CN201673930U - LED support and large-power LED - Google Patents
LED support and large-power LED Download PDFInfo
- Publication number
- CN201673930U CN201673930U CN2010201832267U CN201020183226U CN201673930U CN 201673930 U CN201673930 U CN 201673930U CN 2010201832267 U CN2010201832267 U CN 2010201832267U CN 201020183226 U CN201020183226 U CN 201020183226U CN 201673930 U CN201673930 U CN 201673930U
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- led
- metal substrate
- pole pieces
- luminescence chip
- reflecting
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Abstract
The utility model discloses an LED support and a large-power LED. The LED support comprises a metal base plate 4, a reflecting plate 1 and two pole pieces 2, wherein the reflecting plate 1 is provided with a reflecting wall, and the two pole pieces 2 are used for connecting light-emitting chip 5. The upper surface of the metal base plate 4 has a position for the light-emitting chip 5 be pasted; the two pole pieces 2 are respectively positioned on two sides of the pasting position and separated from the metal base plate 4 respectively through two insulating sheets 3; the reflecting plate 1 is arranged above the two pole pieces 2; a cavity containing the light-emitting chip 5 is enclosed by the reflecting wall; and at least one radiating fin 41 is further arranged at the bottom of the metal base plate 4. By the aid of optimized design for the structures of the LED support and the large-power LED, the radiating performances of the LED support and the large-power LED are remarkably improved, the performance of the large-power LED is enhanced, and the working life of the large-power LED is prolonged.
Description
Technical field
The utility model relates to LED (light-emitting diode) field, relates in particular to a kind of led support and a kind of great power LED.
Background technology
LED has been widely used in lighting fields such as automotive lighting, Landscape Lighting at present as the new generation of semiconductor luminescent device, and the demonstration field of electronic product etc., lighting field uses the great power LED of power greater than 0.5W usually.
For great power LED, luminescence chip generally all can produce more heat in luminescence process, therefore need perhaps to adopt other cooling measures that it is dispelled the heat as early as possible, in order to avoid performance and the working life of LED impacted by on support, adopting certain radiator structure.At present, most of LED adopt the support of material such as pottery, silicon, has the cavity that is used to place luminescence chip on the support, in the LED encapsulation process, after at first luminescence chip being placed on cavity bottom and utilizing the gold thread connection electrode, the phosphor mixture that filling gel and green emitting phosphor, red fluorescence powder etc. constitute in cavity.Yet the material of this support is relative with structural cooling performance relatively poor, for the bigger LED of power, obviously can not satisfy the heat radiation requirement.
The utility model content
The main technical problems to be solved in the utility model is that a kind of led support and great power LED that improves heat dispersion is provided.
For solving the problems of the technologies described above, the utility model provides a kind of led support, two pole pieces that comprise metal substrate, have the reflecting plate of reflecting wall and be used to connect luminescence chip;
The upper surface of metal substrate is provided with the sticky position that is used to paste luminescence chip, and described two pole pieces lay respectively at the both sides of described sticky position, and separates by two insulating trips and described metal substrate respectively;
Reflecting plate is arranged on described two pole pieces top, and described reflecting wall is enclosed the cavity that holds luminescence chip;
The bottom of metal substrate also is provided with at least one radiating fin.
The utility model has also been protected a kind of great power LED, comprises led support and luminescence chip, two pole pieces that described led support comprises metal substrate, has the reflecting plate of reflecting wall and be used to connect described luminescence chip;
The upper surface of metal substrate is provided with the sticky position that is used to paste described luminescence chip, and described two pole pieces lay respectively at the both sides of described sticky position, and separates by two insulating trips and described metal substrate respectively;
Reflecting plate is arranged on described two pole pieces top, and described reflecting wall is enclosed the cavity that holds luminescence chip;
The bottom of described metal substrate also is provided with at least one radiating fin.
Further, also fill the fluorescent material mixture in the described cavity.
Preferably, also cover the reflector on the described reflecting wall.
The beneficial effects of the utility model are: the utility model is optimized design by the structure to led support and great power LED, make the luminescence chip bottom directly contact the metal substrate that has radiating fin, and the setting of radiating fin has enlarged markedly area of dissipation, make the bottom of metal substrate carry out heat exchange fully with air, the heat that produces in the luminescence chip luminescence process is distributed as early as possible, avoid the performance and the life-span of great power LED are exerted an influence.
Description of drawings
Fig. 1 is the led support cutaway view of a kind of embodiment of the utility model;
Fig. 2 is the great power LED cutaway view of a kind of embodiment of the utility model.
Embodiment
In conjunction with the accompanying drawings the utility model is described in further detail below by embodiment.
Please refer to Fig. 1, the led support of present embodiment can be used for the LED of circle, square or other shapes.
Led support mainly comprises metal substrate 4, reflecting plate 1, two pole pieces 2 and two insulating trips 3 etc.Wherein, metal substrate 4 is by aluminium or the good material of other thermal diffusivities, and its bottom has a plurality of radiating fins 41; Thereby have the light that is used for luminescence chip 5 emissions on the reflecting plate 1 and launch the reflecting wall that improves luminous flux and luminous efficiency; Thereby being used to connect luminescence chip 5, two pole pieces 2 derive its positive and negative electrode; Insulating trip 3 separates the two insulation between pole piece 2 and metal substrate 4.Pole piece 2 and reflecting plate 1 can all adopt metal to make.
The sticky position that the upper surface of metal substrate 4 is provided with, this sticky position is used to paste luminescence chip 5, the bottom of luminescence chip 5 is directly contacted with the upper surface of metal substrate 4, and two pole pieces 2 lay respectively at the both sides of this sticky position, and separate by two insulating trips 3 and metal substrate 4 respectively.For square led support, pole piece 2 and insulating trip 3 all are strip, and for the round LED support, pole piece 2 and insulating trip 3 can be designed to circle or other different shapes according to concrete needs.
Reflecting plate 1 is arranged on two pole piece 2 tops, its reflecting wall is enclosed the cavity that holds luminescence chip 5, and for the round LED support, the contour shape of cavity is an annular, for square led support, the profile of cavity can be designed to square or rectangle according to concrete needs.
As shown in Figure 2, for the great power LED that comprises this led support, also can fill fluorescent material in the cavity and mix the fluorescent material mixture 6 that forms with silica gel, be arranged on the luminescence chip 5 of cavity bottom when luminous, can excitated fluorescent powder make that great power LED produces that brightness is higher, color rendering white light preferably.
In order further to strengthen the light reflecting effect, also can cover the reflector on the reflecting wall of reflecting plate 1, reduce the light order of reflection as far as possible, low optical loss falls.
The utility model is optimized design by the structure to led support and great power LED, make after luminescence chip 5 sticks on the metal substrate 4, the bottom of luminescence chip 5 directly contacts the metal substrate 4 that has radiating fin 41, and the setting of radiating fin 41 has enlarged markedly area of dissipation, make the bottom of metal substrate 4 carry out heat exchange fully with air, the heat that produces in luminescence chip 5 luminescence process is distributed as early as possible, avoid the performance and the life-span of great power LED are exerted an influence.
The utility model great power LED can be widely used in multiple illumination place, for example street lamp, square, automobile etc., owing to have good performance of heat dissipation, and the stable performance of LED product, not fragile, long working life.
Above content be in conjunction with concrete execution mode to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. a led support is characterized in that, two pole pieces (2) that comprise metal substrate (4), have the reflecting plate (1) of reflecting wall and be used to connect luminescence chip (5);
The upper surface of metal substrate (4) is provided with the sticky position that is used to paste luminescence chip (5), and described two pole pieces (2) lay respectively at the both sides of described sticky position, and separates by two insulating trips (3) and described metal substrate (4) respectively;
Reflecting plate (1) is arranged on described two pole pieces (2) top, and described reflecting wall is enclosed the cavity that holds luminescence chip (5);
Metal substrate (4) bottom also is provided with at least one radiating fin (41).
2. a great power LED comprises led support and luminescence chip (5), it is characterized in that two pole pieces (2) that described led support comprises metal substrate (4), has the reflecting plate (1) of reflecting wall and be used to connect described luminescence chip (5);
The upper surface of metal substrate (4) is provided with the sticky position that is used to paste described luminescence chip (5), and described two pole pieces (2) lay respectively at the both sides of described sticky position, and separates by two insulating trips (3) and described metal substrate (4) respectively;
Reflecting plate (1) is arranged on described two pole pieces (2) top, and described reflecting wall is enclosed the cavity that holds luminescence chip (5);
Described metal substrate (4) bottom also is provided with at least one radiating fin (41).
3. great power LED as claimed in claim 2 is characterized in that, also fills the fluorescent material mixture in the described cavity.
4. as claim 2 or 3 described great power LEDs, it is characterized in that, also cover the reflector on the described reflecting wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201832267U CN201673930U (en) | 2010-05-07 | 2010-05-07 | LED support and large-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201832267U CN201673930U (en) | 2010-05-07 | 2010-05-07 | LED support and large-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201673930U true CN201673930U (en) | 2010-12-15 |
Family
ID=43331338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201832267U Expired - Fee Related CN201673930U (en) | 2010-05-07 | 2010-05-07 | LED support and large-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201673930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102255036A (en) * | 2011-08-02 | 2011-11-23 | 彩虹集团公司 | Light-Emitting Diode (LED) package structure of high-power substrate |
-
2010
- 2010-05-07 CN CN2010201832267U patent/CN201673930U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102255036A (en) * | 2011-08-02 | 2011-11-23 | 彩虹集团公司 | Light-Emitting Diode (LED) package structure of high-power substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20170507 |
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| CF01 | Termination of patent right due to non-payment of annual fee |