CN201405456Y - Crystal plate taking tool - Google Patents
Crystal plate taking tool Download PDFInfo
- Publication number
- CN201405456Y CN201405456Y CN2009200906006U CN200920090600U CN201405456Y CN 201405456 Y CN201405456 Y CN 201405456Y CN 2009200906006 U CN2009200906006 U CN 2009200906006U CN 200920090600 U CN200920090600 U CN 200920090600U CN 201405456 Y CN201405456 Y CN 201405456Y
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- CN
- China
- Prior art keywords
- wafer
- sheet
- instrument
- crystal
- lamellar body
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a crystal plate taking tool which takes on a T-shaped plate body; the plate body has the thickness of 0.2-0.3mm; the preferential thickness of the plate body is 0.25mm; andthe plate body is made of a spring steel plate. The crystal plate taking tool is ingenious in conception, scientific in design, simple in structure and strong in practicability, and has the advantagesof fewer broken plates, rapid speed, simple operation as well as being safe, reliable and high in efficiency and high in percent of pass of crystal plates when the crystal plates are taken.
Description
Technical field
The utility model relates to the frock of using in a kind of piezoelectric quartz crystal thickness sheet processing, specifically, has related to a kind of wafer and has got the sheet instrument.
Background technology
Along with developing rapidly of large scale integrated circuit, the device manufacturing is more and more higher to the surface quality requirement of quartz crystal, i.e. the degree of wafer its damage in cutting, grinding and polishing process and the degree of depth are the keys of crystalline material cutting; Wire cutting machine is to obtain a kind of hard brittle material cutting equipment of developing rapidly in recent ten years, and it comprises uses free abrasive and concretion abrasive two classes, and motion mode and machine tool structure according to the saw silk can be divided into reciprocating type scroll saw and unidirectional scroll saw; The most widely used in optoelectronics industry at present is reciprocating type multi-thread saw; The carborundum that high rigidity is used in the line cutting is as abrasive material, and its typical abrasives is of a size of below the 20 μ m, can implement accurate, narrow saw kerf cutting to hard brittle material, and can realize the processing that is shaped; Along with application and the development in large scale semiconductor and the cutting of photocell thin slice, the line cutting shows a series of unrivaled advantages gradually: working surface damnification is little, curve table shape is little, section is thin, the thick high conformity of sheet, energy cutting large size crystal, the material saving, the efficient height, high efficiency, output is big etc.
At present, multi-thread cutting is because of the working (machining) efficiency height, and loss is few, is fit to wafer process in enormous quantities, in the cutting of crystalline material, has obtained using widely; The multi-line cutting machine cutting is adopted in the cutting of wafer mostly, along with the increase of crystal diameter, and circle cutting and multitool cutting in multi-thread cutting will substitute fully; The line cutting produces good economic benefit owing to slice on the unit length, but also because slice is many, and wafer is thinner, causes the damage sheet more in process, makes accepted product percentage reduce; Especially after wire cutting machine cuts wafer, it is directly to get by hand that tradition is got sheet mode, because wafer thickness only is 0.15mm, and crystal is fragile material, and sheet and sheet and rod are very little with the slit of rod, have only the 0.20mm spacing, and people's finger is thicker relatively, each operative employee's gimmick is different, thereby causes the wafer that has been difficult to the damage avoided when getting sheet, causes accepted product percentage to reduce.
In order to overcome above problem, people are seeking a kind of technical solution always.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, thus provide a kind of design science, simple in structure, practical, get that sheet is quick, the reliable wafer of handling safety is got the sheet instrument.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of wafer is got the sheet instrument, and this instrument is T-shaped lamellar body.
Based on above-mentioned, described body thickness is 0.2mm～0.3mm; The described preferred 0.25mm of body thickness.
Based on above-mentioned, described lamellar body adopts spring steel plate to make.
Based on above-mentioned, the place, right angle of described lamellar body T shape both sides respectively is provided with a breach, and described breach is 3/4ths circles.
The utility model has substantive distinguishing features and progress with respect to prior art, and specifically, this wafer is got the sheet instrument and is skillfully constructed, and design science is simple in structure, and is practical; Adopt this instrument to get sheet, it is few to decrease sheet, and speed is fast, and is simple to operate, safe and reliable, efficient height, wafer qualification rate height.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
The specific embodiment
Provide the specific embodiment of the present utility model below in conjunction with accompanying drawing:
As shown in Figure 1, a kind of wafer is got the sheet instrument, and this instrument is T-shaped lamellar body 1.
Based on above-mentioned, described lamellar body 1 thickness is 0.2mm～0.3mm, the preferred 0.25mm of described lamellar body 1 thickness.
Based on above-mentioned, described lamellar body 1 adopts spring steel plate to make.
Based on above-mentioned, the place, right angle of described lamellar body 1T shape both sides respectively is provided with a breach 2, that is, and and in the transversal piece 3 of described lamellar body 1 and vertically crossing at right angle place of lamellar body 4; Described transversal piece 3 and described vertical lamellar body 4 constitute T-shaped lamellar body 1;
Described breach 2 is 3/4ths circles.
After wire cutting machine has cut wafer, with kerosene wafer is cleaned earlier, remove drop liquid; Use the sheet instrument of originally getting, in the slit between this instrument insertion wafer and the wafer, because the thickness of frock is 0.25mm, and the slit between wafer and the wafer is 0.20mm, when frock arrives the cover glass of bottom of wafer, because thickness difference is not disconnected with glass; When fetching frock, wafer is adsorbed on the frock, thereby has taken out wafer owing to the vacuum that kerosene causes; Use this method, wafer is excellent, has improved the output capacity of wafer greatly.
Should be noted that at last: above embodiment only is not intended to limit in order to the explanation the technical solution of the utility model; Although with reference to preferred embodiment the utility model is had been described in detail, those of ordinary skill in the field are to be understood that: still can make amendment or the part technical characterictic is equal to replacement the specific embodiment of the present utility model; And not breaking away from the spirit of technical solutions of the utility model, it all should be encompassed in the middle of the technical scheme scope that the utility model asks for protection.
Claims (5)
1, a kind of wafer is got the sheet instrument, it is characterized in that: this instrument is T-shaped lamellar body.
2, a kind of wafer according to claim 1 is got the sheet instrument, it is characterized in that: described body thickness is 0.2mm～0.3mm.
3, a kind of wafer according to claim 2 is got the sheet instrument, it is characterized in that: described body thickness is 0.25mm.
4, get the sheet instrument according to claim 1 or 2 or 3 described a kind of wafers, it is characterized in that: described lamellar body adopts spring steel plate to make.
5, a kind of wafer according to claim 4 is got the sheet instrument, it is characterized in that: the place, right angle of described lamellar body T shape both sides respectively is provided with a breach, and described breach is 3/4ths circles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200906006U CN201405456Y (en) | 2009-06-02 | 2009-06-02 | Crystal plate taking tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200906006U CN201405456Y (en) | 2009-06-02 | 2009-06-02 | Crystal plate taking tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201405456Y true CN201405456Y (en) | 2010-02-17 |
Family
ID=41676381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200906006U Expired - Fee Related CN201405456Y (en) | 2009-06-02 | 2009-06-02 | Crystal plate taking tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201405456Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103230894A (en) * | 2013-04-11 | 2013-08-07 | 中国科学院上海硅酸盐研究所 | Cleaning process of bismuth germanate wafer |
-
2009
- 2009-06-02 CN CN2009200906006U patent/CN201405456Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103230894A (en) * | 2013-04-11 | 2013-08-07 | 中国科学院上海硅酸盐研究所 | Cleaning process of bismuth germanate wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100217 Termination date: 20130602 |