CN201621507U - 一种led灯新型散热结构 - Google Patents

一种led灯新型散热结构 Download PDF

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Publication number
CN201621507U
CN201621507U CN2010201099929U CN201020109992U CN201621507U CN 201621507 U CN201621507 U CN 201621507U CN 2010201099929 U CN2010201099929 U CN 2010201099929U CN 201020109992 U CN201020109992 U CN 201020109992U CN 201621507 U CN201621507 U CN 201621507U
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pcb
led
pcb board
shape
binding face
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范家华
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Dongguan Xianghe plastic electronic Co., Ltd.
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CHANGXIN OPTO-ELECTRONIC (DONGGUAN) Co Ltd
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Priority to JP2010008260U priority patent/JP3166388U/ja
Priority to US13/015,908 priority patent/US8398260B2/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

本实用新型涉及照明设备领域，特指一种LED灯新型散热结构，包括灯头、灯罩、PCB板、若干LED灯、金属型材和卡凸，若干LED灯通过串并联连接形成LED阵列光源固定于PCB板上，PCB板嵌入金属型材上的安置槽中，安置槽包括贴合面和凸缘，分别用以定位和固定PCB板，灯头与光源电连接供电，金属型材上的安置槽与PCB板的贴合面为弧形，在PCB板与凸缘之间嵌入卡凸。本实用新型强制性地将PCB板贴合在与其接触的金属型材贴合面，较现有技术大大地提高了散热面积，因此散热速度快，提高了LED的工作效率，延长了其寿命；且结构简单，制作成本低。

Description

一种LED灯新型散热结构
技术领域：
本实用新型涉及照明设备领域，特指一种LED灯新型散热结构。
背景技术：
普通荧光灯管由于能耗高，而被LED节能灯逐渐代替。LED灯具有发光效率高、节能效果好、使用寿命长、无污染的优点，在生产和生活中被广泛的应用。由于每个LED灯的功率小，因此LED灯都是由数十只或数百只LED灯按串并联方式组合而成。每个LED灯在发光过程中产生的热量如果不及时散发出去将使LED灯产生光衰，降低LED灯的发光效率，使得亮度下降。现有技术中，如附图1所示，设置了LED灯4的PCB板3被安装在金属型材5的安置槽51内，LED灯4发出的光透过灯罩2向外发散，由于LED灯4贴靠在PCB板3一面的光只能以热的形式向PCB板3传导，而PCB板3所吸收的热量再通过其与金属型材5的贴合面511传导至整个金属型材5上，从而使LED灯4所产生的热量得以发散。然而实际运用中，使用状态为金属型材5安装在上，LED灯4安装在下，因此在重力作用下PCB板3并不能与金属型材5的贴合面511相贴合，仅仅是依靠金属型材5的两凸缘512将PCB板3托住，这样，原本希望由金属型材5的接触面511传导热量的方式，变成了依靠金属型材5上的两个用于支撑PCB板3的凸缘512进行热传导；并且PCB板3的厚度也是导致热传导效率下降的原因，由现有工艺成型的金属型材5的安置槽51的最小高度只能制造成0.8mm，为了使PCB板3能贴合金属型材5散热，其厚度也相应地设计成大于或等于0.8mm。上述原因大大减少了热量的传导，造成LED灯4散热效果不佳，使其发光效率下降，并加速了LED灯4的老化。
发明内容：
本实用新型为了克服现有LED灯的散热问题，而提供一种具有新型散热结构的LED灯。
一种LED灯新型散热结构，包括灯头、灯罩、PCB板、若干LED灯、金属型材和卡凸，若干LED灯通过串并联连接形成LED阵列光源固定于PCB板上，PCB板嵌入金属型材上的安置槽中，安置槽包括贴合面和凸缘，分别用以定位和固定PCB板，灯头与光源电连接供电。金属型材上的安置槽与PCB板的贴合面为弧形；金属型材的凸缘与PCB板之间嵌入卡凸。
本实用新型强制性地将PCB板贴合在与其接触的金属型材贴合面，且通过卡凸作用的方式，使得PCB板的贴合面为弧形，设计者因此可以在不降低安置槽高度的情况下，相应的降低PCB板的厚度。较现有技术大大地提高了散热面积，因此散热速度快，提高了LED的工作效率，延长了其寿命；且结构简单，制作成本低。
附图说明：
附图1为现有技术结构示意图
附图2为本实用新型结构示意图
具体实施方式：
如附图2所示，本实用新型包括灯头1、灯罩2、PCB板3、若干LED灯4、金属型材5和卡凸6，若干LED灯4通过串并联连接形成LED阵列光源固定于PCB板3上，PCB板3嵌入金属型材5上的安置槽51中，安置槽51包括贴合面511和凸缘512，分别用以定位和固定PCB板3，灯头1与光源电连接供电。金属型材5上的安置槽51与PCB板3的贴合面511为弧形；在金属型材5的凸缘512与PCB板3之间嵌入卡凸6。
组装时，先将若干LED灯4通过串并联连接形成LED阵列光源固定于PCB板3上，PCB板3嵌入金属型材5上的安置槽51中，用卡凸6嵌入PCB板3与凸缘512之间，使PCB板3受力后形成弧形紧紧地贴合在安置槽51的贴合面511上，再将装有LED灯4的金属型材5从一端插入灯罩2中与其卡接固定，最后把灯头1安装在灯罩2端部，电源通过灯头1向LED灯4供电。这样，在金属型材5在上，LED灯4在下的工作状况中，PCB板3即使是受到重力作用，依然能与金属型材5保持紧密的热接触；且弧形贴合也可以让设计者将PCB板3设计成仅为0.4mm厚，使得LED灯散热迅速。

Claims (1)

1.一种LED灯新型散热结构，包括灯头、灯罩、PCB板、若干LED灯、金属型材和卡凸，若干LED灯通过串并联连接形成LED阵列光源固定于PCB板上，PCB板嵌入金属型材上的安置槽中，安置槽包括贴合面和凸缘，分别用以定位和固定PCB板，灯头与光源电连接供电，其特征在于：金属型材上的安置槽与PCB板的贴合面为弧形，金属型材的凸缘与PCB板之间嵌入卡凸。
CN2010201099929U 2010-01-30 2010-01-30 一种led灯新型散热结构 Expired - Fee Related CN201621507U (zh)

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CN2010201099929U CN201621507U (zh) 2010-01-30 2010-01-30 一种led灯新型散热结构
JP2010008260U JP3166388U (ja) 2010-01-30 2010-12-20 Ｌｅｄランプの放熱構造
US13/015,908 US8398260B2 (en) 2010-01-30 2011-01-28 Heat-dissipation structure of LED lamp

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CN103912825A (zh) * 2014-03-31 2014-07-09 济南大学 壁灯

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CN103912825A (zh) * 2014-03-31 2014-07-09 济南大学 壁灯

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US20110192586A1 (en) 2011-08-11
US8398260B2 (en) 2013-03-19
JP3166388U (ja) 2011-03-03

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