preferred embodiment of the present invention, as shown in fig. 3, the white LED device further includes a substrate 30, and the blue LED chip 10 is fixed on the substrate 30 by a potting compound 70. The substrate 30 may be a PCB or the like; the potting adhesive 70 covers all surfaces of the blue LED chip 10 and the wavelength conversion layer 20, and the potting adhesive 70 is formed by a potting process.
In still another preferred embodiment of the present invention, as shown in fig. 4, the white LED device further includes a holder bowl 40, the blue LED chip 10 is fixed in the holder bowl 40 by the wavelength conversion layer 20, and the wavelength conversion layer 20 covers the entire surface of the blue LED chip 10. Wherein the wavelength conversion layer 20 covers the entire surface of the blue LED chip 10 by a dispensing process and fixes the blue LED chip 10 in the support bowl 40.
According to one aspect of the invention, a method for manufacturing a white light LED device is also provided. The manufacturing method comprises the following steps: providing a blue LED chip; and forming a wavelength conversion layer on the light emitting surface of the blue LED chip, wherein the wavelength conversion layer is a mixture comprising fluorescent powder, glass powder and organic binder.
Blue light emitted by a blue light LED chip in the white light LED device formed by the manufacturing method can pass through the glass powder, namely the glass powder does not absorb the blue light; meanwhile, the manufacturing method adopts the glass powder to replace most of the organic binder, so that the influence of the change of the light transmission performance of the organic binder with low content at high temperature on the white light LED device is limited, and the color temperature drift of the white light LED device is improved.
An exemplary embodiment of a method of fabricating a white LED device provided according to the present invention will be described in more detail below. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to only the embodiments set forth herein. It should be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of these exemplary embodiments to those skilled in the art.
First, the blue LED chip 10 is provided. The blue LED chip 10 may be a blue LED commonly used in the art.
Then, a wavelength conversion layer 20 is formed on the light emitting surface of the blue LED chip 10, the wavelength conversion layer 20 being a mixture including a phosphor, a glass frit, and an organic binder. The blue light emitted by the blue LED chip 10 can pass through the glass powder, i.e., the glass powder does not absorb the blue light, so that the color temperature drift of the formed white LED device can be improved.
There are many methods of forming the wavelength conversion layer 20 described above. In a preferred embodiment, the step of forming the wavelength conversion layer 20 comprises: mixing and stirring fluorescent powder, glass powder and liquid binder to form a mixed material; coating the mixed material on the light emitting surface of the blue LED chip 10; a heat curing process is performed to form the wavelength conversion layer 20. The glass frit may be in the form of solid particles, but is not limited to this form, and may be, for example, a glass frit gel.
The manufacturing method provided by the invention further comprises a step of fixing the blue LED chip 10, and the steps have various realization methods. For example, the blue LED chip 10 may be fixed on the substrate 30 by a soldering process, thereby forming a base structure as shown in fig. 1. For another example, the blue LED chip 10 may be fixed on the substrate 30 by a plastic molding process, so as to form a matrix structure as shown in fig. 2. For another example, the blue LED chip 10 may be fixed on the substrate 30 by a glue filling process, so as to form a matrix structure as shown in fig. 3. For another example, the wavelength conversion layer 20 may cover the entire surface of the blue LED chip 10 by a dispensing process and the blue LED chip 10 may be fixed to the support cup 40, thereby forming the base structure as shown in fig. 4. The specific parameters of the above process can refer to the prior art, and are not described herein again.
As can be seen from the above embodiments, the above-described examples of the present invention achieve the following technical effects:
(1) the wavelength conversion layer in the white light LED device provided by the invention is a mixture comprising fluorescent powder, glass powder and organic binder. The glass powder in the wavelength conversion layer has the advantages of good transparency, high hardness, high temperature resistance, uniform particle size distribution and the like, so that blue light emitted by a blue light LED chip in the white light LED device can pass through the glass powder, namely the glass powder does not absorb the blue light; meanwhile, most of organic binders are replaced by the glass powder, so that the influence of the change of the light transmission performance of the organic binders with low content at high temperature on the white light LED device is limited, and the color temperature drift of the white light LED device is improved.
(2) The invention also adopts the glass powder with the refractive index which is the same as or similar to that of the organic binder, so that blue light emitted by the blue light LED chip has no interface when passing through the organic binder and the glass powder, thereby further improving the color temperature drift of the white light LED device.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A white LED device, comprising:
a blue LED chip (10);
the LED chip comprises a blue LED chip (10), a wavelength conversion layer (20) and an organic binder, wherein the wavelength conversion layer (20) is arranged on the light emitting surface of the blue LED chip (10), the wavelength conversion layer (20) is a mixture comprising fluorescent powder, glass powder and the organic binder, and the organic binder accounts for 15-20% of the wavelength conversion layer (20) in percentage by mass.
2. The white LED device of claim 1, wherein the glass frit has a refractive index that is the same as or similar to the refractive index of the organic binder.
3. The white LED device of claim 1, wherein the glass frit has a particle size of 2-50 μm.
4. The white LED device according to any one of claims 1 to 3, further comprising a substrate (30), wherein the blue LED chip (10) is fixed on the substrate (30) by a solder (50), a molding compound (60) or a potting compound (70).
5. The white LED device according to any one of claims 1 to 3, further comprising a support bowl (40), wherein the blue LED chip (10) is fixed in the support bowl (40) by the wavelength conversion layer (20), and wherein the wavelength conversion layer (20) covers the entire surface of the blue LED chip (10).
6. A method for manufacturing a white light LED device, the method comprising the steps of:
a wavelength conversion layer (20) is formed on a light emitting surface of a blue LED chip (10), the wavelength conversion layer is a mixture comprising fluorescent powder, glass powder and an organic binder, and in the wavelength conversion layer (20), the mass percentage of the organic binder is 15-20%.
7. The method of manufacturing according to claim 6, wherein the step of forming the wavelength conversion layer (20) comprises:
mixing and stirring the fluorescent powder, the glass powder and the liquid binder to form a mixed material;
coating the mixed material on the light emitting surface of the blue light LED chip (10);
and performing a heat curing process to form the wavelength conversion layer (20).
8. The manufacturing method according to claim 6 or 7, further comprising a step of fixing the blue LED chip (10) on a substrate (30) by a soldering process, a plastic encapsulation process or a potting process.
9. The manufacturing method according to claim 6 or 7, further comprising the step of covering the entire surface of the blue LED chip (10) with the wavelength conversion layer (20) by a dispensing process and fixing the blue LED chip (10) in a holder bowl (40).
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