A kind of novel transfer water tank
Technical field
The present invention relates to silicon ingot manufacturing technology fields, more particularly to a kind of novel transfer water tank.
Background technology
After slicer cuts silicon ingot degumming, the slice, thin piece of a knife stick would generally be placed individually into a water tank as transfer.It is existing
Water tank capacity is little, and a knife stick is enough put into reluctantly, and when water tank is in transportational process, the water in water tank can shake with transport,
To which by silicon chip band neat in water tank, at irregular, the silicon chip of similar two ingots easily collides, cause it is hidden split, chipping
Deng.
Invention content
The present invention in view of the above technical problems, the shortcomings that overcoming the prior art, provides a kind of novel transfer water tank, avoids silicon
Piece collides, hidden splits.
Include open babinet in order to solve the above technical problems, the present invention provides a kind of novel transfer water tank, in babinet
Equipped with several partition boards, the inner space of babinet is divided into several regions by partition board, is equipped in each region and is fixed on babinet
On Buffer Unit, Buffer Unit is fixedly arranged above storing frame, and storage frame bottom is strainer, is had between strainer and the bottom of box
Deposition space.
Technique effect:The present invention will be divided into multinugget region domain inside water tank, a silicon ingot corresponds to one piece of region, thus by phase
Mutually isolated between adjacent silicon ingot, avoiding the silicon chip of two neighboring silicon ingot from colliding leads to fragment;It is set simultaneously in storage frame bottom
Strainer is set, fine debris can be deposited under strainer, and fragment is avoided to be in contact with intact silicon chip, cause secondary burst apart;Wherein,
Storing frame is placed on Buffer Unit, can mitigate water in water tank transportational process and babinet shaking causes the silicon chip in storing frame
Dramatic impact, it is broken to reduce silicon chip.
The technical solution that the present invention further limits is:
Further, Buffer Unit includes several first springs and several second springs, and the first spring is outside storage frame bottom
Edge is uniformly arranged, and second spring is uniformly distributed in storing frame bottom centre position.
A kind of preceding novel transfer water tank, the coefficient of elasticity of the first spring are more than the coefficient of elasticity of second spring.
A kind of preceding novel transfer water tank, further includes buffing pad, and buffing pad is square frame-shaped, the gentle punching of storage frame bottom
It is respectively equipped with the card slot and fin structure of cooperation on seat, and is equipped with fixation positioning pin between card slot and fin.
A kind of preceding novel transfer water tank, babinet include the first sheet body and the second sheet body, and the first sheet body is more than second
Sheet body, several first sheet bodies can be assembled into babinet, and several first sheet bodies and several second sheet bodies can be assembled into babinet.
A kind of preceding novel transfer water tank, partition board include first partition and second partition, first partition with second every
Plate is placed in cross in babinet, and first partition is respectively equipped with buckling groove with second partition juxtaposition position.
A kind of preceding novel transfer water tank, babinet are equipped with vertical locating slot, by fixed between partition board and babinet
Position slot is connected and is fixed.
A kind of preceding novel transfer water tank, partition board are to have wave structure and telescopic soft board.
A kind of preceding novel transfer water tank, storing frame inner wall are equipped with pearl cotton pad.
The beneficial effects of the invention are as follows:
(1)Using the different spring of two kinds of coefficient of elasticity and cycle spring coefficient of elasticity bigger in the present invention, can effectively mitigate
Silicon chip is tilted and is shaken outward in storing frame and frame so that silicon chip is more steady in transport in storing frame and frame, reduces broken
It is broken;
(2)Storing frame is connected on buffing pad in the present invention, convenient for disassembly and assembly and fixed;
(3)Middle case tool of the present invention can be transported there are two types of the sheet body of size using different size of sheet body and quantity according to silicon chip
Quantitative requirement when defeated carries out free assembling so that transport is more flexible;
(4)Partition board is connect and is fixed with babinet by locating slot in the present invention, convenient for disassembly and assembly, can be adjusted greatly using flexible soft board
It is small, to adapt to different size of babinet;
(5)Pearl cotton pad is set in storing frame inner wall in the present invention, avoids contacting between silicon chip and water tank, forms certain inclination angle
Degree reduces hidden split.
Description of the drawings
Fig. 1 is the vertical view of the present embodiment;
Fig. 2 is storing frame and buffing pad connection diagram in the present embodiment;
Fig. 3 is Buffer Unit arrangement schematic diagram;
Wherein:1, babinet;2, first partition;3, second partition;4, storing frame;5, strainer;6, the first spring;7, second spring;
8, buffing pad;9, positioning pin;10, locating slot.
Specific implementation mode
A kind of novel transfer water tank provided in this embodiment, structure is as shown in Figs. 1-3, including open babinet 1, babinet 1
Including the first sheet body and the second sheet body, the first sheet body is more than the second sheet body, and several first sheet bodies can be assembled into babinet 1, Ruo Gan
One sheet body and several second sheet bodies can be assembled into babinet 1.
Several partition boards are equipped in babinet 1, partition board is to have wave structure and telescopic soft board.Partition board includes first partition
2 and second partition 3, first partition 2 is placed in cross in babinet 1 with second partition 3, and first partition 2 and the friendship of second partition 3
Fork overlapping part is respectively equipped with buckling groove, and the inner space of babinet 1 is divided into four regions.Babinet 1 is determined equipped with vertical
Position slot 10, is connected and is fixed by locating slot 10 between partition board and babinet 1.
Be equipped with the Buffer Unit being fixed on babinet 1 in each region, if Buffer Unit include several first springs 6 and
Dry second spring 7, the first spring 6 is uniformly arranged along 4 bottom outer edge of storing frame, and second spring 7 is uniformly distributed in 4 bottom of storing frame
Portion center, the coefficient of elasticity of the first spring 6 are more than the coefficient of elasticity of second spring 7.
Buffer Unit is fixedly arranged above storing frame 4, and 4 inner wall of storing frame is equipped with pearl cotton pad.4 bottom of storing frame is strainer 5,
There is deposition space between 1 bottom of strainer 5 and babinet.
Further include buffing pad 8, buffing pad 8 is square frame-shaped, and the card of cooperation is respectively equipped on 4 bottom of storing frame and buffing pad 8
Slot and fin structure, and fixed positioning pin 9 is equipped between card slot and fin.
Raw water box size is increased by assembling the first sheet body and the second sheet body, and it is four that water tank one, which is divided, a silicon ingot
A lattice in corresponding water tank, avoid colliding between silicon ingot and silicon ingot.Pearl cotton pad is arranged in 4 inner wall of storing frame, avoids silicon chip
It is contacted between water tank, forms certain angle of inclination, reduce hidden split.Strainer 5 is arranged in 4 bottom of storing frame, and tiny silicon chip is broken
Piece can be deposited under strainer 5, and avoiding fragment from being contacted with silicon chip, the secondary chipping of generation is hidden to be split.
In addition to the implementation, the present invention can also have other embodiment.It is all to use equivalent substitution or equivalent transformation shape
At technical solution, fall within the scope of protection required by the present invention.