CN201845808U - 支架组合件、封装结构及其发光装置 - Google Patents
支架组合件、封装结构及其发光装置 Download PDFInfo
- Publication number
- CN201845808U CN201845808U CN2010205434127U CN201020543412U CN201845808U CN 201845808 U CN201845808 U CN 201845808U CN 2010205434127 U CN2010205434127 U CN 2010205434127U CN 201020543412 U CN201020543412 U CN 201020543412U CN 201845808 U CN201845808 U CN 201845808U
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- CN
- China
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- guiding access
- carrier unit
- support portion
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- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
Description
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205434127U CN201845808U (zh) | 2010-09-27 | 2010-09-27 | 支架组合件、封装结构及其发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205434127U CN201845808U (zh) | 2010-09-27 | 2010-09-27 | 支架组合件、封装结构及其发光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201845808U true CN201845808U (zh) | 2011-05-25 |
Family
ID=44040690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205434127U Expired - Lifetime CN201845808U (zh) | 2010-09-27 | 2010-09-27 | 支架组合件、封装结构及其发光装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201845808U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682028A (zh) * | 2012-08-30 | 2014-03-26 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN106960914A (zh) * | 2017-03-22 | 2017-07-18 | 京东方科技集团股份有限公司 | 封装结构、显示面板、显示装置及其制作方法 |
-
2010
- 2010-09-27 CN CN2010205434127U patent/CN201845808U/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682028A (zh) * | 2012-08-30 | 2014-03-26 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN106960914A (zh) * | 2017-03-22 | 2017-07-18 | 京东方科技集团股份有限公司 | 封装结构、显示面板、显示装置及其制作方法 |
CN106960914B (zh) * | 2017-03-22 | 2018-10-19 | 京东方科技集团股份有限公司 | 封装结构、显示面板、显示装置及其制作方法 |
US10573844B2 (en) | 2017-03-22 | 2020-02-25 | Boe Technology Group Co., Ltd. | Display panel having a plurality of metal rims on the insulating layer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Free format text: FORMER NAME: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. twenty-five West spectrum Patentee after: Lite-On Electronic (Guangzhou) Co., Ltd. Patentee after: Lite-On Technology Corporation Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. twenty-five West spectrum Patentee before: Xuli Electronics (Guangzhou) Co., Ltd. Patentee before: Lite-On Technology Corporation |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20110525 |