CN202384318U - 一种牢固的整流二极管 - Google Patents

一种牢固的整流二极管 Download PDF

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CN202384318U
CN202384318U CN 201120550024 CN201120550024U CN202384318U CN 202384318 U CN202384318 U CN 202384318U CN 201120550024 CN201120550024 CN 201120550024 CN 201120550024 U CN201120550024 U CN 201120550024U CN 202384318 U CN202384318 U CN 202384318U
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block
firm
fixed block
contiguous block
rectifying diode
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周涛
王兴龙
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Chongqing Pingwei Enterprise Co Ltd
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Chongqing Pingwei Enterprise Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本实用新型公开了一种牢固的整流二极管,涉及一种整流器件整流二极管,包括AT边框,AT边框由固定块和上芯块一体成型组成,上芯块上焊接有芯片,芯片与跳线的一端焊接,跳线的另一端与引脚焊接,芯片、跳线封装在环氧树脂塑封体内,上芯块与固定块连接处为还设有连接块,连接块为等腰梯形,连接块、固定块与上芯块一体成型,连接块的上底与固定块连接,连接块的下底与上芯块连接,本实用新型通过改变AT边框的结构使得环氧树脂塑封体与框架之间的牢固度大大提高,从而使本实用新型更加结实耐用,减小了环氧树脂塑封体与框架分裂致使产品电性受到影响甚至失效的情况发生。

Description

一种牢固的整流二极管
技术领域
本实用新型涉及一种整流器件整流二极管,特别是涉及一种牢固的整流二极管。
背景技术
现有技术中整流二极管AT边框的上芯块通常为长方形,导致环氧树脂塑封体与框架之间的牢固度较差,在安装在电路板时容易造成环氧树脂塑封体与框架分裂致使产品电性受到影响甚至失效。
因此本领域技术人员致力于开发一种提高环氧树脂塑封体与框架之间牢固度的整流二极管。
实用新型内容
有鉴于现有技术的上述缺陷,本实用新型所要解决的技术问题是提供一种提高环氧树脂塑封体与框架之间牢固度的整流二极管。
为实现上述目的,本实用新型提供了一种牢固的整流二极管,包括AT边框;所述AT边框由固定块和上芯块一体成型组成;所述上芯块上焊接有芯片;所述芯片与跳线的一端焊接;所述跳线的另一端与引脚焊接;所述芯片、跳线封装在环氧树脂塑封体内;所述上芯块与固定块连接处为还设有连接块;所述连接块为等腰梯形;所述连接块、固定块与上芯块一体成型;所述连接块的上底与所述固定块连接;所述连接块的下底与上芯块连接。
较佳的,所述连接块的上底为5.6mm。
较佳的,所述固定块、连接块与上芯块均为铜料片。
较佳的,所述跳线为铝线。
本实用新型的有益效果是:本实用新型通过改变AT边框的结构使得环氧树脂塑封体与框架之间的牢固度大大提高,从而使本实用新型更加结实耐用,减小了环氧树脂塑封体与框架分裂致使产品电性受到影响甚至失效的情况发生。
附图说明
图1是本实用新型的正面剖视图。
图2是本实用新型的侧面剖视图。
具体实施方式
下面结合附图和实施例对本实用新型作进一步说明:
如图1、图2所示,一种牢固的整流二极管,包括AT边框,所述AT边框由固定块1和上芯块2一体成型组成,所述上芯块2上焊接有芯片3,所述芯片3与跳线4的一端焊接,所述跳线4的另一端与引脚5焊接,所述芯片3、跳线4封装在环氧树脂塑封体6内,所述上芯块2与固定块1连接处为还设有连接块7,所述连接块7为等腰梯形,所述连接块7、固定块1与上芯块2一体成型,所述连接块7的上底与所述固定块1连接,所述连接块7的下底与上芯块2连接,所述连接块7的上底为5.6mm,所述固定块1、连接块7与上芯块2均为铜料片,所述跳线4为铝线。
封装时环氧树脂塑封料沿连接块7将连接块7与固定块1间的空隙部分填满,由于环氧树脂塑封体6与框架的接触面积增大,从而提高了环氧树脂塑封体6与框架之间的牢固度。
以上详细描述了本实用新型的较佳具体实施例。应当理解,本领域的普通技术人员无需创造性劳动就可以根据本实用新型的构思作出诸多修改和变化。因此,凡本技术领域中技术人员依本实用新型的构思在现有技术的基础上通过逻辑分析、推理或者有限的实验可以得到的技术方案,皆应在由权利要求书所确定的保护范围内。

Claims (4)

1.一种牢固的整流二极管,包括AT边框;所述AT边框由固定块(1)和上芯块(2)一体成型组成;所述上芯块(2)上焊接有芯片(3);所述芯片(3)与跳线(4)的一端焊接;所述跳线(4)的另一端与引脚(5)焊接;所述芯片(3)、跳线(4)封装在环氧树脂塑封体(6)内;其特征在于:所述上芯块(2)与固定块(1)连接处还设有连接块(7);所述连接块(7)为等腰梯形;所述连接块(7)、固定块(1)与上芯块(2)一体成型;所述连接块(7)的上底与所述固定块(1)连接;所述连接块(7)的下底与上芯块(2)连接。
2.如权利要求1所述的一种牢固的整流二极管,其特征是:所述连接块(7)的上底为5.6mm。
3.如权利要求1所述的一种牢固的整流二极管,其特征是:所述固定块(1)、连接块(7)与上芯块(2)均为铜料片。
4.如权利要求1所述的一种牢固的整流二极管,其特征是:所述跳线(4)为铝线。
CN 201120550024 2011-12-26 2011-12-26 一种牢固的整流二极管 Expired - Lifetime CN202384318U (zh)

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Granted publication date: 20120815