CN201838570U - Novel diode - Google Patents
Novel diode Download PDFInfo
- Publication number
- CN201838570U CN201838570U CN201020549377XU CN201020549377U CN201838570U CN 201838570 U CN201838570 U CN 201838570U CN 201020549377X U CN201020549377X U CN 201020549377XU CN 201020549377 U CN201020549377 U CN 201020549377U CN 201838570 U CN201838570 U CN 201838570U
- Authority
- CN
- China
- Prior art keywords
- oxygen
- schottky chip
- epoxy molding
- molding plastic
- novel diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
The utility model relates to a novel diode which comprises a schottky chip and is characterized in that two ends of the schottky chip are respectively welded with an oxygen-free copper lead; the schottky chip and the oxygen-free copper leads are packaged in a square epoxy molding plastic block; and a connecting end of the oxygen-free copper lead extends out of the epoxy molding plastic block. In the utility model, as the schottky chip and the oxygen-free copper leads are packaged in one square epoxy molding plastic block, the structure is more reasonable, the volume is small, the material consumption is low, and the novel diode is especially applicable to be installed in a smaller space. The novel diode can be widely used in microwave hybrid frequency, detection and switching circuits.
Description
Technical field
The utility model relates to a kind of semiconductor device, the novel diode of particularly a kind of semiconductor.
Background technology
Common diode is made up of Schottky diode chip and pin, and its plastic packaging is made in columned epoxy film plastics.Its defective is: its forward voltage drop is higher, and it is bigger to consume energy; Epoxy molding plastic piece of its encapsulation usefulness is columned, and shared volume is big, difficulty relatively when being assemblied in less space.
Summary of the invention
Technical problem to be solved in the utility model is at the deficiencies in the prior art, and the novel diode that a kind of structure is more reasonable, volume is little, the material consumption amount is low is provided.
Technical problem to be solved in the utility model is to realize by following technical scheme.The utility model is a kind of novel diode, be characterized in: it comprises the Schottky chip, each welding is provided with an oxygen-free cupreous at the two ends of Schottky chip, described Schottky chip and oxygen-free cupreous encapsulation are located in the square epoxy molding plastic piece, and the link of oxygen-free cupreous stretches out outside the epoxy molding plastic piece.
Compared with prior art, the novel diode of the utility model (SOD123) is located at Schottky chip and oxygen-free cupreous encapsulation in the square epoxy molding plastic piece, and its structure is more reasonable, and volume is little, the material consumption amount is low, is specially adapted to be installed in the less space.The utility model can be widely used in microwave mixer, detection and the switching circuit.
Description of drawings
Fig. 1 is a kind of structural representation of the present utility model.
Embodiment
Following with reference to accompanying drawing, further describe concrete technical scheme of the present utility model, so that those skilled in the art understands the present invention further, and do not constitute restriction to its right.
Embodiment 1.A kind of novel diode, it comprises Schottky chip 3, each welding is provided with an oxygen-free cupreous 1 at the two ends of Schottky chip 3, described Schottky chip 3 and oxygen-free cupreous 1 encapsulation are located in the square epoxy molding plastic piece 2, and the link of oxygen-free cupreous 1 stretches out outside the epoxy molding plastic piece 2.
Claims (1)
1. novel diode, it is characterized in that: it comprises the Schottky chip, each welding is provided with an oxygen-free cupreous at the two ends of Schottky chip, described Schottky chip and oxygen-free cupreous encapsulation are located in the square epoxy molding plastic piece, and the link of oxygen-free cupreous stretches out outside the epoxy molding plastic piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020549377XU CN201838570U (en) | 2010-09-30 | 2010-09-30 | Novel diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020549377XU CN201838570U (en) | 2010-09-30 | 2010-09-30 | Novel diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201838570U true CN201838570U (en) | 2011-05-18 |
Family
ID=44008673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020549377XU Expired - Lifetime CN201838570U (en) | 2010-09-30 | 2010-09-30 | Novel diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201838570U (en) |
-
2010
- 2010-09-30 CN CN201020549377XU patent/CN201838570U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201838570U (en) | Novel diode | |
| CN202268339U (en) | Novel schottky semiconductor device | |
| CN203774321U (en) | Duodiode packaging structure applied in SOT23 semiconductor | |
| CN201392836Y (en) | Flatly packaged half-control bridge arm device | |
| CN204792788U (en) | Electric leakage protection circuit | |
| CN104779815B (en) | A kind of SiC MOSFET intelligent power integration modules of replaceable IGBT module | |
| CN202043034U (en) | Level shift circuit realizing shifting from 5v signal to 3.3v signal for singlechip system | |
| CN202523702U (en) | Semiconductor component packaging structure | |
| CN102446869A (en) | Diode | |
| CN201608174U (en) | System-in-package structure of semiconductor device | |
| CN201752014U (en) | Super-high voltage semiconductor rectifier | |
| CN203038928U (en) | Large current/ high voltage diode | |
| CN203013708U (en) | Semiconductor die package | |
| CN205211750U (en) | Power module | |
| CN204651306U (en) | A kind of pin formula surface mount power device packaging structure of diving | |
| CN202796916U (en) | Plastic packaging non-insulation power semiconductor module | |
| CN201540890U (en) | Multifunctional flat five-pin frame for encapsulation | |
| CN201478306U (en) | Flat type packaged double-gate field effect transistor | |
| CN203674197U (en) | Novel QFN lead frame | |
| CN203218259U (en) | Ultra-fast recovery high-voltage diode | |
| CN219350228U (en) | Semiconductor integrated circuit packaging structure with high heat dissipation and power supply module thereof | |
| CN103035747A (en) | Point contact type diode | |
| CN201946508U (en) | Universal driving circuit | |
| CN202332968U (en) | Ultrahigh-voltage patch diode | |
| CN202058728U (en) | Chip combination type semiconductor integrated device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110518 |