CN201985085U - Wafer taking tool - Google Patents
Wafer taking tool Download PDFInfo
- Publication number
- CN201985085U CN201985085U CN2011200127339U CN201120012733U CN201985085U CN 201985085 U CN201985085 U CN 201985085U CN 2011200127339 U CN2011200127339 U CN 2011200127339U CN 201120012733 U CN201120012733 U CN 201120012733U CN 201985085 U CN201985085 U CN 201985085U
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- wafer
- sheet body
- shaped sheet
- instrument
- shape plates
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Abstract
The utility model discloses a wafer taking tool. The tool is a T-shaped sheet body, the upper end of the T-shaped sheet body takes the shape of a circular ring or an elliptical ring, the lower part of the T-shaped sheet body is linear, and a cutting edge is formed at the end part of the linear part; the thickness of the T-shaped sheet body ranges from 0.1mm to 0.4mm; the T-shaped sheet body is made of a spring stainless steel sheet; and circular arc-shaped corners are arranged at two right angles where the upper end and the lower part of the T-shaped sheet body are connected. The wafer taking tool has the advantages of ingenious conception, scientific design, simple structure, strong practicability, less possibility of wafer damage, high speed in taking wafers, simplicity, safety and reliability in operation, high efficiency, and high qualification rate of wafers.
Description
Technical field
The utility model relates to the frock of using in a kind of piezoelectric quartz crystal thickness sheet processing, specifically, has related to two kinds of wafers and has got the sheet instrument.
Background technology
Along with developing rapidly of large scale integrated circuit, the electronic device manufacturing is more and more higher to the quality requirement on quartz crystal surface, i.e. the degree of wafer its damage in cutting, grinding and polishing process and the degree of depth are the keys of crystalline material cutting.Wire cutting machine is to obtain a kind of hard brittle material cutting equipment of developing rapidly in recent ten years, and it comprises uses free abrasive and concretion abrasive two classes, and motion mode and machine tool structure according to the saw silk can be divided into reciprocating type scroll saw and unidirectional scroll saw.The most widely used in optoelectronics industry at present is reciprocating type multi-thread saw, and the carborundum that high rigidity is used in the line cutting is as abrasive material, and its typical abrasives is of a size of below the 20 μ m, can implement accurate, narrow saw kerf cutting to hard brittle material, and can realize the processing that is shaped.Along with application and the development in large scale semiconductor and the cutting of photocell thin slice, the line cutting shows a series of unrivaled advantages gradually: little as working surface damnification, curve table shape is little, section is thin, the thick high conformity of sheet, energy cutting large size crystal, the material saving, the efficient height, high efficiency, output is big etc.
At present, multi-thread cutting is because of the working (machining) efficiency height, and loss is few, is fit to wafer process in enormous quantities, in the cutting of crystalline material, has obtained using widely.The multi-line cutting machine cutting is adopted in the cutting of wafer mostly, along with the increase of crystal diameter, and circle cutting and multitool cutting in multi-thread cutting will substitute fully.The line cutting produces good economic benefit owing to slice on the unit length, but also because slice is many, and wafer is thinner, causes the damage sheet more in the course of processing, makes accepted product percentage reduce; Especially after wire cutting machine cuts wafer, it is directly to get by hand that tradition is got sheet mode, because wafer thickness only is 0.15mm, and wafer is a fragile material, and sheet and sheet and rod are very little with the slit of rod, have only the spacing about 0.20mm, and people's finger is thicker relatively, each operative employee's gimmick is different, is difficult to avoid the meeting damage wafers when getting sheet thereby cause, and causes accepted product percentage to reduce.In order to overcome above problem, people are seeking a kind of technical solution always.
The utility model content
The purpose of this utility model is to overcome the defective that exists in the prior art, thus provide a kind of design science, simple in structure, practical, get that sheet is quick, the reliable wafer of handling safety is got the sheet instrument.
For achieving the above object, the technical solution of the utility model is a kind of wafer instrument of getting of design, it is characterized in that, the T-shaped plates of described instrument, the upper end of described T shape plates is annulus or oval ring, the bottom of described T shape plates is yi word pattern, is formed with cutting edge in the end of described yi word pattern.
Optimized technical scheme is that the thickness of described T shape plates is 0.1mm～0.4mm.
Best technical scheme, the thickness of described T shape plates is 0.23mm.
Optimized technical scheme comprises that also described T shape plates adopt the spring stainless steel substrates to make.
Optimized technical scheme comprises that also the place, two right angles of intersecting in the upper end and the bottom of described T shape plates is provided with arc chord angle.
Advantage of the present utility model and beneficial effect are: this is got wafer and is skillfully constructed with instrument, and design science is simple in structure, and is practical.Adopt this instrument to get wafer, it is few to decrease sheet, and speed is fast, and is simple to operate, safe and reliable, efficient height, wafer qualification rate height.
Description of drawings
Fig. 1 is that the utility model is got wafer tool construction schematic diagram;
Fig. 2 is the schematic side view of Fig. 1.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only are used for the technical solution of the utility model more clearly is described, and can not limit protection range of the present utility model with this.
As shown in Figure 1 and Figure 2, the utility model is a kind of wafer instrument of getting, the T-shaped plates 1 of this instrument, and the upper end 2 of described T shape plates 1 is annulus or oval ring, the bottom 3 of described T shape plates is yi word pattern, is formed with cutting edge 4 in the end of described yi word pattern.The thickness of described T shape plates is 0.1mm～0.4mm.Wherein Zui Jia technical scheme is that the thickness of described T shape plates is 0.23mm.
The utility model preferred embodiment comprises that also described T shape plates 1 adopt the spring stainless steel substrates to make.The place, two right angles of intersecting in described T shape plates 1 upper end and bottom is provided with arc chord angle 5.
After wire cutting machine has cut wafer, with kerosene wafer is cleaned earlier, remove drop liquid; Use the sheet instrument of originally getting, in the slit between this instrument insertion wafer and the wafer, because the thickness of frock is 0.23mm, and the slit between wafer and the wafer is 0.20mm, when frock arrives the cover glass of bottom of wafer, because thickness difference is not disconnected with glass; When fetching frock, wafer is adsorbed on the frock, thereby has taken out wafer owing to the vacuum that kerosene causes; Use this method, wafer is excellent, has improved the output capacity of wafer greatly.
The above only is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (5)
1. get the wafer instrument for one kind, it is characterized in that, the T-shaped plates of described instrument, the upper end of described T shape plates is annulus or oval ring, and the bottom of described T shape plates is yi word pattern, is formed with cutting edge in the end of described yi word pattern.
2. the wafer instrument of getting according to claim 1 is characterized in that the thickness of described T shape plates is 0.1mm～0.4mm.
3. the wafer instrument of getting according to claim 2 is characterized in that the thickness of described T shape plates is 0.23mm.
4. according to claim 1 or the 2 or 3 described wafer instruments of getting, it is characterized in that described T shape plates adopt the spring stainless steel substrates to make.
5. the wafer instrument of getting according to claim 4 is characterized in that, the place, two right angles of intersecting in the upper end and the bottom of described T shape plates is provided with arc chord angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200127339U CN201985085U (en) | 2011-01-17 | 2011-01-17 | Wafer taking tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200127339U CN201985085U (en) | 2011-01-17 | 2011-01-17 | Wafer taking tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201985085U true CN201985085U (en) | 2011-09-21 |
Family
ID=44612541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200127339U Expired - Fee Related CN201985085U (en) | 2011-01-17 | 2011-01-17 | Wafer taking tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201985085U (en) |
-
2011
- 2011-01-17 CN CN2011200127339U patent/CN201985085U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110921 Termination date: 20140117 |