CN201904367U - Scribing platform deck special for solar battery chip - Google Patents
Scribing platform deck special for solar battery chip Download PDFInfo
- Publication number
- CN201904367U CN201904367U CN201020660075XU CN201020660075U CN201904367U CN 201904367 U CN201904367 U CN 201904367U CN 201020660075X U CN201020660075X U CN 201020660075XU CN 201020660075 U CN201020660075 U CN 201020660075U CN 201904367 U CN201904367 U CN 201904367U
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- Prior art keywords
- cutting
- chip
- track
- scribing
- solar battery
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a scribing platform deck special for a solar battery chip and thoroughly solves the problems that the back side of a silicon slice is easy to crack when the traditional scribing equipment scribes is solved. The scribing platform deck comprises a sucking disc for fixing the solar battery chip, a main shaft provided with a slicing knife, and a feed motor. The utility model has the technical key points that a scribing rail is arranged on the upper surface of the sucking disc according to the forming size of the chip; the sucking disc is divided into a chip forming area and a plurality of leftover fixing areas by the scribing track of the scribing rail; a plurality of V-shaped gas loops are respectively arranged on the upper surfaces of the chip forming area and the leftover fixing areas; the width of a groove body of the scribing rail is greater than that of a groove body of each V-shaped gas loop; and the lowest point on the excircle of the blade of the slicing knife is allowed to be lower than the upper surface of the sucking disc in the scribing process, so that the chip is completely penetrated. According to the scribing platform deck, leftover materials can be fixedly cut while the back crack is effectively reduced and the scribing finished product rate is improved and the damage of the blade to the leftover materials is avoided.
Description
Technical field
The utility model relates to the processing unit (plant) of wafer being implemented processing, and the special-purpose cutting-up microscope carrier of particularly a kind of solar battery chip is applicable to the scribing operation of manufacture of solar cells.
Background technology
In the middle of effective utilization of solar energy, big sun can solar photovoltaic utilization be a research field with fastest developing speed in the last few years, most active, is one of project that wherein attracts most attention.One procedure is arranged scribing in manufacture of solar cells, and scribing machine is one of key equipment indispensable in the scribing operation.
Common crystal silicon solar energy battery is to make on the high-quality silicon chip of thickness 350～450 μ m, in the process of existing cutting-up solar cell, when saw blade is cut at high speed rotating, the sharp high rigidity particles of silicon carbide of its protrusion of surface is shoveled cutting part and is dug, because these mechanical forces are to act directly on crystal column surface and produce stress damage at crystals, so be easy to generate the silicon chip back side problem of bursting apart.Usually, we burst apart the back side and are controlled at below the 50 μ m, surpass 50 μ m and just are considered to exist potential risks.Burst apart size when surpassing 100 μ m when the back side, and there is integrity problem in chip.More serious bursting apart can cause chip damaged, and such chip is then directly scrapped, and increases production cost.For the extent control burst apart in the silicon chip back side below 50 μ m, do not influence the crudy of chip, the penetraction depth of the strict control slicer of the industry is even more important so the control of the precision of slicer penetraction depth just seems.
Be to disclose a kind of suction plate bench in " processing unit (plant) and suction plate bench " patent application of 200710149164.0 as application number, this suction plate bench has the suction section that suction keeps wafer, the framework that forms by metal around this suction section, this suction section is provided with adsorption plane, the framework back side is provided with SS, connectivity slot, suction socket, all be used to aspirate the wafer on the microscope carrier, precision for the penetraction depth that guarantees slicer, the reference position that promptly keeps slicer and suction plate bench upper surface, it is crooked because of variations in temperature suction plate bench can not occur, perhaps suction section is broken, perhaps suction section is from the situation of framework disengaging, this suction section is formed by the roughly the same porous ceramic of the coefficient of linear expansion and the coefficient of linear expansion of the metal that forms framework, the improvement of this suction plate bench has realized the precision control to the slicer penetraction depth to a certain extent, but still does not fundamentally solve the problem of bursting apart in the silicon chip back side.That is, it is identical with in the past cutting-up technology: the work microscope carrier surface (chuck surface) that it adopts---absorption face only is provided with a kind of gas return path (shown in Fig. 4,6), and the setting of this gas return path is also just brought into and fixed workpiece in order to form negative pressure.In the cutting-up process, do not draw disconnected chip, reserve 4-5 thickness, and then carry out the secondary sliver, adopt mechanical system that leftover pieces are removed.The result who does like this tends to cause chip to occur breaking on microscope carrier, and the chip that breaks might hurt blade, and causes chip damaged owing to break, and forms useless sheet, and percent defective improves, and increases production cost.
The applicant finds in the process of constantly research, production, can produce a main cause that the back of the body collapses and be exactly crystals in the cutting-up process and produce stress and can not discharge timely, just existing microscope carrier can not satisfy the release request of crystals stress in the cutting-up process.Based on this, the applicant thinks that existing cutting-up microscope carrier still need improve.
Summary of the invention
The purpose of this utility model is in order to provide a kind of structural design more reasonable, can satisfy the special-purpose cutting-up microscope carrier of solar battery chip that the crystals Stress Release requires, fundamentally solve and be prone to the problem of bursting apart in the silicon chip back side when having the scribing of cutting-up equipment now, the utility model is when effectively the minimizing back of the body collapses, improves the cutting-up rate of finished products, fixedly the leftover pieces after the cutting have been avoided leftover pieces damage blade.
The technical solution of the utility model is: the special-purpose cutting-up microscope carrier of this solar battery chip, the sucker that comprises the fixed solar battery chip, be equipped with the main shaft of slicer, the feeding motor, its technical essential is: described sucker upper surface is offered the cutting-up track by the chip forming dimension, the cutting-up track of described cutting-up track is separated into a chip shaping district and some leftover pieces fixed areas with described sucker, described chip shaping district and leftover pieces fixed area upper surface are provided with the plurality of V-shaped gas return path respectively, the cell body width of described cutting-up track is greater than the cell body width of described V-type gas return path, and can make that blade cylindrical minimum point is lower than described sucker upper surface in the described slicer cutting-up process, run through chip fully.
The cross section of described cutting-up track cell body is rectangle or trapezoidal or arc, and its width L is greater than the blade thickness s of described slicer, and depth H probes into the degree of depth h of described cutting-up track greater than described slicer blade.
Described sucker is square, described chip shaping district off-centre is arranged at described sucker top, described cutting-up track is divided into horizontal cutting-up road, vertical cutting-up road and chamfering cutting-up road, two adjacent edges that described chip shaping is distinguished overlap with described sucker two adjacent edges respectively, and the both sides in addition in described chip shaping district are separated with vertical cutting-up road by the horizontal cutting-up road of described cutting-up track respectively.
The chamfering in described chip shaping district is formed by the chamfering cutting-up road of described cutting-up track.
SS and the described sucker inner gas communication circuit communication that be provided with of described V-type gas return path by being provided with on it, the SS that described gas communication loop utilizes described sucker lower surface to be provided with is communicated with external vacuum source.
Described sucker is made by resistant material.
Advantage of the present utility model and positive technique effect: because the utility model microscope carrier surface loop has two kinds, a kind of is shallow V-type gas return path, can utilize this V-type gas return path to make it before processing, form the negative pressure band and fix workpiece, simultaneously can utilize it to fix leftover pieces after machining, the leftover pieces after the cutting can not drop from the work microscope carrier yet.Another kind is dark cutting-up track, the width of this cutting-up track and the degree of depth are all greater than the V-type gas return path, can allow the blade that loads on main shaft through-wafer fully in the process of cutting-up, the purpose of doing like this is exactly the smooth surface that makes the chip cutting-up, has omitted the operation of secondary sliver.Owing to the width, the degree of depth that have strengthened cutting-up track cell body, not only can pass through blade, also make chip inner stress that produces when cutting-up in time obtain discharging, effectively reduced the situation generation that the silicon chip back of the body collapses, improved the cutting-up rate of finished products.
In addition, chip of the present utility model is shaped and distinguishes eccentric one jiao in the sucker that is arranged at, changed the set-up mode of being located at the sucker center, specifically: chip be shaped the district two adjacent edges respectively with sucker two adjacent edges on same straight line, then these both sides of processed chip and a chamfering just do not need cutting-up processing; And chip be shaped the district both sides in addition respectively by the horizontal cutting-up road of cutting-up track and vertically the cutting-up road be separated, only need utilize the cutting-up cutter along horizontal cutting-up road and vertically the cutting-up track cutting-up on cutting-up road form the both sides in addition of processed chip; And utilize the chamfering cutting-up rail mark of cutting-up track to form three chamferings that chip is shaped and distinguishes.Then entire chip is shaped only needs the cutting-up cutter along cutting-up track cutting-up 5 cuttves, just can be formed into 4 limits, 4 chamferings of core sheet, and chip in the past is shaped then needs cutting-up 8 cuttves, has significantly improved the operating efficiency of chip manufacture.
Description of drawings
The utility model is described in further detail in conjunction with the accompanying drawings:
Fig. 1 is a kind of structural representation sketch of the present utility model;
Fig. 2 is the upward view of Fig. 1;
Fig. 3 is the cross sectional representation of the utility model cutting-up track cell body;
Fig. 4 is the cross sectional representation of the utility model V-type gas return path, also is raw-gas loop schematic cross-section;
Fig. 5 is the schematic cross-section that utilizes the utility model cutting-up chip;
Fig. 6 is the schematic cross-section of common cutting-up microscope carrier cutting-up chip;
Fig. 7 is another structural representation sketch of the present utility model;
Sequence number explanation among the figure: 1 chip be shaped the district, 2 201 202 203 204 205 206 207 leftover pieces fixed areas, 301 vertical cutting-up roads, 302 horizontal cutting-up roads, 303 304 305 chamfering cutting-up roads, 4 401 402 403 404 405 406
407 the gas return path of 408V type, 5 SSs, 6 gas communication loops, 7 blades, 8 chips.
Embodiment
Be described in detail according to Fig. 1-7 pair the utility model.The utility model is in order effectively to satisfy the release request of crystals stress, sucker on the work on hand microscope carrier is improved, improved key is to make the blade that loads on main shaft through-wafer fully in the process of cutting-up in the structure, and does not damage the working face of sucker.
The special-purpose cutting-up microscope carrier of this solar battery chip is made up of the sucker of fixed solar battery chip, the main shaft that is equipped with slicer, feeding motor etc.Wherein: sucker is made by resistant material, as stainless steel material, is square.Utilize sucker of the present utility model cutting solar cell can be divided into that 5 cuttves are finished cutting and 8 cuttves are finished cutting according to Fig. 1 and cutting-up track shown in Figure 7 different.Fig. 1 is the improved structure setting of Fig. 7, can save the time of 3 cuttves, significantly improves operating efficiency and cutting-up effect.Specific as follows:
Embodiment one, sucker upper surface are offered the cutting-up track by the chip forming dimension, and the cutting-up track of cutting-up track is separated into a chip shaping district 1 and some leftover pieces fixed areas 201,202,203,204,205,206,207 with sucker.The cutting-up track is divided into horizontal cutting-up road 302, vertical cutting-up road 301 and chamfering cutting-up road 303,304,305.Because of the shaping chip be all square, as shown in Figure 1, chip 1 eccentric one jiao of the sucker top that is arranged at, district that is shaped, be shaped two adjacent edges in district 1 of chip overlap with sucker two adjacent edges respectively, the wherein both sides of the chip that then is shaped and a chamfering do not need to process.And other both sides in chip shaping district 1 are separated by horizontal cutting-up road 302 and vertical cutting-up road 301 of cutting-up track respectively, and other both sides of shaping chip utilize horizontal cutting-up road 302 and vertical cutting-up road 301 cutting-ups to form.Three chamferings of remainder in chip shaping district are formed by the chamfering cutting-up road 303,304,305 of cutting-up track respectively.Chip shaping district 1 and leftover pieces fixed area 201,202,203,204,205,206,207 upper surfaces are provided with plurality of V-shaped gas return path 401,402,403,404,405,406,407,408 respectively, shown in Fig. 1 or 7, the simple technique of painting is adopted in the V-type gas return path, is actually the track of V-type gas return path shown in the figure.Shown in Fig. 3,5, the cross section of cutting-up track cell body is rectangle or trapezoidal or arc, the cell body degree of depth of cutting-up track and width are respectively greater than the cell body degree of depth and the width of V-type gas return path, its width L is greater than the blade thickness s of slicer, depth H probes into the degree of depth h of cutting-up track greater than the slicer blade, the cutting-up track can make that blade 7 cylindrical minimum points are lower than the sucker upper surface in the slicer cutting-up process, runs through chip 8 fully.V-type gas return path 401,402,403,404,405,406,407,408 is communicated with the inner gas communication loop 6 that is provided with of sucker by the SS 5 that is provided with on it respectively, the SS that gas communication loop 6 utilizes the sucker lower surface to be provided with is communicated with the dotted portion of gas communication loop 6 as shown in Fig. 1 or 7 with the external vacuum source (not shown).
Embodiment two, as shown in Figure 7, the chip district 1 that is shaped also can be arranged at center, sucker top.The sucker upper surface is offered cutting-up track 301,302,303 by the chip forming dimension, and the cutting-up track of cutting-up track is divided into some leftover pieces fixed areas 2 with the periphery that sucker is separated into a chip shaping district 1, chip shaping district 1.Chip shaping district 1 and leftover pieces fixed area 2 upper surfaces are provided with plurality of V-shaped gas return path 4 respectively, and the degree of depth, the width of cutting-up track 301,302,303 and V-type gas return path are provided with embodiment one.
Claims (6)
1. the special-purpose cutting-up microscope carrier of a solar battery chip, the sucker that comprises the fixed solar battery chip, be equipped with the main shaft of slicer, the feeding motor, it is characterized in that: described sucker upper surface is offered the cutting-up track by the chip forming dimension, the cutting-up track of described cutting-up track is separated into a chip shaping district and some leftover pieces fixed areas with described sucker, described chip shaping district and leftover pieces fixed area upper surface are provided with the plurality of V-shaped gas return path respectively, the cell body width of described cutting-up track is greater than the cell body width of described V-type gas return path, and can make that blade cylindrical minimum point is lower than described sucker upper surface in the described slicer cutting-up process, run through chip fully.
2. the special-purpose cutting-up microscope carrier of solar battery chip according to claim 1, it is characterized in that: the cross section of described cutting-up track cell body is rectangle or trapezoidal or arc, its width L is greater than the blade thickness s of described slicer, and depth H probes into the degree of depth h of described cutting-up track greater than described slicer blade.
3. the special-purpose cutting-up microscope carrier of solar battery chip according to claim 1 and 2, it is characterized in that: described sucker is square, described chip shaping district off-centre is arranged at described sucker top, described cutting-up track is divided into horizontal cutting-up road, vertical cutting-up road and chamfering cutting-up road, two adjacent edges that described chip shaping is distinguished overlap with described sucker two adjacent edges respectively, and the both sides in addition in described chip shaping district are separated with vertical cutting-up road by the horizontal cutting-up road of described cutting-up track respectively.
4. the special-purpose cutting-up microscope carrier of solar battery chip according to claim 3 is characterized in that: the chamfering in described chip shaping district is formed by the chamfering cutting-up road of described cutting-up track.
5. the special-purpose cutting-up microscope carrier of solar battery chip according to claim 1, it is characterized in that: SS and the described sucker inner gas communication circuit communication that be provided with of described V-type gas return path by being provided with on it, the SS that described gas communication loop utilizes described sucker lower surface to be provided with is communicated with external vacuum source.
6. the special-purpose cutting-up microscope carrier of solar battery chip according to claim 1, it is characterized in that: described sucker is made by resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020660075XU CN201904367U (en) | 2010-12-15 | 2010-12-15 | Scribing platform deck special for solar battery chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020660075XU CN201904367U (en) | 2010-12-15 | 2010-12-15 | Scribing platform deck special for solar battery chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201904367U true CN201904367U (en) | 2011-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020660075XU Expired - Lifetime CN201904367U (en) | 2010-12-15 | 2010-12-15 | Scribing platform deck special for solar battery chip |
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| Country | Link |
|---|---|
| CN (1) | CN201904367U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102082206A (en) * | 2010-12-15 | 2011-06-01 | 沈阳仪表科学研究院 | Special scribing and cutting worktable for solar cell chip |
-
2010
- 2010-12-15 CN CN201020660075XU patent/CN201904367U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102082206A (en) * | 2010-12-15 | 2011-06-01 | 沈阳仪表科学研究院 | Special scribing and cutting worktable for solar cell chip |
| CN102082206B (en) * | 2010-12-15 | 2012-09-05 | 沈阳仪表科学研究院 | Special scribing and cutting worktable for solar cell chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110720 Effective date of abandoning: 20120905 |