CN202461081U

CN202461081U - Transit trough structure for cleaning silicon chips

Info

Publication number: CN202461081U
Application number: CN2012200600632U
Authority: CN
Inventors: 王建军
Original assignee: Changzhou Trina Solar Energy Co Ltd
Current assignee: Changzhou Trina Solar Energy Co Ltd
Priority date: 2012-02-23
Filing date: 2012-02-23
Publication date: 2012-10-03
Anticipated expiration: 2022-02-23

Abstract

The utility model relates to a transit trough structure for cleaning silicon chips, which comprises a box body, a plurality of silicon chip toolings and a filter screen, wherein the silicon chip toolings and the filter screen are arranged in the box body; the filter screen is arranged below the silicon chip toolings; each silicon chip tooling comprises two support plates, a connecting rod and silicon chip protection sheets bonded on the surfaces of the support plates; the sections of the support plates are L-shaped; the support plates are fixed together through the connecting rod fixed at the bottoms thereof; paired L-shaped stop blocks are fixed on the box body; the silicon chip toolings are arranged in the box body side by side through stop blocks; the filter screen adopts a groove-shaped structure; a handle is arranged on the filter screen; the stop blocks are fixed on the box body; and the filter screen is arranged in the box body through the stop blocks. The transit trough structure has the advantages that due to the silicon chip toolings, the stored silicon chips are hung in the air, so that scraps are deposited to the filter screen at the bottom for centralized treatment. Therefore, the problem that the cracked rate, the scrap rate and the fragment rate of the silicon chips stored for many times are high can be solved.

Description

Be used for the transfer sink structure that silicon chip cleans

Technical field

The utility model relates to silicon chip cleaning equipment technical field, particularly a kind of transfer sink structure that is used for the silicon chip cleaning.

Background technology

At present domestic and international solar energy industry has two kinds to the main method of single polysilicon crystal block slicing: the one, and the single polycrystalline crystal block of diamond dust grinding that structure is utilized structure steel wire high-speed cruising to drive and is suspended among the PEG is realized section; The 2nd, directly utilize the surface to inlay or be coated with the single polycrystalline crystal block realization of Buddha's warrior attendant line high-speed motion grinding in the environment of the cutting fluid section of the high rigidity material of eka-gold emery.No matter adopt any slice process in above two kinds of methods, when crystal bar after cutting machine is processed into silicon chip, several procedures just can become the finished product silicon chip below must passing through: 1. prerinse and coming unstuck; 2. clean; 3. testing, sorting is packed.Present domestic silicon chip is after prerinse is come unstuck and manually silicon chip is inserted slide cassette after cleaning machine cleans; Need manual handling to put into cleaning sink or transfer tank through prerinse and after coming unstuck at this process silicon chip so that clean after manually silicon chip being inserted slide cassette; The design rationality degree of tank and transfer tank directly determines personnel to insert the fragment ratio of slide cassette process at the carrying silicon chip and with silicon chip, reduce prerinse simultaneously and the carrying number of times of the back silicon chip that comes unstuck also can reduce greatly silicon chip the fragment ratio.Find that from the investigation of present most of silicon chip processing enterprise all have prerinse and the back silicon chip carrying and silicon chip inserted the high problem of slide cassette process fragment ratio of coming unstuck, this has also had a strong impact on the benefit of section factory.Tank and transfer tank reasonable in design and that be convenient to silicon chip circulation will reduce the fragment ratio in the silicon chip cleaning process greatly.

The utility model content

The utility model technical problem to be solved is: a kind of transfer sink structure that silicon chip cleans that is used for is provided, solves the unreasonable of existing transfer sink structure design, cause the fragment unfilled corner to collapse bad silicon chip ratio problem of higher such as limit.

The utility model solves the technical scheme that its technical problem adopted: a kind of transfer sink structure that is used for the silicon chip cleaning, comprise casing, silicon chip frock and screen pack, and silicon chip frock and screen pack are arranged in the casing, and screen pack is positioned at the below of silicon chip frock.

Further limit; The silicon chip frock comprises that two cross sections are L shaped gripper shoe, connecting rod and the silicon chip protection skin that is bonded in the gripper shoe surface; Two gripper shoes are fixed together through the connecting rod that is fixed on its bottom; Distance between two gripper shoes is a bit larger tham die size, the L shaped block of fixing pairing on the casing, and a plurality of silicon chip frocks are shelved in the casing through block side by side.

Further limit, screen pack adopts trench structure, and handle is arranged on the screen pack, fixed stop on the casing, and screen pack is shelved in the casing through block.

Further limit, tank floor is the inclined plane, in the extreme lower position of bottom half valve is set.

The beneficial effect of the utility model is: through silicon chip unsettled depositing in the transfer tank that prerinse is washed; Broken silicon wafers can be deposited in the following screen pack and focus on; No longer contact with the silicon chip of depositing; Save simultaneously silicon chip is moved into the step of inserted sheet tank from the transfer tank, this has just significantly reduced problems such as fragmentation, unfilled corner, crackle, has fundamentally avoided bad the high problem of proportion of fragmentation, unfilled corner and crackle that occurs in the road, back; In addition, the structural base of this design has the inclination angle, when changing water, as long as with the valve open below the tank, needn't painstakingly an end of tank be raised, has reduced employee's workload so greatly.

Comparison shows that through actual the use this novel silicon chip cleans transfer tank not only can be reduced fragment unfilled corner that silicon chip inserts the slide cassette process to collapse bad ratio such as limit be 0.1% by 0.5%, and has made things convenient for personnel's operation, has improved production efficiency.

Description of drawings

Below in conjunction with accompanying drawing the utility model is further specified.

Fig. 1 is the structural representation of the transfer sink structure of the utility model;

Fig. 2 is the structural representation of the silicon chip frock of the utility model;

Wherein: 1. casing, 2. silicon chip frock, 3. screen pack, 4. gripper shoe, 5. connecting rod, 6. block, 7. valve, 8. silicon chip.

The specific embodiment

As illustrated in fig. 1 and 2, a kind of transfer sink structure that is used for the silicon chip cleaning comprises casing 1, silicon chip frock 2 and screen pack 3, and silicon chip frock 2 is arranged in the casing 1 with screen pack 3, and screen pack 3 is positioned at the below of silicon chip frock 2.Casing 1 is a main material with the stainless steel iron sheet mainly

Silicon chip frock 2 comprises that two cross sections are L shaped gripper shoe 4, connecting rod 5 and the silicon chip protection skin that is bonded in gripper shoe 4 surfaces, and connecting rod 5 is a stainless steel.The gripper shoe 4 of the stainless steel material of two similar angle steel is fixed together through the connecting rod 5 that is welded on its bottom; Distance between two gripper shoes 4 is a bit larger tham silicon chip 8 sizes; The L shaped block 6 of fixing pairing on the casing 1, a plurality of silicon chip frocks 2 are shelved in the casing 1 through block 6 side by side.

Screen pack 3 adopts trench structure, to guarantee to deposit the crooked pressure that bears behind the broken compressing tablet; Screen pack has two handles, can frock be taken off then more for a long time and takes out cleaning to screen pack and get final product when depositing fragment.Fixed stop 6 on the casing 1, and screen pack 3 is shelved in the casing 1 through block 6.

Casing 1 bottom surface is that the angle of inclined plane and horizontal plane is 2 degree, and the extreme lower position in casing 1 bottom is provided with valve 7.

The innovation of the design concept of this transfer sink structure is: 1. through after the prerinse silicon chip 8 being placed in the transfer tank with unsettled placement, eliminating silicon chip 8 unfilled corner, fragmentation, the crack problem that causes because of silicon chip 8 local pressures when placing; 2. access silicon chip 8 easy cleanings and rapid when changing water have reduced personnel labor, have improved the quality of silicon chip 8 simultaneously, for silicon chip 8 further provides strong guarantee at the yield of battery-end.

Claims

1. one kind is used for the transfer sink structure that silicon chip cleans, and it is characterized in that: comprise casing (1), silicon chip frock (2) and screen pack (3), silicon chip frock (2) and screen pack (3) are arranged in the casing (1), and screen pack (3) is positioned at the below of silicon chip frock (2).

2. the transfer sink structure that is used for the silicon chip cleaning according to claim 1; It is characterized in that: described silicon chip frock (2) comprises that two cross sections are L shaped gripper shoe (4), connecting rod (5) and the silicon chip protection skin that is bonded in gripper shoe (4) surface; Two gripper shoes (4) are fixed together through the connecting rod (5) that is fixed on its bottom; Distance between two gripper shoes (4) is a bit larger tham die size; Casing (1) is gone up the L shaped block (6) of fixing pairing, and a plurality of silicon chip frocks (2) are shelved in the casing (1) through block (6) side by side.

3. the transfer sink structure that is used for the silicon chip cleaning according to claim 1; It is characterized in that: described screen pack (3) adopts trench structure; Screen pack has handle on (3), and casing (1) is gone up fixed stop (6), and screen pack (3) is shelved in the casing (1) through block (6).

4. the transfer sink structure that is used for the silicon chip cleaning according to claim 1, it is characterized in that: described casing (1) bottom surface is the inclined plane, the extreme lower position in casing (1) bottom is provided with valve (7).