CN202357026U - Grinding device - Google Patents
Grinding device Download PDFInfo
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- CN202357026U CN202357026U CN2011204650960U CN201120465096U CN202357026U CN 202357026 U CN202357026 U CN 202357026U CN 2011204650960 U CN2011204650960 U CN 2011204650960U CN 201120465096 U CN201120465096 U CN 201120465096U CN 202357026 U CN202357026 U CN 202357026U
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- grinding pad
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Abstract
The utility model relates to a grinding device, which comprises a wafer adsorber, a grinding pad adsorber, a bar-shaped grinding pad and a grinding fluid supply device. The wafer adsorber adsorbs a wafer to be grinded, and a surface to be grinded of the wafer to be grinded faces upwards, the grinding pad adsorber adsorbs the bar-shaped grinding pad and presses the bar-shaped grinding pad on the surface to be grinded of the wafer to be grinded, and the grinding fluid supply device injects grinding fluid to the surface to be grinded of the wafer to be grinded. The grinding device is low in cost, uniform in grinding efficiency and particularly applicable to large-sized wafers.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to a kind of lapping device.
Background technology
(chemical mechanical polish, CMP) technology is a planarization commonly used in the semiconductor manufacturing industry to chemical-mechanical planarization.Shown in Figure 1 is to be applicable to that diameter is the chemical mechanical polishing device of the wafer of 200mm and 300mm in the prior art, and said lapping device comprises grinding plate (platen), adheres to grinding pad (pad) 11, grinding head (polishing head) 12, lapping liquid nozzle (slurry nozzle) 13 and grinding mat trimmer (dresser) 14 on the said grinding plate.
When carrying out cmp; Said grinding plate rotation; Drive said grinding pad 11 and rotate together, said lapping liquid nozzle 13 is to said grinding pad 11 jet grinding liquid, and the centrifugal force that produces through said grinding pad 11 rotations is evenly distributed on the said grinding pad 11 said lapping liquid; Said grinding head 12 adsorbs the wafer (not shown) that will grind; And the face to be ground of said wafer is pressed on the lapped face of said grinding pad 11, said grinding head 12 drives said wafer and rotates together, and the relative motion between the lapped face of through said wafer to be ground and said grinding pad 11 is with to be ground planarization of said wafer.In process of lapping; Can pile up wafer on the lapped face of said grinding pad 11 and ground the material that removes and the abrasive grains in the lapping liquid, these particulates will fill up, stop up the micropore hole on the lapped face, and the grainding capacity of said grinding pad 11 is descended; In addition; Grind after some wafers, it is smooth and smooth that the lapped face of said grinding pad 11 can become, and the grinding pad of this smooth surface can not keep lapping liquid; Can significantly reduce grinding rate, said grinding mat trimmer 14 is used to repair the lapped face of grinding pad 11.Said grinding mat trimmer 14 is pressed on the lapped face of said grinding pad 11 and rotation, on the lapped face of said grinding pad 11, produces cutting force, makes the lapped face of said grinding pad 11 be returned to comparatively ideal state again.
Lapping liquid is injected in earlier on the unlapped grinding pad of said wafer in the prior art; Flow on the grinding pad of said wafer covering through action of centrifugal force again; Be the lapping liquid that ejects of said lapping liquid nozzle 13 some can not be used for grinding, cause certain waste; In addition, its usefulness can descend after said grinding pad 11 used a period of times, though there is grinding mat trimmer 14 that it is repaired, still can not recover as before, i.e. grinding order is different, the grinding effect difference.
Along with wafer size constantly increases; The above wafer of diameter 450mm becomes the main flow of semicon industry gradually; The lapping device of prior art will adapt to the large scale wafer, and its size just must increase, and promptly the size of grinding head 12, grinding plate and grinding pad 11 all must increase; This just brings some problems: the size of grinding plate increases, and the stability during its rotation is difficult to control; The size of grinding pad 11 increases, and the route that lapping liquid is flowed through increases, and the waste that causes is big more.Therefore, to adapt to the increase of wafer size be unfavorable to the size of the lapping device through increasing prior art.
The utility model content
The purpose of the utility model is to provide a kind of lapping device, and cost is low, the grinding effect homogeneous, is specially adapted to the large scale wafer.
In order to reach above-mentioned purpose, the utility model provides a kind of lapping device, comprises wafer absorber, grinding pad absorber, bar shaped grinding pad and lapping liquid supply; Said wafer absorber adsorbs wafer to be ground, and the to be ground of said wafer to be ground faced up; Said grinding pad absorber adsorbs said bar shaped grinding pad, and said bar shaped grinding pad is pressed on to be ground of said wafer to be ground; Said lapping liquid supply is to be ground jet grinding liquid of said wafer to be ground.
Above-mentioned lapping device, wherein, said grinding pad absorber comprises housing, iron core, coil, first mechanical arm and second mechanical arm; Said iron core and coil are arranged in the said housing, and said coil is wrapped on the said iron core, and an end of said coil forms positive terminal, the other end formation negative pole end of said coil; Said housing forms the adsorption plane of the said bar shaped grinding pad of absorption near an end of wafer absorber; Said first mechanical arm and second mechanical arm are separately positioned on said housing both sides along its length, and are connected with said housing; Said bar shaped grinding pad comprises grinding layer and ferromagnetic layer, and a surface of said grinding layer is an abradant surface, and said ferromagnetic layer is arranged on another surface of said grinding layer.
Above-mentioned lapping device, wherein, the width of said bar shaped grinding pad is 0.5～10cm.
Above-mentioned lapping device, wherein, said wafer absorber comprises body, film, locating ring and support bar;
Be provided with gas passage in the said body, vacuumize the generation negative pressure, adsorb said wafer to be ground through said gas passage; Said film is arranged at an end of said body, and said wafer to be ground is adsorbed on the said film; Said locating ring is arranged at the end that said body is provided with film, and around said film; Said support bar is connected with the other end of said body.
Above-mentioned lapping device, wherein, said lapping liquid supply comprises carrier pipe, discharging tube, a plurality of nozzle and flow valve; One end of said carrier pipe connects said flow valve, and the other end of said carrier pipe is connected with said discharging tube; Said a plurality of nozzle is arranged on the said discharging tube, and the length direction of the said discharging tube in edge is arranged in a linear.
Above-mentioned lapping device, wherein, the spacing between adjacent two said nozzles equates arbitrarily; The straight line that said a plurality of nozzle arrangement forms is over against the diameter of said wafer to be ground.
Above-mentioned lapping device, wherein, said carrier pipe comprises the multichannel conveyance conduit, and the said conveyance conduit in each road connects a flow valve or the common flow valve that connects respectively, and the said conveyance conduit in each road all is connected with said discharging tube.
Above-mentioned lapping device; Wherein, Said lapping device also comprises first guide rail and second guide rail, and said first guide rail and second guide rail are arranged at the both sides of said wafer absorber respectively, and are parallel to each other; In grinding processing procedure, the two ends of said bar shaped grinding pad place respectively on said first guide rail and second guide rail.
Above-mentioned lapping device; Wherein, Said lapping device also comprises grinding pad receptacle and grinding pad gatherer, and said grinding pad receptacle and grinding pad gatherer are positioned at an end of said first guide rail and second guide rail, is arranged at the position that said grinding pad absorber conveniently takes, puts the bar shaped grinding pad.
Above-mentioned lapping device; Wherein, said grinding pad receptacle is the casing of an end opening, respectively is provided with a plurality of intermediate plates on the inner surface of the two opposite side walls of said grinding pad receptacle; Said intermediate plate and sidewall flexibly connect; Intermediate plate on the two opposite side walls is corresponding one by one, when said bar shaped grinding pad places in the said grinding pad receptacle, respectively has an intermediate plate to clamp the two ends of said bar shaped grinding pad respectively on the two opposite side walls.
Above-mentioned lapping device, wherein, said grinding pad gatherer is the casing of an end opening.
The lapping device of present embodiment uses the bar shaped grinding pad; Utilize the reciprocal translational motion of bar shaped grinding pad to come the face to be ground of whole wafer is ground, can dwindle the area (being size) of grinding pad greatly, therefore; The size of grinding pad absorber that is used to adsorb grinding pad is also less, control easily; To be ground of the direct directive wafer of lapping liquid of lapping liquid supply supply, lapping liquid can avoid waste; Every grinding finishes a wafer, and the bar shaped grinding pad is just changed once, not only can make the grinding effect of every wafer identical, and said lapping device no longer needs grinding mat trimmer, helps having reduced cost.
Description of drawings
The lapping device of the utility model is provided by following embodiment and accompanying drawing.
Fig. 1 is the vertical view of the lapping device of prior art.
Fig. 2 is the side view of the lapping device of the utility model embodiment one.
Fig. 3 is the sketch map of grinding pad absorber absorption bar shaped grinding pad in the utility model.
Fig. 4 is the sketch map when the bar shaped grinding pad breaks away from the grinding pad absorber in the utility model.
Fig. 5 is the sketch map of carrier pipe in the utility model.
Fig. 6 be the utility model embodiment two lapping device attach view.
Fig. 7 be the utility model embodiment three lapping device attach view.
Fig. 8 is the sketch map of grinding pad receptacle among the utility model embodiment three.
Fig. 9 is the sketch map of grinding pad gatherer among the utility model embodiment three.
The specific embodiment
Below will combine Fig. 2～Fig. 9 that the lapping device of the utility model is done further to describe in detail.
Embodiment one
Referring to Fig. 2, the lapping device of present embodiment comprises wafer absorber 200, grinding pad absorber 300, bar shaped grinding pad 400 and lapping liquid supply 500;
Said wafer absorber 200 is used to adsorb wafer 600 to be ground, and the to be ground of said wafer to be ground 600 faced up, and said wafer absorber 200 can drive said wafer to be ground 600 rotations;
Said grinding pad absorber 300 is used to adsorb said bar shaped grinding pad 400; And said bar shaped grinding pad 400 is pressed on to be ground of said wafer to be ground 600, said grinding pad absorber 300 can drive said bar shaped grinding pad 400 and on to be ground of said wafer 600 to be ground, do reciprocal translational motion; In the present embodiment, a ground wafer, said bar shaped grinding pad 400 needs to change once, and promptly said bar shaped grinding pad 400 is disposable grinding pad;
Said lapping liquid supply 500 is to be ground jet grinding liquid of said wafer 600 to be ground.
The lapping device of present embodiment uses the bar shaped grinding pad; Utilize the reciprocal translational motion of bar shaped grinding pad to come the face to be ground of whole wafer is ground, can dwindle the area (being size) of grinding pad greatly, therefore; The size of grinding pad absorber that is used to adsorb grinding pad is also less, fine control; To be ground of the direct directive wafer of lapping liquid of said lapping liquid supply 500 supplies, lapping liquid can avoid waste; Every grinding finishes a wafer; The bar shaped grinding pad is just changed once; Not only can make the grinding effect of every wafer identical, and said lapping device no longer needs grinding mat trimmer, greatly reduce cost (cost of bar shaped grinding pad is well below the cost of grinding mat trimmer).
For processing procedure is ground in monitoring in real time; Can in lapping device, assemble monitoring instrument, the lapping device of present embodiment can directly be contained in the probe 900 of monitoring instrument the top of said wafer to be ground 600, and is as shown in Figure 2; Can not have any impact to grinding processing procedure; Promptly the assembling monitoring instrument is not only convenient in the lapping device of present embodiment, and monitoring directly can improve monitoring effect.
Referring to Fig. 3, preferably, said grinding pad absorber 300 comprises housing 310, iron core 320, coil 330, first mechanical arm 340 and second mechanical arm 350;
Said iron core 320 is arranged in the said housing 310 with coil 330; Said coil 330 is wrapped on the said iron core 320; And an end of said coil 330 forms positive terminal 331, and the other end of said coil 330 forms negative pole end 332, is used for being connected with the positive and negative electrode of external power source;
Said housing 310 forms the adsorption plane 311 of the said bar shaped grinding pad 400 of absorption near an end of wafer absorber 200;
Said first mechanical arm 340 and second mechanical arm 350 are separately positioned on said housing 310 both sides along its length, and are connected with said housing 310, and said first mechanical arm 340 and second mechanical arm 350 can drive said housing 310 and do translational motion;
As shown in Figure 3; Said bar shaped grinding pad 400 comprises grinding layer 410 and ferromagnetic layer 420; Said grinding layer 410 is identical with the material of grinding pad in the prior art; One surface of said grinding layer 410 is an abradant surface, and said ferromagnetic layer 420 is arranged on another surface of said grinding layer 410, and the material of said ferromagnetic layer 420 for example is one or more in iron, steel, nickel, the cobalt.
Let said coil 330 switch on, said grinding pad absorber 300 produces the suction that attracts said ferromagnetic layer 420, said ferromagnetic layer 420 is held, thereby adsorb said bar shaped grinding pad 400, and is as shown in Figure 3; After said coil 330 outages, suction disappears, and said bar shaped grinding pad 400 breaks away from said grinding pad absorber 300, and is as shown in Figure 4.
During grinding; Said grinding pad absorber 300 adsorbs said bar shaped grinding pad 400; Said bar shaped grinding pad 400 is pressed on to be ground of said wafer to be ground 600; And drive said bar shaped grinding pad 400 in the reciprocal translational motion of doing on to be ground perpendicular to bar shaped grinding pad 400 length directions (shown in the arrow among Fig. 2), and this reciprocal translational motion is variable motion.
Preferably, said housing 310 is the cuboid cavity, and said iron core 320 is bar-shaped, and said coil 330 is wrapped on the said iron core 320 equably.
Preferably, the width of said bar shaped grinding pad 400 is 0.5～10cm.
Continuation is referring to Fig. 2, and preferably, said wafer absorber 200 comprises body 210, film (membrane) 220, locating ring 230 and support bar 240;
Be provided with gas passage 211 in the said body 210, produce negative pressure, adsorb said wafer to be ground 600 through said gas passage 211 vacuum-pumpings;
Said film 220 is arranged at an end of said body 210, and in grinding processing procedure, said wafer 600 to be ground is adsorbed on the said film 220, and to be ground facing up;
Said locating ring 230 is arranged at the end that said body 210 is provided with film 220; And around said film 220; When said wafer 600 to be ground is adsorbed on 220 last times of said film, the edge of said wafer 600 to be ground is surrounded by said locating ring 230, and said locating ring 230 is used to limit the position of said wafer to be ground 600; When preventing to rotate, said wafer 600 to be ground throws away from said wafer absorber 200;
Said support bar 240 is connected with the other end of said body 210, is used to support said body 210, and can drive said body 210 rotations.
Continuation is referring to Fig. 2, and preferably, said lapping liquid supply 500 comprises carrier pipe 510, discharging tube 520, a plurality of nozzle 530 and flow valve (not showing among Fig. 2);
One end of said carrier pipe 510 connects said flow valve, and said carrier pipe 510 is used to carry lapping liquid, and said flow valve is used to control the conveying capacity of lapping liquid in said carrier pipe 510;
The other end of said carrier pipe 510 is connected with said discharging tube 520;
Said a plurality of nozzle 530 is arranged on the said discharging tube 520, and the length direction of the said discharging tube 520 in edge is arranged in a linear, and preferably, the spacing between adjacent two said nozzles 530 equates arbitrarily;
In grinding processing procedure; Said discharging tube 520 is positioned to be ground top of said wafer to be ground 600; Said a plurality of nozzle 530 is towards to be ground of said wafer 600 to be ground, and preferably, said a plurality of nozzles 530 are arranged the diameter of the straight line of formation over against said wafer 600 to be ground.
Because said a plurality of nozzles 530 are towards to be ground of said wafer 600 to be ground; Be directly injected on to be ground from the lapping liquid of said a plurality of nozzle 530 ejections; Can improve the utilization rate of lapping liquid, the straight line that said a plurality of nozzles 530 arrangements form can make the utilization rate of lapping liquid reach maximum over against the diameter of said wafer 600 to be ground.
Referring to Fig. 5, preferably, said carrier pipe 510 comprises multichannel conveyance conduit 511; Each road conveyance conduit 511 is used to carry a kind of liquid, and said liquid for example is lapping liquid, deionized water or chemical reagent, and the said conveyance conduit 511 in each road can connect a flow valve respectively; Also can connect a flow valve jointly; The said conveyance conduit 511 in each road all is connected with said discharging tube 520, and like this, said carrier pipe 510 not only can be used for carrying lapping liquid; Also can be used for carrying deionized water and chemical reagent, increased the purposes of said carrier pipe 510.
Embodiment two
Referring to Fig. 6; Embodiment two is with the difference of embodiment one; The lapping device of present embodiment also comprises first guide rail 710 and second guide rail 720, and said first guide rail 710 and second guide rail 720 are arranged at the both sides of said wafer absorber 200 respectively, and are parallel to each other; In grinding processing procedure; The two ends of said bar shaped grinding pad 400 place respectively on said first guide rail 710 and second guide rail 720, and guide rail reciprocatingly slides (shown in the arrow among Fig. 6) in the guide rail upper edge at the two ends of said bar shaped grinding pad 400, and said first guide rail 710 and second guide rail 720 are used to support said bar shaped grinding pad 400; Abradant surface to guarantee said bar shaped grinding pad 400 is parallel to horizontal plane all the time in process of lapping, guarantee to grind homogeneous.
Preferably, the spacing R between said first guide rail 710 and second guide rail 720 is greater than the diameter D of the body 210 of said wafer absorber 200, the R=D+ Δ, wherein, Δ=1～10cm.
Embodiment three
Referring to Fig. 7; Embodiment three is with the difference of embodiment two; The lapping device of present embodiment also comprises grinding pad receptacle 810 and grinding pad gatherer 820; Said grinding pad receptacle 810 is used to deposit untapped bar shaped grinding pad; Said grinding pad gatherer 820 is used to deposit discarded bar shaped grinding pad, and said grinding pad receptacle 810 and grinding pad gatherer 820 are positioned at an end of said first guide rail 710 and second guide rail 720, are arranged at the position that said grinding pad absorber 300 conveniently takes, puts the bar shaped grinding pad.
Referring to Fig. 8, said grinding pad receptacle 810 is the casing of an end opening, when said bar shaped grinding pad 400 places in the said grinding pad receptacle 810, abradant surface down, ferromagnetic layer 420 up, preferably, said grinding pad receptacle 810 is the cuboid casing.
Preferably; Respectively be provided with a plurality of intermediate plates 811 on the two opposite side walls 812 of said grinding pad receptacle 810 and 813 the inner surface; Said intermediate plate 811 flexibly connects with sidewall 812,813; But said intermediate plate 811 opposing sidewalls 812,813 are rotated, and the intermediate plate 811 on the two opposite side walls 812 and 813 is corresponding one by one, when said bar shaped grinding pad 400 places in the said grinding pad receptacle 810; Respectively there is an intermediate plate 811 to clamp the two ends of said bar shaped grinding pad 400 respectively on the two opposite side walls 812 and 813; When preventing that said grinding pad absorber 300 from drawing a last bar shaped grinding pad 400, drive next bar shaped grinding pad 400, guarantee that promptly said grinding pad absorber 300 once only draws a bar shaped grinding pad 400.
Referring to Fig. 9, said grinding pad gatherer 820 is the casing of an end opening, when said bar shaped grinding pad 400 places in the said grinding pad gatherer 820, abradant surface down, ferromagnetic layer 420 up, preferably, said grinding pad gatherer 820 is the cuboid casing.
It is 450mm and above wafer that the lapping device of the utility model is not only applicable to diameter, and is applicable to that diameter is the wafer of 200mm or 300mm, but concerning the large scale wafer, the advantage of the lapping device of the utility model is more obvious.
Obviously, those skilled in the art can carry out various changes and modification to utility model and not break away from the spirit and the scope of the utility model.Like this, if these of the utility model are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these change and modification.
Claims (11)
1. a lapping device is characterized in that, comprises wafer absorber, grinding pad absorber, bar shaped grinding pad and lapping liquid supply;
Said wafer absorber adsorbs wafer to be ground, and the to be ground of said wafer to be ground faced up;
Said grinding pad absorber adsorbs said bar shaped grinding pad, and said bar shaped grinding pad is pressed on to be ground of said wafer to be ground;
Said lapping liquid supply is to be ground jet grinding liquid of said wafer to be ground.
2. lapping device as claimed in claim 1 is characterized in that, said grinding pad absorber comprises housing, iron core, coil, first mechanical arm and second mechanical arm;
Said iron core and coil are arranged in the said housing, and said coil is wrapped on the said iron core, and an end of said coil forms positive terminal, the other end formation negative pole end of said coil;
Said housing forms the adsorption plane of the said bar shaped grinding pad of absorption near an end of wafer absorber;
Said first mechanical arm and second mechanical arm are separately positioned on said housing both sides along its length, and are connected with said housing;
Said bar shaped grinding pad comprises grinding layer and ferromagnetic layer, and a surface of said grinding layer is an abradant surface, and said ferromagnetic layer is arranged on another surface of said grinding layer.
3. according to claim 1 or claim 2 lapping device is characterized in that the width of said bar shaped grinding pad is 0.5～10cm.
4. lapping device as claimed in claim 1 is characterized in that, said wafer absorber comprises body, film, locating ring and support bar;
Be provided with gas passage in the said body, vacuumize the generation negative pressure, adsorb said wafer to be ground through said gas passage;
Said film is arranged at an end of said body, and said wafer to be ground is adsorbed on the said film;
Said locating ring is arranged at the end that said body is provided with film, and around said film;
Said support bar is connected with the other end of said body.
5. lapping device as claimed in claim 1 is characterized in that, said lapping liquid supply comprises carrier pipe, discharging tube, a plurality of nozzle and flow valve;
One end of said carrier pipe connects said flow valve, and the other end of said carrier pipe is connected with said discharging tube;
Said a plurality of nozzle is arranged on the said discharging tube, and the length direction of the said discharging tube in edge is arranged in a linear.
6. lapping device as claimed in claim 5 is characterized in that, the spacing between adjacent two said nozzles equates arbitrarily; The straight line that said a plurality of nozzle arrangement forms is over against the diameter of said wafer to be ground.
7. lapping device as claimed in claim 5 is characterized in that said carrier pipe comprises the multichannel conveyance conduit, and the said conveyance conduit in each road connects a flow valve or the common flow valve that connects respectively, and the said conveyance conduit in each road all is connected with said discharging tube.
8. lapping device as claimed in claim 1; It is characterized in that; Said lapping device also comprises first guide rail and second guide rail, and said first guide rail and second guide rail are arranged at the both sides of said wafer absorber respectively, and are parallel to each other; In grinding processing procedure, the two ends of said bar shaped grinding pad place respectively on said first guide rail and second guide rail.
9. lapping device as claimed in claim 8; It is characterized in that; Said lapping device also comprises grinding pad receptacle and grinding pad gatherer; Said grinding pad receptacle and grinding pad gatherer are positioned at an end of said first guide rail and second guide rail, are arranged at the position that said grinding pad absorber conveniently takes, puts the bar shaped grinding pad.
10. lapping device as claimed in claim 9; It is characterized in that said grinding pad receptacle is the casing of an end opening, respectively be provided with a plurality of intermediate plates on the inner surface of the two opposite side walls of said grinding pad receptacle; Said intermediate plate and sidewall flexibly connect; Intermediate plate on the two opposite side walls is corresponding one by one, when said bar shaped grinding pad places in the said grinding pad receptacle, respectively has an intermediate plate to clamp the two ends of said bar shaped grinding pad respectively on the two opposite side walls.
11. lapping device as claimed in claim 9 is characterized in that, said grinding pad gatherer is the casing of an end opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204650960U CN202357026U (en) | 2011-11-21 | 2011-11-21 | Grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204650960U CN202357026U (en) | 2011-11-21 | 2011-11-21 | Grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202357026U true CN202357026U (en) | 2012-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204650960U Expired - Lifetime CN202357026U (en) | 2011-11-21 | 2011-11-21 | Grinding device |
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| CN (1) | CN202357026U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103223638A (en) * | 2013-04-28 | 2013-07-31 | 上海华力微电子有限公司 | Chemical machinery polishing device |
| CN108356684A (en) * | 2017-12-13 | 2018-08-03 | 中国电子科技集团公司第十三研究所 | A kind of semiconductor wafer polishing apparatus vacuum suction template and burnishing device |
| CN114074286A (en) * | 2020-08-17 | 2022-02-22 | 铠侠股份有限公司 | Polishing apparatus and polishing method |
-
2011
- 2011-11-21 CN CN2011204650960U patent/CN202357026U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103223638A (en) * | 2013-04-28 | 2013-07-31 | 上海华力微电子有限公司 | Chemical machinery polishing device |
| CN103223638B (en) * | 2013-04-28 | 2016-04-13 | 上海华力微电子有限公司 | Chemical-mechanical grinding device |
| CN108356684A (en) * | 2017-12-13 | 2018-08-03 | 中国电子科技集团公司第十三研究所 | A kind of semiconductor wafer polishing apparatus vacuum suction template and burnishing device |
| CN108356684B (en) * | 2017-12-13 | 2024-02-06 | 中国电子科技集团公司第十三研究所 | Vacuum adsorption template for semiconductor wafer polishing device and polishing device |
| CN114074286A (en) * | 2020-08-17 | 2022-02-22 | 铠侠股份有限公司 | Polishing apparatus and polishing method |
| CN114074286B (en) * | 2020-08-17 | 2024-04-26 | 铠侠股份有限公司 | Polishing apparatus and polishing method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130503 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130503 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120801 |