CN201812808U - Ceramic packaging base with boss - Google Patents

Ceramic packaging base with boss Download PDF

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Publication number
CN201812808U
CN201812808U CN 201020552631 CN201020552631U CN201812808U CN 201812808 U CN201812808 U CN 201812808U CN 201020552631 CN201020552631 CN 201020552631 CN 201020552631 U CN201020552631 U CN 201020552631U CN 201812808 U CN201812808 U CN 201812808U
Authority
CN
China
Prior art keywords
boss
ceramic
package substrates
support bosses
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201020552631
Other languages
Chinese (zh)
Inventor
邱基华
刘建伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchong Three Circle Electronics Co Ltd
Original Assignee
Chaozhou Three Circle Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chaozhou Three Circle Group Co Ltd filed Critical Chaozhou Three Circle Group Co Ltd
Priority to CN 201020552631 priority Critical patent/CN201812808U/en
Priority to PCT/CN2010/078165 priority patent/WO2012045214A1/en
Application granted granted Critical
Publication of CN201812808U publication Critical patent/CN201812808U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model belongs to a semiconductor packaging carrier and discloses a ceramic packaging base with a boss. The carrier comprises a packaging substrate and a plurality of support bosses which are arranged on the packaging substrate, wherein a part of support bosses are insulated support bosses and a part of support bosses are metal support bosses; the insulated support bosses are ceramic support bosses; and the ceramic support bosses are formed by printing on the packaging substrate. By the ceramic packaging base, stacking of ceramic layers can be reduced effectively and electrical performance can be enhanced effectively.

Description

The ceramic encapsulated base of band boss
Technical field
The utility model belongs to the semiconductor packages carrier, relates in particular to a kind of ceramic encapsulated base with boss.
Background technology
Existing ceramic encapsulated base comprises a package substrates; One configuration layer is positioned on this package substrates, comprises at least one the metal paste district that is arranged on this package substrates; One package-side parietal layer, be positioned at around this configuration layer on, define size within this ceramic encapsulated base cavity; At least two supporting layers are divided on the both sides of this configuration layer that this package-side parietal layer is manifested, and use to support crystal; Supporting layer also can be made of the metal paste boss that is arranged at this configuration layer; One lid supporting layer is positioned on this package-side parietal layer.
The shortcoming of prior art is: support the supporting layer that crystal uses and formed by ceramic punching out abnormity chamber, complex process has increased the number of plies of lamination, does not meet the trend of chip crystal element to the miniaturization development; Perhaps supporting layer directly prints boss by metal paste and forms, and technology is simple relatively, but because metal paste is a conductor, an end boss may contact with the electrode on the crystal when supporting crystal and cause the parasitic capacitance increase, and electrical property is caused harmful effect.
Summary of the invention
At the shortcoming of prior art, the purpose of this utility model provides piling up of a kind of effective minimizing ceramic layer and improves the ceramic encapsulated base of the band boss of electrical property.
For achieving the above object, the technical solution of the utility model is: a kind of ceramic encapsulated base with boss, comprise package substrates and a plurality of support rim that is arranged on the package substrates, wherein, the support rim that is electrically connected with electrode is the metallic support boss, other support rim is the insulation support rim, and metallic support boss and insulation support rim form by printing on package substrates.
In this programme, the part support rim adopts insulating material to form, and the silver layer that can effectively avoid its plane of crystal that supports to be coated with contacts and causes parasitic capacitance to increase, and has improved the electrical property of device.
Further, this insulation support rim is the ceramic support boss.
Further, also be provided with the encapsulation fixed bed on this package substrates.
Particularly, this encapsulation fixed bed comprises package-side parietal layer and the lid supporting layer of being located at successively on the package substrates.
Compared with prior art, effect of the present utility model is,
To make with the method for printing ceramic size except that support rim as the electrode purposes, compare in multi-layered ceramic or dry-pressing formed making support rim, simplify greatly on the technology, simplified laminated process, die cost also reduces greatly simultaneously, does not promptly have cavity forming punch die or dry-pressing formed mould; And the level that method is made before reaching fully on the performance, and owing to reduced piling up of ceramic layer, the integral thickness of product is guaranteeing under the prerequisite that encapsulation requires attenuate greatly, meets the development trend of current electronic devices and components miniaturization.
Description of drawings
Fig. 1 is a kind of structural representation of the ceramic encapsulated base of the utility model band boss;
Fig. 2 is the another kind of structural representation of the ceramic encapsulated base of the utility model band boss;
Fig. 3 is the cross-sectional view of the ceramic encapsulated base of the utility model band boss;
Fig. 4 is the structural representation of the utility model support rim.
Embodiment
Below in conjunction with embodiment and accompanying drawing the utility model is described in detail.
Embodiment 1
As shown in Figure 1, the utility model discloses a kind of ceramic encapsulated base with boss, comprise package substrates 1 and a plurality of support rim 2,3 that is arranged on the package substrates 1, part support rim 2 forms for metal material, and other support rims 3 form for insulating material.Wherein, metallic support boss 2 is the needs according to circuit, decides its position and metal material by the size of packaged chip.
In this programme, other support rims 3 adopt insulating material to form, and the silver layer that can effectively avoid its plane of crystal that supports to be coated with contacts and causes parasitic capacitance to increase, and has improved the electrical property of device.
Further, this insulating material is a ceramic material.
Further, this ceramic support boss 3 forms being positioned on the package substrates 1 printing, and printing forms this metallic support boss 2 on the package substrates 1 being positioned at.
Particularly, also be provided with the encapsulation fixed bed on this package substrates 1, this encapsulation fixed bed comprises package-side parietal layer 41 and the lid supporting layer of being located at successively on the package substrates 42.Such structure makes that the structure of encapsulation base is more firm.

Claims (4)

1. ceramic encapsulated base with boss, comprise package substrates and a plurality of support rim that is arranged on the package substrates, it is characterized in that: the support rim that is electrically connected with electrode is the metallic support boss, other support rim is the insulation support rim, and metallic support boss and insulation support rim form by printing on package substrates.
2. the ceramic encapsulated base of band boss according to claim 1 is characterized in that, this insulation support rim is the ceramic support boss.
3. the ceramic encapsulated base of band boss according to claim 1 and 2 is characterized in that, also is provided with the encapsulation fixed bed on this package substrates.
4. the ceramic encapsulated base of band boss according to claim 3 is characterized in that, this encapsulation fixed bed comprises package-side parietal layer and the lid supporting layer of being located at successively on the package substrates.
CN 201020552631 2010-10-08 2010-10-08 Ceramic packaging base with boss Expired - Lifetime CN201812808U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 201020552631 CN201812808U (en) 2010-10-08 2010-10-08 Ceramic packaging base with boss
PCT/CN2010/078165 WO2012045214A1 (en) 2010-10-08 2010-10-27 Ceramic packaging base having convex platforms

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020552631 CN201812808U (en) 2010-10-08 2010-10-08 Ceramic packaging base with boss

Publications (1)

Publication Number Publication Date
CN201812808U true CN201812808U (en) 2011-04-27

Family

ID=43895747

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020552631 Expired - Lifetime CN201812808U (en) 2010-10-08 2010-10-08 Ceramic packaging base with boss

Country Status (2)

Country Link
CN (1) CN201812808U (en)
WO (1) WO2012045214A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102217059A (en) * 2011-06-03 2011-10-12 华为技术有限公司 Insulating ring, insulating assembly and package for packaging
CN102956508A (en) * 2012-11-29 2013-03-06 中国电子科技集团公司第十三研究所 Laminating process and positioning tool of ceramic packaging shell with boss structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255851A (en) * 1995-03-17 1996-10-01 Toshiba Corp Semiconductor package
US6613605B2 (en) * 1999-12-15 2003-09-02 Benedict G Pace Interconnection method entailing protuberances formed by melting metal over contact areas
CN201130926Y (en) * 2007-09-19 2008-10-08 杨绍华 Ceramic packing piece for SMD crystal resonator
CN101132169A (en) * 2007-09-19 2008-02-27 杨绍华 Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102217059A (en) * 2011-06-03 2011-10-12 华为技术有限公司 Insulating ring, insulating assembly and package for packaging
CN102956508A (en) * 2012-11-29 2013-03-06 中国电子科技集团公司第十三研究所 Laminating process and positioning tool of ceramic packaging shell with boss structure
CN102956508B (en) * 2012-11-29 2015-06-24 中国电子科技集团公司第十三研究所 Laminating process and positioning tool of ceramic packaging shell with boss structure

Also Published As

Publication number Publication date
WO2012045214A1 (en) 2012-04-12

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: NANCHONG THREE-CIRCLE ELECTRONIC CO., LTD.

Effective date: 20130417

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20130417

Address after: 515646 Sanhuan Industrial City, Chaozhou, Guangdong

Patentee after: Chaozhou Three-Circle (Group) Co., Ltd.

Patentee after: Nanchong Three-Circle Electronics Co., Ltd.

Address before: 515646 Sanhuan Industrial City, Chaozhou, Guangdong

Patentee before: Chaozhou Three-Circle (Group) Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20110427