CN103434755B - Buffering package unit and buffer packing case - Google Patents
Buffering package unit and buffer packing case Download PDFInfo
- Publication number
- CN103434755B CN103434755B CN201310406856.4A CN201310406856A CN103434755B CN 103434755 B CN103434755 B CN 103434755B CN 201310406856 A CN201310406856 A CN 201310406856A CN 103434755 B CN103434755 B CN 103434755B
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- China
- Prior art keywords
- bight
- substrate
- circuit card
- interior circuit
- package unit
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- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention provides a kind of buffer packing case, for holding plate-like product, described buffer packing case comprises peripheral cards, cover plate and at least one buffering package unit, described cover plate is covered in described peripheral cards and forms cavity, described buffering package unit is positioned in described cavity, described buffering package unit is provided with interior circuit card, bight damper element and side bumper member, buffering package unit of the present invention and buffer packing case adopt EPE to combine with cardboard and form bight damper element, side bumper member, save material, reduce costs, meet environmental demands.The plate-like product hardly differ for size, be of uniform thickness can share bight damper element, side bumper member, only need change interior circuit card, the peripheral cards of different size.The present invention also provides a kind of buffering package unit.
Description
Technical field
The present invention relates to a kind of buffering package unit and a kind of buffer packing case, for accommodation, the protection of plate-like product.
Background technology
In prior art, for plate-like product, the buffering package as display pannel, panel computer adopts full EPE cushion rubber (EPE, Expandable Polyethylene, expandability polyethylene) or cutter card structure usually.Wherein, EPE cushion rubber is expensive, take up room large, greatly increases storage, traffic cost; Cutter card structure adopts cardboard to make, and product is placed therein the risk that there is cutter card bent intermediate; And the size of each parts of this type of buffering package cannot change, replace, and only can adapt to the panel of single size, shape, the panel of different size classification can not be applicable to simultaneously, thus cause buffering package stock group in panel various, stock buildup pressure.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the invention provides a kind of volume little, the buffer packing case of multiple product can be held, for holding plate-like product, described buffer packing case comprises peripheral cards, cover plate and at least one buffering package unit, described cover plate is covered in described peripheral cards and forms cavity, described buffering package unit is positioned in described cavity, described buffering package unit is provided with interior circuit card, bight damper element and side bumper member, described bight damper element comprises bight substrate and is connected to the bight bump rubber of bight substrate, described side bumper member comprises side substrate and is connected to the side bump rubber of side substrate, bump rubber corresponding described plate-like product in described bight offers the first draw-in groove, the corresponding described plate-like product of described side bump rubber offers the second draw-in groove, described plate-like product is fastened in described first draw-in groove and the second draw-in groove.
Further, be provided with two buffering package unit in described buffer packing case peripheral cards, three laminatings of the interior circuit card of each buffering package unit are held in peripheral cards, and the remaining one side of described interior circuit card is held in adjacent interior circuit card.
Further, the bight substrate of described bight damper element, the side substrate of side bumper member adopt corrugated board to make, and bight bump rubber, side bump rubber adopt EPE material to make.
Further, described bight substrate comprises orthogonal first bight substrate and the second bight substrate, and described first bight baseplate-laminating is in cover plate, and the second bight baseplate-laminating is in interior circuit card.
Further, described buffering package unit is also provided with reinforcement frame, and described reinforcement frame is provided with at right angles vertical outer supporting surface, and described interior circuit card is provided with interior circuit card seamed edge, and the outer supporting surface of described reinforcement frame fits in the interior circuit card seamed edge of interior circuit card.
Further, two sides that described plate-like product is relative are held in bight damper element, thus interior circuit card is fitted tightly in peripheral cards.
A kind of buffering package unit, described buffering package unit is provided with interior circuit card, bight damper element and side bumper member, described bight damper element comprises bight substrate and is connected to the bight bump rubber of bight substrate, described side bumper member comprises side substrate and is connected to the side bump rubber of side substrate, bump rubber corresponding described plate-like product in described bight offers the first draw-in groove, the corresponding described plate-like product of described side bump rubber offers the second draw-in groove, and described plate-like product is fastened in described first draw-in groove and the second draw-in groove.
Further, the bight substrate of described bight damper element, the side substrate of side bumper member adopt corrugated board to make, and bight bump rubber, side bump rubber adopt EPE material to make.
Further, described buffering package unit is also provided with reinforcement frame, and described reinforcement frame is provided with at right angles vertical outer supporting surface, and described interior circuit card is provided with interior circuit card seamed edge, and the outer supporting surface of described reinforcement frame fits in the interior circuit card seamed edge of interior circuit card.
Further, described bight substrate comprises orthogonal first bight substrate and the second bight substrate, and described bight bump rubber is fixedly connected on the first bight substrate and the second bight substrate of described bight substrate.
Compared to prior art, buffering package unit of the present invention and buffer packing case adopt EPE to combine with cardboard and form bight damper element, side bumper member, save material, reduce costs, meet environmental demands.The plate-like product hardly differ for size, be of uniform thickness can share bight damper element, side bumper member, only need change interior circuit card, the peripheral cards of different size.Adopt peripheral cards sheathed two in circuit card structure, not only can increase entire compression, also can the length of single damper element, convenient processing.By arranging reinforcement frame, strengthen seamed edge protection.Buffering package unit of the present invention and buffer packing case, by the drop test of system, effectively can prevent the damage of product in storage, transport, use procedure, and by structure design, the degree of utilization making material can be made to reach the highest.
Accompanying drawing explanation
Fig. 1 is the structural representation of buffer packing case of the present invention.
Fig. 2 is the structural representation of buffering package unit of the present invention.
Detailed description of the invention
Illustrate below in conjunction with accompanying drawing and detailed description of the invention the present invention is further described.
Refer to Fig. 1 and Fig. 2, the invention provides a kind of buffering package unit and a kind of buffer packing case, can be used for holding, placing multiple plate-like product, and it is protected.Buffer packing case 10 in the present embodiment comprises peripheral cards 20, is covered in the cover plate 30 of peripheral cards 20, the buffering package unit 40 be arranged in circuit card.
Peripheral cards 20 is provided with the peripheral cards sidewall 210 enclosed as hollow cuboid, is bent to form peripheral cards seamed edge 220 between adjacent two peripheral cards sidewalls 210.In the present embodiment, peripheral cards 20 is folded to form by corrugated board.Cover plate 30 is covered in two openings that peripheral cards 20 is oppositely arranged thus forms closed cavity, and buffering package unit 40 is contained in described cavity.
The damper element that buffering package unit 40 comprises interior circuit card 41 and is arranged among interior circuit card 41.Interior circuit card 41 encloses and is formed for receiving cavity, and damper element is arranged in interior circuit card 41 for placement plate-like product.Similar with peripheral cards 20, interior circuit card 41 is provided with and encloses as circuit card sidewall 410 in hollow cuboid, and interior circuit card 41 offers opening in two sides relatively, is bent to form interior circuit card seamed edge 411 between adjacent interior circuit card sidewall 410.In the present embodiment, peripheral cards 20 is folded to form by corrugated board, and interior circuit card 41 is highly identical with peripheral cards 20, when interior circuit card 41 is arranged in peripheral cards 20, the interior circuit card sidewall 410 of interior circuit card 41 fits tightly the peripheral cards sidewall 210 in peripheral cards 20, and cover plate 30 is covered in interior circuit card 41 simultaneously.
Damper element is arranged in each in circuit card 41, for holding fixing plate-like product, and plays buffer protection function to plate-like product.In the present embodiment, described damper element comprises bight damper element 43, side bumper member 45.Bight damper element 43 correspondence is arranged at the bight of plate-like product, plays buffer protection to the corner of plate-like product.Side bumper member 45 correspondence is arranged at the side of plate-like product, shields to the side of plate-like product, and can prevent plate-like product from rocking.
In the present embodiment, bight damper element 43 comprises bight substrate 431 and is arranged at the bight bump rubber 433 on bight substrate 431.Bight substrate 431 is bent to L shape, and it comprises the first bight substrate 431 and the second bight substrate 431.In the present embodiment, bight substrate 431 is folded to form by corrugated board, and described first bight substrate 431 is perpendicular to the second bight substrate 431.During assembling, the first bight substrate 431 fits in cover plate 30, and the second bight substrate 431 fits in the interior circuit card sidewall 410 of interior circuit card 41.
Bight bump rubber 433 is fixedly connected on the inner side of bight substrate 431, and the bight of corresponding plate-like product is arranged.Bight bump rubber 433 is bar shaped bulk, it offers multiple first draw-in groove 4331, the first draw-in groove 4331 and extends along the direction being parallel to cover plate 30.First draw-in groove 4331 of multiple bights bump rubber 433 is mutually corresponding to be arranged, thus is convenient to plate-like product and is fastened in the first draw-in groove 4331, and ensures that two sides of plate-like product are vertical.In the present embodiment, the cross sectional shape of the first draw-in groove 4331 is rectangle, is understandable that, the cross sectional shape of the first draw-in groove 4331 can be consistent with the side edge shape of plate-like product.In the present embodiment, bight damper element 43 is equipped with multiple bight bump rubber 433 be parallel to each other at its first bight substrate 431 and the second bight substrate 431, for protecting the bight of plate-like product and the side in formation bight.
Side bumper member 45 comprises side substrate 451 and arranges the side bump rubber 453 on side substrate 451.In the present embodiment, side bumper member 45 be positioned over below cover plate 30 and be arranged at below two bight damper elements 43 between.Side bumper member 45 is provided with at least one side bump rubber 453, same, and side bump rubber 453 correspondence is provided with the second draw-in groove 4531.First draw-in groove 4331 of side bump rubber 453 is corresponding with the second draw-in groove 4531 of bight bump rubber 433 to be arranged.Because plate-like product is when being positioned over buffer packing case 10 of the present invention, the interior circuit card sidewall 410 of interior circuit card 41 and the peripheral cards sidewall 210 of peripheral cards 20 are vertically arranged usually, and plate-like product also inserts in the first draw-in groove 4331 of each damper element in vertical state.Therefore the usual correspondence of plate-like product center of gravity is positioned in the middle part of casing, and it easily shakes under the effect of the impulsive force from horizontal direction.By arranging side bumper member 45, the side of plate-like product being held, ensureing the stable of plate-like product and protection is formed to the side of plate-like product.Meanwhile, in the present embodiment, the area coverage of the bight bump rubber 433 be arranged on the bight damper element 43 of below is greater than the area coverage of the bight bump rubber 433 of the bight damper element 43 being arranged at top.Thus strengthen the degree of stability stablizing the below of plate-like product, prevent plate-like product from rocking.
Be understandable that, side bumper member 45 can be arranged at any side of plate-like product.In the present embodiment, the bight substrate 431 of bight damper element 43, the side substrate 451 of side bumper member 45 adopt corrugated board to make, bight bump rubber 433, side bump rubber 453 adopt EPE material (EPE, Expandable Polyethylene, expandability polyethylene) to make.
Buffering package unit 40 is also provided with strengthens frame 50.Strengthen frame 50 be bar shaped and formed by folding cardboard.Strengthen frame 50 and be provided with flanging along its bearing of trend, this reinforcement frame 50 is orthogonal strip along described flap folded, and its cross sectional shape is L shape.Strengthen frame 50 and be provided with at right angles vertical outer supporting surface.During assembling, the outer supporting surface strengthening frame 50 fits in the interior circuit card seamed edge 411 of interior circuit card 41, and bight bump rubber 433 is held in strengthens frame 50, thus the impact resistant capability of the seamed edge of buffer packing case 10.In the present embodiment, strengthen frame 50 and be arranged between interior circuit card 41 and bight damper element 43, side bumper member 45, also can thus prevent bight damper element 43, between side bumper member 45 and interior circuit card 41, produce gap, and then cause plate-like product to rock.
When plate-like product is positioned in buffering package unit 40, cover plate 30 water steadying being arranged at below sets firmly to be put, and is arranged on cover plate 30 by peripheral cards 20, and interior circuit card 41 is positioned among peripheral cards 20.The interior circuit card sidewall 410 of interior circuit card 41 fits in the peripheral cards sidewall 210 of peripheral cards 20.First bight damper element 43, side bumper member 45 are positioned over cover plate 30, and multiple plate-like product are fastened in respectively in the first draw-in groove 4331, second draw-in groove 4531.Two sides that plate-like product is relative are held in bight damper element 43, and then make interior circuit card 41 fit tightly in peripheral cards 20, both can prevent from producing gap between interior circuit card 41 and peripheral cards 20, interior circuit card 41 and peripheral cards 20 can be prevented again to be out of shape.After plate-like product places, above plate-like product, place bight damper element 43, and side bumper member 45 is set as required, finally by cover plate 30, peripheral cards 20, interior circuit card 41 are sealed.
In the present embodiment, be provided with two buffering package unit 40 in peripheral cards 20, thus make three laminatings of each buffering package unit 40 be held in the peripheral cards sidewall 210 of peripheral cards 20, remaining one side is held in adjacent buffering package unit 40.More than arrange and buffering package unit 40 can be made to clash in the coated lower opposing of peripheral cards 20, be out of shape; prevent the deformation of interior circuit card 41; when arranging more than two buffering package unit 40 in peripheral cards 20; whether buffering package unit 40 wherein may only support or only have one side to be held in peripheral cards 20; therefore its overall anti-deformability is poor, is unfavorable for the protection of the product be placed therein.
Buffering package unit 40 of the present invention and buffer packing case 10 adopt EPE to combine with cardboard and form bight damper element 43, side bumper member 45, save material, reduce costs, meet environmental demands.The plate-like product hardly differ for size, be of uniform thickness can share bight damper element 43, side bumper member 45, only need change interior circuit card 41, the peripheral cards 20 of different size.Adopt peripheral cards 20 sheathed two in circuit card 41 structure, not only can increase entire compression, also can the length of single damper element, convenient processing.Strengthening frame 50 by arranging, strengthening seamed edge protection.Buffering package unit 40 of the present invention and buffer packing case 10, by the drop test of system, effectively can prevent the damage of product in storage, transport, use procedure, and by structure design, the degree of utilization making material can be made to reach the highest.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (8)
1. a buffer packing case, for holding plate-like product, it is characterized in that: described buffer packing case comprises peripheral cards, cover plate and at least one buffering package unit, described cover plate is covered in described peripheral cards and forms cavity, described buffering package unit is positioned in described cavity, described buffering package unit is provided with interior circuit card, bight damper element and side bumper member, described bight damper element comprises bight substrate and is connected to the bight bump rubber of bight substrate, described side bumper member comprises side substrate and is connected to the side bump rubber of side substrate, bump rubber corresponding described plate-like product in described bight offers the first draw-in groove, the corresponding described plate-like product of described side bump rubber offers the second draw-in groove, described plate-like product is fastened in described first draw-in groove and the second draw-in groove, described bight substrate comprises orthogonal first bight substrate and the second bight substrate, described first bight baseplate-laminating is in cover plate, second bight baseplate-laminating is in interior circuit card.
2. buffer packing case according to claim 1, it is characterized in that: in described buffer packing case peripheral cards, be provided with two buffering package unit, three laminatings of the interior circuit card of each buffering package unit are held in peripheral cards, and the remaining one side of described interior circuit card is held in adjacent interior circuit card.
3. buffer packing case according to claim 1 or 2, is characterized in that: the bight substrate of described bight damper element, the side substrate of side bumper member adopt corrugated board to make, and bight bump rubber, side bump rubber adopt EPE material to make.
4. buffer packing case according to claim 1 or 2, it is characterized in that: described buffering package unit is also provided with reinforcement frame, described reinforcement frame is provided with at right angles vertical outer supporting surface, described interior circuit card is provided with interior circuit card seamed edge, and the outer supporting surface of described reinforcement frame fits in the interior circuit card seamed edge of interior circuit card.
5. buffer packing case according to claim 1 or 2, is characterized in that: two sides that described plate-like product is relative are held in bight damper element, thus interior circuit card is fitted tightly in peripheral cards.
6. a buffering package unit, for holding plate-like product, it is characterized in that: described buffering package unit is provided with interior circuit card, bight damper element and side bumper member, described bight damper element comprises bight substrate and is connected to the bight bump rubber of bight substrate, described side bumper member comprises side substrate and is connected to the side bump rubber of side substrate, bump rubber corresponding described plate-like product in described bight offers the first draw-in groove, the corresponding described plate-like product of described side bump rubber offers the second draw-in groove, described plate-like product is fastened in described first draw-in groove and the second draw-in groove, described bight substrate comprises orthogonal first bight substrate and the second bight substrate, described bight bump rubber is fixedly connected on the first bight substrate and the second bight substrate of described bight substrate.
7. buffering package unit according to claim 6, is characterized in that: the bight substrate of described bight damper element, the side substrate of side bumper member adopt corrugated board to make, and bight bump rubber, side bump rubber adopt EPE material to make.
8. buffering package unit according to claim 6, it is characterized in that: described buffering package unit is also provided with reinforcement frame, described reinforcement frame is provided with at right angles vertical outer supporting surface, described interior circuit card is provided with interior circuit card seamed edge, and the outer supporting surface of described reinforcement frame fits in the interior circuit card seamed edge of interior circuit card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310406856.4A CN103434755B (en) | 2013-09-09 | 2013-09-09 | Buffering package unit and buffer packing case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310406856.4A CN103434755B (en) | 2013-09-09 | 2013-09-09 | Buffering package unit and buffer packing case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103434755A CN103434755A (en) | 2013-12-11 |
| CN103434755B true CN103434755B (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310406856.4A Expired - Fee Related CN103434755B (en) | 2013-09-09 | 2013-09-09 | Buffering package unit and buffer packing case |
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| Country | Link |
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| CN (1) | CN103434755B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107697397B (en) * | 2017-09-30 | 2023-12-26 | 日海智能科技股份有限公司 | Packaging structure and packaging method |
| JP7005839B2 (en) * | 2018-01-22 | 2022-01-24 | 信越ポリマー株式会社 | Cushioning body and packing body |
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| CN203568168U (en) * | 2013-09-09 | 2014-04-30 | 东莞市美盈森环保科技有限公司 | Buffering packaging unit and buffering packaging box |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000327079A (en) * | 1999-05-24 | 2000-11-28 | Dainippon Printing Co Ltd | Substrate-carrying box |
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- 2013-09-09 CN CN201310406856.4A patent/CN103434755B/en not_active Expired - Fee Related
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|---|---|---|---|---|
| JP2990330B2 (en) * | 1994-12-22 | 1999-12-13 | 積水化成品工業株式会社 | Supporting frame for packaging |
| CN2525057Y (en) * | 2002-01-16 | 2002-12-11 | 均阳寰技股份有限公司 | Paper plastic package material for LCD liquid crystal panel |
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| CN103434755A (en) | 2013-12-11 |
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Granted publication date: 20151028 Termination date: 20200909 |