CN202188336U - LED lamp bulb with favorable heat dissipation property - Google Patents
LED lamp bulb with favorable heat dissipation property Download PDFInfo
- Publication number
- CN202188336U CN202188336U CN2011202371506U CN201120237150U CN202188336U CN 202188336 U CN202188336 U CN 202188336U CN 2011202371506 U CN2011202371506 U CN 2011202371506U CN 201120237150 U CN201120237150 U CN 201120237150U CN 202188336 U CN202188336 U CN 202188336U
- Authority
- CN
- China
- Prior art keywords
- ceramic package
- outer housing
- metal inner
- led
- ceramic outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
An LED lamp bulb with favorable heat dissipation property comprises a burner and a ceramic outer housing fixedly connected with the burner, wherein an LED luminous component is mounted in the ceramic outer housing; a metal inner housing is fixed in the ceramic outer housing; the outer surface of the metal inner housing is in close contact with the inner surface of the ceramic outer housing; and the LED luminous component is in close contact with the metal inner housing. By adopting the LED lamp bulb, heat given out by the LED luminous component is quickly equalized to the inner surface of the ceramic outer housing through the metal inner housing, and then quickly radiated in the air through the ceramic outer housing, so that the heat conduction deficiency of the ceramic outer housing is compensated, the heat dissipation property of the LED lamp bulb is improved, and meanwhile, the advantages of the ceramic outer housing are reserved. Therefore, the LED lamp bulb has the advantages of both the ceramic outer housing and the metal outer housing.
Description
Technical field
The utility model relates to bulb, relates in particular to light emitting diode or the light-emitting diode chip for backlight unit LED bulb as light-emitting component.
Background technology
A kind of LED bulb that adopts ceramic package has appearred in recent years.Compare with the LED bulb of Traditional use metal shell, adopt the LED bulb of ceramic package to have insulation safety property height, be difficult for oxidation, corrosion resistant advantage.Yet because the thermal conductivity factor of ceramic material is not very high (20 ~ 50 W/mK), and the LED bulb mainly relies on the ceramic package heat radiation, and therefore the heat dispersion of the LED bulb of this employing ceramic package is not ideal enough.
The utility model content
The purpose of the utility model provides a kind of LED bulb that adopts ceramic package and have excellent heat dispersion performance.
The utility model is achieved in that the LED bulb with excellent heat dispersion performance; Comprise lamp holder, the ceramic package that is fixedly connected with lamp holder; The LED luminescence component is installed in ceramic package; In said ceramic package, be fixed with the metal inner casing, the outer surface of metal inner casing closely contacts with the inner surface of ceramic package, and the LED luminescence component closely contacts with the metal inner casing.
The utility model has the advantages that: utilize the rapid samming of heat that the metal inner casing sends the LED luminescence component inner surface to ceramic package; Be radiated heat in the air fast through ceramic package again; Mi has mended the deficiency of ceramic package aspect heat conduction; Improved the heat dispersion of LED bulb, kept the advantage of ceramic package simultaneously, made the advantage of LED bulb with ceramic package and metal shell.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is a three-dimensional installation diagram embodiment illustrated in fig. 1;
Fig. 3 is the structural representation of the utility model embodiment two;
Fig. 4 is a three-dimensional installation diagram embodiment illustrated in fig. 3.
The specific embodiment
Embodiment one
Embodiment illustrated in figures 1 and 2 is a LED ball bubble, belongs to a kind of of LED bulb.This LED ball bubble comprises lamp holder 1, and the ceramic package 2 that is fixedly connected with lamp holder 1 is equipped with the LED luminescence component in ceramic package 2.Because ceramic package 2 is the cup shape, therefore often ceramic package 2 is called " Lamp cup " in the industry.The LED luminescence component is made up of the substrate 3 of heat conduction and insulation and a plurality of light-emitting diode chip for backlight unit 4 that are welded on the substrate 3.In ceramic package 2, be fixed with metal inner casing 5, the outer surface of metal inner casing 5 closely contacts with the inner surface of ceramic package 2.The top of metal inner casing 5 is fixed with a sheet metal 5a, and sheet metal 5a is the part of metal inner casing 5.But sheet metal 5a and metal inner casing 5 global formations.The substrate 3 of LED luminescence component closely contacts with sheet metal 5a.Substrate 3 can adopt integrated forming techniques such as welding, punching press with the connected mode that sheet metal 5a closely contacts.Ceramic package 2 used ceramic materials can adopt the ceramic material of existing exothermic coefficient >=0.9, for example high alumina ceramic, aluminium nitride ceramics, silicon carbide ceramics, contain rare earth glass pottery, composite ceramics, high frequency porcelain or the like.The molding mode of ceramic package 2 can adopt injection moulding, injection, slip casting, dry-pressing or the like.Metal inner casing 5 can adopt the composite of aluminium, copper, gold, silver or these metals to process.
LED ball bubble illustrated in figures 1 and 2 comprises that also lampshade 6 and drive circuit 7 wait other parts.
Embodiment two
Fig. 3 and embodiment shown in Figure 4 are the LED shot-lights, belong to a kind of of LED bulb.This LED shot-light comprises lamp holder 1, and the ceramic package 2 that is fixedly connected with lamp holder 1 is equipped with the LED luminescence component in ceramic package 2.The ceramic package 2 of this LED shot-light also is to be the cup shape, therefore also often is referred to as in the industry " Lamp cup ".The LED luminescence component is made up of the substrate 3 of heat conduction and insulation and a plurality of light emitting diodes 8 that are welded on the substrate 3.In ceramic package 2, be fixed with metal inner casing 5, the outer surface of metal inner casing 5 closely contacts with the inner surface of ceramic package 2.The bottom of metal inner casing 5 is fixed with a sheet metal 5b, and sheet metal 5b is the part of metal inner casing 5.But sheet metal 5b and metal inner casing 5 global formations.The substrate 3 of LED luminescence component closely contacts with sheet metal 5b.Substrate 3 can adopt integrated forming techniques such as welding, punching press with the connected mode that sheet metal 5b closely contacts.
The ceramic package 2 of present embodiment and the material selection of metal inner casing 5 and molding mode are identical with embodiment one, repeat no more.
Fig. 3 and LED shot-light shown in Figure 4 comprise that also lens 9 and drive circuit 7 wait other members.
As the further improvement of the utility model, should fill heat-conducting glue or thermal grease conduction in the gap between the inner surface of the outer surface of metal inner casing 5 and ceramic package 2, reduce the thermal contact resistance between metal inner casing 5 and the ceramic package 2 with this.
Claims (2)
1. the LED bulb that has excellent heat dispersion performance; Comprise lamp holder, the ceramic package that is fixedly connected with lamp holder; The LED luminescence component is installed in ceramic package; It is characterized in that: in said ceramic package, be fixed with the metal inner casing, the outer surface of metal inner casing closely contacts with the inner surface of ceramic package, and the LED luminescence component closely contacts with the metal inner casing.
2. the LED bulb with excellent heat dispersion performance as claimed in claim 1 is characterized in that: the gap between the inner surface of the outer surface of said metal inner casing and ceramic package is filled with heat-conducting glue or thermal grease conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202371506U CN202188336U (en) | 2011-07-07 | 2011-07-07 | LED lamp bulb with favorable heat dissipation property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202371506U CN202188336U (en) | 2011-07-07 | 2011-07-07 | LED lamp bulb with favorable heat dissipation property |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202188336U true CN202188336U (en) | 2012-04-11 |
Family
ID=45919787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202371506U Expired - Fee Related CN202188336U (en) | 2011-07-07 | 2011-07-07 | LED lamp bulb with favorable heat dissipation property |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202188336U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588905A (en) * | 2012-02-10 | 2012-07-18 | 何永祥 | Screw lamp cap for heat dissipation |
-
2011
- 2011-07-07 CN CN2011202371506U patent/CN202188336U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102588905A (en) * | 2012-02-10 | 2012-07-18 | 何永祥 | Screw lamp cap for heat dissipation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203481273U (en) | LED light source module based on AlSiC composite substrate | |
| CN102734649A (en) | High-efficiency ceramic infrared-radiation radiating LED lamp | |
| CN201576701U (en) | Metal cooling device for LED lamp chip | |
| CN102612304A (en) | Heat radiation base plate and manufacturing method thereof | |
| CN202303268U (en) | Moulding device with integrated heat conduction and heat radiation for LED (light-emitting diode) | |
| CN201796950U (en) | Light emitting diode light source structure | |
| CN202188336U (en) | LED lamp bulb with favorable heat dissipation property | |
| CN102781164A (en) | Novel special circuit board for LED (light-emitting diode) lighting fixture | |
| CN202419611U (en) | Heat dissipation device of light-emitting diode (LED) light source | |
| CN201487854U (en) | High thermal conductivity LED lamp | |
| CN101924178A (en) | LED heat radiating device | |
| CN101581406B (en) | Thermotube type high-power LED lamp | |
| CN101545620A (en) | Led lamp | |
| CN202487657U (en) | Composite type light-emitting diode (LED) package substrate | |
| CN202101047U (en) | High-power LED (light-emitting diode) light source module with excellent heat dissipation performance | |
| CN201269415Y (en) | LED lamp | |
| CN202177080U (en) | LED (light-emitting diode) lamp device applying silicon-urethane foaming and radiating materials | |
| CN204577460U (en) | Adopt the LED encapsulation structure of nitride multilayer aluminium base | |
| CN202018991U (en) | Ceramic bracket for packaging light emitting diode (LED) integrated light source | |
| CN204271136U (en) | The heat-radiating substrate of brilliant COB light source is covered for street lamp | |
| CN204885139U (en) | Thyrite arrester fin | |
| CN202927571U (en) | LED (Light Emitting Diode) lamp directly packaged on radiator | |
| CN201788999U (en) | LED heat dissipating device | |
| CN201611668U (en) | High-power LED chip package integrated aluminium-based ceramic composite plate | |
| CN202454557U (en) | LED integrated module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SIHUI KANGRONG FINE CERAMICS CO., LTD. Free format text: FORMER OWNER: MO ZHUORONG Effective date: 20150710 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150710 Address after: Sihui City, Guangdong city in Zhaoqing province 526253 Jiang Gu Zhen Li Zhai Shi Tantai Patentee after: Sihui Kang Rong Fine Ceramics Co., Ltd. Address before: 528226 Guangdong Province, Foshan City Nanhai Luocun Industrial Avenue Langsha Kang Rong Photoelectric Technology Co. Ltd. Patentee before: Mo Zhuorong |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20200707 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |